Supermicro X11SPG-TF operation manual

X11SPG-TF

USER'S MANUAL

Revision 1.1

The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/ or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: This product can expose you to chemicals including

!lead, known to the State of California to cause cancer and birth defects or other reproductive harm. For more information, go to www.P65Warnings.ca.gov.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment, nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical systems whose failure to perform be reasonably expected to result in significant injury or loss of life or catastrophic property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.1

Release Date: March 28, 2019

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document. Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2019 by Super Micro Computer, Inc.

All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users. It provides information for the installation and use of the X11SPG-TF motherboard.

About This Motherboard

The Supermicro X11SPG-TF supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx series (Socket P0-LGA 3647) processor with a thermal design power (TDP) of up to 205W. Built with the Intel C621 chipset, the X11SPG-TF includes three

PCI-E slots for GPU and AOC support and offers such features as SATA 3.0, dual 10GbE

LAN, USB ports, and a built-in PCIe storage solution enhancement via Intel VROC. This motherboard supports 6-channel, 6-DIMM DDR4 ECC RDIMM/LRDIMM memory with speeds of up to 2933MHz. The X11SPG-TF is the ideal solution for GPU server platforms that address the needs of next generation computing. Please note that this motherboard is intended to be installed and serviced by professional technicians only. For processor/memory updates, please refer to our website at http://www.supermicro.com/products/.

Note 1: 2933MHz memory is supported by the 82xx/62xx series processors.

Note 2: Intel VROC requires a separate hardware key to enable.

Conventions Used in the Manual

Warning! Indicates important information given to prevent equipment/property damage or personal injury.

Warning! Indicates high voltage may be encountered while performing a procedure.

Important: Important information given to ensure proper system installation or to relay safety precautions.

Note: Additional Information given to differentiate various models or provides information for proper system setup.

3

Super X11SPG-TF User's Manual

Contacting Supermicro

Headquarters
Address:	Super Micro Computer, Inc.
	980 Rock Ave.
	San Jose, CA 95131 U.S.A.
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail] (General Information)
	[e-mail] (Technical Support)
Website:	www.supermicro.com
Europe
Address:	Super Micro Computer B.V.
	Het Sterrenbeeld 28, 5215 ML
	's-Hertogenbosch, The Netherlands
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail] (General Information)
	[e-mail] (Technical Support)
	[e-mail] (Customer Support)
Website:	www.supermicro.nl
Asia-Pacific
Address:	Super Micro Computer, Inc.
	3F, No. 150, Jian 1st Rd.
	Zhonghe Dist., New Taipei City 235
	Taiwan (R.O.C)
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail]
Website:	www.supermicro.com.tw

4

Preface

	Table of Contents
Chapter 1 Introduction
1.1	Checklist................................................................................................................................	8
	Quick Reference................................................................................................................	11
	Quick Reference Table......................................................................................................	12
	Motherboard Features.......................................................................................................	14
1.2	Processor and Chipset Overview.......................................................................................	18
1.3	Special Features.................................................................................................................	19
	Recovery from AC Power Loss.........................................................................................	19
1.4	System Health Monitoring...................................................................................................	19
	Onboard Voltage Monitors.................................................................................................	19
	Fan Status Monitor with Firmware Control........................................................................	19
	Environmental Temperature Control..................................................................................	19
	System Resource Alert......................................................................................................	19
1.5	ACPI Features....................................................................................................................	20
1.6	Power Supply......................................................................................................................	20
1.7	Serial Port...........................................................................................................................	20
Chapter 2 Installation
2.1	Static-Sensitive Devices.....................................................................................................	21
	Precautions........................................................................................................................	21
	Unpacking..........................................................................................................................	21
2.2	Processor and Heatsink Installation...................................................................................	22
	The Intel Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx Series
	Processor...........................................................................................................................	22
	Overview of the Processor Carrier Assembly....................................................................	23
	Overview of the CPU Socket.............................................................................................	23
	Overview of the Processor Heatsink Module....................................................................	24
	Creating the Non-F Model Processor Carrier Assembly...................................................	25
	Assembling the Processor Heatsink Module.....................................................................	26
	Preparing the CPU Socket for Installation.........................................................................	27
	Installing the Processor Heatsink Module.........................................................................	28
	Removing the Processor Heatsink Module.......................................................................	29
2.3	Motherboard Installation.....................................................................................................	30

