Supermicro X11SPW-TF operation manual

X11SPW-CTF X11SPW-TF

USER'S MANUAL

Revision 1.0

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates.

Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/ or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment, nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical systems whose failure to perform be reasonably expected to result in significant injury or loss of life or catastrophic property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: July 12, 2017

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document. Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2017 by Super Micro Computer, Inc.

All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users. It provides information for the installation and use of the X11SPW-CTF/-TF motherboard.

About This Motherboard

The Supermicro X11SPW-CTF/-TF supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA 3647) processor with a thermal design power (TDP) of up to 205W. Built with the Intel PCH C622 chipset, this motherboard offers such features as four SAS 3.0 ports (available on X11SPW-CTF), dual 10GbE ports, two SuperDOM connectors, the Intel Node Manager, and the Trusted Platform Module (TPM) header. The X11SPW-CTF/-TF supports 6-DIMM DDR4 ECC RDIMM/LRDIMM memory with speeds of up to 2666MHz. This motherboard provides great performance and is ideal for cost-effective, general purpose server platforms. Please note that this motherboard is intended to be installed and serviced by professional technicians only. For processor/memory updates, please refer to our website at http://www.supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage or personal injury.

Warning! Indicates high voltage may be encountered while performing a procedure.

Important: Important information given to ensure proper system installation or to relay safety precautions.

Note: Additional Information given to differentiate various models or provides information for proper system setup.

3

X11SPW-CTF/-TF User's Manual

Contacting Supermicro

Headquarters
Address:	Super Micro Computer, Inc.
	980 Rock Ave.
	San Jose, CA 95131 U.S.A.
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail] (General Information)
	[e-mail] (Technical Support)
Website:	www.supermicro.com
Europe
Address:	Super Micro Computer B.V.
	Het Sterrenbeeld 28, 5215 ML
	's-Hertogenbosch, The Netherlands
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail] (General Information)
	[e-mail] (Technical Support)
	[e-mail] (Customer Support)
Website:	www.supermicro.nl
Asia-Pacific
Address:	Super Micro Computer, Inc.
	3F, No. 150, Jian 1st Rd.
	Zhonghe Dist., New Taipei City 235
	Taiwan (R.O.C)
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail]
Website:	www.supermicro.com.tw

4

Preface

	Table of Contents
Chapter 1 Introduction
1.1	Checklist................................................................................................................................	8
	Quick Reference................................................................................................................	12
	Quick Reference Table......................................................................................................	13
	Motherboard Features.......................................................................................................	15
1.2	Processor and Chipset Overview.......................................................................................	19
1.3	Special Features.................................................................................................................	19
	Recovery from AC Power Loss.........................................................................................	19
1.4	System Health Monitoring...................................................................................................	20
	Onboard Voltage Monitors.................................................................................................	20
	Fan Status Monitor with Firmware Control........................................................................	20
	Environmental Temperature Control..................................................................................	20
	System Resource Alert......................................................................................................	20
1.5	ACPI Features....................................................................................................................	20
1.6	Power Supply......................................................................................................................	21
1.7	Serial Port...........................................................................................................................	21
Chapter 2 Installation
2.1	Static-Sensitive Devices.....................................................................................................	22
	Precautions........................................................................................................................	22
	Unpacking..........................................................................................................................	22
2.2	Processor and Heatsink Installation...................................................................................	23
	The Intel® Xeon 81xx/61xx/51xx/41xx/31xx Series Processor ........................................	23
	Overview of the Processor Socket Assembly....................................................................	24
	Overview of the Processor Heatsink Module (PHM).........................................................	25
	Attaching the Non-F Model Processor to the Processor Clip to Create the Processor
	Carrier Assembly................................................................................................................	26
	Attaching the Non-F Model Processor Carrier Assembly to the Heatsink to Form the
	Processor Heatsink Module (PHM)...................................................................................	27
	Preparing the CPU Socket for Installation.........................................................................	28
	Removing the Dust Cover from the CPU Socket..............................................................	28
	Installing the Processor Heatsink Module (PHM) ............................................................	29
	Removing the Processor Heatsink Module (PHM) from the Motherboard........................	30

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X11SPW-CTF/-TF User's Manual

