Diodes DMP32D9UFZ User Manual

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Diodes DMP32D9UFZ User Manual

NEW PRODUCT

DMP32D9UFZ

P-CHANNEL ENHANCEMENT MODE MOSFET

Product Summary

V(BR)DSS

RDS(ON) max

ID max

TA = +25°C

 

 

 

5Ω @ VGS = -4.5V

 

-30V

6Ω @ VGS = -2.5V

-0.2A

7Ω @ VGS = -1.8V

 

 

 

10Ω @ VGS = -1.5V

 

Description and Applications

This MOSFET has been designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

General Purpose Interfacing Switch

Power Management Functions

Analog Switch

ESD PROTECTED

Features and Benefits

Low Package Profile, 0.42mm Maximum Package height

0.62mm x 0.62mm Package Footprint

Low On-Resistance

Very low Gate Threshold Voltage, 1.0V max

ESD Protected Gate

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Mechanical Data

Case: X2-DFN0606-3

Case Material: Molded Plastic, “Green” Molding Compound UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Finish – NiPdAu over Copper leadframe Solderable per MIL-STD-202, Method 208 e4

Weight: 0.001 grams (approximate)

Bottom View

Equivalent Circuit

Top View

 

 

Package Pin Configuration

Ordering Information (Note 4)

 

Part Number

Case

 

Packaging

 

DMP32D9UFZ-7B

X2-DFN0606-3

 

10K/Tape & Reel

Notes:

1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

 

2.See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogenand Antimony-free, "Green" and Lead-free.

3.Halogenand Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

4.For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

U2 = Product Type Marking Code

Top View

Bar Denotes Gate

and Source Side

DMP32D9UFZ

1 of 6

June 2014

Document number: DS36842 Rev. 2 - 2

www.diodes.com

© Diodes Incorporated

NEW PRODUCT

 

 

 

 

 

DMP32D9UFZ

 

 

 

 

 

 

 

 

 

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

 

 

 

 

 

 

 

 

Symbol

 

 

 

 

Characteristic

 

 

Value

 

Units

 

Drain-Source Voltage

 

 

VDSS

-30

 

V

 

Gate-Source Voltage

 

 

VGSS

±10

 

V

 

Continuous Drain Current (Note 5) VGS = -4.5V

Steady

TA = +25°C

ID

-200

 

mA

 

State

TA = +70°C

-100

 

 

 

 

 

 

 

Pulsed Drain Current (Note 6)

 

 

IDM

-500

 

mA

 

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

 

 

Characteristic

 

 

 

 

 

Symbol

 

 

Value

Units

 

Total Power Dissipation (Note 5)

 

 

 

Steady State

PD

 

390

mW

 

Thermal Resistance, Junction to Ambient (Note 5)

 

 

Steady State

RθJA

 

322

°C/W

 

Operating and Storage Temperature Range

 

 

 

 

 

 

TJ, TSTG

 

 

-55 to +150

°C

 

 

 

 

 

 

 

 

 

 

 

 

 

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

 

 

 

 

 

 

 

 

 

 

 

 

Typ

 

 

 

 

 

 

 

 

Characteristic

 

Symbol

Min

 

Max

 

Unit

 

Test Condition

 

OFF CHARACTERISTICS (Note 7)

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain-Source Breakdown Voltage

 

BVDSS

-30

 

 

V

 

VGS = 0V, ID = -250μA

 

Zero Gate Voltage Drain Current

@TC = +25°C

IDSS

 

100

 

nA

 

VDS = -24V, VGS = 0V

 

Gate-Source Leakage

 

IGSS

 

±10

 

µA

 

VGS = ±10V, VDS = 0V

 

ON CHARACTERISTICS (Note 7)

 

 

 

 

 

 

 

 

 

 

 

 

 

Gate Threshold Voltage

 

VGS(th)

-0.4

 

-1.0

 

V

 

VDS = VGS, ID = -250μA

 

 

 

 

 

 

5

 

 

 

VGS = -4.5V, ID = -100mA

 

 

 

 

 

 

6

 

 

 

VGS = -2.5V, ID = -50mA

 

Static Drain-Source On-Resistance

 

RDS (ON)

 

7

 

 

VGS = -1.8V, ID = -20mA

 

 

 

 

 

 

10

 

 

 

VGS = -1.5V, ID = -10mA

 

 

 

 

 

6

 

 

 

 

VGS = -1.2V, ID = -1mA

 

Diode Forward Voltage

 

VSD

-0.75

 

-1.0

 

V

 

VGS = 0V, IS = -10mA

 

DYNAMIC CHARACTERISTICS (Note 8)

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

Ciss

22.5

 

 

pF

 

VDS = -15V, VGS = 0V,

 

Output Capacitance

 

Coss

2.9

 

 

pF

 

 

 

 

 

 

f = 1.0MHz

 

 

Reverse Transfer Capacitance

 

Crss

2.1

 

 

pF

 

 

 

 

 

 

 

 

 

 

Total Gate Charge

 

Qg

0.35

 

 

nC

 

VGS = -4.5V, VDS =- 15V,

 

Gate-Source Charge

 

Qgs

0.06

 

 

nC

 

 

 

 

 

 

ID = -200mA

 

 

Gate-Drain Charge

 

Qgd

0.09

 

 

nC

 

 

 

 

 

 

 

 

 

 

Turn-On Delay Time

 

tD(on)

3.1

 

 

ns

 

 

 

 

Turn-On Rise Time

 

tr

2.3

 

 

ns

 

VDD = -10V, VGS = -4.5V,

 

Turn-Off Delay Time

 

tD(off)

19.9

 

 

ns

 

RG = 6Ω, ID = -200mA

 

Turn-Off Fall Time

 

tf

10.5

 

 

ns

 

 

 

 

Notes:

5. Device mounted on FR-4 PCB, with minimum recommended pad layout.

 

 

 

 

 

 

 

 

6.Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%.

7.Short duration pulse test used to minimize self-heating effect.

8.Guaranteed by design. Not subject to product testing.

DMP32D9UFZ

2 of 6

June 2014

Document number: DS36842 Rev. 2 - 2

www.diodes.com

© Diodes Incorporated

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