Datasheet ILX553A Datasheet (Sony)

Page 1

5150-pixel CCD Linear Sensor (B/W)

Description

The ILX553A is a reduction type CCD linear sensor developped for DPPC, multifunction printers. This sensor reads A4-size documents at a density of 600 DPI at high speed of 16MHZ.

Features

• Number of effective pixels: 5150 pixels

• Pixel size: 7µm × 7µm (7µm pitch)

• Clamp circuit is on-chip

• Ultra high sensitivity/Ultra low lag

• Maximum data rate: 16MHz

• Single 12V power supply

• Input clock pulse: CMOS 5V drive

• Package: 22 pin Plastic DIP (400mil)

ILX553A

22 pin DIP (Plastic)

Block Diagram

φROG 16

Absolute Maximum Ratings

• Supply voltage VDD 15 V

• Operating temperature –10 to +60 °C

• Storage temperature –30 to +80 °C

Pin Configuration (Top View)

GND

OUT

VDD

GND

φ1

GND

5150

GND

φLH

φRS

GND

φCLP

φROG

φ2

GND

φ2

φLH

Driver

D64

S5150

Read out gate

D63

D15 D14

CCD register

OUT

φ1

φRS

φCLP

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

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E00X48-PS

Page 2

Pin Description

ILX553A

Pin No. Symbol Description

1 2 3 4 5 6 7 8

9 10 11

GND GND GND GND VOUT VDD GND φ1 GND GND GND

GND GND GND GND Signal out 12V power supply GND Clock pulse input GND GND GND

Recommended Supply Voltag e

Item Min.

VDD 11.4

Typ.

12.0

Max.

12.6

Pin No. Symbol Description

12 13 14 15 16 17 18 19 20 21 22

GND GND GND

φ2 φROG φCLP

GND

φRS φLH

GND GND

GND GND GND Clock pulse input Clock pulse input Clock pulse input GND Clock pulse input Clock pulse input GND GND

Unit

Clock Characteristics

Item Min. Input capacity of φ1, φ2 Input capacity of φLH Input capacity of φRS

∗1

Input capacity of φCLP Input capacity of φROG

Symbol Cφ1, Cφ2 CφLH CφRS

∗1

CφCLP CφROG

— — — — —

Typ.

400

10 10 10 10

Clock Frequency

Item Min.

φ1, φ2, φLH, φRS, φCLP —

fφ1, fφ2, fφLH, fφRS, fφCLP

Symbol

Input Clock Pulse Voltage Condition

Item

φ1, φ2, φLH, φRS, φCLP, φROG pulse voltage

High level Low level

Min.

4.75 0

Typ.

5.0

—

Max.

— — — — —

Max.

5.25

0.1

Typ.

Unit

pF pF pF pF pF

Unit

V V

Max.

Unit

MHz

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Page 3

Electrooptical Characteristics (Note 1)

ILX553A

Ta = 25°C, VDD = 12V, fφR = 2MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)

Item Min. Sensitivity Sensitivity nonuniformity Saturation output voltage Saturation exposure Dark voltage average

Symbol R PRNU VSAT SER VDRK

11.8

—

— —

Typ.

14.8 4 2

0.14

0.3

Max.

17.8 10

— —

Unit

V/(lx · s)

lx · s

Remarks

Note 2 Note 3 Note 4 Note 5

Note 6

Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level

DSNU IL IVDD TTE ZO VOS

— — —

— —

0.6

0.02 15 98

230

6.2

—

— — —

Ω

Note 7

— — —

Note 8

Notes

1) In accordance with the given electrooptical characteristics, the even black level is defined as the average value of D14, D15, to D62.

2) For the sensitivity test light is applied with a uniform intensity of illumination.

3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.

VOUT = 500mV (Typ.)

PRNU = × 100 [%]

(VMAX – VMIN)/2

VAVE

The maximum output of 5150 pixels is set to VMAX, the minimum output to VMIN and the average output to VAVE.

4) Use below the minimum value of the saturation output voltage.

5) Saturation exposure is defined as follows.

SE =

VSAT

6) Optical signal accumulated time τ int stands at 10ms.

7) VOUT = 500mV (Typ.)

8) VOS is defined as indicated bellow.

VOUT

VOS

GND

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Page 4

Clock Timing Chart 1

φ2

OUT

5 0

0 5 0

5 0

Note) The transfer pulses (φ1, φ2, φLH) must have more than 5220 cycles.

Dummy signal (63 pixles)

D13

Optical black (49 pixles)

D15

D14

1-line output period (5220 pixles)

D61

D62

D63

S5148

S5149

S5150

D64

D65

φROG

φ1 φLH

φRS

– 4 –

φCLP

ILX553A

Page 5

Clock Timing Chart 2

ILX553A

φROG

φ1 φLH

φ2

Clock Timing Chart 3

φ1 φLH

t6 t7

φ2

φRS

φCLP

OUT

t10

t13

t16

t17

t11

t14

t15

t12

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Page 6

Clock Timing Chart 4

Cross point φ1 and φ2

φ1

ILX553A

φ2

Cross point φLH and φ2

φ2

φLH

1.5V (Min.)

