Supermicro X11SPL-F User Manual

X11SPL-F

USER'S MANUAL

Revision 1.0b

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates.

Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/ or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment, nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical systems whose failure to perform be reasonably expected to result in significant injury or loss of life or catastrophic property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0b

Release Date: April 04, 2018

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document. Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2018 by Super Micro Computer, Inc.

All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users. It provides information for the installation and use of the X11SPL-F motherboard.

About This Motherboard

The Supermicro X11SPL-F motherboard supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA 3647) processor with up to 28 cores and a thermal design power (TDP) of up to165W. Built with the Intel PCH C621 chipset, the motherboard supports 6-channel, 8-DIMM DDR4 ECC RDIMM/LRDIMM memory with speeds of up to 2666MHz. It features such technologies as the Intel Virtualization Technology for Directed I/O for improved security and system reliability. The X11SPL-F includes PCI-Express 3.0 slots, SATA 3.0 ports, dual 1G Base-T LAN support, and an M.2 slot (Type 2280 and 22110). This motherboard is ideal for I/O intensive application and video surveillance. Please note that this motherboard is intended to be installed and serviced by professional technicians only. For processor/memory updates, please refer to our website at http://www.supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage or personal injury.

Warning! Indicates high voltage may be encountered while performing a procedure.

Important: Important information given to ensure proper system installation or to relay safety precautions.

Note: Additional Information given to differentiate various models or provides information for proper system setup.

3

Super X11SPL-F User's Manual

Contacting Supermicro

Headquarters
Address:	Super Micro Computer, Inc.
	980 Rock Ave.
	San Jose, CA 95131 U.S.A.
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail] (General Information)
	[e-mail] (Technical Support)
Website:	www.supermicro.com
Europe
Address:	Super Micro Computer B.V.
	Het Sterrenbeeld 28, 5215 ML
	's-Hertogenbosch, The Netherlands
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail] (General Information)
	[e-mail] (Technical Support)
	[e-mail] (Customer Support)
Website:	www.supermicro.nl
Asia-Pacific
Address:	Super Micro Computer, Inc.
	3F, No. 150, Jian 1st Rd.
	Zhonghe Dist., New Taipei City 235
	Taiwan (R.O.C)
Tel:	[phone]
Fax:	[phone]
Email:	[e-mail]
Website:	www.supermicro.com.tw

4

Preface

	Table of Contents
Chapter 1 Introduction
1.1	Checklist................................................................................................................................	8
	Quick Reference................................................................................................................	11
	Quick Reference Table......................................................................................................	12
	Motherboard Features.......................................................................................................	14
1.2	Processor and Chipset Overview.......................................................................................	18
1.3	Special Features.................................................................................................................	18
	Recovery from AC Power Loss.........................................................................................	18
1.4	System Health Monitoring...................................................................................................	19
	Onboard Voltage Monitors.................................................................................................	19
	Fan Status Monitor with Firmware Control........................................................................	19
	Environmental Temperature Control..................................................................................	19
	System Resource Alert......................................................................................................	19
1.5	ACPI Features....................................................................................................................	19
1.6	Power Supply......................................................................................................................	20
1.7	Serial Port...........................................................................................................................	20
Chapter 2 Installation
2.1	Static-Sensitive Devices.....................................................................................................	21
	Precautions........................................................................................................................	21
	Unpacking..........................................................................................................................	21
2.2	Processor and Heatsink Installation...................................................................................	22
	The Intel Xeon 81xx/61xx/51xx/41xx/31xx Series Processor............................................	22
	Overview of the Processor Carrier Assembly....................................................................	23
	Overview of the CPU Socket.............................................................................................	23
	Overview of the Processor Heatsink Module....................................................................	24
	Creating the Non-F Model Processor Carrier Assembly...................................................	25
	Assembling the Processor Heatsink Module.....................................................................	26
	Preparing the CPU Socket for Installation.........................................................................	27
	Installing the Processor Heatsink Module.........................................................................	28
	Removing the Processor Heatsink Module.......................................................................	29
2.3	Motherboard Installation.....................................................................................................	30