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Super X11SPG-TF User's Manual

	Tools Needed.....................................................................................................................	30
	Location of Mounting Holes...............................................................................................	30
	Installing the Motherboard.................................................................................................	31
2.4	Memory Support and Installation........................................................................................	32
	Memory Support................................................................................................................	32
	DDR4 Memory Support for 81xx/61xx/51xx/41xx/31xx Platform......................................	32
	DDR4 Memory Support for 82xx/62xx/52xx/42xx/32xx Platform......................................	33
	General Guidelines for Optimizing Memory Performance ...............................................	34
	DIMM Installation...............................................................................................................	35
	DIMM Removal..................................................................................................................	35
2.5	Rear I/O Ports.....................................................................................................................	36
2.6	Front Control Panel.............................................................................................................	40
2.7	Connectors..........................................................................................................................	45
	Power Connections............................................................................................................	45
	Headers.............................................................................................................................	46
2.8	Jumper Settings..................................................................................................................	55
	How Jumpers Work...........................................................................................................	55
2.9	LED Indicators....................................................................................................................	58
Chapter 3 Troubleshooting
3.1	Troubleshooting Procedures...............................................................................................	61
	Before Power On...............................................................................................................	61
	No Power...........................................................................................................................	61
	No Video............................................................................................................................	62
	System Boot Failure ........................................................................................................	62
	Memory Errors...................................................................................................................	62
	Losing the System's Setup Configuration..........................................................................	63
	When the System Becomes Unstable...............................................................................	63
3.2	Technical Support Procedures............................................................................................	65
3.3	Frequently Asked Questions...............................................................................................	66
3.4	Battery Removal and Installation........................................................................................	67
	Battery Removal................................................................................................................	67
	Proper Battery Disposal.....................................................................................................	67

6

Preface

	Battery Installation.............................................................................................................	67
3.5	Returning Merchandise for Service....................................................................................	68
Chapter 4 UEFI BIOS
4.1	Introduction.........................................................................................................................	69
4.2	Main Setup..........................................................................................................................	70
4.3	Advanced Setup Configurations.........................................................................................	72
4.4	Event Logs..........................................................................................................................	99
4.5	IPMI...................................................................................................................................	101
4.6	Security.............................................................................................................................	104
4.7	Boot ..................................................................................................................................	108
4.8	Save & Exit.......................................................................................................................	111
Appendix A UEFI BIOS Codes
Appendix B Software Installation
B.1	Installing Software Programs............................................................................................	115
B.2	SuperDoctor® 5.................................................................................................................	116
Appendix C Standardized Warning Statements
	Battery Handling..............................................................................................................	117
	Product Disposal..............................................................................................................	119

Appendix D UEFI BIOS Recovery

7

Super X11SPG-TF User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro motherboards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard, several important parts that are included in the retail box are listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description	Part Number	Quantity
Supermicro Motherboard	X11SPG-TF	1
SATA Cables	CBL-0044L	6
Quick Reference Guide	MNL-1965-QRG	1

Important Links

For your system to work properly, please follow the links below to download all necessary drivers/utilities and the user’s manual for your server.

•Supermicro product manuals: http://www.supermicro.com/support/manuals/

•Product drivers and utilities: https://www.supermicro.com/wftp/driver/

•Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

•If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website for possible updates to the manual revision level.

8

Chapter 1: Introduction

Figure 1-1. X11SPG-TF Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision available at the time of publication of the manual. The motherboard you received may

or may not look exactly the same as the graphics shown in this manual.

9

Super X11SPG-TF User's Manual

Figure 1-2. X11SPG-TF Motherboard Layout

(not drawn to scale)

JUIDB1 LE1								USB1	USB0

SXB1A

COM2

VGA

JPTG1

JPCK1

LAN2 LAN1 IPMI_LAN

USB4/5(3.0)

SXB2A

	X16 0.3 E-PCI SLOT3 CPU
SXB1B	+
X16 0.3 E-PCI

	Aspeed
AST2500
LEDM1
JPG1
JSTBY1		JD1
TF-X11SPG 01.1 REV: USA IN DESIGNED	JWD1

BT1

SATA4-I	JSD1	JSD2	Intel
I			C621
SATA5-

Intel

X550

			USB2/3
	MH10	MH12
	JP2
		JIPMB1	+
	JPME2		SP1
		USB6/7(3
		0).
		JP4	0).USB8(3
	M.2-H_1 PCI-E 3.0 X4
			LE3
	M.2-H_2 PCI-E 3.0 X4		LE4

