Page 1
10500 × 3 pixel CCD Linear Sensor (Color)
Description
The ILX734LA is a reduction type CCD linear sensor
developped for color image scanner, and has shutter
function per each color. This sensor reads A4-size
documents at a density of 1200 DPI.
Features
• Number of effective pixels: 31500 pixels
(10500 pixels × 3)
• Pixel size: 8µm × 8µm (8µm pitch)
• Distance between line: 64µm (8 lines)
• Single-sided readout
• Shutter function
• Ultra low lag/High sensitivity
• Single 12V power supply
• Input Clock Pulse: CMOS 5V drive
• Number of output 3 (R, G, B)
• Package: 56 pin SDIP (400 mil)
Absolute Maximum Ratings
• Supply voltage VDD 15 V
• Operating temperature –10 to +55 °C
• Storage temperature –30 to +80 °C
Pin Configuration (Top View)
Block Diagram
– 1 –
E99216-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX734LA
56 pin SDIP (Cer-DIP)
Driver
33
Driver
φSHUT
54
V
OUT-B
50
φ2
7
φ1
23
φ1
26
GND
25
φROG-
R
φRS
3
GND
6
GND
32
φROG
-B
31
φROG
-G
34
φ2
5
φLH
53
V
DD
Driver
24
Driver
φSHUT
55
V
OUT-G
Driver
Shutter Drain Shutter Gate
Read Out Gate
CCD Register
Red
D14
D15
D63
S1
S10500
D64
D83
Shutter Drain Shutter Gate
Read Out Gate
CCD Register
Green
D14
D15
D63
S1
S10500
D64
D83
Shutter Drain Shutter Gate
Read Out Gate
CCD Register
Blue
D14
D15
D63
S1
S10500
D64
D83
22
Driver
φSHUT
2
V
OUT-R
4
35
V
DD
1
2
3
4
5
6
7
22
23
24
25
26
27
28
29
30
31
32
33
34
35
50
51
52
53
54
55
56
NC
NC
V
OUT-R
GND
φRS
10500 R 1
10500 G 1
10500 B 1
φLH
GND
φ1
φSHUT
-R
φ1
φSHUT
-G
φROG-R
GND
NC
NC
NC
V
OUT-G
VOUT-B
VDD
NC
NC
φ2
V
DD
φ2
φSHUT
-B
φROG-B
φROG-G
NC
For the availability of this product, please contact the sales office.
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ILX734LA
Unit
pF
pF
pF
pF
Max.
—
—
—
—
Typ.
1600
10
10
10
Min.
—
—
—
—
Symbol
Cφ1, Cφ2
CφLH
CφRS
CφROG, CφSHUT
Item
Input capacity of φ1, φ2
Input capacity of φLH
Input capacity of φRS
Input capacity of φROG, φSHUT
∗1
Clock Characteristics
Unit
MHz
Max.
5
Typ.
1
Min.
—
Symbol
fφ1, fφ2, fφLH, fφRS
Item
Item
φ1, φ2, φLH, φRS
Clock Frequency
Unit
V
Max.
12.6
Typ.
12
Min.
11.4
Item
VDD
Recommended Supply Voltage
Unit
V
V
Max.
5.25
0.1
Typ.
5.0
0
Min.
4.75
—
High level
Low level
φ1, φ2, φLH, φRS, φROG, φSHUT pulse voltage
Input Clock Pulse Voltage Condition
Pin Description (Pins other than below are defined as NC.)
∗1
It indicates that φROG-R, φROG-G, φROG-B as φROG, φSHUT-R, φSHUT-G, φSHUT-B as φSHUT.
Pin
No.
Symbol Description
1
2
3
4
5
6
7
22
23
24
25
26
NC
VOUT-R
GND
φRS
φLH
GND
φ1
φSHUT-R
φ1
φSHUT-G
φROG-R
GND
NC
Signal out (red)
GND
Clock pulse input
Clock pulse input
GND
Clock pulse input
Clock pulse input
Clock pulse input
Clock pulse input
Clock pulse input
GND
Pin
No.
