Datasheet ILX548K Datasheet (Sony)

5340 pixel × 3 line CCD Linear Sensor (Color)

Description

The ILX548K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 600DPI.

Features

• Number of effective pixels: 16020 pixels

(5340 pixels × 3)

• Pixel size: 4µm × 4µm (4µm pitch)

• Distance between line: 32µm (8 lines)

• Single-sided readout

• Ultra low lag/High sensitivity

• Single 12V power supply

• Maximum data rate: 5MHz/Color

• Input clock pulse: CMOS 5V drive

• Number of output: 3 (R, G, B)

• Package: 22 pin Cer-DIP (400mil)

22 pin Plastic DIP (400mil)

Absolute Maximum Ratings

• Supply voltage VDD 15 V

• Operating temperature –10 to +55 °C

Pin Configuration (Top View)

Block Diagram

– 1 –

E00429-PS

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

ILX548K

22 pin DIP (Cer-DIP) 22 pin DIP (Plastic)

D74

D75

S5340

Red

Read out gate

CCD register

D70

D69

S1

D18

D19

D74

D75

S5340

Green

Read out gate

CCD register

D70

D69

S1

D18

D19

D74

D75

S5340

Blue

Read out gate

CCD register

D70

D69

S1

D18

D19

Driver

14

φROG-

R

Driver

12

φROG-

G

Driver

11

φROG-

B

Output

amplifier

22

19

V

OUT-R

Output

amplifier

3

V

OUT-G

Output

amplifier

20

2 4 1

V

OUT-B

GND VDD φRS

13

φ1

10

φ2

φCLP

21

GND

1

22

φRS

2

GND

3

VOUT-G

4

V

DD

5

NC

6

NC

7

NC

8

NC

9

NC

10

φ2

11

21

20

19

18

17

16

15

14

13

12

φROG-

B

φCLP

GND

V

OUT-B

VOUT-R

NC

φROG-

R

φ1

φROG-

G

5340

B1

1

G

R

5340

For the availability of this product, please contact the sales office.

– 2 –

ILX548K

Unit

pF pF pF pF

Max.

— — — —

Typ.

500

10 10 10

Min.

— — — —

Symbol Cφ1, Cφ2 CφRS CφCLP CφROG

Item Input capacity of φ1, φ2 Input capacity of φRS Input capacity of φCLP Input capacity of φROG

Clock Characteristics

Unit

MHz

Max.

5

Typ.

1

Min.

—

Symbol

fφ1, fφ2, fφRS, fφCLP

Item

φ1, φ2, φRS, φCLP

Clock Frequency

Unit

V

Max.

12.6

Typ.

12

Min.

11.4

Item

VDD

Recommended Supply Voltage

Unit

V V

Max.

5.25

0.1

Typ.

5.0 0

Min.

4.75

—

High level Low level

φ1, φ2, φRS, φCLP, φROG pulse voltage

Input Clock Pulse Voltage Condition

Pin Description

Pin No.

Symbol Description

1 2 3 4 5 6 7 8

9 10 11

φRS GND VOUT-G VDD NC NC NC NC NC

φ2 φROG-

B

Clock pulse input GND Signal output (green) 12V power supply NC NC NC NC NC Clock pulse input Clock pulse input

Pin No.

Symbol Description

12 13 14 15 16 17 18 19 20 21 22

φROG-G φ1 φROG-R

NC NC NC NC VOUT-R VOUT-B GND φCLP

Clock pulse input Clock pulse input Clock pulse input NC NC NC NC Signal output (red) Signal output (blue) GND Clock pulse input

– 3 –

ILX548K

Unit

%

V

mV mV

%

mA

%

Ω

V

Remarks

Note 3 Note 4

— — —

Note 8

Max.

3.6

4.5

3.5 20

— — — —

5

12

—

50

— — —

Typ.

2.7

3.3

2.6 4

2.5

0.93

0.76

0.96 2 4

0.02

25 98

450

7.3

Min.

1.8

2.1

1.7

—

2

0.56

0.44

0.57

— — — —

92

— —

Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE Zo VOS

Item

Sensitivity nonuniformity Saturation output voltage

Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level

Electrooptical Characteristics (Note 1)

(Ta = 25°C, VDD = 12V, fφRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm))

Notes)

1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of D18, D19 to D67.

2. For the sensitivity test light is applied with a uniform intensity of illumination.

3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.

VOUT-G= 500mV (Typ.) PRNU = × 100 [%]

Where the 5340 pixels are divided into blocks of 100, the maximum output of each block is set to V

MAX, the

minimum output to V

MIN and the average output to VAVE.

4. Use below the minimum value of the saturation output voltage.

5. Saturation exposure is defined as follows.

SE =

Where R indicates R

R, RG, RB, and SE indicates SER, SEG, SEB.

6. Optical signal accumulated time τint stands at 5.5ms.

7. VOUT-G = 500mV (Typ.)

8. Vos is defined as indicated below. VOUT indicates VOUT-R, VOUT-G and VOUT-B.

(V

MAX – VMIN)/2

VAVE

VSAT

R

Sensitivity

Saturation exposure

Red Green Blue

V/(lx · s) Note 2

lx · s Note 5

Note 6

Note 7

VOS

VOUT

GND

– 4 –

ILX548K

Clock Timing Chart 1

5φ10

5

φROG

0

5φ20

5

φRS

0

5

φCLP

V

OUT

0

1

2

3

4

5415

D1

D2

D3

D17

D18

D19

D67

D68

D69

S1

S2

S5338

S5339

S5340

D70

D71

D74

D75

Optical black (50 pixels)

Dummy signal (69 pixels)

1-line output period (5415 pixels)

Note) The transfer pulses (φ1, φ2) must have more than 5415 cycles.