5

Super X11SPL-F User's Manual

	Tools Needed.....................................................................................................................	30
	Location of Mounting Holes...............................................................................................	30
	Installing the Motherboard.................................................................................................	31
2.4	Memory Support and Installation........................................................................................	32
	Memory Support................................................................................................................	32
	General Guidelines for Optimizing Memory Performance.................................................	33
	DIMM Installation...............................................................................................................	34
	DIMM Removal..................................................................................................................	34
2.5	Rear I/O Ports.....................................................................................................................	35
2.6	Front Control Panel.............................................................................................................	40
2.7	Connectors..........................................................................................................................	45
	Power Connections............................................................................................................	45
	Headers.............................................................................................................................	47
2.8	Jumper Settings..................................................................................................................	56
	How Jumpers Work...........................................................................................................	56
2.9	LED Indicators....................................................................................................................	59
Chapter 3 Troubleshooting
3.1	Troubleshooting Procedures...............................................................................................	62
	Before Power On...............................................................................................................	62
	No Power...........................................................................................................................	62
	No Video............................................................................................................................	63
	System Boot Failure ........................................................................................................	63
	Memory Errors...................................................................................................................	63
	Losing the System's Setup Configuration..........................................................................	64
	When the System Becomes Unstable...............................................................................	64
3.2	Technical Support Procedures............................................................................................	66
3.3	Frequently Asked Questions...............................................................................................	67
3.4	Battery Removal and Installation........................................................................................	68
	Battery Removal................................................................................................................	68
	Proper Battery Disposal.....................................................................................................	68
	Battery Installation.............................................................................................................	68
3.5	Returning Merchandise for Service....................................................................................	69

6

Preface

Chapter 4 BIOS
4.1	Introduction.........................................................................................................................	70
4.2	Main Setup..........................................................................................................................	71
4.3	Advanced Setup Configurations.........................................................................................	73
4.4	Event Logs........................................................................................................................	100
4.5	IPMI...................................................................................................................................	102
4.6	Security.............................................................................................................................	105
4.7	Boot ..................................................................................................................................	109
4.8	Save & Exit.......................................................................................................................	112
Appendix A BIOS Codes
Appendix B Software Installation
B.1	Installing Software Programs............................................................................................	116
B.2	SuperDoctor® 5.................................................................................................................	117
Appendix C Standardized Warning Statements
	Battery Handling..............................................................................................................	118
	Product Disposal..............................................................................................................	120

Appendix D UEFI BIOS Recovery

7

Super X11SPL-F User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro motherboards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard, several important parts that are included in the retail box are listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

	Description	Part Number	Quantity
	Supermicro Motherboard	X11SPL-F	1
	I/O Shield	MCP-260-00109-0N	1
	SATA Cables	CBL-0044L	6
	Quick Reference Guide	MNL-1950-QRG	1

Important Links

For your system to work properly, please follow the links below to download all necessary drivers/utilities and the user’s manual for your server.

•Supermicro product manuals: http://www.supermicro.com/support/manuals/

•Product drivers and utilities: ftp://ftp.supermicro.com

•Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

•If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website for possible updates to the manual revision level.

8

Chapter 1: Introduction

Figure 1-1. X11SPL-F Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision available at the time of publication of the manual. The motherboard you received may

or may not look exactly the same as the graphics shown in this manual.

9

Super X11SPL-F User's Manual

Figure 1-2. X11SPL-F Motherboard Layout

(not drawn to scale)

		UID	VGA		COM1
		-UID -
JPL2	JPL1	SW		0).USB8/9(3	FAN5
		LED
ASpeed
AST2500			LAN2	LAN1	IPMI_LAN
			JLAN2	JLAN1
LEDBMC					USB0/1

