Diodes AP2301FGEG, AP2301SN, AP2311FGEG, AP2311SN, AP2301M8G Schematic [ru]

AP2301/AP2311

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2301 and AP2311 are single channel current-limited integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB standards and is available with both polarities of Enable input.

The devices have fast short-circuit response time for improved overall system robustness, and have integrated output discharge function to ensure completely controlled discharging of the output voltage capacitor. They provide a complete protection solution for applications subject to heavy capacitive loads and the prospect of short circuit, and offer reverse current blocking, over-current, over-temperature and short-circuit protection, as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the opendrain Flag output prevents false over-current reporting and does not require any external components.

All devices are available in SO-8, MSOP-8, MSOP-8EP, U-DFN3030- 8 and U-DFN2020-6 packages.

Features

Pin Assignments

				( Top View )
GND		1					8		NC
	IN								OUT
		2					7
									OUT
	IN	3					6
	EN								FLG
		4					5
					SO-8
				( Top View )
GND											NC
	1
									8
IN											OUT
	2								7
IN											OUT
	3								6
EN											FLG
	4
									5

MSOP-8 /MSOP-8EP Note: latter with exposed pad

(dotted line)

(Top View)

•Single channel current-limited power switch

•Output discharge function

•Fast short-circuit response time: 2µs

•2.5A accurate current limiting

•Reverse current blocking

•70mΩ on-resistance

•Input voltage range: 2.7V - 5.5V

•Built-in soft-start with 0.6ms typical rise time

•Over-current and thermal protection

•Fault report (FLG) with blanking time (7ms typ)

•ESD protection: 2kV HBM, 200V MM

•Ambient temperature range: -40°C to +85°C

•SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6: Available in “Green” Molding Compound (No Br, Sb)

GND	1						8	NC
IN	2					7		OUT

IN

3

6

OUT

EN
	4			5 FLG

U-DFN3030-8 Type E

	Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2)	U-DFN2020-6
	Halogen and Antimony Free. “Green” Device (Note 3)
	• UL Recognized, File Number E322375
	• IEC60950-1 CB Scheme Certified	Applications
		• LCD TVs & Monitors
		• Set-Top-Boxes, Residential Gateways
		• Laptops, Desktops, Servers, e-Readers, Printers, Docking
		Stations, HUBs

Notes:	1.	No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
	2.	See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogenand Antimony-free, "Green"
		and Lead-free.
	3.	Halogenand Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
		<1000ppm antimony compounds.

AP2301/AP2311	1 of 18	February 2014
Document number: DS32241 Rev. 5 - 2	www.diodes.com	© Diodes Incorporated

AP2301/AP2311

Typical Applications Circuit

Enable Active High

IN

OUT

Load

Power Supply

2.7V to 5.5V

10k

0.1uF

0.1uF

120uF

FLG

EN

GND

ON

OFF

Available Options

Part Number

Channel

Enable Pin (EN)

Recommended Maximum

Typical Current

Package

Continuous Load Current (A)

Limit (A)

AP2301

1

Active Low

SO-8

MSOP-8

2A

2.5A

MSOP-8EP

AP2311

1

Active High

U-DFN3030-8

U-DFN2020-6

Pin Descriptions

Pin

Pin Number

Function

SO-8,

MSOP-8EP,

Name

U-DFN2020-6

MSOP-8

U-DFN3030-8

GND

1

1

2

Ground

IN

2, 3

2, 3

1

Voltage Input Pin; Connect a 0.1µF or larger ceramic capacitor from IN to GND as

close as possible. (all IN pins must be tied together externally)

EN

4

4

3

Enable input, active low (AP2301) or active high (AP2311)

FLG

5

5

4

Over-temperature and over-current fault reporting with 7ms deglitch; active low open-

drain output. FLG is disabled for 7ms after turn-on.

OUT

6, 7

6, 7

5

Voltage Output Pin All OUT pins must be tied together externally.

NC

8

8

6

NC:

No Internal Connection; recommend tie to OUT pins

Exposed

—

Exposed

Exposed

Exposed pad.

It should be externally connected to GND and thermal mass for enhanced thermal

Pad

Pad

Pad

impedance. It should not be used as electrical ground conduction path.

