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XM-504Z |
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SERVICE MANUAL |
US Model |
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Ver 1.0 2004. 01 |
Canadian Model |
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AEP Model |
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UK Model |
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E Model |
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS (US model)
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
50 watts per channel minimum continuous average power into 4 ohms, both channels driven from 20 Hz to 20 kHz with no more than 0.04% total harmonic distortion per Car Audio Ad Hoc Committee standards.
Other Specifications
Circuit system |
OTL (output transformerless) circuit |
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Pulse power supply |
Inputs |
RCA pin jacks |
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High level input connector |
Input level adjustment range |
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0.3 – 6 V (RCA pin jacks), |
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0.6 – 12 V (High level input) |
Outputs |
Speaker terminals |
Speaker impedance |
2 – 8 Ω (stereo) |
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4 – 8 Ω (when used as a bridging amplifier) |
Maximum outputs |
Four speakers: 100 W × 4 (at 4 Ω) |
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Three speakers: 100 W × 2 + 250 W × 1 (at 4 Ω) |
Rated outputs (supply voltage at 14.4 V) |
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Four speakers: |
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50 W × 4 (20 Hz – 20 kHz, 0.04% THD, at 4 Ω) |
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60 W × 4 (20 Hz – 20 kHz, 0.1% THD, at 2 Ω) |
Frequency response |
5 Hz – 80 kHz ( +0–3 dB) |
Harmonic distortion |
0.005% or less (at 1 kHz, 4 Ω, 10 W) |
Low-pass filter |
80 Hz, –18 dB/oct |
High-pass filter |
80 Hz, –12 dB/oct |
Power requirements |
12 V DC car battery (negative ground) |
Power supply voltage |
10.5 – 16 V |
Current drain |
at rated output : 30 A (4 Ω, 50 W × 4) |
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Remote input : 1 mA |
Dimensions |
Approx. 350 × 55 × 233 mm |
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(13 7/8 × 2 1/4 × 9 1/4 in.) (w/h/d) |
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not incl. projecting parts and controls |
Mass |
Approx. 3.1 kg (6 lb. 14 oz.) not incl. accessories |
Supplied accessories |
Mounting screws (4) |
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High level input cord (1) |
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Protection cap (1) |
Design and specifications are subject to change without notice.
STEREO POWER AMPLIFIER
9-877-562-01 |
Sony Corporation |
2004A04-1 |
e Vehicle Company |
© 2004. 01 |
Published by Sony Engineering Corporation |
1
XM-504Z
PROTECTOR OPERATION CHECK
Thermal Protect
1.Short across TH901 with the power on.
2.Verify that the protector is operated and LED901 illuminates red.
3.Verify that the protector is released and LED901 illuminates green when the short is removed.
4.Likewise, perform items 1 to 3 for TH902 and TH903.
Over Current Protect
1.Short between the positive and negative sides of the speaker output terminal CN903 and CN904 (1/2) with the power on. (Perform this shorting for each channel on FRONT and REAR.)
2.Verify that the protector is operated and LED901 illuminates red.
3.Verify that the protector is not released and LED901 remains red even when the short is removed.
4.Verify that the protector is released and LED901 illuminates green when the power is turned off and then on again.
Offset Protect
1.Short between the +12V terminal of CN904 (2/2) and the BTL+ or BTL– of the speaker output terminal CN903 and CN904 (1/ 2).
(Short between +12V terminal and BTL+ and between +12V terminal and BTL–.)
2.Verify that the protector is operated and LED901 illuminates red.
3.Verify that the protector is not released and LED901 remains red even when the short is removed.
4.Verify that the protector is released and LED901 illuminates green when the power is turned off and then on again.
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TABLE OF CONTENTS |
1. GENERAL |
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Connections ............................................................................. |
3 |
2. DISASSEMBLY
2-1. |
Bottom Plate ........................................................................ |
5 |
2-2. |
Main Board Section ............................................................ |
6 |
2-3. |
Main Board ......................................................................... |
6 |
3. DIAGRAMS
3-1. |
IC Block Diagram ............................................................... |
7 |
3-2. |
Printed Wiring Board .......................................................... |
8 |
3-3. |
Schematic Diagram –Amp Section– ................................... |
9 |
3-4. |
Schematic Diagram –Power Section– ............................... |
10 |
4. EXPLODED VIEWS
4-1. |
Heat Sink (Main) Section .................................................. |
11 |
4-2. |
Main Board Section .......................................................... |
12 |
5. ELECTRICAL PARTS LIST ........................................ |
13 |
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Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be damaged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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XM-504Z
SECTION 1
GENERAL This section is extracted from instruction manual.
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XM-504Z
4
XM-504Z
SECTION 2
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
SET
2-1. BOTTOM PLATE (Page 5)
2-2. MAIN BOARD SECTION (Page 6)
2-3. MAIN BOARD (Page 6)
Note : Follow the disassembly procedure in the numerical order given.
2-1. BOTTOM PLATE
1 three screws (+BTP 3 x 8)
2 three screws (+BTP 3 x 8)
3 bottom plate
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XM-504Z
2-2. MAIN BOARD SECTION
1three screws (+BTP 3 x 8)
4 screw (+BTP 3 x 8)
2 three screws (+BTP 3 x 8)
3 three screws (+BTP 3 x 8)
5 MAIN board section
After unfastening the screw, taping with the screw inserted facilitates the work.
heat sink (MAIN)
2-3. MAIN BOARD
4 MAIN board
3 panel (front)
1 two screws (+BTP 3 x 8)
2 three screws (+BTP 3 x 8)
6
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