COM2

PCH

CPU

CPU

CPU

01.REV:1

CPU

CPU

CPU

DIMMB1

CPU

DIMMF1

JPG1

X8) X4(IN 0.3 E-SLOT1PCI

X8 0.3 E-SLOT2PCI

X8 0.3 E-SLOT3PCI

X16) X8(IN 0.3 E-SLOT4PCI

X8 0.3 E-SLOT5PCI

X16) X8(IN 0.3 E-SLOT6PCI

X8 0.3 E-SLOT7PCI

DIMME1

JWD1

JD1

USA INDESIGNED

FX11SPL-

DIMMA2 DIMMA1 DIMMC1

DIMMD1 DIMMD2

0).USB10/11(3

MH10

SP1

+

USB2/3

MH11

USB4/5

BIOS LICENSE

JRK1

SGPIO1-I

JBT1

BT1

JOH1

I-SGPIO2

JIPMB1

I

SATA0-

PWR ON

JF1

RST

I-SATA2

Intel

0).USB12(3

PWR HDD NIC NIC UID PS LED LED 1 2 LED FAIL

BAR CODE

I-SATA3

C621

+

MAC CODE

JPWR1

I-SATA4

M.2 PCI-E 3.0 X4

USB6/7

IPMI CODE

I-SATA5

JNVI2C1

I-SATA6

I-SATA7

JSD2 SATA1-I

JPME2

LE3

JTPM1

LEDPWR

NMIX

FAN3

JPWR2

JSTBY1

JPI2C1

JL1

FANB

FANA

FAN4

FAN2

FAN1

JSD1

JF1

Note: Components not documented are for internal testing only.

10

Chapter 1: Introduction

Quick Reference

UID-LED

USB8/9 (3.0)

SLOT4

IPMI_LAN

SLOT6

UID-SW

USB0/1

SLOT3

SLOT5

LAN2 LAN1

SLOT2

JPL2

SLOT7

VGA

COM1

LEDBMC

JPL1

ASpeed SLOT1 AST2500

LEDBMC

JPL2

JPL1

SW-UID LED-UID

VGA

LAN2 LAN1

JLAN2 JLAN1

0).USB8/9(3

COM1

FAN5

IPMI_LAN

USB0/1

FAN5

COM2

JWD1

JPG1

JD1

MH10 USB10/11 (3.0)

SP1

USB2/3

MH11

	COM2	PCH	CPU
JWD1	JPG1	0.3 E-PCISLOT1	0.3 E-PCISLOT2
	JD1	X4(IN	X8
		X8)
	0).USB10/11(3	SP1
		+
	USB2/3

JOH1USB4/5				USB4/5
JIPMB1	JRK1	JRK1		SGPIO1-I	JOH1
S-SGPIO1
					JIPMB1
S-SGPIO2					JBT1
	-SGPIO2				I
I-SATA2 I-SATA2					-
					SATA0
I-SATA3 I-SATA3
I-SATA4 I-SATA4					JSD2
I-SATA5 I-SATA5
I-SATA6 I-SATA6					-I
	JL1		JL1		JSD1SATA1	FANB
I-SATA7 I-SATA7

X16) X8(IN 0.3 E-PCI SLOT4 CPU BIOS X8 0.3 E-PCI SLOT3 CPU LICENSE

F-X11SPL USAINDESIGNED	CPU	CPU	CPU	DIMMC1	DIMMA2 DIMMA1		DIMMD1 DIMMD2
	X80.3 E-PCI SLOT5	X16)X8(IN0.3 E-PCI SLOT6	X80.3E-PCI SLOT7					DIMMF1
01 . REV:1				DIMMB1		CPU			DIMMB1
							DIMME1
									DIMMC1
									DIMMA1
									DIMMA2
	MH10								DIMMD2
									DIMMD1
									DIMME1
	MH11								DIMMF1

CPU

BT1

Intel

USB6/7

0).USB12(3

BAR CODE

JPWR1

JPI2C1

C621

JNVI2C1

M.2 PCI-E 3.0 X4

IPMI CODE

JPWR1

JPME2

FANA

JTPM1

FAN4

FAN2

JPWR2

FAN1

JSTBY1

JPI2C1

LE3

LEDPWR

FAN3

JF1

I-SATA0	JSD2		LE3	BT1	JF1	JNVI2C1	JPWR2
I-SATA1		JBT1		JTPM1	FAN4		JSTBY1
JSD1		JPME2		USB6/7	FAN3		FAN1
FANB		FANA		USB12 (3.0)	FAN2

M.2 PCI-E 3.0 X4 LEDPWR

Notes:

•See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connections.

•"" indicates the location of Pin 1.

•Jumpers/LED indicators not indicated are used for testing only.

•Use only the correct type of onboard CMOS battery as specified by the manufacturer. Do not install the onboard battery upside down to avoid possible explosion.