AP2301/AP2311	2 of 18	February 2014
Document number: DS32241 Rev. 5 - 2	www.diodes.com	© Diodes Incorporated

AP2301/AP2311

Functional Block Diagram

	IN	Current	OUT
		Sense

	UVLO			Discharge
				Control
	EN	Driver	Current
			Limit	FLG
		Thermal		Deglitch
		Sense
				GND

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Symbol	Parameter		Ratings	Unit
ESD HBM	Human Body Model ESD Protection	2		kV
ESD MM	Machine Model ESD Protection	200		V
VIN	Input Voltage (Note 4)		-0.3 to 6.5	V
VOUT	Output Voltage (Note 4)		-0.3 to (VIN +0.3) or 6.5	V
VEN , VFLG	Enable Voltage (Note 4)		-0.3 to (VIN +0.3) or 6.5	V
ILOAD	Maximum Continuous Load Current		Internal Limited	A
TJ(MAX)	Maximum Junction Temperature	150		°C
TST	Storage Temperature Range (Note 5)		-65 to +150	°C

Notes: 4. All voltages referred to GND pin. Maximums are the lower of (VIN +0.3) and 6.5V

5.UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices.

Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)

Symbol	Parameter	Min	Max	Unit
VIN	Input voltage	2.7	5.5	V
IOUT	Output Current	0	2	A
VIL	EN Input Logic Low Voltage	0	0.8	V
VIH	EN Input Logic High Voltage	2	VIN	V
TA	Operating Ambient Temperature	-40	+85	°C

AP2301/AP2311	3 of 18	February 2014
Document number: DS32241 Rev. 5 - 2	www.diodes.com	© Diodes Incorporated

AP2301/AP2311

Electrical Characteristics (@TA = +25°C, VIN = +5V, CIN = 0.1µF, CL = 1µF, unless otherwise specified.)

Symbol		Parameter	Test Conditions		Min	Typ	Max	Unit
VUVLO		Input UVLO	VIN rising		1.6	2.0	2.4	V
∆VUVLO		Input UVLO Hysteresis	VIN decreasing			50		mV
ISHDN		Input Shutdown Current	Disabled, OUT = open			0.1	1	µA
IQ		Input Quiescent Current	Enabled, OUT = open			60	100	µA
ILEAK		Input Leakage Current	Disabled, OUT grounded			0.1	1	µA
IREV		Reverse Leakage Current	Disabled, VIN = 0V, VOUT = 5V, IREV at VIN			0.01	1	µA
			VIN = 5V, IOUT= 2.0A	TA = +25°C		70	84
RDS(ON)		Switch on-resistance		-40°C ≤ TA ≤ +85°C			105	mΩ
			VIN = 3.3V, IOUT = 2.0A	TA = +25°C		90	108
				-40°C ≤ TA ≤ +85°C			135
ILIMIT		Over-Load Current Limit (Note 6)	VIN = 5V, VOUT = 4.5V	-40°C ≤ TA ≤ +85°C	2.05	2.50	2.85	A
ITrig		Current limiting trigger threshold	Output Current Slew rate (<100A/s)			2.5		A
ISHORT		Short-Circuit Current Limit	Enabled into short circuit			2.75		A
TSHORT		Short-circuit Response Time	VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground)			2		µs
VIL		EN Input Logic Low Voltage	VIN = 2.7V to 5.5V				0.8	V
VIH		EN Input Logic High Voltage	VIN = 2.7V to 5.5V		2			V
ILEAK-EN		EN Input leakage	VIN = 5V, VEN = 0V and 5.5V			0.01	1	µA
ILEAK-O		Output leakage current	Disabled, VOUT = 0V			0.5	1	µA
TD(ON)		Output turn-on delay time	CL= 1µF, RLOAD = 5Ω			0.1		ms
TR		Output turn-on rise time	CL= 1µF, RLOAD = 5Ω			0.6	1.5	ms
TD(OFF)		Output turn-off delay time	CL= 1µF, RLOAD = 5Ω			0.1		ms
TF		Output turn-off fall time	CL= 1µF, RLOAD = 5Ω			0.05	0.1	ms
RFLG		FLG output FET on-resistance	IFLG = 10mA			20	40	Ω
IFOH		FLG Off Current	VFLG= 5V			0.01	1	µA
TBlank		FLG blanking time	Assertion or deassertion due to overcurrent and over-		4	7	15	ms
			temperature condition
TDIS		Discharge time	CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V			0.6		ms
RDIS		Discharge resistance (Note 7)	VIN = 5V, disabled, IOUT= 1mA			100		Ω
TSHDN		Thermal Shutdown Threshold	Enabled			140		°C
THYS		Thermal Shutdown Hysteresis				20		°C
			SO-8 (Note 8)			96		°C/W
		Thermal Resistance Junction-to-	MSOP-8 (Note 8)			130		°C/W
θJA			MSOP-8-EP (Note 9)			92		°C/W
		Ambient
			U-DFN3030-8 (Note 9)			84		°C/W
			U-DFN2020-6 (Note 10)			90		°C/W
Notes:	6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.