2.3	Motherboard Installation.....................................................................................................	31
	Tools Needed.....................................................................................................................	31
	Location of Mounting Holes...............................................................................................	31
	Installing the Motherboard.................................................................................................	32
2.4	Memory Support and Installation........................................................................................	33
	Memory Support................................................................................................................	33
	DIMM Module Population Sequence.................................................................................	34
	DIMM Installation...............................................................................................................	35
	DIMM Removal..................................................................................................................	35
2.5	Rear I/O Ports.....................................................................................................................	36
2.6	Front Control Panel.............................................................................................................	41
2.7	Connectors..........................................................................................................................	45
	Power Connections............................................................................................................	45
	Headers.............................................................................................................................	47
2.8	Jumper Settings..................................................................................................................	56
	How Jumpers Work...........................................................................................................	56
2.9	LED Indicators....................................................................................................................	61
Chapter 3 Troubleshooting
3.1	Troubleshooting Procedures...............................................................................................	65
	Before Power On...............................................................................................................	65
	No Power...........................................................................................................................	65
	No Video............................................................................................................................	66
	System Boot Failure ........................................................................................................	66
	Memory Errors...................................................................................................................	66
	Losing the System's Setup Configuration..........................................................................	67
	When the System Becomes Unstable...............................................................................	67
3.2	Technical Support Procedures............................................................................................	69
3.3	Frequently Asked Questions...............................................................................................	70
3.4	Battery Removal and Installation........................................................................................	71
	Battery Removal................................................................................................................	71
	Proper Battery Disposal.....................................................................................................	71
	Battery Installation.............................................................................................................	71
3.5	Returning Merchandise for Service....................................................................................	72

6

Preface

Chapter 4 BIOS
4.1	Introduction.........................................................................................................................	73
4.2	Main Setup..........................................................................................................................	74
4.3	Advanced Setup Configurations.........................................................................................	76
4.4	Event Logs........................................................................................................................	101
4.5	IPMI...................................................................................................................................	103
4.6	Security.............................................................................................................................	106
4.7	Boot...................................................................................................................................	110
4.8	Save & Exit.......................................................................................................................	113
Appendix A BIOS Codes
Appendix B Software Installation
B.1	Installing Software Programs............................................................................................	117
B.2	SuperDoctor® 5.................................................................................................................	118
Appendix C Standardized Warning Statements
	Battery Handling..............................................................................................................	119
	Product Disposal..............................................................................................................	121

Appendix D UEFI BIOS Recovery

7

X11SPW-CTF/-TF User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro motherboards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard, several important parts that are included in the retail box are listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

	Description	Part Number	Quantity
	Supermicro Motherboard	X11SPW-CTF/-TF	1
	SATA Cables	CBL-0044L	6
	Quick Reference Guide	MNL-1916-QRG	1

Important Links

For your system to work properly, please follow the links below to download all necessary drivers/utilities and the user’s manual for your server.

•Supermicro product manuals: http://www.supermicro.com/support/manuals/

•Product drivers and utilities: ftp://ftp.supermicro.com

•Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

•If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website for possible updates to the manual revision level.

8

Chapter 1: Introduction

Figure 1-1. X11SPW-CTF Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision available at the time of publication of the manual. The motherboard you received may

or may not look exactly the same as the graphics shown in this manual.

9

X11SPW-CTF/-TF User's Manual

Figure 1-2. X11SPW-TF Motherboard Image

10

Chapter 1: Introduction

Figure 1-3. X11SPW-CTF/-TF Motherboard Layout

(not drawn to scale)

JUIDB1	LE1
		COM1
	VGA

	MAC SAN	SXB1A	SXB2
IPMI CODE SAS	SXB1B		+
CODE
CODE MAC	SATA2-I		7-4 SATA-I
		SATA0-I	SATA1-I

BT1

Intel

X557

JWD1 JPME2 JPTG1

Intel

C622

		USB7/8(3.0)
LAN2	LAN1	IPMI_LAN
		USB0/1
		MH10

ASpeed AST2500

LEDM1 MH11

BAR CODE

JIPMB1

JPG1JPS1JPSAS1

COM2

FIT PRESS

3-SAS0-L

		JP4
	LEDS1	LSI3008
		(-CTF only)
JBT1		USB9(3.0)
		USB2/3
		USB4/5
	M.2 PCI-E 3.0 X4

SATA3-I	SXB1C
USB10/11(3	USB6
0).
SATA1-S	SATA0-S

X11SPW-CTF/-TF

LE3

REV: 1.02

CPU

DESIGNED IN USA

JNVI2C1	JP1	JP3	JP2
	JTPM1
	JOH1
	JSTBY1		JD1
			PWR ON
				RST
		JF1	FAIL	PS
			2 LED	NIC UID
			1	NIC
			LED	HDD
			LED	PWR
		LE2		X
				NMI