11

Super X11SPL-F User's Manual

Quick Reference Table

Jumper	Description	Default Setting
JBT1	CMOS Clear	Open (Normal)
JPG1	VGA Enable/Disable	Pins 1-2 (Enabled)
JPL1	LAN1 Enable/Disable	Pins 1-2	(Enabled)
JPL2	LAN2 Enable/Disable	Pins 1-2	(Enabled)
JPME2	ME Manufacturing Mode	Pins 1-2	(Normal)
JWD1	Watchdog Timer	Pins 1-2	(Reset)

LED	Description	Status
LE3	M.2 LED	Blinking Green: Device Working
LEDBMC	BMC Heartbeat LED	Blinking Green: BMC Normal
LEDPWR	Onboard Power LED	Solid Green: Power On
UID-LED	Unit Identifier (UID) LED	Solid Blue: Unit Identified

Connector	Description
BT1	Onboard Battery
COM1, COM2	COM Port, COM Header
FAN1 ~ FAN5, FANA/FANB	CPU/System Fan Headers
IPMI_LAN	Dedicated IPMI LAN Port
I-SATA0 ~ I-SATA7	Intel® PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)
I-SGPIO1, I-SGPIO2	Serial Link General Purpose I/O Connection Headers
JD1	Speaker/Power LED Indicator (Pins 1-3: Power LED, Pins 4-7: Speaker)
JF1	Front Control Panel Header
JIPMB1	4-pin BMC External I2C Header (for an IPMI Card)
JL1	Chassis Intrusion Header
JNVI2C1	NVMe I2C Header
JOH1	Overheat LED Indicator
JPI2C1	Power System Management Bus (SMB) I2C Header
JPWR1	8-pin 12V CPU Power Connector
JPWR2	24-pin ATX Power Connector
JRK1	Intel RAID Key Header
JSD1, JSD2	SATA DOM Power Connectors
JSTBY1	Standby Power Header
JTPM1	Trusted Platform Module/Port 80 Connector
LAN1, LAN2	Dual 1G Base-T Ports
M.2	M.2 PCI-E 3.0 x4 or SATA 3.0 Slot (Supports M-Key 2280 and 22110)
MH10, MH11	M.2 Mounting Holes
SLOT1	PCH PCI-E 3.0 x4 (in x8) Slot

Note: Table is continued on the next page.

12

Chapter 1: Introduction

Connector	Description
SLOT2, SLOT3, SLOT5, SLOT7	CPU PCI-E 3.0 x8 Slot
SLOT4, SLOT6	CPU PCI-E 3.0 x8 (in x16) Slot
SP1	Internal Speaker/Buzzer
UID-SW	Unit Identifier (UID) Switch
USB0/1	Back Panel Universal Serial Bus (USB) 2.0 Ports
USB2/3, USB4/5, USB6/7	Front Accessible USB 2.0 Headers
USB8/9	Back Panel USB 3.0 Ports
USB10/11	Front Accessible USB 3.0 Header
USB12	USB 3.0 Type-A Header
VGA	VGA Port

13

Super X11SPL-F User's Manual

Motherboard Features

Motherboard Features

CPU

•Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA 3647) processor with up to 28 cores and a thermal design power (TDP) of up to 165W

Note: The X11SPL-F motherboard does not support FPGA or Fabric processors.

Memory

•Up to 256GB of RDIMM, 512GB of LRDIMM, and 1TB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of up to 2666MHz in eight memory slots

Note: Memory speed support depends on the processors used in the system.

DIMM Size

• Up to 128GB at 1.2V

Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/ motherboard.

Chipset

• Intel PCH C621

Expansion Slots

•One (1) PCI-Express 3.0 x4 (in x8) Slot (PCH SLOT1)

•Four (4) PCI-Express 3.0 x8 Slots (CPU SLOT2, SLOT3, SLOT5, SLOT7)

•Two (2) PCI-Express 3.0 x8 (in x16) Slot (CPU SLOT4, SLOT6)

Network

•Intel Ethernet Controller i210 + i210 for Dual 1G BASE-T Ports

•One (1) Dedicated IPMI LAN located on the rear I/O panel

Baseboard Management Controller (BMC)

• ASpeed AST2500 BMC

Graphics

• Graphics controller via ASpeed AST2500 BMC

I/O Devices

•Serial (COM) Port

•SATA 3.0

•Video (VGA) Port

•One (1) serial port on the rear I/O panel (COM1)

•One (1) front accessible serial port header (COM2)

•Eight (8) SATA 3.0 ports at 6Gb/s (I-SATA0 ~ I-SATA7 with RAID 0, 1, 5, 10)