7.The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time.

8.Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

9.Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.

10.Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.

AP2301/AP2311	4 of 18	February 2014
Document number: DS32241 Rev. 5 - 2	www.diodes.com	© Diodes Incorporated

							AP2301/AP2311
Typical Performance Characteristics
VEN	50%		50%	VEN	50%		50%
		TR	TD(OFF)		TR		TD(OFF)
			TF				TF
	TD(ON)	90%	90%		TD(ON)	90%	90%
VOUT		10%	10%	VOUT	10%		10%
		Figure 1. Voltage Waveforms: AP2301 (left), AP2311 (right)
			All Enable Plots are for Enable Active Low
Turn-On Delay and Rise Time					Turn-Off Delay and Fall Time
VOUT			TA=25°C	VOUT			TA=25°C
			V =5V	2V/div			VIN=5V
2V/div			IN
			CL=1uF				CL=1uF
VEN			ROUT=2.5Ω	VEN			ROUT=2.5Ω
5V/div				5V/div

Device enabled

Device disabled

	IIN	IIN
	1A/div
		1A/div

	Turn-On Delay and Rise Time		Turn-Off Delay and Fall Time
			TA=25°C
	TA=25°C	VOUT	VIN=5V
VOUT	VIN=5V	2V/div	CL=120uF
	CL=120uF		ROUT=2.5Ω
2V/div
	ROUT=2.5Ω	VEN
	Device enabled	5V/div
VEN			Device disabled
5V/div
IIN	Inrush current limit	IIN
1A/div
		1A/div

AP2301/AP2311	5 of 18	February 2014
Document number: DS32241 Rev. 5 - 2	www.diodes.com	© Diodes Incorporated

AP2301/AP2311

Typical Performance Characteristics (cont.)

Device Enabled Into Short-Circuit

	VEN	TA=25°C
		VIN=5V
	5V/div
		CL=120uF
		ROUT=1Ω

IOUT

1A/div

Full-Load to Short-Circuit

Transient Response

VOUT	Output short	TA=25°C
2V/div	circuited	VIN=5V
		ROUT=2.5Ω
IIN
2A/div

Device turns off and re-enables into current limit

FLG 5V/div

No-Load to Short-Circuit

Transient Response

	VOUT	Output short	TA=25°C
	2V/div
		circuited	VIN=5V

ROUT=0Ω

IIN
2A/div	Device enters current limit
FLG
5V/div

Inrush Current

	VEN	TA=25°C
		VIN=5V
	5V/div
		ROUT=2.5Ω

CL=120uF CL=220uF

	IOUT	CL=470uF
	1A/div

Short-Circuit to Full-Load

Recovery Response

Output short	TA=25°C
circuit removed
VOUT	VIN=5V
2V/div	ROUT=2.5Ω

IIN	Short circuit present and
2A/div	device thermal cycles
FLG
5V/div

Short-Circuit to No-Load

Recovery Response

	Output short
VOUT	circuit removed	TA=25°C
		VIN=5V
2V/div		ROUT=0Ω
IIN	Short circuit present and
2A/div	device thermal cycles

FLG 5V/div

AP2301/AP2311	6 of 18	February 2014
Document number: DS32241 Rev. 5 - 2	www.diodes.com	© Diodes Incorporated