					JPI2C1
JSD2	JSD1				JPWR1
JL1
-S		DIMMD1		SP1	JPWR2
SGPIO2-I SGPIO1				DIMMC1 DIMMB1 DIMMA1
	JRK1	DIMME1 DIMMF1	BIOS LICENSE
-I
SGPIO1	JPWR3	FAN5 FAN4
FAN7	FAN6		FAN3	FAN2	FAN1

Notes:

•The image above combines both X11SPW-CTF and X11SPW-TF models. See pages 9-10 for a more accurate representation of each motherboard.

•X11SPW-CTF Only: SAS 3.0 Connections (LSI3008)

•Components not documented are for internal testing only.

11

X11SPW-CTF/-TF User's Manual

Quick Reference

				JWD1	USB7/8 (3.0)		COM1
JUIDB1						IPMI_LAN
		VGA		LAN2				JPSAS1
						USB0/1
SXB2	LE1				LAN1			JPS1
SXB1A								JPG1

JUIDB1 LE1

VGA

	SAN			Intel
JPME2	MAC	SXB1A	SXB2	X557
JPTG1

SAS

	BT1	IPMI CODE	SXB1B
	SXB1B
		CODE
	JBT1
	I-SATA4-7	MAC
		CODE	SATA2-I
	I-SATA1
	I-SATA0
	I-SATA2
	I-SATA3		-I
			SATA3
	SXB1C		0).USB10/11(3
	USB10/11 (3.0)
	USB6

SATA0-I

SXB1C

USB6

JWD1JPME2JPTG1

BT1 +

4SATA-I			Intel
7-			C622
	SATA1-I

X11SPW-CTF/-TF

REV: 1.02

DESIGNED IN USA

		USB7/8(3.0)
LAN2	LAN1	IPMI_LAN
		USB0/1
		MH10

ASpeed AST2500

LEDM1 MH11

BAR CODE

COM1 JIPMB1 JPSAS1JPS1JPG1

COM2

FIT PRESS

3-SAS0-L

JP4

LEDS1	LSI3008
	(-CTF only)

JIMPB1

COM2

MH10

L-SAS0-3 MH11

LEDM1

LEDS1 USB9 (3.0)

JBT1			USB9(3.0)
			USB2/3		USB2/3
					USB4/5
			USB4/5		M.2
	M.2 PCI-E 3.0 X4				LE3
	LE3
CPU	JNVI2C1	JP1	JP3	JP2	JNVI2C1
		JTPM1			JTPM1
		JOH1
					JOH1
				JD1
		JSTBY1			JSTBY1
					JD1
				PWR ON
				RST

S-SATA1

S-SATA0 JSD1

JSD2

DIMMD1

DIMME1

SATA1-S

SATA0-S

JSD1 JSD2

JF1	1 2 LED FAIL	NIC NIC UID PS	JF1
LE2	LED LED	NMI X PWR HDD	LE2
JPI2C1			JPI2C1
JPWR1			JPWR1
			CPU

DIMMF1

JL1

JRK1 S-SGPIO1

I-SGPIO2

JPWR3

I-SGPIO1

JL1						SP1
						JPWR2
-S		DIMMD1		SP1	JPWR2
SGPIO2-I SGPIO1				DIMMC1 DIMMB1 DIMMA1		DIMMA1
	JRK1	DIMME1 DIMMF1	BIOS LICENSE
						DIMMB1
-I						DIMMC1
SGPIO1	JPWR3	FAN5 FAN4
FAN7		FAN6	FAN3	FAN2	FAN1

FAN5 FAN4	FAN3 FAN2 FAN1
FAN7 FAN6

Notes:

•See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connections. Jumpers/LED indicators not indicated are used for testing only.

•"" indicates the location of Pin 1.

•Use only the correct type of onboard CMOS battery as specified by the manufacturer. Do not install the onboard battery upside down to avoid possible explosion.