•One (1) VGA connection on the rear I/O panel

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Motherboard Features

Peripheral Devices

•Two (2) USB 2.0 ports on the rear I/O panel (USB0/1)

•Two (2) USB 3.0 ports on the rear I/O panel (USB8/9)

•Three (3) front accessible USB 2.0 headers with two (2) USB connections (USB2/3, USB4/5, USB6/7)

•One (1) front accessible USB 3.0 header with two (2 ) USB connections (USB10/11)

•One (1) USB 3.0 Type-A header (USB12)

BIOS

•256Mb AMI BIOS® SPI Flash ROM

•ACPI 6.0, Plug and Play (PnP), BIOS rescue hot-key, SPI dual/quad speed support, riser card auto detection support, real time clock (RTC) wakeup, and SMBIOS 3.0 or later

Power Management

•ACPI power management

•Power button override mechanism

•Power-on mode for AC power recovery

•Wake-On LAN

•Power supply monitoring

System Health Monitoring

•Onboard voltage monitoring for +1.8V, +3.3V, +5V, +/-12V, +3.3V stdby, +5V stdby, VBAT, HT, memory, PCH temperature, system temperature, and memory temperature

•5 CPU switch phase voltage regulator

•CPU thermal trip support

•Platform Environment Configuration Interface (PECI)/TSI

Fan Control

•Fan status monitoring via IPMI connections

•Single cooling zone

•Low-noise fan speed control

•Seven (7) 4-pin fan headers

System Management

•Trusted Platform Module (TPM) support

•SuperDoctor® 5

•Redundant power supply unit detection sensor

•Chassis intrusion header and detection

•Server Platform Service

LED Indicators

•CPU/system overheat LED

•Power/suspend-state indicator LED

•Fan failed LED

•UID/remote UID

•HDD activity LED

•LAN activity LED

Note: The table above is continued on the next page.

15

Super X11SPL-F User's Manual

Motherboard Features

Dimensions

• 12" (W) x 9.6" (L) ATX (304.8mm x 243.84mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and heatsink cooling restrictions. For proper thermal management, please check the chassis and heatsink specifications for proper CPU TDP sizing.

Note 2: For IPMI configuration instructions, please refer to the Embedded IPMI Configuration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon initial system power-on. The manufacture default username is ADMIN and the password is ADMIN. For proper BMC configuration, please refer to http://www.supermicro.com/ products/info/files/IPMI/Best_Practices_BMC_Security.pdf.

16

Chapter 1: Introduction

Figure 1-3.

System Block Diagram

VCCP0 12v

VR13

#F-1

5+1 PHASE

#C-1

#E-1

165W

#B-1

#D-2

#A-2

VCCP0

#D-1

#A-1

SNB CORE

DDR-IV

PECI:30

DDRIV

SLOT 2

DDRIV

SOCKET ID:0

#3A

#3B #1B #2B DMI3 #2A #1A

X8

X8

SLOT 3

2133/2666

2133/2666

PCI-E

PCI-E X8 G3

PCI-E X8 G3

PCI-E

X8

PCI-E

PCI-E X8 G3

PCI-E X8 G3

-E X8

SLOT 7

X16

PCI-E X8 G3

SLOT 5

PCI

PCI-E X8 G3

X16

PCI-E X4 G3

PCI-E

PCI-E X8

SLOTPCI-E

DMI3

#7

#6

#5

#4

6

#0~3

#3

SLOT 4

#2

SLOT 1

PCIe

#1

PCI-E X4 G3 (SATA X1)

#0

M.2 SSD

#8~11

6.0 Gb/S

SATA

Intel

RJ45

LAN2

PCI-E X1 G2

#7

i210AT

PCH

RJ45

LAN1

PCI-E X1 G2

#6

(C621)

i210AT

LAN3

RGRMII

RMII/NCSI

Front USB2.0 x 6

RJ45

RTL8211FD-CG

USB2.0 #3,6

USB 2.0

USB

Rear USB2.0 x 2

PCI-E X1 G2

USB2.0 #4,5

USB2.0 #7,9

USB 2.0

DDR4

#5

USB

BMC

USB2.0 #0,1

SPI

USB 2.0

#13 USB2.0

BMC Boot Flash

AST2500

ESPI

USB 3.0

USB

Front USB3.0 x 2

ESPI

Switch

SPI

USB

Type A USB3.0

Header

SPI(Reserved)

SPI

USB

Rear USB3.0 x 2

VGA CONN

COM1

COM2

TPM HEADER

BIOS

Connector

Header

Debug Card

SYSTEM POWER

Temp Sensor
				FAN SPEED
W83773G local and remote at SMBUS		FRONT PANEL		CTRL

Note: This is a general block diagram and may not exactly represent the features on your motherboard. See the previous pages for the actual specifications of your motherboard.

