Toshiba satellite pro s500m, tecra m11 Service Manual

4.3 (3)

Toshiba Personal Computer

TECRA M11/Satellite Pro S500M Series

Maintenance Manual

First edition April 2010

TOSHIBA CORPORATION

File Number 960-813

[CONFIDENTIAL]

Copyright

© 2010 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.

Toshiba Personal Computer TECRA M11/Satellite Pro S500M Series Maintenance Manual First edition April 2010

Disclaimer

The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the TECRA M11/Satellite Pro S500M Series at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.

Trademarks

IBM is a registered trademark and IBM PC is a trademark of International Business Machines Corporation.

Intel, Intel SpeedStep, Intel Core, Celeron and Centrino are trademarks or registered trademarks of Intel Corporation.

Windows, Microsoft and Windows Vista are either registered trademarks or trademarks of Microsoft Corporation.

Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license. InterVideo and WinDVD are registered trademarks of InterVideo Inc.

Photo CD is a trademark of Eastman Kodak.

i.LINK is trademark and registered trademark of Sony Corporation.

Other trademarks and registered trademarks not listed above may be used in this manual.

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TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)) [CONFIDENTIAL]

Preface

This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M11/Satellite Pro S500M Series

The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.

SAFETY PRECAUTIONS

Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.

DANGER: “Danger” indicates the existence of a hazard that could result in death or serious bodily injury, if the safety instruction is not observed.

WARNING: “Warning” indicates the existence of a hazard that could result in bodily injury, if the safety instruction is not observed.

CAUTION: “Caution” indicates the existence of a hazard that could result in property damage, if the safety instruction is not observed.

NOTE: “Note” contains general information that relates to your safe maintenance service.

Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.

Be sure to fasten screws securely with the right screwdriver. If a screw is not fully fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.

If you replace the battery pack or RTC battery, be sure to use only the same model battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.

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The manual is divided into the following parts:

Chapter 1 Hardware Overview describes the Qosmio F60 Series system unit and each FRU.

Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems.

Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.

Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.

Appendices The appendices describe the following:

Handling the LCD module

Board layout

Pin assignments

Keyboard scan/character codes

Key layout

Wiring diagrams

BIOS rewrite procedures

EC/KBC rewrite procedures

Reliability

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Conventions

This manual uses the following formats to describe, identify, and highlight terms and operating procedures.

Acronyms

On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:

Read Only Memory (ROM)

Keys

Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.

Key operation

Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.

User input

Text that you are instructed to type in is shown in the boldface type below:

DISKCOPY A: B:

The display

Text generated by the computer that appears on its display is presented in the type face below:

Format complete

System transferred

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Table of Contents

Chapter 1 Hardware Overview

 

1.1

Features......................................................................................................................

1-5

1.2

System Unit Block Diagram ....................................................................................

1-12

1.3

3.5-inch Floppy Disk Drive (USB External) ...........................................................

1-20

1.4

2.5-inch Hard Disk Drive.........................................................................................

1-21

1.5

Optical Drive (ODD) ...............................................................................................

1-23

1.5.1

DVD-ROM Drive ....................................................................................................

1-23

1.5.2

DVD-Super Multi Drive ..........................................................................................

1-24

1.6

Keyboard..................................................................................................................

1-26

1.7

TFT Color Display...................................................................................................

1-27

1.7.1

LCD Module ............................................................................................................

1-27

1.8

Power Supply ...........................................................................................................

1-29

1.9

Batteries ...................................................................................................................

1-32

1.9.1

Main Battery ............................................................................................................

1-32

1.9.2

Battery Charging Control.........................................................................................

1-33

1.9.3

RTC battery..............................................................................................................

1-34

1.10

AC Adapter ..............................................................................................................

1-35

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Chapter 2 Troubleshooting Procedures

 

2.1

Troubleshooting .........................................................................................................

2-6

2.2

Troubleshooting Flowchart........................................................................................

2-8

2.3

Power Supply Troubleshooting................................................................................

2-13

2.4

System Board Troubleshooting................................................................................

2-22

2.5

USB FDD Troubleshooting .....................................................................................

2-30

2.6

2.5” HDD Troubleshooting......................................................................................

2-34

2.7

Keyboard Troubleshooting ......................................................................................