-I
-I SATA6	SATA0-S	SATA1-S	JP1
SATA7			JBT1
			CPU
	S-SGPIO1
	I-SGPIO2
FANA
FANB

JRK1

JOH1 FAND FANC JNVI2C1 JTPM1 JP3 X16 0.3 E-PCI SXB2B

BIOS LICENSE

JPWR5
	DIMMF1		DIMME1		DIMMD1

FAN4 FAN3

	IPMI CODE
SAN MAC	MAC CODE	BAR CODE
JPI2C1

		PWR ON
			RST	JF1
		LED FAIL	UID PS
		2	NIC
		1	NIC	LE2
		LED LED	PWR HDD
			X
			NMI
DIMMA1	DIMMB1	DIMMC1		JPWR6

FAN2 FAN1 JL1

Note: Components not documented are for internal testing only.

10

Chapter 1: Introduction

Quick Reference

JUIDB1

JPTG1

USB0

IPMI_LAN

VGA

LAN2

USB4/5 (3.0)

LE1

USB1

LAN1

JUIDB1 LE1

USB1

USB0

COM2

COM2

VGA

JPTG1

JPCK1

SXB2A

SXB1A

SXB1A

LAN2

LAN1

IPMI_LAN

SXB2A

USB4/5(3.0)

SLOT3

Aspeed

Intel

X550

CPU

AST2500

LEDM1

LEDM1

JPG1

SLOT3

JPG1

USB2/3

.3 E-PCI

USB2/3

JSTBY1

MH10

X16 0

JSTBY1

MH10

MH12

JD1

JP2

MH12

JWD1

01.1 REV: DESIGNED

JIPMB1

+

JIPMB1

JPME2

SP1

.3 E-PCI SXB1B

USAIN

JWD1

JPME2 JD1

SP1

SXB1B

0).USB6/7(3

USB6/7 (3.0)

BT1

+

BT1 TF-X11SPG

SXB2B

JSD2

X160

JP4

0.3 E-PCI SXB2B

JSD1

SATA4-I

JSD1

JSD2

M.2-H_1 PCI-E 3.0 X4

0).USB8(3

USB8 (3.0)

I-SATA4

Intel

I-SATA5

SATA5-I

C621

LE3

X16

LE3

M.2-H_2 PCI-E 3.0 X4

LE4

S-SATA0

LE4

S-SATA1

-I SATA6-I

SATA1-S SATA0-S

JP1

JP3

I-SATA6

JBT1

M.2-H_2 PCI-E 3.0 x4

I-SATA7

SATA7

CPU

M.2-H_1 PCI-E 3.0 x4

JBT1

S-SGPIO1

JTPM1

JTPM1

S-SGPIO1

I-SGPIO2

I-SGPIO2

FANB FANA

FANA

JNVI2C1

JNVI2C1

FANB

CPU

DIMMD1

JRK1

JRK1

FAND FANC

FANC

DIMME1

DIMMF1

FAND

JOH1

JOH1

DIMMC1

BIOS LICENSE

JF1

JF1

DIMMB1

JPWR6 LE2

LE2

DIMMA1

JPWR5

DIMMF1

DIMMD1 DIMME1

DIMMA1

DIMMB1

DIMMC1

JPWR5

JPI2C1

FAN4

FAN3

FAN2 FAN1

JPWR6

IPMI CODE

JL1

SAN MAC

MAC CODE

BAR CODE

JL1

JPI2C1

FAN4 FAN3

FAN2 FAN1

Notes:

•See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connections.

•"" indicates the location of Pin 1.

•Jumpers/LED indicators not indicated are used for testing only.

•Use only the correct type of onboard CMOS battery as specified by the manufacturer. Do not install the onboard battery upside down to avoid possible explosion.