12

Chapter 1: Introduction

Quick Reference Table

Jumper	Description	Default Setting
JBT1	CMOS Clear	Open (Normal)
JPG1	VGA Enable/Disable	Pins 1-2 (Enabled)
JPME2	ME Manufacturing Mode	Pins 1-2 (Normal)
JPS1	SAS 3.0 Enable/Disable	Pins 1-2	(Enabled)
JPSAS1	SAS HDD Enable/Disable	Pins 1-2	(Enabled)
JPTG1	LAN Enable/Disable	Pins 1-2	(Enabled)
JWD1	Watch Dog Timer	Pins 1-2	(Reset)

	LED	Description	Status
	LE1	Unit Identifier (UID) LED	Solid Blue: Unit Identified
	LE2	Onboard Power LED	Solid Green: Power On
	LE3	M.2 LED	Blinking Green: Device Working
	LEDM1	BMC Heartbeat LED	Blinking Green: BMC Normal
	LEDS1	SAS Activity LED	Blinking Green: SAS Active
			Solid Red: SAS Error

Connector	Description
BT1	Onboard Battery
COM1, COM2	COM Port, COM Header
FAN1 ~ FAN7	System Fan Headers
IPMI_LAN	Dedicated IPMI LAN Port
I-SATA0~7	Intel® PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)
I-SGPIO1, I-SGPIO2, S-SGPIO1	Serial Link General Purpose I/O Headers
JD1	Speaker/Power LED Indicator (Pins 1-3: Power LED, Pins 4-7: Speaker)
JF1	Front Control Panel Header
JIPMB1	4-pin BMC External I2C Header (for an IPMI card)
JL1	Chassis Intrusion Header
JNVI2C1	NVMe I2C Header
JOH1	Overheat LED Header
JPI2C1	Power System Management Bus (SMB) I2C Header
JPWR1	8-pin 12V DC Power Connector for CPU (Required)
JPWR2	24-pin ATX Power Connector
JPWR3	4-pin 12V Power Connector for GPU Card (Requires an extra 12V power at up to 75W)
JRK1	Intel RAID Key Header
JSD1, JSD2	SATA DOM Power Connectors
JSTBY1	Standby Power Header

Note: Table is continued on the next page.

13

X11SPW-CTF/-TF User's Manual

Connector	Description
JTPM1	Trusted Platform Module (TPM)/Port 80 Connector
JUIDB1	Unit Identifier (UID) Switch
LAN1, LAN2	10GbE LAN Ports
L-SAS0~3	Four SAS 3.0 Ports (with RAID 0, 1, 10) (X11SPW-CTF only)
M.2	M.2 PCI-E 3.0 x4 or SATA 3.0 Slot
MH10, MH11	M.2 Mounting Holes
SP1	Internal Speaker/Buzzer
S-SATA0~1	SATA 3.0 Ports with SATA DOM Power
SXB1A, SXB1B, SXB1C	Supermicro Proprietary WIO Left Add-on Card Slots
SXB2	Supermicro Proprietary WIO Right Add-on Card Slot
USB0/1	Back Panel Universal Serial Bus (USB) 2.0 Ports
USB2/3, USB4/5	Front Accessible USB 2.0 Headers
USB6	USB 2.0 Header (Not customized for the front panel)
USB7/8	Back Panel USB 3.0 Ports
USB9	USB 3.0 Type-A Header
USB10/11	Front Accessible USB 3.0 Header
VGA	VGA Port

14

Chapter 1: Introduction

Motherboard Features

Motherboard Features

CPU

•Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA3647) processor with up to 28 cores and a thermal design power (TDP) of up to 205W

Note: The X11SPW-CTF/-TF motherboard does not support FPGA or Fabric processors.

Memory

•Up to 192GB of RDIMM, 384GB of LRDIMM, and 768GB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of up to 2666MHz in six memory slots

Note: Memory speed support depends on the processors used in the system.

DIMM Size

•Up to 128GB at 1.2V

Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/ motherboard.

Chipset

• Intel PCH C622

Expansion Slots

•One (1) PCI-Express 3.0 WIO Left x32 Slot

•One (1) PCI-Express 3.0 WIO Right x8 Slot

Network

•Intel X557 10G PHY

•Intel Ethernet Controller X722 for 10G BASE-T Ports

•One (1) Dedicated IPMI LAN located on the rear I/O panel

Baseboard Management Controller (BMC)

• ASpeed AST 2500 BMC

Graphics

• Graphics controller via ASpeed 2500 BMC

Note: The table above is continued on the next page.