2.0V (Min.)

1.5V (Min.)

0.5V (Min.)

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Page 7

Clock Pulse Recommended Timing

ILX553A

Item

φROG, φ1 pulse timing φROG pulse high level per iod φROG, φ1 pulse timing φROG pulse rise time φROG pulse fall time φ1 pulse rise time/φ2 pulse fall time φ1 pulse fall time/φ2 pulse rise time φRS pulse high level period φRS, φCLP pulse timing φRS pulse rise time φRS pulse fall time φCLP pulse high level period φCLP, φLH pulse timing φCLP pulse rise time φCLP pulse fall time

Signal output delay time

Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17

Min.

3 1 0 0 0

0 10 10

0 20

— —

Typ. 100

20 200 200

10 200

Max.

—

5 2 5 5

— —

10 10 60 60

∗

— —

30 30

∗

— —

30 30

—

Unit

ns µs µs ns ns ns ns ns ns ns ns ns ns ns ns ns ns

∗

These timing is the recommended condition under fφRS = 1MHz.

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Page 8

Application Circuit

∗

IC2

φLH

φRS

φCLP

IC2

φROG

IC1

GND

100Ω

φLH

100Ω

φRS

GND

100Ω

171819202122

100Ωφ22Ω

1213141516

φ2

φCLP

φROG

GND

– 8 –

GND

OUT

1 2 3 4 5 6

GND

φ1

GND

7 8 9 10 11

GND

12V

∗

Data rate fφ

RS = 1MHz

100Ω

5.1kΩ

Tr1

2Ω

47µF/16V

IC1

OUT

IC1: 74AC04

φ1

IC2: 74HC04

0.1µF

Tr1: 2SC2785

Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

ILX553A

Page 9

Example of Representative Characteristics (VDD = 12V, Ta = 25°C)

Spectral sensitivity characteristics (Standard characteristics)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

Relative sensitivity

0.3

0.2

0.1 0

400 500 600 700

Wavelength [nm]

Dark signal output temperature characteristics

(Standard characteristics)

800

Integration time output voltage characteristics

ILX553A

900 1000

(Standard characteristics)

0.5

Output voltage rate

0.1 01020

Ta – Ambient temperature [˚C]

Offset level vs. VDD characteristics

(Standard characteristics)

30 40 50 60

Ta = 25˚C

0.5

Output voltage rate

0.1 1

τ int – integration time [ms]

510

Offset level vs. Temperature characteristics

(Standard characteristics)

∆V

∆Ta

≈ –2mV/˚C

– Offset level [V]

11.4

∆V

≈ 0.6

∆V

12.0 12.6

[V]

– 9 –

– Offset level [V]

Ta – Ambient temperature [˚C]V

302010 40 50 60

Page 10

Notes of Handling

1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive

shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.

2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages.

a) Remain within the following limits when applying static load to the package:

(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter

of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm

ILX553A

Cover glass

Plastic portion

Ceramic portion

(1)

39N

Adhesive

29N

(2)

(3)

29N

(4)

0.9Nm

b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be

generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.

c) Be aware that any of the following can cause the package to crack or dust to be generated.

(1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Pr ying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered.

d) The notch of the plastic portion is used for directional index, and that can not be used for reference of

fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion.

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Page 11

3) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W

soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.

c) To dismount an imaging device, do not use a solder suction equipment. When using an electric

desoldering tool, ground the controller. For the control system, use a zero cross type.

4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces.

Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.)

c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to

scratch the glass.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

ILX553A

5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions.

6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.

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Page 12

Package Outline Unit: mm

22 pin DIP (400mil)

55.7 ± 0.3

10.6 ± 0.3 22

36.05 (7µm X 5150pixels) 12

0˚ to 9˚

5.0 ± 0.3

No.1 Pixel

∗

53.00 or 54.2

7.3 or 9.0

10.0 ± 0.3

∗

10.16

0.25

– 12 –

4.0 ± 0.5

3.58

2.54

0.3

0.51

4.28 ± 0.5

1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm.

2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.

∗

The dimension of cover glass is 54.2 × 9.0mm or 53.0 × 7.3mm.

PACKAGE STRUCTURE

Sony Corporation

PACKAGE MATERIAL LEAD TREA TMENT LEAD MATERIAL

PACKAGE MASS

DRAWING NUMBER

Plastic, Ceramic GOLD PLATING 42 ALLOY

5.43g LS-B23-01(E)

ILX553A