11

Super X11SPG-TF User's Manual

Quick Reference Table

Jumper	Description	Default Setting
JBT1	CMOS Clear	Open (Normal)
JPG1	VGA Enable/Disable	Pins 1-2	(Enabled)
JPME2	ME Manufacturing Mode	Pins 1-2	(Normal)
JPTG1	LAN Enable/Disable	Pins 1-2	(Enabled)
JWD1	Watchdog Timer	Pins 1-2	(Reset)

LED	Description	Status
LE1	Unit Identifier (UID) LED	Solid Blue: Unit Identified
LE2	Onboard Power LED	Solid Green: Power On
LE3, LE4	M.2 LED	Blinking Green: Device Working
LEDM1	BMC Heartbeat LED	Blinking Green: BMC Normal

	Connector	Description
	BT1	Onboard Battery
	COM2	COM Header
	FAN1 ~ FAN4	CPU/System Fan Headers
	FANA ~ FAND	GPU Fan Headers
	IPMI_LAN	Dedicated IPMI LAN Port
	I-SATA4 ~ I-SATA7	Intel® PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)
	I-SGPIO2, S-SGPIO1	Serial Link General Purpose I/O Connection Headers (I-SGPIO: SATA use; S-SGPIO: sSATA
		use)
	JD1	Speaker/Power LED Indicator (Pins 1-3: Power LED, Pins 4-7: Speaker)
	JF1	Front Control Panel Header
	JIPMB1	4-pin BMC External I2C Header (for an IPMI card)
	JL1	Chassis Intrusion Header
	JNVI2C1	NVMe I2C Header
	JOH1	Overheat LED Indicator
	JPI2C1	Power I2C System Management Bus (SMB) Header
	JPWR5	20-pin Main Power Connector
	JPWR6	8-pin Power Connector for GPU
	JRK1	Intel RAID Key Header
	JSD1, JSD2	SATA DOM Power Connectors
	JSTBY1	Standby Power Header
	JTPM1	Trusted Platform Module/Port 80 Connector
	JUIDB1	Unit Identifier (UID) Switch
	LAN1, LAN2	10GbE LAN Ports
	M.2-H_1, M.2-H_2	Dual M.2 PCI-E 3.0 x4 or SATA 3.0 Slots (Supports M-Key 2280)

Note: Table is continued on the next page.

12

Chapter 1: Introduction

Connector	Description
MH10, MH12	M.2 Mounting Holes
SLOT3	Middle CPU PCI-E 3.0 x16 Slot
SP1	Internal Speaker/Buzzer
S-SATA0, S-SATA1	SATA 3.0 Ports with SATA DOM Power
SXB1A, SXB1B	Left PCI-E 3.0 x16 GPU Slot
SXB2A, SXB2B	Right PCI-E 3.0 x16 GPU Slot
USB0, USB1	Back Panel Universal Serial Bus (USB) 2.0 Ports
USB2/3	Front Accessible USB 2.0 Header
USB4/5	Back Panel USB 3.0 Ports
USB6/7	Front Accessible USB 3.0 Header
USB8	USB 3.0 Type-A Header
VGA	VGA Port

13

Super X11SPG-TF User's Manual

Motherboard Features

Motherboard Features

CPU

•Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx series (Socket P0-LGA3647) processor with a thermal design power (TDP) of up to 205W and 28 cores

Note: The X11SPG-TF motherboard does not support FPGA or Fabric processors.

Memory

•Up to 384GB of RDIMM, 768GB of LRDIMM, and 1.5TB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of up to 2933MHz in six memory slots

Note 1: Memory speed support depends on the processors used in the system.

Note 2: 2933MHz memory is supported by the 82xx/62xx series processors only.

DIMM Size

• Up to 256GB at 1.2V

Note 1: Memory capacity and frequency is CPU dependent.

Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/ motherboard.

Chipset

• Intel C621

Expansion Slots

•Three (3) PCI-Express 3.0 x16 Slots (CPU Slot 3, SXB1A/SXB1B Slot, SXB2A/SXB2B Slot)

•Two (2) M.2 for PCI-Express 3.0 x4 or SATA 3.0 Slot (Supports M-Key 2280)

Network

•Intel Ethernet Controller X550 for 10G BASE-T Ports

•One (1) Dedicated IPMI LAN located on the rear I/O panel

Baseboard Management Controller (BMC)

• ASpeed AST2500 BMC

Graphics

• Graphics controller via ASpeed AST2500 BMC

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Motherboard Features

I/O Devices

•Serial (COM) Port

•SATA 3.0

•Video (VGA) Port

•One (1) front accessible serial port header (COM2)

•Four (4) SATA 3.0 ports with RAID 0, 1, 5, 10 (I-SATA4~7)

