Silicon N-Channel Junction FET
Application
Low frequency / High frequency amplifier
Outline
TO-92 (2)
2SK435
1. Drain
2. Source
3. Gate
3
2
1
2SK435
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Gate current I
DS
GSO
D
G
Channel power dissipation Pch 300 mW
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Gate to source breakdown
V
(BR)GSS
voltage
Gate cutoff current I
Gate to source cutoff voltage V
Drain current I
Forward transfer admittance
GSS
GS(off)
DSS
y
fs
Input capacitance Ciss — 9.0 11.0 pF VDS = 5 V, VGS = 0,
Reverse transfer capacitance Crss — 2.8 4.0 pF VDS = 5 V, VGS = 0,
Noise figure NF — 0.5 3.0 dB VDS = 5 V, ID = 1 mA,
Note: 1. The 2SK435 is grouped by I
Grade B C D E
I
DSS
6 to 14 12 to 22 18 to 30 26 to 40
–22 — — V IG = –10 µA, VDS = 0
— — –10 nA VGS = –15 V, VDS = 0
— — –2.5 V VDS = 5 V, ID = 10 µA
1
*
6 — 40 mA V
20 — — mS V
as follows.
DSS
22 V
–22 V
100 mA
10 mA
= 5 V, VGS = 0, Pulse test
DS
= 5 V, ID = 10 mA,
DS
f = 1kHz
f = 1MHz
f = 1MHz
f = 1kHz, Rg = 1kΩ
2
2SK435
Maximum Channel Dissipation Curve
400
(mW)
ch
300
200
100
Channel Power Dissipation P
0 50 100 200150
Ambient Temperature Ta (°C)
Typical Transfer Characteristics
20
VDS = 5 V
16
(mA)
D
12
Typical Output Characteristics
20
16
(mA)
D
12
8
Drain Current I
4
02 68104
Drain to Source Voltage V
Forward Transfer Admittance
vs. Drain Current
100
VDS = 5 V
f = 1 kHz
10
= 0V
V
GS
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
(V)
DS
8
Drain Current I
4
0
–1.25 –1.0 –0.5 –0.25 0–0.75
Gate to Source Voltage V
GS
(V)
(mS)
fs
y
1.0
Forward Transfer Admittance
0.1
0.1 1.0 10 100
Drain Current I
D
(mA)
3