Symbol Description
31
32
33
34
35
50
51
52
53
54
55
56
φROG-G
φROG-B
φSHUT-B
φ2
VDD
φ2
NC
NC
VDD
VOUT-B
VOUT-G
NC
Clock pulse input
Clock pulse input
Clock pulse input
Clock pulse input
12V power supply
Clock pulse input
NC
NC
12V power supply
Signal out (blue)
Signal out (green)
NC
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ILX734LA
Unit
%
V
mV
mV
%
mA
%
Ω
V
—
Remarks
Note 3
Note 4
—
—
—
Note 8
Note 9
Max.
2.7
4.3
3.4
20
—
—
—
—
2.2
5.5
—
50
—
—
—
—
Typ.
2.0
3.2
2.5
6
3.2
1.6
1
1.28
0.3
1.5
0.02
26
95
250
6.5
10670
Min.
1.3
2.1
1.6
—
2
0.74
0.46
0.58
—
—
—
—
92
—
—
1000
Symbol
RR
RG
RB
PRNU
VSAT
SER
SEG
SEB
VDRK
DSNU
IL
IVDD
TTE
Zo
VOS
DR
Item
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
Supply current
Total transfer efficiency
Output impedance
Offset level
Dynamic range
Electrooptical Characteristics (Note 1)
(Ta = 25°C, VDD = 12V, fφRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm))
Notes)
1. In accordance with the given electrooptical characteristics, the black level is defined as the average value
of D2, D3 to D12.
2. For the sensitivity test light is applied with a uniform intensity of illumination.
3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.
VOUT-G = 500mV (Typ.)
PRNU = × 100 [%]
Where the 10500 pixels are divided into blocks of 100. The maximum output of each block is set to VMAX,
the minimum output to VMIN and the average output to VAVE.
4. Use below the minimum value of the saturation output voltage.
5. Saturation exposure is defined as follows.
SE = VSAT/R
Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB.
6. Optical signal accumulated time τ int stands at 11ms.
7. VOUT-G = 500mV (Typ.)
8. Vos is defined as indicated bellow.
VOUT indicates VOUT-R, VOUT-G, and VOUT-B.
9. Dynamic range is defined as follows.
DR = VSAT/VDRK
When the optical signal accumulated time is shorter, the dynamic range gets wider because the optical
signal accumulated time is in proportion to the dark voltage.
(VMAX – VMIN)/2
VAVE
Sensitivity
Saturation exposure
Red
Green
Blue
Red
Green
Blue
V/(lx · s) Note 2
lx · s Note 5
Note 7
Note 6
Note 6
,
,
VOS
VOUT
GND
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ILX734LA
2
1
0
5
0
5
3
4
φROG
φ1
φLH
5φ20
5
φRS
0
VOUT
,
D1
D2
D3
D13
D14
D15
D61
D62
D63
S1
S10500
S64
S71
D72
D73
D78
D79
D83
10583
Optical black (49 pixels)
Dummy signal (63 pixels)
1-line output period (10583 pixels)
Note) The transfer pulses (φ1, φ2, φLH) must have more than 10583 cycles.
V
OUT indicates VOUT-R, VOUT-G, VOUT-B.
Clock Timing Chart 1
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ILX734LA
Clock Timing Chart 2
t4 t5
φROG
t2
t6 t7
φ1
φ2
t1 t3
Clock Timing Chart 3
,
φ1
φLH
φ2
V
OUT
t13
t12
t7 t6
,
,
φRS
t8
t10 t11
t9
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ILX734LA
2
1
0
5
0
5
3
4
φROG
φ1
φLH
5φ20
5
φRS
0
φSHUT
Integration time
10583
Clock Timing Chart 4 (Shutter Operation)
Note) Shutter pulse must not be low level during from 2 to 10583 of φ1.
Integration time can be controlled by changing the timing φSHUT fall.
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ILX734LA
Clock Pulse Recommended Timing
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Max.
—
—
—
10
10
60
60
—
—
30
30
—
—
Typ.
100
3000
3000
5
5
20
20
250
∗1
250
∗1
10
10
10
10
Min.