•Two (2) S-SATA 3.0 ports with RAID 0, 1, 5, 10 (S-SATA0~1)

•One (1) VGA connection on the rear I/O panel

Peripheral Devices

•Two (2) USB 2.0 ports on the rear I/O panel (USB0, USB1)

•Two (2) USB 3.0 ports on the rear I/O panel (USB4/5)

•One (1) front accessible USB 2.0 header with two (2) USB connections (USB2/3)

•One (1) front accessible USB 3.0 header with two (2) USB connections (USB6/7)

•One (1) USB 3.0 Type-A header (USB8)

BIOS

•256Mb AMI BIOS® SPI Flash UEFI BIOS

•ACPI 6.0, Plug and Play (PnP), PCI F/W 3.0, BIOS rescue hot-key, SPI dual/quad speed support, riser Card auto detection support, SMBIOS 3.0 or later, real time clock (RTC) wakeup

Power Management

•ACPI power management

•Power button override mechanism

•Wake-on-LAN

•Power-on mode for AC power recovery

•Power supply monitoring

System Health Monitoring

•Onboard voltage monitoring for +1.8V, +3.3V, +5V, +12V, +3.3V stdby, +5V stdby, VBAT, PCH temperature, system temperature, and memory temperature

•5 CPU switch phase voltage regulator

•CPU thermal trip support

•Platform Environment Control Interface (PECI)/TSI

Fan Control

•Fan status monitoring via IPMI connections

•Three cooling zones

•Multi-fan speed control support through onboard BMC

•Eight (8) 4-pin fan headers

System Management

•Trusted Platform Module (TPM) support

•SuperDoctor® 5

•Watchdog, Non-maskable Interrupt (NMI), RoHs

•Chassis intrusion header and detection (Note: Please connect a cable from the Chassis Intrusion header at JD1 to the chassis to receive an alert via IPMI)

•Server Platform Service

Note: The table above is continued on the next page.

15

Super X11SPG-TF User's Manual

Motherboard Features

LED Indicators

•CPU/system overheat LED

•Powe state indicator LED

•Fan failed LED

•UID/remote UID

•HDD activity LED

•LAN activity LED

Dimensions

• 7.71" (W) x 16.64" (L) (195.8mm x 422.7mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and heatsink cooling restrictions. For proper thermal management, please check the chassis and heatsink specifications for proper CPU TDP sizing.

Note 2: For IPMI configuration instructions, please refer to the Embedded IPMI Configuration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon initial system power-on. The manufacture default username is ADMIN and the password is

ADMIN. For proper BMC configuration, please refer to https://www.supermicro.com/ products/nfo/files/IPMI/Best_Practices_BMC_Security.pdf.

16

Chapter 1: Introduction

Figure 1-3.

System Block Diagram

#C-1 #B-1

#A-1

DDRIV UP TO 2666/2933

VCCP0 12v

			VR13
		5+1 PHASE
			205W
	VCCP0
	SNB CORE			PECI:30
	DDR-IV
			SOCKET ID:0

#3 #2 #1 DMI3

#F-1 #E-1

#D-1

2666/2933

UP TO

DDRIV

X16

PCI-E X16 G3

DMI3

PCI-E

Right GPU PCI-E X16

PCI-E X16 G3

PCI-E X16 G3

GPU X16

LEFT PCI-E

PCI-E X4 G3

#8~11

M.2 SSD

PCI-E X4 G3

#12~15

M.2 SSD

PCH

LAN1

RJ45

Intel

PCIE X4 G3

(C621)

X550 (10G)

#0~3

LAN2

RJ45

RGRMII

LAN3

RMII/NCSI

IPMI

USB2.0 #3,4

RJ45

RTL8211E-VB-CG

USB2.0 #0,1

PCI-E X1 G2

USB3.0 #3,4

DDR4

BMC

#5

SPI

USB 2.0

USB2.0 #8,9 &

USB3.0 #6

BMC Boot Flash

AST2500

#7 USB2.0

USB2.0 #10 &

ESPI

USB3.0 #1,2

USB2.0 #13,14 &

	ESPI		SPI
	Header	Switch
	SPI		SPI

TPM HEADER

BIOS

VGA CONN

COM2

Debug Card

Header

Temp Sensor

EMC1402-1 *2 at diff SMBUS

FRONT PANEL

#7

#6

#5

#4

6.0 Gb/S	SATA

#1SATA-DOM #0

6.0 Gb/S	sSATA

Front USB2.0 x 2

	USB 2.0			USB
	USB 2.0
	USB 3.0

Rear USB2.0 x 2

USB

Front USB3.0 x 2

USB

Type A USB3.0

USB

Rear USB3.0 x 2

USB

SYSTEM POWER

FAN SPEED

CTRL

Note 1: This is a general block diagram and may not exactly represent the features on your motherboard. See the previous pages for the actual specifications of your motherboard.

