Mitsubishi Electric Corporation Semiconductor Group FK20SM-10 Datasheet

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MITSUBISHI Nch POWER MOSFET

FK20SM-10

HIGH-SPEED SWITCHING USE

FK20SM-10

 

OUTLINE DRAWING

Dimensions in mm

 

 

15.9MAX.

 

4.5

 

 

 

 

 

 

1.5

 

 

 

r

 

 

 

 

 

5.0

20.0

 

 

 

φ 3.2

 

 

 

 

 

 

 

 

 

 

2

 

 

 

 

2

 

4

 

 

 

 

 

4.4

 

 

 

 

19.5MIN.

 

 

1.0

 

 

 

 

q w

e

 

 

 

 

5.45

5.45

0.6

2.8

 

 

4

 

 

 

 

 

w r

 

 

 

 

 

 

 

q GATE

 

¡VDSS

500V

q

 

w DRAIN

 

 

e SOURCE

 

 

0.36Ω

 

 

 

¡rDS (ON) (MAX)

 

 

r DRAIN

 

 

 

 

 

¡ID .........................................................................................

20A

e

 

 

 

 

 

 

 

 

¡Integrated Fast Recovery Diode (MAX.) ........

150ns

 

TO-3P

 

 

 

 

 

APPLICATION

Servo motor drive, Robot, UPS, Inverter Fluorecent

lamp, etc.

MAXIMUM RATINGS (Tc = 25°C)

Symbol

Parameter

Conditions

Ratings

Unit

 

 

 

 

 

VDSS

Drain-source voltage

VGS = 0V

500

V

VGSS

Gate-source voltage

VDS = 0V

±30

V

ID

Drain current

 

20

A

IDM

Drain current (Pulsed)

 

60

A

IS

Source current

 

20

A

ISM

Source current (Pulsed)

 

60

A

PD

Maximum power dissipation

 

275

W

Tch

Channel temperature

 

–55 ~ +150

°C

Tstg

Storage temperature

 

–55 ~ +150

°C

Weight

Typical value

4.8

g

 

 

 

 

 

Feb.1999

Mitsubishi Electric Corporation Semiconductor Group FK20SM-10 Datasheet

MITSUBISHI Nch POWER MOSFET

FK20SM-10

HIGH-SPEED SWITCHING USE

ELECTRICAL CHARACTERISTICS (Tch = 25°C)

Symbol

Parameter

Test conditions

 

Limits

 

Unit

Min.

Typ.

Max.

 

 

 

 

V (BR) DSS

Drain-source breakdown voltage

ID = 1mA, VGS = 0V

500

V

V (BR) GSS

Gate-source breakdown voltage

IG = ±100mA, VDS = 0V

±30

V

IGSS

Gate-source leakage current

VGS = ±25V, VDS = 0V

±10

mA

IDSS

Drain-source leakage current

VDS = 500V, VGS = 0V

1

mA

VGS (th)

Gate-source threshold voltage

ID = 1mA, VDS = 10V

2

3

4

V

rDS (ON)

Drain-source on-state resistance

ID = 10A, VGS = 10V

0.28

0.36

W

VDS (ON)

Drain-source on-state voltage

ID = 10A, VGS = 10V

2.80

3.60

V

½yfs½

Forward transfer admittance

ID = 10A, VDS = 10V

7.0

10.0

S

Ciss

Input capacitance

 

2800

pF

Coss

Output capacitance

VDS = 25V, VGS = 0V, f = 1MHz

350

pF

Crss

Reverse transfer capacitance

 

55

pF

td (on)

Turn-on delay time

 

60

ns

tr

Rise time

VDD = 200V, ID = 10A, VGS = 10V, RGEN = RGS = 50W

80

ns

td (off)

Turn-off delay time

270

ns

 

tf

Fall time

 

80

ns

VSD

Source-drain voltage

IS = 10A, VGS = 0V

1.5

2.0

V

Rth (ch-c)

Thermal resistance

Channel to case

0.45

°C/W

trr

Reverse recovery time

IS = 20A, dis/dt = –100A/ms

150

ns

PERFORMANCE CURVES

POWER DISSIPATION PD (W)

POWER DISSIPATION DERATING CURVE

300

250

200

150

100

50

0

0

50

100

150

200

MAXIMUM SAFE OPERATING AREA

 

102

 

 

 

 

 

 

 

7

 

 

 

 

 

 

 

5

 

 

 

 

 

 

(A)

3

 

 

 

 

 

tw=100µs

2

 

 

 

 

 

ID

101

 

 

 

 

 

 

CURRENT

 

 

 

 

 

 

7

 

 

 

 

 

1ms

5

 

 

 

 

 

 

 

 

 

 

 

3

 

 

 

 

 

 

2

 

 

 

 

 

10ms

 

 

 

 

 

 

100

 

 

 

 

 

 

DRAIN

 

 

 

 

 

100ms

7

 

 

 

 

 

5

TC = 25°C

 

 

 

DC

3

 

 

 

 

 

Single Pulse

 

 

 

 

2

 

 

 

 

 

 

 

 

 

 

 

10–1

2 3

5 7 101

2 3

5 7 102

2 3

5 7 103

 

100

CASE TEMPERATURE TC (°C)

DRAIN-SOURCE VOLTAGE VDS (V)

Feb.1999

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