15

X11SPW-CTF/-TF User's Manual

Motherboard Features

I/O Devices

•Serial (COM) Port

•SATA 3.0

•RAID (PCH)

•SAS 3.0 (X11SPW-CTF only)

•RAID (LSI3008)

Peripheral Devices

•One (1) serial port on the rear I/O panel (COM1)

•One (1) front accessible serial port header (COM2)

•Ten (10) SATA 3.0 ports (I-SATA0~7, S-SATA0~1) supported by C622

•RAID 0, 1, 5, 10

•Four (4) SAS 3.0 connections via LSI3008 with one mini-SAS HD (SAS0-3)

•RAID 0, 1, 10

•Two (2) USB 2.0 ports on the rear I/O panel (USB0/1)

•Two (2) USB 3.0 ports on the rear I/O panel (USB7/8)

•Three (3) front accessible USB 2.0 headers with two (2) USB connections (USB2/3, USB4/5, USB6)

•One (1) front accessible USB 3.0 header with two (2) USB connections (USB10/11)

•One (1) USB 3.0 Type-A header (USB9)

BIOS

•256 Mb SPI AMI BIOS® SM Flash UEFI BIOS

•ACPI 6.0, SMBIOS 3.0 or later, BIOS rescue hot-key, Plug-and-Play (PnP), SPI dual/quad speed support, riser card auto detection support, real time clock (RTC) wakeup

Power Management

•ACPI Power Mangement

•Power button override mechanism

•Power-on mode for AC power recovery

•Wake-on-LAN

•Power supply monitoring

System Health Monitoring

•Onboard voltage monitoring for +1.05V, +1.2V, +1.8V, +3.3V, +3.3V standby, +5V, +5V standby, +12V, VBAT, memory, PCH temperature, system temperature, memory temperature

•5 CPU switch phase voltage regulator

•CPU thermal trip support

•PECI (Platform Environment Control Interface) 2.0 support

Fan Control

•Fan status monitoring via IPMI connections

•Single cooling zone

•Low-noise fan speed control

•Seven (7) 4-pin fan headers

Note: The table above is continued on the next page.

16

Chapter 1: Introduction

Motherboard Features

System Management

•Trusted Platform Module (TPM) support

•UID (Unit Identification)/Remote UID

•System resource alert via SuperDoctor® 5

•SuperDoctor® 5

•Chassis intrusion header and detection

LED Indicators

•CPU/System Overheating

•Power/M.2/SAS3008 (CTF)/BMC state Indicator

•UID/Remote UID

•HDD activity

•LAN activity

Dimensions

• 8" (W) x 13" (L) (203.2 mm x 330.2 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and heatsink cooling restrictions. For proper thermal management, please check the chassis and heatsink specifications for proper CPU TDP sizing.

Note 2: For IPMI configuration instructions, please refer to the Embedded IPMI Configuration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC login information upon initial system power-on. The manufacture default username is ADMIN and the password is

ADMIN. For proper BMC configuration, please refer to http://www.supermicro.com/ products/info/files/IPMI/Best_Practices_BMC_Security.pdf

17

X11SPW-CTF/-TF User's Manual

				Figure 1-4.
			System Block Diagram
				VCCP0 12v
				VR13
			#C-1	5+1 PHASE
				205W
		#B-1
		#A-1		VCCP0
		2133/2666		SNB CORE PECI:30
	X8	DDRIV		DDR-IV	SOCKET ID:0
	SXB2			#1A #3 #2	#1B	DMI3
	-E				E-PCI
	PCI	PCI-E X8 G3
	X16	PCI-E X16 G3			X8	DMI3
	E-	PCI-E X16 G3
	X16
	PCI
	PCI-E
	SXB1
		LSI3008		PCI-E X4 G3	Uplink
	SAS x1			#0~3
		M.2 SSD		PCI-E X4 G3
				#8~11
	LAN1	Intel			PCH
	RJ45			SFI
		X557 (10G)		SFI
	LAN2				C622
	RJ45		RMII/NCSI
				C622 X8 UPLINK
				NO QAT 2*10G+2*1G(~17W)
	LAN3	RGRMII
RJ45
	RTL8211E-VB-CG
				PCI-E X1 G2		USB2.0 #2,3
DDR4						USB2.0 #4,5
	SPI	BMC		#5
				USB 2.0		USB2.0 #0,1
BMC Boot Flash		AST2500		#6 USB2.0
				ESPI
				ESPI	Switch	SPI
				Header
				SPI		SPI