Note 2: 2933 MHz Memory is only supported by the 82xx/62xx series processors.

17

Super X11SPG-TF User's Manual

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx series (Socket P0-LGA3647) processor and the Intel C621 chipset, the X11SPG-TF motherboard provides system performance, power efficiency, and feature sets to address the needs of next-generation computer users.

With the support of the new Intel Microarchitecture 14nm Process Technology, the X11SPG-TF dramatically increases system performance for a multitude of server applications.

The Intel C621 chipset provides Enterprise SMbus support, including the following features:

•DDR4 288-pin memory support

•Support for Management Engine (ME)

•Support of SMBus speeds of up to 400KHz for BMC connectivity

•Improved I/O capabilities to high-storage-capacity configurations

•SPI Enhancements

•Intel Node Manager 3.0 for advanced power monitoring, capping and management for BMC enhancement (see note below).

•BMC supports remote management, virtualization, and the security package for enterprise platforms

Note: Note Manager support depends on the power supply used in your system.

New features supported by the 82xx/62xx/52xx/42xx/32xx series processors include the following:

•Higher performance for a variety of workloads per-core performance increase

•Vector Neural Network Instructions (VNNI) support to accelerate AI/Deep Learning workloads

•Intel Speed Select Technology with support by boosting performance on critical cores in CPU based on on workload needs **

**- support on select SKUs

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Chapter 1: Introduction

1.3 Special Features

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond when AC power is lost and then restored to the system. You can choose for the system to remain powered off (in which case you must press the power switch to turn it back on), or for it to automatically return to the power-on state. See the Advanced BIOS Setup section for this setting. The default setting is Last State.

1.4 System Health Monitoring

Onboard Voltage Monitors

An onboard voltage monitor will scan the voltages of the onboard chipset, memory, CPU, and battery continuously. Once a voltage becomes unstable, a warning is given, or an error message is sent to the screen. The user can adjust the voltage thresholds to define the sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors monitor temperatures and voltage settings of onboard processors and the system in real time via the IPMI interface. Whenever the temperature of the CPU or the system exceeds a user-defined threshold, system/CPU cooling fans will be turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air- flow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux environment. SuperDoctor is used to notify the user of certain system events. For example, you can configure SuperDoctor to provide you with warnings when the system temperature, CPU temperatures, voltages and fan speeds go beyond a predefined range.

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Super X11SPG-TF User's Manual

1.5 ACPI Features

ACPI stands forAdvanced Configuration and Power Interface. TheACPI specification defines a flexible and abstract hardware interface that provides a standard way to integrate power management features throughout a computer system, including its hardware, operating system and application software. This enables the system to automatically turn on and off peripherals such as CD-ROMs, network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a generic system event mechanism for Plug and Play, and an operating system-independent interface for configuration control. ACPI leverages the Plug and Play BIOS data structures, while providing a processor architecture-independent implementation that is compatible with the appropriate operating systems.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable operation. It is even more important for processors that have high CPU clock rates where noisy power transmission is present.

The X11SPG-TF motherboard accommodates a 20-pin main power supply. In addition, one 12V 8-pin power connector is supported to provide the required power to the GPU add-on card.

It is strongly recommended that you use a high quality power supply that meets ATX power supply Specification 2.02 or above. It must also be SSI compliant. (For more information, please refer to the website at http://www.ssiforum.org/).

1.7 Serial Port

The X11SPG-TF motherboard supports one serial communication connection. COM Port 2 can be used for input/output. The UART provides legacy speeds with a baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support high-speed serial communication devices.

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Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic components­. To avoid damaging your system board, it is important to handle it very carefully. The following measures are generally sufficient to protect your equipment from ESD.

Precautions

•Use a grounded wrist strap designed to prevent static discharge.