V

OUT indicates VOUT-R, VOUT-G, VOUT-B.

φROG indicates φROG-R, φROG-G, φROG-B.

– 5 –

ILX548K

Clock Timing Chart 2

φROG

φ1

φ2

t1

t2

t4

t5

t3

t7

t6

Clock Timing Chart 3

φ1

φ2

V

OUT

φRS

t12

t8

t9

t6

t7

t11

t10

t14

t15

t13

φCLP

t16 t17

;;

– 6 –

ILX548K

Clock Pulse Recommended Timing

Unit

ns µs µs ns ns ns ns ns ns ns ns ns ns ns ns ns ns

Max.

— — — — — — — — — — — — — — — — —

Typ.

100

5 2 5

5 20 20

50

∗

1

20 20 50 20

100 100

50 20 20

Min.

50

3 1 0 0 0 0

30

0 0

— —

40 40 10

0 0

Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17

Item

φROG, φ1 pulse timing φROG pulse high level period φROG, φ1 pulse timing φROG pulse rise time φROG pulse fall time φ1 pulse rise time/φ2 pulse fall time φ1 pulse fall time/φ2 pulse rise time φRS pulse high level period φRS pulse rise time φRS pulse fall time

Signal output delay time

φCLP pulse high level period

φCLP pulse timing

φCLP pulse rise time φCLP pulse fall time

∗

1

These timing is the recommended condition under fφRS = 1MHz.

– 7 –

ILX548K

Application Circuit

∗

φCLP

IC1

100Ω

φROG-

R φROG-G

100Ω

IC1

φRS

2Ω

IC1

φ2

1

φRS

2

GND

3

VOUT-G

4

VDD

5

NC

6

NC

7

NC

9

NC

10

φ2

20

19

18

16

φROG-B

φCLP

GND

V

OUT-B

VOUT-R

NC

φROG-

R

φ1

φROG-G

IC1: 74AC04

Tr1: 2SC2785

0.1µF

47µF/16V

12V

2Ω

φ1

100Ω

∗

Data rate fφRS = 1MHz

100Ω

φROG-

B

IC1

15

17

8

21

22

14 13

12

11

100Ω

Tr1

V

OUT-G

5.1kΩ

100

Ω

100

Ω

Tr1

V

OUT

-

B

5.1k

Ω

V

OUT

-

R

5.1k

Ω

100

Ω

Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for

any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

– 8 –

ILX548K

Example of Representative Characteristics (VDD = 12V, Ta = 25°C)

Wavelength [nm]

Relative sensitivity

550 600 650

400

0

0.2

0.4

0.6

0.8

1.0

450

500 700

Spectral sensitivity characteristics (Standard characteristics)

Dark voltage rate vs. Ambient temperature

(Standard characteristics)

Output voltage rate vs. Integration time

(Standard characteristics)

Offset level vs. Supply voltage

(Standard characteristics)

Offset level vs. Ambient temperature

(Standard characteristics)

Ta – Ambient temperature [°C]

Dark voltage rate

30 40 50–10 0

0.1

1

100

10

10 20 60

Ta – Ambient temperature [°C]

Vos – Offset level [V]

20 30 40 50–10

0

2

4

6

8

10

010 60

V

DD – Supply voltage [V]

Vos – Offset level [V]

1211.4

0

2

4

6

10

8

12.6

τ int – Integration time [ms]

Output voltage rate

51

0.1

1

10

∆Vos ∆V

DD

≈ 0.7

∆Vos

∆Ta

≈ 1mV/°C

Ta = 25°C

– 9 –

ILX548K

Notes of Handling

1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material.

Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.

2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package:

(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter

of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm

b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be

generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.

c) Be aware that any of the following can cause the package to crack or dust to be generated.

(1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as

tweezers. (5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass. (6) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (7) Applying the metal a crash or a rub against the plastic portion.

Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered.

39N

Lower ceramic layer

Upper ceramic layer

Low-melting glass

(1)

29N

(3)

0.9Nm

(4)

29N

(2)

;

Plastic portion

Cover glass

39N

Ceramic portion

Adhesive

(1)

29N

(3)

0.9Nm

(4)

29N

(2)

– 10 –

ILX548K

3) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded

30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.

c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering

tool, ground the controller. For the control system, use a zero cross type.

4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.)

c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch

the glass.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions.

6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.

– 11 –

ILX548K

Package Outline Unit: mm

1

22

5.0 ± 0.5

H

V

No.1 Pixel (Green)

11

12

0° to 9°

(AT STAND OFF)

0.25

0.3

1. The height from the bottom to the sensor surface is 1.61 ± 0.3mm.

2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.

32.0 ± 0.5

10.0 ± 0.5

10.16

4.0 ± 0.5

2.54

0.51

2.7

3.4 ± 0.5

22pin DIP (400mil)

21.36 (4µm × 5340Pixels)

6.22 ± 0.5

Cer-DIP TIN PLATING 42 ALLOY

3.0g

M

PACKAGE STRUCTURE

PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER

LS-D15(E)

M

PACKAGE STRUCTURE

PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER

H

V

1

11

12

22

Plastic,Ceramic GOLD PLATING 42ALLOY

0.25

2.54

2.1

6.22 ± 0.3

10.16

0.51

0.3

0˚ to 9˚

10.0 ± 0.3

No.1 Pixel (Green)

21.36 (4µmX5340Pixels)

32.0 ± 0.3

5.0 ± 0.3

4.0 ± 0.5

2.8 ± 0. 5

1. The height from the bottom to the sensor surface is 1.61 ± 0.3mm.

2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.

22pin DIP (400mil)

2.21g LS-D13-01(E)

Sony Corporation