COM1

COM2

VGA CONN

TPM HEADER

BIOS

Connector

Header

Debug Card

Temp Sensor

EMC1402-1 *2 at diff SMBUS

FRONT PANEL

#F-1 #E-1

#D-1

2133/2666

DDRIV

#7

#6

#5

#4

#3

#2

#1

#0

6.0 Gb/S

SATA

#1

SATA-DOM

#0

sSATA

6.0 Gb/S

Front USB2.0 x 4

USB 2.0

USB

Rear USB2.0 x 2

USB 2.0

USB

Front USB3.0 x 2

USB 3.0

USB

Type A USB3.0

USB

Rear USB3.0 x 2

USB

SYSTEM POWER

FAN SPEED

CTRL

Note: This is a general block diagram and may not exactly represent the features on your motherboard. See the previous pages for the actual specifications of your motherboard.

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Chapter 1: Introduction

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA3647) processor and the Intel PCH C622 chipset, the X11SPW-CTF/-TF motherboard offers maximum I/O expandability, energy efficiency, and data reliability in a

14-nm process architecture, and is optimized for embedded storage solutions, data centers, and high performance computing.

The Intel® Xeon 81xx/61xx/51xx/41xx/31xx and Intel PCH C622 chipset supports the following features:

•ACPI Power Management Logic Support Rev. 6.0

•Intel® Turbo Boost Technology 2.0, Power Monitoring/Power Control, Turbo Time Parameter (TAU), and Platform Power Control

•Configurable TDP (cTDP) and Lower-Power Mode

•Adaptive Thermal Management/Monitoring

•PCI-E 3.0, SATA 3.0 with transfer rates of up to 6 Gb/s, xHCI USB with SuperSpeed 3.0

•System Management Bus (SMBus) Specification, Version 2.0

•Integrated Sensor Hub (ISH)The BMC supports remote management, virtualization, and the security package for enterprise platforms

•Intel Trusted Execution Technology (Intel TXT)

•Intel Rapid Storage Technology

•Intel Virtualization Technology for Directed I/O (Intel VT-d)

1.3 Special Features

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond when AC power is lost and then restored to the system. You can choose for the system to remain powered off (in which case you must press the power switch to turn it back on), or for it to automatically return to the power-on state. See the Advanced BIOS Setup section for this setting. The default setting is Last State.

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X11SPW-CTF/-TF User's Manual

1.4 System Health Monitoring

Onboard Voltage Monitors

An onboard voltage monitor will scan the voltages of onboard chipset, memory, CPU, and battery continuously. Once a voltage becomes unstable, a warning is given, or an error message is sent to the screen. The user can adjust the voltage thresholds to define the sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors monitor temperatures and voltage settings of onboard processors and the system in real time via the IPMI interface. Whenever the temperature of the CPU or the system exceeds a user-defined threshold, system/CPU cooling fans will be turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air- flow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux environment. SuperDoctor is used to notify the user of certain system events. For example, you can configure SuperDoctor to provide you with warnings when the system temperature, CPU temperatures, voltages and fan speeds go beyond a predefined range.

1.5 ACPI Features

ACPI stands for Advanced Configuration and Power Interface. The ACPI specification defines a flexible and abstract hardware interface that provides a standard way to integrate power management features throughout a computer system, including its hardware, operating system and application software. This enables the system to automatically turn on and off peripherals such as CD-ROMs, network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a generic system event mechanism for Plug and Play, and an operating system-independent interface for configuration control. ACPI leverages the Plug and Play BIOS data structures, while providing a processor architecture-independent implementation that is compatible with Windows 2012/R2 and Windows Server 2016 operating systems.

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Chapter 1: Introduction

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable operation. It is even more important for processors that have high CPU clock rates.

The X11SPW-CTF/-TF motherboard accommodates a 24-pin ATX power supply. Although most power supplies generally meet the specifications required by the CPU, some are inadequate. In addition, one 12V 8-pin power connection is also required to ensure adequate power supply to the system.

Warning: To avoid damaging the power supply or the motherboard, be sure to use a power supply that contains a 24-pin and an 8-pin power connector. Be sure to connect the power supplies to the 24-pin power connector (JPWR2), and the 8-pin power connector (JPWR1) on the motherboard. Failure in doing so may void the manufacturer warranty on your power supply and motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX power supply Specification 2.02 or above. It must also be SSI compliant. (For more information, please refer to the website at http://www.ssiforum.org/). Additionally, in areas where noisy power transmission is present, you may choose to install a line filter to shield the computer from noise. It is recommended that you also install a power surge protector to help avoid problems caused by power surges.