17

Super X11SPL-F User's Manual

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA 3647) processor and the Intel PCH C621 chipset, the X11SPL-F motherboard provides system performance, power efficiency, and feature sets to address the needs of next-generation computer users. This motherboard is the perfect solution for I/O intensive application and video surveillance.

The Intel PCH C621 chipset supports the following features:

•DDR4 288-pin memory support

•Intel Rapid Storage Technology Enterprise

•ACPI Power Management

•Digital Media Interface (DMI)

•Management Engine (ME)

•SMBus speeds of up to 400KHz for BMC connectivity

•Improved I/O capabilities to high-storage-capacity configurations

•SPI Enhancements

•Intel® Node Manager 3.0 for advanced power monitoring, capping, and management for BMC enhancement (see note below).

•BMC supports remote management, virtualization, and the security package for enterprise platforms

Note: Node Manager support depends on the power supply used in your system.

1.3 Special Features

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond when AC power is lost and then restored to the system. You can choose for the system to remain powered off (in which case you must press the power switch to turn it back on), or for it to automatically return to the power-on state. See the Advanced BIOS Setup section for this setting. The default setting is Last State.

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Chapter 1: Introduction

1.4 System Health Monitoring

Onboard Voltage Monitors

An onboard voltage monitor will scan the voltages of the onboard chipset, memory, CPU, and battery continuously. Once a voltage becomes unstable, a warning is given, or an error message is sent to the screen. The user can adjust the voltage thresholds to define the sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors monitor temperatures and voltage settings of onboard processors and the system in real time via the IPMI interface. Whenever the temperature of the CPU or the system exceeds a user-defined threshold, system/CPU cooling fans will be turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air- flow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux environment. SuperDoctor is used to notify the user of certain system events. For example, you can configure SuperDoctor to provide you with warnings when the system temperature, CPU temperatures, voltages and fan speeds go beyond a predefined range.

1.5 ACPI Features

ACPI stands for Advanced Configuration and Power Interface. The ACPI specification defines a flexible and abstract hardware interface that provides a standard way to integrate power management features throughout a computer system, including its hardware, operating system and application software. This enables the system to automatically turn on and off peripherals such as CD-ROMs, network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a generic system event mechanism for Plug and Play, and an operating system-independent interface for configuration control. ACPI leverages the Plug and Play BIOS data structures, while providing a processor architecture-independent implementation that is compatible with Windows 2012/2012R and 2016 operating systems.

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Super X11SPL-F User's Manual

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable operation. It is even more important for processors that have high CPU clock rates where noisy power transmission is present.

The X11SPL-F motherboard accommodates a 24-pin ATX power supply. Although most power supplies generally meet the specifications required by the CPU, some are inadequate. In addition, one 12V 8-pin power connection is also required to ensure adequate power supply to the system.

Warning: To avoid damaging the power supply or the motherboard, be sure to use a power supply that contains a 24-pin and an 8-pin power connector. Be sure to connect the power supplies to the 24-pin power connector (JPWR2), and the 8-pin power connector (JPWR1) on the motherboard. Failure in doing so may void the manufacturer warranty on your power supply and motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX power supply Specification 2.02 or above. It must also be SSI compliant. (For more information, please refer to the website at http://www.ssiforum.org/).

1.7 Serial Port

The X11SPL-F motherboard supports two serial communication connections. COM Ports 1 and 2 can be used for input/output. The UART provides legacy speeds with a baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support high-speed serial communication devices.

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Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic components­. To avoid damaging your system board, it is important to handle it very carefully. The following measures are generally sufficient to protect your equipment from ESD.

Precautions

•Use a grounded wrist strap designed to prevent static discharge.

•Touch a grounded metal object before removing the board from the antistatic bag.

•Handle the motherboard by its edges only; do not touch its components, peripheral chips, memory modules or gold contacts.

•When handling chips or modules, avoid touching their pins.