2-39

2.8

Touch pad or Dual point Troubleshooting...............................................................

2-40

2.9

Display Troubleshooting..........................................................................................

2-42

2.10

Optical Disk Drive Troubleshooting........................................................................

2-44

2.11

Modem Troubleshooting..........................................................................................

2-46

2.12

LAN Troubleshooting..............................................................................................

2-48

2.13

Wireless LAN Troubleshooting...............................................................................

2-49

2.14

Bluetooth Troubleshooting ......................................................................................

2-52

2.15

Sound Troubleshooting............................................................................................

2-54

2.15.3

Procedure 3 Replacement Check .............................................................................

2-55

2.16

Bridge media Slot Troubleshooting.........................................................................

2-56

2.17

PCI ExpressCard Slot Troubleshooting...................................................................

2-57

2.18

Fingerprint sensor Troubleshooting.........................................................................

2-58

2.19

Web camera Troubleshooting ..................................................................................

2-62

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Chapter 3 Tests and Diagnostics

 

3.1

The Diagnostic Test ...................................................................................................

3-7

3.2

Executing the Diagnostic Test .................................................................................

3-10

3.3

Setting of the hardware configuration .....................................................................

3-15

3.4

Heatrun Test.............................................................................................................

3-17

3.5

Subtest Names..........................................................................................................

3-18

3.6

System Test..............................................................................................................

3-20

3.7

Keyboard Test..........................................................................................................

3-23

3.8

Display Test .............................................................................................................

3-24

3.9

Floppy Disk Test......................................................................................................

3-27

3.10

Printer Test...............................................................................................................

3-29

3.11

Async Test ...............................................................................................................

3-31

3.12

Hard Disk Test .........................................................................................................

3-32

3.14

Real Timer Test........................................................................................................

3-35

3.15

NDP Test..................................................................................................................

3-37

3.16

Expansion Test.........................................................................................................

3-38

3.17

CD-ROM/DVD-ROM Test .....................................................................................

3-40

3.18

Error Code and Error Status Names.........................................................................

3-41

3.19

Hard Disk Test Detail Status ...................................................................................

3-44

3.20

ONLY ONE TEST...................................................................................................

3-46

3.21

Head Cleaning..........................................................................................................

3-57

3.22

Log Utilities .............................................................................................................

3-58

3.23

Running Test............................................................................................................

3-60

3.24

Floppy Disk Drive Utilities......................................................................................

3-62

3.25

System Configuration ..............................................................................................

3-67

3.26

Wireless LAN Test Program (Atheros) ...................................................................

3-69

3.27

Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC)...............

3-71

3.28

Wireless LAN Test Program on DUT PC (Intel-made)...........................................

3-76

3.29

LAN/Modem/Bluetooth/IEEE1394 Test Program ..................................................

3-80

3.30

Sound Test program.................................................................................................

3-87

3.31

SETUP .....................................................................................................................

3-88

3.32

Maintenance (WinPE&FreeDos) Test Program Operation .....................................

3-95

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3.33

. Starting TOSHIBA Test & Diagnostic ..................................................................

3-96

3.34

. Windows PE T&D .................................................................................................

3-98

3.35

DOS T&D ..............................................................................................................

3-144

3.36

Maintenance (WinPE&FreeDos) Test Program Supplementary Information .......

3-172

3.37

Maintenance (WinPE&FreeDos) Test Program Supplementary Information .......

3-175

Chapter 4 Replacement Procedures

 

4.1

Overview....................................................................................................................

4-1

4.2

Battery pack .............................................................................................................

4-11

4.3

ExperssCard/Bridge media/Smart card....................................................................

4-13

4.4

Memory module.......................................................................................................

4-16

4.5

Fin cover ..................................................................................................................

4-19

4.6

SIM card...................................................................................................................

4-21

4.7

HDD.........................................................................................................................

4-24

4.8

Keyboard..................................................................................................................

4-28

4.9

Optical disk drive (DVD-ROM/DVD-Super Multi drive) ......................................

4-32

4.10

SW board .................................................................................................................

4-37

4.11

Wireless LAN card ..................................................................................................

4-39

4.12

Cover assembly and Base assembly ........................................................................