1.7 Serial Port

The X11SPW-CTF/-TF motherboard supports two serial communication connections. COM Ports 1 and 2 can be used for input/output. The UART provides legacy speeds with a baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support high-speed serial communication devices.

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X11SPW-CTF/-TF User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com­ponents. To prevent damage to your motherboard, it is important to handle it very carefully. The following measures are generally sufficient to protect your equipment from ESD.

Precautions

•Use a grounded wrist strap designed to prevent static discharge.

•Touch a grounded metal object before removing the board from the antistatic bag.

•Handle the board by its edges only; do not touch its components, peripheral chips, memory modules or gold contacts.

•When handling chips or modules, avoid touching their pins.

•Put the motherboard and peripherals back into their antistatic bags when not in use.

•For grounding purposes, make sure that your chassis provides excellent conductivity between the power supply, the case, the mounting fasteners and the motherboard.

•Use only the correct type of CMOS onboard battery as specified by the manufacturer. Do not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking the motherboard, make sure that the person handling it is static protected.

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Chapter 2: Installation

2.2 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can cause serious damage to the CPU or motherboard which may result in RMA repairs. Please read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

•Always connect the power cord last, and always remove it before adding, removing, or changing any hardware components. Please note that the processor and heatsink should be assembled together first to form the Processor Heatsink Module (PHM), and then install the entire PHM into the CPU socket.

•When you receive a motherboard without a processor pre-installed, make sure that the plastic CPU socket cap is in place and that none of the socket pins are bent; otherwise, contact your retailer immediately.

•Refer to the Supermicro website for updates on CPU support.

•Please follow the instructions given in the ESD Warning section on the first page of this chapter before handling, installing, or removing system components.

The Intel® Xeon 81xx/61xx/51xx/41xx/31xx Series Processor

SKX Processor

Note: All graphics, drawings, and pictures shown in this manual are for illustration only. The components that came with your machine may or may not look exactly the same as those shown in this manual.

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X11SPW-CTF/-TF User's Manual

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) the Intel SKX processor, 2) the processor clip,

3)the dust cover, and 4) the CPU socket.

1.SKX Processor

2.Processor Clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not installed.

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Chapter 2: Installation

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a processor clip, and 3) the SKX processor.

1. Heatsink

2. Processor Clip

3. SKX Processor

Processor Heatsink Module (PHM)

(Bottom View for a non-F Model)

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X11SPW-CTF/-TF User's Manual

Attaching the Non-F Model Processor to the Processor Clip to Create the Processor Carrier Assembly

To properly install the CPU into the processor clip, please follow the steps below:

1.Locate pin 1 (notch A), which is the triangle located on the top of the processor clip. Also locate notch B and notch C on the processor clip.

2.Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate notch B and notch C on the CPU as shown below.

3.Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of the processor clip. Once they are aligned, carefully insert the CPU into the processor clip by sliding notch B of the CPU into notch B of the processor clip, and sliding notch C of the CPU into notch C of the processor clip.

4.Examine all corners of the CPU to ensure that it is properly seated on the processor clip. Once the CPU is securely attached to the processor clip, the processor carrier assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD

gloves when handling components.

CPU (Upside Down) w/CPU LGA Lands up

C

Align Notch C of the CPU

and Notch C of the Processor Clip

B			Allow Notch C to
			latch on to CPU
A			C
Pin 1	C
Align Notch B of the CPU
and Notch B of the Processor Clip
B	CPU/Heatsink Package	B
	(Upside Down)
Align CPU Pin 1
A		Allow Notch B to
		latch on to CPU	A

Processor Carrier Assembly (with CPU

mounted on the Processor Clip)

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Chapter 2: Installation

Attaching the Non-F Model Processor Carrier Assembly to the Heatsink to Form the Processor Heatsink Module (PHM)

After you have made a processor carrier assembly by following the instructions on the previous page, please follow the steps below to mount the processor carrier assembly onto the heatsink to create the Processor Heatsink Module (PHM):

1.Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.

With your index finger pressing against the screw at this triangular corner, carefully hold and turn the heatsink upside down with the thermal-grease side facing up. Remove the protective thermal film if present, and apply the proper amount of the thermal grease as needed. (Skip this step if you have a new heatsink because the necessary thermal grease is pre-applied in the factory.)