•Put the motherboard and peripherals back into their antistatic bags when not in use.

•For grounding purposes, make sure your computer chassis provides excellent conductivity between the power supply, the case, the mounting fasteners and the motherboard.

•Use only the correct type of onboard CMOS battery. Do not install the onboard battery upside down to avoid possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking the motherboard, make sure that the person handling it is static protected.

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Super X11SPL-F User's Manual

2.2 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together first to form the processor carrier assembly. This will be attached to the heatsink to form the processor heatsink module (PHM) before being installed onto the CPU socket.

Notes:

•Use ESD protection.

•Unplug the AC power cord from all power supplies after shutting down the system.

•Check that the plastic protective cover is on the CPU socket and none of the socket pins are bent. If they are, contact your retailer.

•When handling the processor, avoid touching or placing direct pressure on the LGA lands (gold contacts). Improper installation or socket misalignment can cause serious damage to the processor or CPU socket, which may require manufacturer repairs.

•Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.

•Refer to the Supermicro website for updates on processor support.

•All graphics in this manual are for illustrations only. Your components may look different.

The Intel Xeon 81xx/61xx/51xx/41xx/31xx Series Processor

Non-Fabric Model

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Chapter 2: Installation

Overview of the Processor Carrier Assembly

The processor carrier assembly contains the Intel Xeon Non-Fabric (Non-F) processor and a processor carrier.

1. Non-F Processor

2. Processor Carrier

Overview of the CPU Socket

The CPU socket is protected by a plastic protective cover.

1. Plastic Protective Cover

2. CPU Socket

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Super X11SPL-F User's Manual

Overview of the Processor Heatsink Module

The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the Intel Xeon Non-Fabric (Non-F) processor.

1. Heatsink with Thermal Grease

2. Processor Carrier

3. Non-F Processor

Processor Heatsink Module

Bottom View

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Chapter 2: Installation

Creating the Non-F Model Processor Carrier Assembly

To install a Non-F model processor into the processor carrier, follow the steps below:

1.Hold the processor with the LGA lands (gold contacts) facing up. Locate the small, gold triangle in the corner of the processor and the corresponding hollowed triangle on the processor carrier. These triangles indicate pin 1. See the images below.

2.Using the triangles as a guide, carefully align and place Point A of the processor into

Point A of the carrier. Then gently flex the other side of the carrier for the processor to fit into Point B.

3.Examine all corners to ensure that the processor is firmly attached to the carrier.

CPU (Upside Down)	B
with CPU LGA Lands up

A

Align Point B of the CPU and Point B of the Processor Carrier

Pin 1

Align Point A of the CPU and

Point A of the Processor Carrier

B

A

Processor Carrier

(Upside Down)

Align CPU Pin 1

Allow carrier to

latch onto CPU

B

A

Allow carrier to

latch onto CPU

Pin 1

Processor Carrier Assembly (Non-F Model)

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Super X11SPL-F User's Manual

Assembling the Processor Heatsink Module

After creating the processor carrier assembly for the Non-F model processor, mount it onto the heatsink to create the processor heatsink module (PHM):

1.Note the label on top of the heatsink, which marks the heatsink mounting holes as 1, 2, 3, and 4. If this is a new heatsink, the thermal grease has been pre-applied on the underside. Otherwise, apply the proper amount of thermal grease.

2.Turn the heatsink over with the thermal grease facing up. Hold the processor carrier assembly so the processor's gold contacts are facing up, then align the triangle on the assembly with hole 1 of the heatsink. Press the processor carrier assembly down. The plastic clips of the assembly will lock outside of holes 1 and 2, while the remaining clips will snap into their corresponding holes.

3.Examine all corners to ensure that the plastic clips on the processor carrier assembly are firmly attached to the heatsink.

Non-Fabric Processor Carrier Assembly

(Upside Down)	2

Triangle on the CPU

1 2

Triangle on the

Processor Carrier

Heatsink

(Upside Down) 1

		Remaining plastic clips snap
	2	into the other corner holes
		of the heatsink

1

Plastic clips 1 and 2 lock outside the heatsink’s mounting holes

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Chapter 2: Installation

Preparing the CPU Socket for Installation

This motherboard comes with a plastic protective cover installed on the CPU socket. Remove it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner of the plastic protective cover to remove it.

CPU Socket with Plastic Protective Cover

Remove the plastic protective cover from the CPU socket.