4-41

4.13

MDC/USB board .....................................................................................................

4-48

4.14

RTC battery..............................................................................................................

4-53

4.15

Bluetooth module.....................................................................................................

4-55

4.16

Smart card slot .........................................................................................................

4-57

4.17

Jack/3G/Express board/Microphone/3G card..........................................................

4-59

4.18

RGB/USB board ......................................................................................................

4-64

4.19

System board............................................................................................................

4-67

4.20

CPU/Fin/DC fan.......................................................................................................

4-73

4.21

Speaker.....................................................................................................................

4-80

4.22

Touch pad/Fingerprint sensor board ........................................................................

4-84

4.23

LCD unit ..................................................................................................................

4-91

4.24

Camera module/Wireless LAN antenna/3G antenna.............................................

4-104

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Appendices

 

 

Appendix A

Handling the LCD Module ...........................................................................

A-1

Appendix B

Board Layout ................................................................................................

B-1

Appendix C

Pin Assignments............................................................................................

C-1

Appendix D

Keyboard Scan/Character Codes ..................................................................

D-1

Appendix E

Key Layout.....................................................................................................

E-1

Appendix F

Wiring Diagrams............................................................................................

F-1

Appendix G

BIOS rewrite Procedures ..............................................................................

G-1

Appendix H

EC/KBC rewrite Procedures.........................................................................

H-1

Appendix I

Reliability........................................................................................................

I-1

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1 Hardware Overview

Chapter 1

Hardware Overview

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1 Hardware Overview

1-2

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1 Hardware Overview

Chapter 1

Contents

Chapter 1 Hardware Overview.........................................................................................

1

1.1

Features.........................................................................................................................

 

5

1.2

System Unit Block Diagram .......................................................................................

12

1.3

3.5-inch Floppy Disk Drive (USB External) ..............................................................

20

1.4

2.5-inch Hard Disk Drive............................................................................................

21

1.5

Optical Drive (ODD) ..................................................................................................

23

 

1.5.1

DVD-ROM Drive..................................................................................

23

 

1.5.2

DVD-Super Multi Drive........................................................................

24

1.6

Keyboard.....................................................................................................................

 

26

1.7

TFT Color Display......................................................................................................

27

 

1.7.1

LCD Module..........................................................................................

27

1.8

Power Supply ..............................................................................................................

29

1.9

Batteries ......................................................................................................................

 

32

 

1.9.1

Main Battery..........................................................................................

32

 

1.9.2

Battery Charging Control ......................................................................

33

 

1.9.3

RTC battery ...........................................................................................

34

1.10

AC Adapter .................................................................................................................

 

35

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1 Hardware Overview

Figures

 

 

Figure 1-1

Front of the computer...........................................................................................

10

Figure 1-2

System unit configurations...................................................................................

11

Figure 1-3

System unit block diagram (case of 10, 10c model .........................................

12

Figure 1-4 System unit block diagram (case of 10GC model) ..............................................

13

Figure 1-5 3.5-inch FDD (USB External)..............................................................................

20

Figure 1-6 2.5-inch HDD.......................................................................................................

21

Figure 1-7 DVD Super Multi drive........................................................................................

24

Figure 1- 8 Keyboard.............................................................................................................

26

Figure 1- 9 LCD module........................................................................................................

27

Tables

 

 

Table 1-1

3.5-inch FDD specifications..................................................................................

20

Table 1-2

2.5-inch HDD specifications .................................................................................

21

Table 1-3

2.5-inch HDD specifications .................................................................................

22

Table 1-4 DVD-ROM drive specifications............................................................................

23

Table 1-5 DVD Super Multi drive outline dimensions..........................................................

25

Table 1-6 LCD module specifications ...................................................................................

28

Table 1-7

Power supply output rating....................................................................................

30

Table 1-8

Battery specifications ............................................................................................

32

Table 1-9

Time required for charges .....................................................................................

33

Table 1-10

Data preservation time.........................................................................................

34

Table 1-11

RTC battery charging/data preservation time .....................................................

34

Table 1-12

AC adapter specifications....................................................................................

35

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1 Hardware Overview

1.1Features

The Toshiba TECRA M11/Satellite Pro S500M Series Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features.