2.Holding the processor carrier assembly at the center edge, turn it upside down. With the thermal-grease side facing up, locate the hollow triangle located at the corner of the processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting clicks located next to the hollow triangle. Also locate another set of mounting clicks and a larger hole at the diagonal corner

of the same (reverse) side of the processor carrier assembly ("b" in

the graphic).		Non-Fabric CPU and Processor Clip
		(Upside Down)		b
3. With the back of the heatsink and
the reverse side of the processor
carrier assembly facing up, align the	Triangle on the CPU	d		c
triangular corner on the heatsink
("A" in the graphic) against the			a	B
mounting clips next to the hollow
triangle ("a") on the processor		D		C
carrier assembly.

		Triangle on the
	4. Also align the triangular corner ("B")	Processor Clip
		Heatsink
	at the diagonal side of the heatsink		A
	with the corresponding clips on the	(Upside Down)
			On Locations of (C, D), the notches
	processor carrier assembly ("b").
			B	snap onto the heat sink’s
				mounting holes
	5. Once the mounting clips on	D		C
	the processor carrier assembly
	are properly aligned with the
	corresponding holes on the back
	of the heatsink, securely attach the
	heatsink to the processor carrier		A
	assembly by snapping the mounting	On Locations (A, B), the notches		Make sure Mounting
	clips at the proper places on the	snap onto the heatsink’s sides
				Notches snap into place
	heatsink to create the processor
	heatsink module (PHM).

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X11SPW-CTF/-TF User's Manual

Preparing the CPU Socket for Installation

This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket contains 1) a dust cover, 2) a socket bracket, 3) the CPU (P0) socket, and 4) a back plate. These components are pre-installed on the motherboard before shipping.

CPU Socket w/Dust Cover On

Removing the Dust Cover from the CPU Socket

Remove the dust cover from the CPU socket, exposing the SKX socket and socket pins as shown on the illustration below.

Note: Do not touch the socket pins to avoid damaging them, causing the CPU to malfunction.

Dusk Cover

Remove the dust cover from

the CPU socket. Do not

touch the socket pins!

Socket Pins

SKX CPU Socket

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Chapter 2: Installation

Installing the Processor Heatsink Module (PHM)

Once you have assembled the processor heatsink module (PHM) by following the instructions listed on page 26, you are ready to install the processor heatsink module (PHM) into the CPU socket on the motherboard. To install the PHM into the CPU socket, follow the instructions below:

1.Locate the triangle (pin 1) on the CPU socket, and locate the triangle (pin 1) at the corner of the PHM that is closest to "1." (If you have difficulty locating pin 1 of the PHM, turn the PHM upside down. With the LGA-lands side facing up, you will note the hollow triangle located next to a screw at the corner. Turn the PHM right side up, and you will see a triangle marked on the processor clip at the same corner of hollow triangle.)

2.Carefully align pin 1 (the triangle) on the the PHM against pin 1 (the triangle) on the CPU socket.

3.Once they are properly aligned, insert the two diagonal oval holes on the heatsink into the guiding posts.

4.Using a T30 Torx-bit screwdriver, install four screws into the mounting holes on the socket to securely attach the PHM onto the motherboard starting with the screw marked "1" (in the sequence of 1, 2, 3, and 4).

Note: Do not use excessive force when tightening the screws to avoid damaging the LGA-lands and the processor.

Oval C

Oval D

Large Guiding Post

Small Guiding Post

Printed Triangle

Mounting the Processor Heatsink Module into the CPU socket (on the motherboard)

	Use a torque
	of 12 lbf
	T30 Torx Driver
	#4
#1	#2

#3

Tighten the screws in the sequence of 1, 2, 3, 4 (top 3 quarter view)

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X11SPW-CTF/-TF User's Manual

Removing the Processor Heatsink Module (PHM) from the Motherboard

Before removing the processor heatsink module (PHM), unplug the power cord from the power outlet.

1.Using a T30 Torx-bit screwdriver, turn the screws on the PHM counterclockwise to loosen them from the socket, starting with the screw marked #4 (in the sequence of 4, 3, 2, 1).

2.After all four screws are removed, wiggle the PHM gently and pull it up to remove it from the socket.

Note: To properly remove the processor heatsink module, be sure to loosen and re- move the screws on the PHM in the sequence of 4, 3, 2, 1 as shown below.

Removing the screws in the sequence of 4, 3, 2, 1

		#4
	#1	#2
		#3

Printed Triangle on Motherboard

CPU Socket

After removing the screws, lift the Processor Heatsink Module off the CPU socket.

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