Datasheet ILX535K Datasheet (Sony)

– 1 –

ILX535K

22 pin DIP (Plastic)

E97446D98-PS

5300 pixel × 3 line CCD Linear Sensor (Color)

Description

The ILX535K is a reduction type CCD linear sensor
developed for color image scanner. The distance
between lines is only 4 line (32µm). This sensor reads
A4-size documents at a density of 600DPI.

Features

• Number of effective pixels: 15900 pixels

(5300 pixels × 3)

• Pixel size: 8µm × 8µm (8µm pitch)

• Distance between line: 32µm (4 Lines)

• Number of output 3 (R, G, B)

• Single-sided readout

• Clamp circuit are on-chip

• Ultra high sensitivity/Ultra low lag

• Single 12V power supply

• Maximum data rate: 9MHz (3MHz × 3)

• Input Clock Pulse: CMOS 5V drive

• Package:

22 pin Plastic-DIP (400 mil)

Absolute Maximum Ratings

• Supply voltage VDD 15 V

• Operating temperature –10 to +55 °C

• Storage temperature –30 to +80 °C

Pin Configuration (Top View)

Block Diagram

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

1

5300 R 1

5300 G 1

5300 B 1

GND

GND

V

OUT-B

NC

NC

NC

NC

NC

φ2

φROG

-R

φROG-G

φRS

V

OUT-R

VDD

NC

NC

NC

NC

NC

φ1

φROG

-B

VOUT-G

D14

D15

D63

S1

Read Out Gate

CCD Register

S5300

Driver

D14

D15

D63

S1

Read Out Gate

CCD Register

S5300

Driver

D14

D15

D63

S1

Read Out Gate

CCD Register

S5300

Driver

Driver

Blue

Green

Red

φROG-B

φROG-G

φROG-R

VOUT-B

VOUT-G

VOUT-R

VDD

φ2

GND

φRS φ1

20

4

13

12

10

11

3

2

1

14

21

Clamp Pulse

Generator

Clamp

Clamp

Clamp

For the availability of this product, please contact the sales office.

– 2 –

ILX535K

Pin Description

Pin No. Symbol Description Pin No. Symbol Description

1
2
3
4
5
6
7
8

9
10
11

φRS
VOUT-R
VOUT-G
VDD
NC
NC
NC
NC
NC

φ1
φROG-B

Clock pulse input
Signal out (red)
Signal out (green)
12V power supply
NC
NC
NC
NC
NC
Clock pulse input
Clock pulse input

12
13
14
15
16
17
18
19
20
21
22

φROG-G
φROG-R
φ2

NC
NC
NC
NC
NC
VOUT-B
GND
GND

Clock pulse input
Clock pulse input
Clock pulse input
NC
NC
NC
NC
NC
Signal out (blue)
GND
GND

Recommended Supply Voltage

Item

VDD

Min.

11.4

Typ.

12

Max.

12.6

Unit

V

Clock Characteristics

Symbol
Cφ1, Cφ2
CφRS
CφROG

Min.

—
—
—

Typ.

800

10
10

Max.

—
—
—

Unit

pF
pF
pF

Item
Input capacity of φ1, φ2
Input capacity of φRS
Input capacity of φROG

∗1

Input Clock Pulse Voltage Condition

High level
Low level

Min.

4.75
—

Typ.

5.0
0

Max.

5.25

0.1

Unit

V
V

Item

φ1, φ2, φRS, φROG
pulse voltage

∗1

It indicates that φROG-R, φROG-G, φROG-B as φROG.

Clock Frequency

Min.

—

Typ.

1

Max.

3

Unit

MHz

Item Symbol

φ1, φ2, φRS fφ1, fφ2, fφRS

– 3 –

ILX535K

Electrooptical Characteristics (Note 1)

Ta = 25°C, VDD = 12V, fφRS = 1MHz, Input clock = 5Vp-p,
Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)

Item Symbol Min. Typ. Max. Unit Remarks

Sensitivity

Sensitivity nonuniformity
Saturation output voltage

Saturation
exposure

Dark voltage average
Dark signal nonuniformity
Image lag
Supply current
Total transfer efficiency
Output impedance
Offset level

RR
RG
RB
PRNU
VSAT
SER
SEG
SEB
VDRK
DSNU
IL
IVDD
TTE
ZO
VOS

6.2

12.3

7.5
—

2.0

0.15

0.10

0.12
—
—
—
—
92
—
—

9.5
19

11.5
4

2.5

0.26

0.13

0.21
2
4

0.02

30
98

300

6.3

12.8

25.6

15.5
20
—
—
—
—

5
12
—
50
—
—
—

V/(lx · s)

%

V

lx · s

mV
mV

%

mA

%

Ω

V

Note 2

Note 3
Note 4

Note 5

Note 6
Note 6
Note 7

—
—
—

Note 8

Red
Green
Blue

Red
Green
Blue

Notes

1) In accordance with the given electrooptical characteristics, the black level is defined as the average value
of D2, D3 to D12.

2) For the sensitivity test light is applied with a uniform intensity of illumination.

3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.

VOUT-G = 500mV (Typ.)
PRNU = × 100 [%]

Where the 5300 pixels are divided into blocks of 100. The maximum output of each block is set to VMAX,
the minimum output to VMIN and the average output to VAVE.

4) Use below the minimum value of the saturation output voltage.

5) Saturation exposure is defined as follows.

SE =

Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB.

6) Optical signal accumulated time τint stands at 5ms.