50
1200
1200
0
0
0
0
45
45
0
0
—
—
Symbol
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
Item
φROG, φ1 pulse timing
φROG pulse high level period
φROG, φ1 pulse timing
φROG pulse rise time
φROG pulse fall time
φ1 pulse rise time/φ2 pulse fall time
φ1 pulse fall time/φ2 pulse rise time
φRS pulse high level period
φRS, φLH pulse timing
φRS pulse rise time
φRS pulse fall time
Signal output delay time
∗1
These timing data are the recommended condition under fφRS = 1MHz.
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ILX734LA
1
2
3
4 5 6
7
22
23
24 25 26
27 28
29
56 55
54
53 52 51
50
35 34 33 32 31 30
NC
2Ω
IC1
IC1
IC1: 74AC04
Tr1: 2SC2785
NC
VOUT-G
VDD
VOUT-B
NC
NC
φ2
VDD
φ2
φSHUT-
B
φROG-B
φROG-G
φ2
φROG
-B
φROG-G
NC
NC
NC
VOUT-R
GND
φRS
φLH
GND
φ1
φSHUT-
R
φ1
φSHUT-
G
φROG-R
GND
NC
φSHUT-B
100Ω 2Ω
φRS
φLH
100Ω
12V
47µF/
16V
0.1µF
φ1
φSHUT-
G
φROG-R
φSHUT-R
5.1kΩ
100Ω
V
OUT-B
Tr1
5.1kΩ
100Ω
V
OUT-G
Tr1
5.1kΩ
100Ω
VOUT-R
Tr1
Application Circuit
∗1
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
∗1
Data rate fφRS = 1MHz. In the case of fφRS = 5MHz, 3 pieces of 74AC04 are recommended to use for φ1 and φ2 driver.
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ILX734LA
Example of Representative Characteristics (VDD = 12V, Ta = 25°C)
Spectral sensitivity characteristics
(Standard characteristics)
Wavelength [nm]
Relative sensitivity
550 600 650400
0
0.2
0.4
0.6
0.8
1
450 500 700
Dark signal output temperature characteristics
(Standard characteristics)
Integration time output voltage characteristics
(Standard characteristics)
Ta – Ambient temperature [°C]
Output voltage rate
30 40 500
0.1
0.5
1
5
10
10 20 60
τ int – Integration time [ms]
Output voltage rate
51
0.1
0.5
1
10
Offset level vs. temperature characteristics
(Standard characteristics)
Offset level vs. VDD characteristics
(Standard characteristics)
Ta – Ambient temperature [°C]
Vos – Offset level [V]
30 40 500
0
2
4
6
8
10
12
10 20 60
∆Vos
∆Ta
–0.5mV/°C
VDD [V]
Vos – Offset level [V]
12.011.4
0
2
4
6
8
10
12
12.6
∆Vos
∆V
DD
0.3
Ta = 25°C
Page 10
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ILX734LA
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Cer-DIP Packages
The following points should be observed when handling and installing cer-DIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after it
has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
Upper ceramic layer 39N
Lower ceramic layer
Low-melting glass
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
Page 11
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ILX734LA
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch
the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
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ILX734LA
Package Outline Unit: mm
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
Cer-DIP
TIN PLATING
42ALLOY
LS-E4(E)
1. The point “A” of the package is the horizontal reference.
The two points “A'” of the package are the vertical reference.
2. The height from the bottom “B” to the effective image area is 2.4 ± 0.30mm.
3. The thickness of the cover glass is 0.8mm, and the refractive index is 1.5.
4. The notch of the package must not be used for reference of fixing.
56Pin DIP ( 400mil )
(AT STAND OFF)
1 14
56 43
15
28
29
42
V
H
10.16
4.0 ± 0.5
1.27 29.21
29.21
0.46
3.6
4.4 ± 0.5
8.8
10.0 ± 1.0
84.0 ( 8µm X 10500 Pixels )
113.0 ± 1.0
No.1 Pixel (Green)
0.25
110.0
15.0 ± 0.8
5.0 ± 0.8
5.0
97.0
3.0
3.0
7.0
2.0
A
0˚ to 9˚
A'
A'
~ ~
~
B
13.5g
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