Motorola MC10H105P, MC10H105FN Datasheet

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SEMICONDUCTOR TECHNICAL DATA

   

The MC10H105 is a triple 2–3–2–input OR/NOR gate. This MECL 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increases in power–supply current.

• Propagation Delay, 1.0 ns Typical

• Power Dissipation 25 mW/Gate (same as MECL 10K)

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V Input Voltage (VCC = 0) V Output Current— Continuous

— Surge Operating Temperature Range T Storage Temperature Range— Plastic

— Ceramic

out

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I Input Current High I Input Current Low I High Output Voltage V Low Output Voltage V High Input Voltage V Low Input Voltage V

inH

inL

— 23 — 21 — 23 mA — 425 — 265 — 265 µA

0.5 — 0.5 — 0.3 — µA –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

AC PARAMETERS

Propagation Delay t Rise Time t Fall Time t

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.

0.4 1.2 0.4 1.2 0.4 1.3 ns

0.5 1.5 0.5 1.6 0.5 1.7 ns

–8.0 to 0 Vdc 0 to V

100

0 to +75 °C

–55 to +150 –55 to +165

Vdc

°C °C



L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

LOGIC DIAGRAM

43 5

9 10 11

13 14 12

= PIN 1

CC1

= PIN 16

CC2

VEE = PIN 8

DIP

PIN ASSIGNMENT

OUT

CC1

1 2 3 4 5 6 7 8

16 15 14 13 12 11 10

6 7

CC2

OUT

3/93

 Motorola, Inc. 1996

2–128

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

REV 5

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H105

–L–

20 1

0.010 (0.250) N

–N–

L–M

Y BRK

–M–

0.007 (0.180) N

0.004 (0.100)

PLANE

SEATING

–T–

VIEW S

0.007 (0.180) N

L–M

0.010 (0.250) N

L–M

VIEW D–D

L–M

0.007 (0.180) N

L–M

0.007 (0.180) N

L–M

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).

2–129 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

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