HP MSA-0335, MSA-0336-BLK, MSA-0336-TR1 Datasheet

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HP MSA-0335, MSA-0336-BLK, MSA-0336-TR1 Datasheet

Cascadable Silicon Bipolar

MMICÊ Amplifiers

Technical Data

Features

Cascadable 50 Ω Gain Block

3 dB Bandwidth:

DC to 2.7 GHz

12.0 dB Typical Gain at 1.0Ê GHz

10.0 dBm Typical P1 dB at 1.0Ê GHz

Unconditionally Stable (k>1)

Cost Effective Ceramic Microstrip Package

Description

The MSA-0335 is a high performance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) housed in a cost effective, microstrip package. This MMIC is

designed for use as a general purpose 50 Ω gain block. Typical applications include narrow and broad band IF and RF amplifiers in industrial and military applications.

The MSA-series is fabricated using HP’s 10 GHz fT, 25Ê GHz MAXf , silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility.

Available in cut lead version (package 36) as MSA-0336.

MSA-0335, -0336

35 micro-X Package[1]

Note:

1.Short leaded 36 package available upon request.

Typical Biasing Configuration

 

 

 

R bias

 

 

 

VCC > 7 V

 

 

 

RFC (Optional)

 

C block

4

C block

 

 

 

 

 

3

IN

1

MSA

OUT

 

 

Vd = 5 V

 

 

2

 

 

 

5965-9568E

6-302

MSA-0335, -0336 Absolute Maximum Ratings

Parameter

Absolute Maximum[1]

Device Current

80 mA

 

 

Power Dissipation[2,3]

425mW

RF Input Power

+13dBm

 

 

Junction Temperature

200°C

Storage Temperature[4]

–65 to 200°C

Notes:

1.Permanent damage may occur if any of these limits are exceeded.

2.TCASE = 25°C.

3.Derate at 6.7 mW/°C for TC > 136°C.

4.Storage above +150°C may tarnish the leads of this package making it difficult to solder into a circuit.

5.The small spot size of this technique results in a higher, though more accurate determination of θjc than do alternate methods. See MEASUREMENTS section “Thermal Resistance” for more information.

Electrical Specifications[1], TA = 25°C

Thermal Resistance[2,5]:

θjc = 150°C/W

Symbol

Parameters and Test Conditions: Id = 35 mA, ZO = 50 Ω

Units

Min.

Typ.

Max.

GP

PowerGain(|S21|2)

f = 0.1 GHz

dB

11.5

12.5

13.5

GP

Gain Flatness

f = 0.1 to 1.6 GHz

dB

 

± 0.6

± 1.0

f3 dB

3 dB Bandwidth

 

GHz

 

2.7

 

VSWR

 

Input VSWR

f = 0.1 to 3.0 GHz

 

 

1.6:1

 

 

Output VSWR

f = 0.1 to 3.0 GHz

 

 

1.7:1

 

 

 

 

 

 

NF

50 Ω Noise Figure

f = 1.0 GHz

dB

 

10.0

 

P1 dB

Output Power at 1 dB Gain Compression

f = 1.0 GHz

dBm

 

6.0

 

IP3

Third Order Intercept Point

f = 1.0 GHz

dBm

 

23.0

 

tD

Group Delay

f = 1.0 GHz

psec

 

125

 

Vd

Device Voltage

 

V

4.5

5.0

5.5

dV/dT

Device Voltage Temperature Coefficient

 

mV/°C

 

–8.0

 

Notes:

1.The recommended operating current range for this device is 20 to 50 mA. Typical performance as a function of current is on the following page.

MSA-0335, -0336 Part Number Ordering Information

Part Number

No. of Devices

Container

 

 

 

MSA-0335

10

Strip

MSA-0336-BLK

100

Antistatic Bag

MSA-0336-TR1

1000

7" Reel

 

 

 

For more information, see “Tape and Reel Packaging for Semiconductor Devices.”

6-303

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