•Touch a grounded metal object before removing the board from the antistatic bag.

•Handle the motherboard by its edges only; do not touch its components, peripheral chips, memory modules or gold contacts.

•When handling chips or modules, avoid touching their pins.

•Put the motherboard and peripherals back into their antistatic bags when not in use.

•For grounding purposes, make sure that your computer chassis provides excellent conductivity between the power supply, the case, the mounting fasteners and the motherboard.

•Use only the correct type of onboard CMOS battery. Do not install the onboard battery upside down to avoid possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking the motherboard, make sure that the person handling it is static protected.

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Super X11SPG-TF User's Manual

2.2 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together first to form the processor carrier assembly. This will be attached to the heatsink to form the processor heatsink module (PHM) before being installed onto the CPU socket.

Notes:

•Use ESD protection.

•Unplug the AC power cord from all power supplies after shutting down the system.

•Check that the plastic protective cover is on the CPU socket and none of the socket pins are bent. If they are, contact your retailer.

•When handling the processor, avoid touching or placing direct pressure on the LGA lands (gold contacts). Improper installation or socket misalignment can cause serious damage to the processor or CPU socket, which may require manufacturer repairs.

•Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.

•Refer to the Supermicro website for updates on processor support.

•All graphics in this manual are for illustrations only. Your components may look different.

The Intel Xeon 81xx/61xx/51xx/41xx/31xx and 82xx/62xx/52xx/42xx/32xx Series Processor

Non-Fabric Model

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Chapter 2: Installation

Overview of the Processor Carrier Assembly

The processor carrier assembly contains the Intel Xeon Non-Fabric (Non-F) processor and a processor carrier.

1. Non-F Processor

2. Processor Carrier

Overview of the CPU Socket

The CPU socket is protected by a plastic protective cover.

1. Plastic Protective Cover

2. CPU Socket

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Super X11SPG-TF User's Manual

Overview of the Processor Heatsink Module

The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the Intel Xeon Non-Fabric (Non-F) processor.

1. Heatsink with Thermal Grease

2. Processor Carrier

3. Non-F Processor

Processor Heatsink Module

Bottom View

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Chapter 2: Installation

Creating the Non-F Model Processor Carrier Assembly

To install a Non-F model processor into the processor carrier, follow the steps below:

1.Hold the processor with the LGA lands (gold contacts) facing up. Locate the small, gold triangle in the corner of the processor and the corresponding hollowed triangle on the processor carrier. These triangles indicate pin 1. See the images below.

2.Using the triangles as a guide, carefully align and place Point A of the processor into

Point A of the carrier. Then gently flex the other side of the carrier for the processor to fit into Point B.

3.Examine all corners to ensure that the processor is firmly attached to the carrier.

CPU (Upside Down)	B
with CPU LGA Lands up

A

Align Point B of the CPU and Point B of the Processor Carrier

Pin 1

Align Point A of the CPU and

Point A of the Processor Carrier

B

A

Processor Carrier

(Upside Down)

Align CPU Pin 1

Allow carrier to

latch onto CPU

B

A

Allow carrier to

latch onto CPU

Pin 1

Processor Carrier Assembly (Non-F Model)

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Super X11SPG-TF User's Manual

Assembling the Processor Heatsink Module

After creating the processor carrier assembly for the Non-F model processor, mount it onto the heatsink to create the processor heatsink module (PHM):

1.Note the label on top of the heatsink, which marks the heatsink mounting holes as 1, 2, 3, and 4. If this is a new heatsink, the thermal grease has been pre-applied on the underside. Otherwise, apply the proper amount of thermal grease.

2.Turn the heatsink over with the thermal grease facing up. Hold the processor carrier assembly so the processor's gold contacts are facing up, then align the triangle on the assembly with hole 1 of the heatsink. Press the processor carrier assembly down. The plastic clips of the assembly will lock outside of holes 1 and 2, while the remaining clips will snap into their corresponding holes.

3.Examine all corners to ensure that the plastic clips on the processor carrier assembly are firmly attached to the heatsink.

Non-Fabric Processor Carrier Assembly

(Upside Down)	2

Triangle on the CPU

1 2

Triangle on the

Processor Carrier

Heatsink

(Upside Down) 1

		Remaining plastic clips snap
	2	into the other corner holes
		of the heatsink

1

Plastic clips 1 and 2 lock outside the heatsink’s mounting holes

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Chapter 2: Installation

Preparing the CPU Socket for Installation

This motherboard comes with a plastic protective cover installed on the CPU socket. Remove it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner of the plastic protective cover to remove it.