Do not touch or bend the socket pins.

Socket Pins

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Super X11SPL-F User's Manual

Installing the Processor Heatsink Module

After assembling the Processor Heatsink Module (PHM), install the PHM onto the CPU socket:

1.Align hole 1 of the heatsink with the printed triangle on the CPU socket. See the left image below.

2.Make sure all four holes of the heatsink are aligned with the socket before gently placing the heatsink on top.

3.With a T30 Torx-bit screwdriver, gradually tighten screws #1 - #4 to ensure even pressure. The order of the screws is shown on the label on top of the heatsink. To avoid damaging the processor or socket, do not use a force greater than 12 lbf-in when tightening the screws.

4.Examine all corners to ensure that the PHM is firmly attached to the socket.

Oval C

Oval D

Large Guide Post

Small Guide Post

Printed Triangle

Mounting the Processor Heatsink Module onto the CPU socket (on the motherboard)

	Use a torque
	of 12 lbf-in
	T30 Torx Screwdriver
	#4
#1	#2
	#3
	Tighten the screws in
	the sequence of 1, 2, 3, 4

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Chapter 2: Installation

Removing the Processor Heatsink Module

Before removing the processor heatsink module (PHM) from the motherboard, unplug the AC power cord from all power supplies after shutting down the system. Then follow the steps below:

1.Use a T30 Torx-bit screwdriver to loosen the four screws in a backwards sequence of #4, #3, #2, and #1.

2.Gently lift the PHM upwards to remove it from the socket.

Remove the screws in the sequence of 4, 3, 2, 1

		#4
	#1	#2
		#3

Printed Triangle on Motherboard

CPU Socket

After removing the screws, lift the Processor Heatsink Module off the CPU socket.

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Super X11SPL-F User's Manual

2.3 Motherboard Installation

All motherboards have standard mounting holes to fit different types of chassis. Make sure that the locations of all the mounting holes for both the motherboard and the chassis match. Although a chassis may have both plastic and metal mounting fasteners, metal ones are highly recommended because they ground the motherboard to the chassis. Make sure that the metal standoffs click in or are screwed in tightly.

Tools Needed

Phillips		Phillips Screws		Standoffs (9)
Screwdriver		(9)
				Only if Needed
(1)
		UID	VGA		COM1
		-UID -
JPL2	JPL1	SW		0).USB8/9(3	FAN5
		LED
ASpeed
AST2500			LAN2	LAN1	IPMI_LAN
			JLAN2	JLAN1
LEDBMC					USB0/1

COM2

PCH

CPU

CPU

CPU

01.REV:1

CPU

CPU

CPU

DIMMB1

CPU

DIMMF1

JPG1

X8) X4(IN 0.3 E-SLOT1PCI

X8 0.3 E-SLOT2PCI

X8 0.3 E-SLOT3PCI

X16) X8(IN 0.3 E-SLOT4PCI

X8 0.3 E-SLOT5PCI

X16) X8(IN 0.3 E-SLOT6PCI

X8 0.3 E-SLOT7PCI

DIMME1

JWD1

JD1

USA INDESIGNED

FX11SPL-

DIMMA2 DIMMA1 DIMMC1

DIMMD1 DIMMD2

0).USB10/11(3

MH10

SP1

+

USB2/3

BIOS LICENSE

MH11

USB4/5

JRK1

SGPIO1-I

JBT1

BT1

JOH1

I-SGPIO2

JIPMB1

I

SATA0-

PWR ON

JF1

RST

I-SATA2

Intel

0).USB12(3

PWR HDD NIC NIC UID PS LED LED 1 2 LED FAIL

BAR CODE

I-SATA3

C621

+

MAC CODE

JPWR1

I-SATA4

M.2 PCI-E 3.0 X4

USB6/7

IPMI CODE

I-SATA5

JNVI2C1

I-SATA6

I-SATA7

JSD2 SATA1-I

JPME2

LE3

JTPM1

LEDPWR

NMIX

FAN3

JPWR2

JSTBY1

JPI2C1

JL1

FANB

FANA

FAN4

FAN2

FAN1

JSD1

JF1

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use a force greater than 8 lbf-in on each mounting screw during motherboard installation. 2) Some components are very close to the mounting holes. Please take precautionary measures to avoid damaging these components when installing the motherboard to the chassis.

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