There some models and options. Refer to the Parts List for the configuration of each model and options.

Microprocessor

The Toshiba TECRA M11/Satellite Pro S500M Series computer is equipped with an Intel® Processor.

The PC comes in with one of the following speeds:

Intel® Arrandale Processor (Arrandale)

Core Frequency

System Bus Frequency

L2 Cache Size

(GHz)

(MHz)

(Mbytes)

 

 

4

2.66GHz

1066

Core i7-620M

 

 

 

 

3

2.4GHz

1066

Core i5-520M

 

 

 

 

3

2.26GHz

1066

Core i5-430M

 

 

 

 

3

2.13GHz

1066

Core i5-330M

 

 

 

 

 

Memory

Two DDR3-1066 SDRAM slots. Memory modules can be installed to provide a maximum of 8GB. Memory modules are available in 1024MB, 2048MB and 4096MB sizes.

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1 Hardware Overview

Chipset

Toshiba TECRA M11/Satellite Pro S500M Series computer is Equipped with Intel Ibex peak-M QM57 or HM55.

VGA Controller

The PC comes in with one of the following two types:

The internal graphics controller in Intel Processor (Core i*) is used..

nVIDIA NVS 2100M is used.

HDD

The computer has a 2.5-inch SATA HDD. The following capacities are available.

160/250/320/500 GB

USB FDD

A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks.

Optical Drive

A DVD-ROM drive or DVD Super Multi drive (double layer) can be installed.

Display

The PC comes in with one of the following two types:

14.0”HD(1366x768) Non-CSV

14.0””HD+(1600x900) Non-CSV

Interface

To external monitor via - RGB connector and mini display port

Keyboard

An-easy-to-use 85(US)/87(UK)-key keyboard provides a numeric keypad overlay for fast

numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft® Windows® 7. It supports software that uses a 101or 102-key enhanced keyboard.

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1 Hardware Overview

TOSHIBA Dual Pointing Device

The TOSHIBA Dual Pointing Device consists of Touch Pad and AccuPoint. The touch pad and control buttons enable control of the on-screen pointer and scrolling of windows. The pointer control stick and AccuPoint enables convenient control of the cursor.

Batteries

The computer has two batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory.

Universal Serial Bus (USB2.0)

Two Universal Serial Bus ports, which comply to the USB 2.0 standard, are provided on the right hand side of the computer.

eSATA/USB combo

One eSATA/USB combo port, which complies to the USB 2.0 standard, is provided on the left hand side of the computer. This port has eSATA (External Serial ATA) function. Some models are equipped with an eSATA/USB combo port.

A Charge power supply (When a computer is power-on or sleep).

External monitor (RGB) port

This port provides 15-pin, analog VGA port. This port allows you to connect an external monitor to the computer.

Mini Display Port

This port is capable of driving resolutions up to 2560x1600, commonly used with 30-inch displays. With a suitable adapter, Mini Display Port may be used to drive displays with a VGA or DVI interface.

Bridge Media slot

This slot lets you insert an SD™/SDHC™ memory card, miniSD™/microSD™ Card, Memory Stick® (PRO™/PRO Duo™), xD-Picture Card™ and MultiMediaCard

ExpressCard slot(Some models)

This slot allows you to install a single ExpressCard device.

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1 Hardware Overview

SmartCard Slot

This slot can accommodate a single Smart Card device. Some models are equipped with a Smart Card slot.

Fingerprint sensor(Some models)

The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.

Docking interface port

The docking interface port enables connection of an optional Express Port Replicator. It provides additional features as follows:

RJ45 LAN jack

External monitor port

DC IN 15V jack

Security lock slot

Universal Serial Bus 2.0 port (four)

DVI port

Sound system

The sound system is equipped with the following features:

Stereo speakers

Built-in microphone

Stereo headphone jack

External microphone jack

External Headphone jack

Internal modem(Some models)

The computer contains a MDC, enabling data and fax communication. It supports ITU-T V.90 (V.92). The transfer rates are 56 Kbps for data reception, 33.6 Kbps for data transmission, and 14,400 bps for fax transmission. However, the actual speed depends on the line quality. The RJ11 modem jack is used to accommodate a telephone line. Both of V.90 and V.92 are supported only in USA, Canada and Australia. Only V.90 is available in other regions.