7) VOUT-G = 500mV (Typ.)

8) Vos is defined as the right side.
VOUT indicates VOUT-R, VOUT-G, and VOUT-B.

(VMAX – VMIN) /2

VAVE

A

VOS

VOUT

GND

VSAT

R

A

– 4 –

ILX535K

2

1

3

4

φROG

φ1

φ2

φRS

D1

D2

D3

D13

D14

D15

D61

D62

D63

S1

D64

D70

Optical black (49 pixels)

Dummy signal (63 pixels)

1-line output period

V

OUT

Noto) The transfer pulses (φ1, φ2) must have more than 5370 cycles.

VOUT indicates VOUT-R, VOUT-G, VOUT-B.

S5298

S2

S5299

S5300

D65

5

0

5

0

5

0

5

0

Clock Timing Chart 1

– 5 –

ILX535K

Clock Timing Chart 2

t4 t5

t2

t1 t3

t7t6

φROG

φ1

φ2

Clock Timing Chart 3

t7

φ1

φ2

V

OUT

t6

t9

t10 t11

t13

t12

t8

φRS

t14

– 6 –

ILX535K

Clock Pulse Recommended Timing

Symbol

t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13

t14

Min.

50
800
800

0
0
0

0
50
80

0

0
—
—

50

Typ.

100
1000
1000

5

5
20
20

250

∗1

250

∗1

10
10
70
10

250

∗1

Max.

—
—
—
10
10
60
60
—
—
30
30
—
—

—

Unit

ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

ns

Item

φROG, φ1 pulse timing
φROG pulse high level period
φROG, φ1 pulse timing
φROG pulse rise time
φROG pulse fall time
φ1 pulse rise time/φ2 pulse fall time
φ1 pulse fall time/φ2 pulse rise time
φRS pulse high level period
φRS, φ1 pulse timing 1
φRS pulse rise time
φRS pulse fall time

Signal output delay time

φRS, φ1/φ2 pulse timing 2

∗1

These timing is the recommended condition under fφRS = 1MHz.

– 7 –

ILX535K

2

3

4

5

10

11

12

13

1415

20

φRS

V

OUT-R

V

DD

NC

NC

NC

NC

NC

φ1

GND

V

OUT-B

NC

NC

NC

φ2

φROG

-R

φROG

-G

IC1

2Ω

100Ω

V

OUT-R

0.1µF 47µF/16V

12V

φROG

-Bφ1

100Ω

Tr1

5.1kΩ

V

OUT-B

2Ω

IC1

φ2 φROG

-R φROG-G

IC1: 74AC04

Tr1: 2SC2785

Tr1

5.1kΩ

16

17

18

19

21

22

Tr1

VOUT-G

100Ω

6

7

8

9

1

φRS

V

OUT-G

GND

NC

NC

φROG

-B

5.1kΩ

∗

Data rate fφ

RS = 1MHz

IC1

Application Circuit

∗

Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for

any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

– 8 –

ILX535K

Example of Representative Characteristics (VDD = 12V, Ta = 25°C)

1

0.8

0.6

0.4

0.2

0

Wavelength [nm]

Relative sensitivity

Spectral sensitivity characteristics (Standard characteristics)

1

0

Ta – Ambient temperature [°C]

Output voltage rate

Dark signal output temperature characteristics

(Standard characteristics)

10

5

0.5

0.1
10 20 30 40 50 60 1

τ int – Integration time [ms]

Output voltage rate

Integration time output voltage characteristics

(Standard characteristics)

1

0.5

0.1
5 10

V

DD [V]

V

OS

– Offset level [V]

Offset level vs. VDD characteristics

(Standard characteristics)

12

12

10

8

6

4

2

0

11.4 12.6

Ta = 25°C

∆V

OS

∆VDD

0.6

Ta – Ambient temperature [°C]

V

OS

– Offset level [V]

Offset level vs. temperature characteristics

(Standard characteristics)

12

10

8

6

4

2

0

0

∆VOS

∆Ta

+0.5mV/°C

10 20 30 40 50 60

400 450 500 550 600 650 700

– 9 –

ILX535K

Notes of Handling

1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.

2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:

(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter

of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm

b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be

generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.

c) Be aware that any of the following can cause the package to crack or dust to be generated.

(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.

Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.

d) The notch of the plastic portion is used for directional index, and that can not be used for reference of

fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap
with the notch of the plastic portion.

Plastic portion

Cover glass

39N

Ceramic portion

Adhesive

(1)

29N

(3)

0.9Nm

(4)

29N

(2)

– 10 –

ILX535K

3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded

30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool
sufficiently.

c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering

tool, ground the controller. For the control system, use a zero cross type.

4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)

c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch

the glass.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.

6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.

– 11 –

ILX535K

Package Outline Unit: mm

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

DRAWING NUMBER

Plastic, Ceramic

GOLD PLATING

42ALLOY

5.43g

LS-B12-01(E)

M

1

22

11

12

7.9 ± 0.3

10.16

55.7 ± 0.3

2.54

0.51

0.25

*7.3 or 9.0

*53.00 or 54.2

3.58

H

V

22pin DIP(400mil)

42.4(8µmX5300pixels)

No.1 Pixel(Green)

10.0 ± 0.3

0˚to 9˚

4.28 ± 0.5

0.3

4.0 ± 0.5

5.0 ± 0.3

1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm.

2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.

*The dimension of cover glass is 54.2 X 9.0mm or 53.0 X 7.3mm.