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DISCRETE SEMICONDUCTORS
DATA SHEET
PDZ-B series
Voltage regulator diodes
Product data sheet |
2004 Mar 22 |
Supersedes data of 2002 Feb 18 |
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NXP Semiconductors |
Product data sheet |
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Voltage regulator diodes |
PDZ-B series |
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FEATURES
•Total power dissipation: max. 400 mW
•Small plastic package suitable for surface mounted design
•Wide variety of voltage ranges: nominal 2.4 to 36 V (E24 range)
•Tolerance approximately ±2%.
APPLICATIONS
• General voltage regulation.
DESCRIPTION
Low-power general purpose voltage regulator diodes in a small plastic SMD SOD323 (SC-76) package.
MARKING
PINNING
PIN |
DESCRIPTION |
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1 |
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cathode |
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2 |
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anode |
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handbook, |
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Top view |
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MAM387 |
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The marking bar indicates the cathode.
Fig.1 Simplified outline (SOD323; SC-76) and symbol.
TYPE |
MARKING |
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TYPE |
MARKING |
TYPE |
MARKING |
TYPE |
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MARKING |
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NUMBER |
CODE |
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NUMBER |
CODE |
NUMBER |
CODE |
NUMBER |
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CODE |
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PDZ2.4B |
Z0 |
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PDZ5.1B |
Z8 |
PDZ11B |
ZG |
PDZ24B |
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ZQ |
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PDZ2.7B |
Z1 |
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PDZ5.6B |
Z9 |
PDZ12B |
ZH |
PDZ27B |
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ZR |
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PDZ3.0B |
Z2 |
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PDZ6.2B |
ZA |
PDZ13B |
ZJ |
PDZ30B |
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ZS |
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PDZ3.3B |
Z3 |
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PDZ6.8B |
ZB |
PDZ15B |
ZK |
PDZ33B |
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ZT |
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PDZ3.6B |
Z4 |
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PDZ7.5B |
ZC |
PDZ16B |
ZL |
PDZ36B |
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ZU |
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PDZ3.9B |
Z5 |
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PDZ8.2B |
ZD |
PDZ18B |
ZM |
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PDZ4.3B |
Z6 |
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PDZ9.1B |
ZE |
PDZ20B |
ZN |
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PDZ4.7B |
Z7 |
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PDZ10B |
ZF |
PDZ22B |
ZP |
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ORDERING INFORMATION |
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TYPE |
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PACKAGE |
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NUMBER |
NAME |
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DESCRIPTION |
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VERSION |
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PDZ2.4B to |
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plastic surface mounted package; 2 leads |
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SOD323 |
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PDZ36B |
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2004 Mar 22 |
2 |
NXP Semiconductors |
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Product data sheet |
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Voltage regulator diodes |
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PDZ-B series |
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LIMITING VALUES |
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In accordance with the Absolute Maximum Rating System (IEC 60134). |
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SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
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MAX. |
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UNIT |
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IF |
continuous forward current |
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200 |
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mA |
IZSM |
non-repetitive peak reverse current |
tp = 100 μs; square wave; |
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see Table 2 |
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Tamb = 25 °C prior to surge |
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Ptot |
total power dissipation |
Tamb = 25 °C; note 1; |
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400 |
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mW |
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see Fig.2 |
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Tstg |
storage temperature |
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−65 |
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+150 |
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°C |
Tj |
junction temperature |
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150 |
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°C |
Note
1. Device mounted on a printed-circuit board measuring 11 × 25 × 1.6 mm.
THERMAL CHARACTERISTICS
SYMBOL |
PARAMETER |
CONDITIONS |
VALUE |
UNIT |
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Rth(j-s) |
thermal resistance from junction to soldering point |
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130 |
K/W |
Rth(j-a) |
thermal resistance from junction to ambient |
note 1 |
340 |
K/W |
Note
1. Device mounted on a printed-circuit board measuring 11 × 25 × 1.6 mm.
2004 Mar 22 |
3 |
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