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1 Hardware Overview

Internal LAN

The computer has built-in support for Ethernet LAN (10 megabits per second, 10BASE- T), Fast Ethernet LAN (100 megabits per second, 100BASE-TX) and Gigabit Ethernet LAN (1000 megabits per second, 1000BASE-T).

Wireless LAN

Some computers in this series are equipped with a Wireless LAN module that is compatible with other LAN systems based on Direct Sequence Spread Spectrum/Orthogonal Frequency Division Multiplexing radio technology that complies with the IEEE 802.11 Standard.

Bluetooth

Some computers in this series have Bluetooth wireless communication function which eliminates the need for cables between electronic devices such as computers, printers and mobile phones. When it is enabled, Bluetooth provides the wireless personal area network environment which is safe and trustworthy, that is quick and easy.

Web Camera

Web Camera is a device that allows you to record video or take photographs with your computer. You can use it for video chatting or video conferences using a communication tool such as Windows Live Messenger. TOSHIBA Web Camera Application will help you to add various video effects to your video or photograph.

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1 Hardware Overview

Figure 1-1 Front of the computer

1-10

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Toshiba satellite pro s500m, tecra m11 Service Manual

1 Hardware Overview

The system unit configuration is shown in figure 1-2

Figure 1-2 System unit configurations

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1 Hardware Overview

1.2System Unit Block Diagram

Figure 1-4 and 1-5 is a block diagram of the system unit.

Figure 1-3 System unit block diagram (case of 10, 10c model

1-12

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1 Hardware Overview

Figure 1-4 System unit block diagram (case of 10GC model)

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1 Hardware Overview

The system unit is composed of the following major components:

Microprocessor

The Toshiba TECRA M11/Satellite Pro S500M Series computer is equipped with an Intel® Processor.

The PC comes in with one of the following speeds:

Intel® Arrandale Processor (Arrandale)

Core Frequency

System Bus Frequency

L2 Cache Size

(GHz)

(MHz)

(Mbytes)

 

 

4

2.66GHz

1066

Core i7-620M

 

 

 

 

3

2.4GHz

1066

Core i5-520M

 

 

 

 

3

2.26GHz

1066

Core i5-430M

 

 

 

 

3

2.13GHz

1066

Core i5-330M

 

 

 

 

 

Memory

Two DDR3-1066 SDRAM slots. Memory modules can be installed to provide a maximum of 8GB. Memory modules are available in 1024MB, 2048MB and 4096MB sizes.

-204-pin slot

-DDR3-1066 support

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1 Hardware Overview

Chipset

Toshiba TECRA M11/Satellite Pro S500M Series computer is Equipped with Intel Ibex peak-M QM57 or HM55.

Intel PCH (Processor Control HUB) North Bridge:Intel MontaraGM+

Banias Processor System Bus support

DRAM control : DDR333/DDR266 support and 2GBmax

Hub Link interface

593-ball 37.5x37.5 mm FC-BGA package

South Bridge:Intel ICH4-M

Hub Link interface

PCI Rev2.2 An interface (6 PCI REQ/GNT Pairs)

A busmaster IDE controller (Ultra ATA 100/66/33)

USB 1.1/2.0 controller 6 Prots (EHCI:Enhanced Host Controller)

I/O APIC (ACPI 1.0b conformity)

SMBus2.0 controller

FWH An interface (BIOS)

LPC Interface (EC/KBC, Super I/O)

IRQ controller

Serial interruption function

Power management control

Deeper Sleep (C4) support

Suspension/resume control

AC'97 2.2 Interface

RTC built-in

LAN controller built-in (WfM 2.0)

421-ball 31x31mm BGA Package

YEBISU3S

A PCI interface (PCI Rev.2.2)

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1Hardware Overview

CardBus / PC card controller (Yenta2 Ver.2.2)

SD card controller (SDHC Ver.1.2)

A SD IO card controller (Ver.1.0)

SmartMedia Controller (SMHC Ver.01/SMIL1.0) (it is not used in Spa)

SIO (UART) controller (MS Debug Port Specification ver.1.0)

Docking interface (Q-SW control, reset control)

External device interface

(1)Calpella Ibex Peak-M HM55 (Non-AMT)

(2)Calpella Ibex Peak-M QM57 (AMT)

-1071-ball 25x27mm FCBGA Package

VGA Controller

The PC comes in with one of the following two types:

The internal graphics controller in Intel Processor (Core i*) is used..

nVIDIA NVS 2100M is used.

