Motorola PZT2222AT1, PZT2222AT3 Datasheet

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Motorola PZT2222AT1, PZT2222AT3 Datasheet

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by PZT2222AT1/D

NPN Silicon Planar

Epitaxial Transistor

This NPN Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications.

PNP Complement is PZT2907AT1

The SOT-223 package can be soldered using wave or reflow.

SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.

Available in 12 mm tape and reel

 

COLLECTOR

Use PZT2222AT1 to order the 7 inch/1000 unit reel.

 

2, 4

Use PZT2222AT3 to order the 13 inch/4000 unit reel.

 

 

 

 

 

 

BASE

 

 

1

 

 

 

3

 

 

 

EMITTER

PZT2222AT1

Motorola Preferred Device

SOT-223 PACKAGE

NPN SILICON

TRANSISTOR

SURFACE MOUNT

1

3

CASE 318E-04, STYLE 1

TO-261AA

MAXIMUM RATINGS

Rating

Symbol

 

Value

Unit

 

 

 

 

 

 

Collector-Emitter Voltage

VCEO

 

40

Vdc

Collector-Base Voltage

VCBO

 

75

Vdc

Emitter-Base Voltage (Open Collector)

VEBO

 

6.0

Vdc

Collector Current

IC

 

600

mAdc

Total Power Dissipation up to T = 25°C(1)

P

 

1.5

Watts

A

D

 

 

 

 

Storage Temperature Range°

Tstg

± 65 to +150

°C

Junction Temperature°

TJ

 

150

°C

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

Thermal Resistance from Junction to Ambient

RqJA

 

83.3

°C/W

Lead Temperature for Soldering, 0.0625″ from case

TL

 

260

°C

Time in Solder Bath

 

 

10

Sec

 

 

 

 

 

 

DEVICE MARKING

 

 

 

 

 

 

 

 

 

 

 

P1F

 

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

 

 

 

 

 

Characteristic

Symbol

Min

 

Max

Unit

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

Collector-Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0)

V(BR)CEO

40

 

Ð

Vdc

Collector-Base Breakdown Voltage (IC = 10 mAdc, IE = 0)

V(BR)CBO

°75°

 

°Ð °

Vdc

Emitter-Base Breakdown Voltage (IE = 10 mAdc, IC = 0)

V(BR)EBO

6.0

 

Ð

Vdc

Base-Emitter Cutoff Current (VCE = 60 Vdc, VBE = ± 3.0 Vdc)

IBEX

Ð

 

20

nAdc

Collector-Emitter Cutoff Current (VCE = 60 Vdc, VBE = ± 3.0 Vdc)

ICEX

Ð

 

10

nAdc

Emitter-Base Cutoff Current (VEB = 3.0 Vdc, IC = 0)

IEBO

Ð

 

100

nAdc

1. Device mounted on an epoxy printed circuit board 1.575 inches x 1.575 inches x 0.059 inches; mounting pad for the collector lead min. 0.93 inches2.

Thermal Clad is a trademark of the Bergquist Company

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola, Inc. 1996

PZT2222AT1

ELECTRICAL CHARACTERISTICS Ð continued (TA = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Max

Unit

 

 

 

 

 

OFF CHARACTERISTICS (continued)

Collector-Base Cutoff Current

ICBO

Ð

10

nAdc

(VCB = 60

Vdc, IE = 0)

 

(VCB = 60

Vdc, IE = 0, TA = 125°C)

 

Ð

10

μAdc

ON CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

DC Current Gain

 

hFE

 

 

Ð

(IC = 0.1 mAdc, VCE = 10 Vdc)

 

35

Ð

 

(IC = 1.0 mAdc, VCE = 10 Vdc)

 

50

Ð

 

(IC = 10 mAdc, VCE = 10 Vdc)

 

70

Ð

 

(IC = 10 mAdc, VCE = 10 Vdc, TA = ± 55°C)

 

35

Ð

 

(IC = 150 mAdc, VCE = 10 Vdc)

 

100

300

 

(IC = 150 mAdc, VCE = 1.0 Vdc)

 

50

Ð

 

(IC = 500 mAdc, VCE = 10 Vdc)

 

40

Ð

 

Collector-Emitter Saturation Voltages

VCE(sat)

 

 

Vdc

(IC = 150 mAdc, IB = 15 mAdc)

 

Ð

0.3

 

(IC = 500 mAdc, IB = 50 mAdc)

 

Ð

1.0

 

Base-Emitter Saturation Voltages

VBE(sat)

 

 

Vdc

(IC = 150 mAdc, IB = 15 mAdc)

 

0.6

1.2

 

(IC = 500 mAdc, IB = 50 mAdc)

 

Ð

2.0

 

Input Impedance°

 

°hie°

 

 

kΩ

(VCE = 10

Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

 

2.0

8.0

 

(VCE = 10

Vdc, IC = 10 mAdc, f = 1.0 kHz)

 

0.25

1.25

 

Voltage Feedback Ratio

hre

 

8.0x10-4

Ð

(V

CE

= 10

Vdc, I = 1.0 mAdc, f = 1.0 kHz)

 

Ð

 

 

 

 

C

 

 

4.0x10-4

 

(V

CE

= 10

Vdc, I = 10 mAdc, f = 1.0 kHz)

 

Ð

 

 

 

 

C

 

 

 

 

Small-Signal Current Gain

hfe

 

 

Ð

(VCE = 10

Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

 

50

300

 

(VCE = 10

Vdc, IC = 10 mAdc, f = 1.0 kHz)

 

75

375

 

Output Admittance°

°hoe°

 

 

μmhos

(VCE = 10

Vdc, IC = 1.0 mAdc, f = 1.0 kHz)

 

5.0

35

 

(VCE = 10

Vdc, IC = 10 mAdc, f = 1.0 kHz)

 

25

200

 

Noise Figure (VCE = 10 Vdc, IC = 100 μAdc, f = 1.0 kHz)

F

Ð

4.0

dB

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

Current-Gain Ð Bandwidth Product

fT

300

Ð

MHz

(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)

 

 

 

 

Output Capacitance

Cc

Ð

8.0

pF

(VCB = 10

Vdc, IE = 0, f = 1.0 MHz)

 

 

 

 

Input Capacitance

 

Ce

Ð

25

pF

(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)

 

 

 

 

SWITCHING TIMES (TA = 25°C)

 

 

 

 

Delay Time

 

(VCC = 30 Vdc, IC = 150 mAdc,

td

Ð

10

ns

 

 

 

 

IB(on) = 15 mAdc, VEB(off) = 0.5 Vdc)

 

 

 

 

Rise Time

 

tr

Ð

25

 

 

Figure 1

 

Storage Time

(VCC = 30 Vdc, IC = 150 mAdc,

ts

Ð

225

ns

 

 

 

 

IB(on) = IB(off) = 15 mAdc)

 

 

 

 

Fall Time

 

tf

Ð

60

 

 

Figure 2

 

2

Motorola Small±Signal Transistors, FETs and Diodes Device Data

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