CPU Socket with Plastic Protective Cover

Remove the plastic protective cover from the CPU socket.

Do not touch or bend the socket pins.

Socket Pins

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Super X11SPG-TF User's Manual

Installing the Processor Heatsink Module

After assembling the Processor Heatsink Module (PHM), install the PHM onto the CPU socket:

1.Align hole 1 of the heatsink with the printed triangle on the CPU socket. See the left image below.

2.Make sure all four holes of the heatsink are aligned with the socket before gently placing the heatsink on top.

3.With a T30 Torx-bit screwdriver, gradually tighten screws #1 - #4 to ensure even pressure. The order of the screws is shown on the label on top of the heatsink. To avoid damaging the processor or socket, do not use a force greater than 12 lbf-in when tightening the screws.

4.Examine all corners to ensure that the PHM is firmly attached to the socket.

Oval C

Oval D

Large Guide Post

Small Guide Post

Printed Triangle

Mounting the Processor Heatsink Module onto the CPU socket (on the motherboard)

	Use a torque
	of 12 lbf-in
	T30 Torx Screwdriver
	#4
#1	#2
	#3
	Tighten the screws in
	the sequence of 1, 2, 3, 4

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Chapter 2: Installation

Removing the Processor Heatsink Module

Before removing the processor heatsink module (PHM) from the motherboard, unplug the AC power cord from all power supplies after shutting down the system. Then follow the steps below:

1.Use a T30 Torx-bit screwdriver to loosen the four screws in a backwards sequence of #4, #3, #2, and #1.

2.Gently lift the PHM upwards to remove it from the socket.

Remove the screws in the sequence of 4, 3, 2, 1

		#4
	#1	#2
		#3

Printed Triangle on Motherboard

CPU Socket

After removing the screws, lift the Processor Heatsink Module off the CPU socket.

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Super X11SPG-TF User's Manual

2.3 Motherboard Installation

All motherboards have standard mounting holes to fit different types of chassis. Make sure that the locations of all the mounting holes for both the motherboard and the chassis match. Although a chassis may have both plastic and metal mounting fasteners, metal ones are highly recommended because they ground the motherboard to the chassis. Make sure that the metal standoffs click in or are screwed in tightly.

Tools Needed

Phillips

Screwdriver

(1)

Phillips Screws

(7)

JUIDB1	LE1	USB1	USB0
	COM2	VGA
SXB1A		JPTG1	JPCK1	LAN1	IPMI_LAN	SXB2A
			LAN2
					USB4/5(3.0)

	X16 0.3 E-PCI SLOT3 CPU
SXB1B	+
X16 0.3 E-PCI

	Aspeed
AST2500
LEDM1
JPG1
JSTBY1		JD1
TF-X11SPG 01.1 REV: USA IN DESIGNED	JWD1

BT1

SATA4-I	JSD1	JSD2	Intel
-I			C621
SATA5

Intel

X550

		USB2/3
MH10	MH12
JP2
	JIPMB1	+
JPME2		SP1
	USB6/7(3
	0).
	JP4
M.2-H_1 PCI-E 3.0 X4		USB8(3
		0).
		LE3
M.2-H_2 PCI-E 3.0 X4		LE4

-I SATA6-I	SATA0-S	SATA1-S	JBT1	JP1
SATA7				CPU
	S-SGPIO1
	I-SGPIO2
FANA
FANB

JRK1

JOH1 FAND FANC JNVI2C1 JTPM1 JP3 X16 0.3 E-PCI SXB2B

					BIOS LICENSE			JF1
JPWR5	DIMMF1	DIMME1	DIMMD1		DIMMA1	DIMMB1	DIMMC1	JPWR6 LE2
	FAN4	FAN3		IPMI CODE	FAN2 FAN1			JL1
JPI2C1			SAN MAC	MAC CODE	BAR CODE

Standoffs (7)

Only if Needed

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use a force greater than 8 lbf-in on each mounting screw during motherboard installation. 2) Some components are very close to the mounting holes. Please take precautionary measures to avoid damaging these components when installing the motherboard to the chassis.

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