LAN Controller

This controller has the following functions:

Support only a Gigabit Ethernet.

RJ45x1 port (with LED), docking connector (branch) 1 port.

WOL support (from S3, S4, and S5)

LAN controller

Made in Intel Hanksville (WG82577 LC/LM (AMT)): PCI-Ex Connection

AMT6.0 support (BTO correspondence)

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Modem Controller

One MDC is used.

Product made from Askey MDC1.5 (Azalia)

This controller has the following functions: One RJ11 port

V.92 (V.90) 56K Modem/FAX

Ring Wakeup support

Wireless LAN

One PCI Express Mini Card slot1

802.11 a/b/g/n Intel 802.11(a/b/g/n)13ch-PP 2x2 MOW-HMC

Atheros 802.11 a/b/g/n Atheros 802.11(a/b/g/n) 13ch-HB92 MOW-HMC Atheros 802.11 b/g/n Atheros 802.11(b/g/n) 13ch-HB95 MOW-HMC

Supports Wireless Communication SW

WOWL support (only Intel module)

Bluetooth

V2.1 +EDR Module with a built-in antenna

USB I/F connection

BTO correspondence

Express Card slot

ExpressCard/34 x1 USB/PCI Express I/F

Smart Card slot

Controller: Product made from O2Micro OZ77CR6 LN-B-0 (USB I/F)

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1 Hardware Overview

Bridge Media Controller slot

Card slot

SD, mini SD (w/ adapter),Micro SD (w/adapter),xD, MMC,Memory Stick,Memory Stick Pro,Memory Stick Duo (w/ adapter),

Memory Stick Pro Duo (w/ adapter),Memory Stick Micro (w/ adapter)

SD Token KEY, SD boot correspondence

SD IO is No-supporting.

Controller : RICOH R5U230-QFN48P

Sound Controller

PCH built-in HD Audio Link (Intel High Definition Audio I/F)+RealTek ALC268

Amplifier: Matsushita AN12947AA

Built-in microphone :(BTO correspondence by Camera and a set)

Built-in speaker: Stereo

External monophonic microphone input plug

Stereo headphone jack

Digital volume (button type)

VoIP support

Camera

It is BTO correspondence by the built-in microphone and a set.

Connection interface: USB I/F connection

Product made from Chicony With a 1.0M HD Auto broad view

Resolution :WXGA (1280*800)

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1 Hardware Overview

Other chips

Clock generator ICS9LVRS394CKLFT (Made by Integrated Device Technology)

EC/KBC MEC1609-PZP(REVISION.D) (Made by standard micro system)

GPIO Expander ECE1088-DZK (Made by standard micro system)

PSC: TMP86FS49BUG (made by Toshiba)

TPM: SLB9635 TT 1.2 (made by Infineon)

Sensor

Temperature reset IC 85-degree-C type

Thermistor Three places (CPU, Memory, for normal temperature measurement)

Magneto metric sensor

Use it as a LCD opening-and-closing sensor (ferrite magneto system).

Acceleration sensor Made by ST Microelectronics

TSH35TR (Three axes)

HDD protection

Fingerprint sensor Made by Authen Tec

(AES1660-C-SZ-CA-BB0A-TS)

It mounts between the Touchpad buttons.

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1 Hardware Overview

1.33.5-inch Floppy Disk Drive (USB External)

The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks.

The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1.

Figure 1-5 3.5-inch FDD (USB External)

Table 1-1 3.5-inch FDD specifications

 

 

TEAC FD-05PUB-337

Items

(G8AC0000B320)

 

 

720KB mode

 

1.44MB mode

 

 

 

 

 

Data transfer rate

FDD part

250K bits/second

 

500K bits/second

 

 

 

 

 

USB

Full speed mode (12M bits/second)

 

 

 

 

Disk rotation speed

 

300rpm

 

 

Track density

5.3 track/mm (135TPI)

 

 

 

 

 

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