EMB2 / UMB2N / IMB2A
Transistors
General purpose
(dual digital transistors)
EMB2 / UMB2N / IMB2A
zFeatures
1) Two DT A144E chips in a EMT or UMT or SMT
package.
2) Same size as EMT3 or UMT3 or SMT3 package, so
same mounting machine can be used for both.
3) Transistor elements are independent, eliminating
interference.
zStructure
Epitaxial planar type
PNP silicon transistor (Built-in resistor type)
The following characteristics apply to both DTr
DTr
2.
1 and
zEquivalent circuit
EMB2 / UMB2N IMB2A
(3) (2) (1)
R
1
R
2
DTr
1
2
R
1
R
R
1
=47kΩ
2
=47kΩ
DTr
2
R
(4) (5) (6)
DTr
2
(4) (5) (6)
R
1
R
2
DTr
R
2
R
1
(3) (2) (1)
1
1
=47kΩ
R
R2=47kΩ
zAbsolute maximum ratings (Ta = 25°C)
Parameter
Symbol Limits
Supply voltage
Input voltage
Output current
Power
dissipation
EMB2, UMB2N
IMB2A
I
C (Max.)
Junction temperature
Storage temperature
1 120mW per element must not be exceeded.
∗
2 200mW per element must not be exceeded.
∗
V
CC
V
IN
I
O
150 (TOTAL)
Pd
300 (TOTAL)
Tj 150
Tstg
−55 to +150
−50
−40
10
−30
−100
Unit
V
V
mA
mW
˚C
˚C
Rev.A 1/2
zExternal dimensions (Unit : mm)
EMB2
0.22
0.13
ROHM : EMT6
Abbreviated symbol : B2
UMB2N
0.2
0.15
0.1Min.
ROHM : UMT6
EIAJ : SC-88
Abbreviated symbol : B2
IMB2A
0.3
0.15
0.3to0.6
ROHM : SMT6
EIAJ : SC-74
Abbreviated symbol : B2
1
∗
2
∗
(3)
(4)
(6)
0.5
1.0
(2)(5)
0.5
(1)
1.2
1.6
0.5
Each lead has same dimensions
)
)
3
4
(
(
)
5
(
)
6
(
)
5
(
)
4
(
)
2
(
)
)
6
1
(
(
1.25
2.1
0to0.1
Each lead has same dimensions
)
1
(
0.95
)
2
(
0.95
)
3
(
1.6
2.8
0.8
0to0.1
Each lead has same dimensions
1.6
0.65
0.65
0.7
1.3
2.0
0.9
2.9
1.9
1.1
Transistors
zElectrical characteristics (Ta = 25°C)
Parameter Symbol
Input voltage
Output voltage
V
Input current
Output current
DC current gain
Transition frequency
Input resistance
Resistance ratio
Transition frequency of the device
∗
R2 / R
zPackaging specifications
Package
Code TN T110
Type
Basic ordering
unit (pieces)
EMB2
UMB2N
IMB2A
zElectrical characteristic curves
−100
−50
−20
(V)
I (on)
−10
Ta=−40˚C
−5
25˚C
100˚C
−2
−1
−500m
INPUT VOLTAGE : V
−200m
−100m
−100µ
Fig.1 Input voltage vs. output current
−1
−500m
(V)
−200m
O (on)
−100m
−50m
−20m
−10m
−5m
OUTPUT VOLTAGE : V
−2m
−1m
−100µ
−1m −10m −100m
−200µ−2m −20m−500µ−5m −50m
OUTPUT CURRENT : I
O
(ON characteristics)
Ta=100˚C
25˚C
−40˚C
−1m −10m −100m
−200µ−2m −20m−500µ−5m −50m
OUTPUT CURRENT : I
O
Fig.4 Output voltage vs. output
current
I (off)
V
V
I (on)
O (on)
I
I
I
O (off)
G
I
f
T
R
1
VO=−0.3V
(A)
lO/lI =20
(A)
Min.
−
−3
−
−
−
68
−
32.9
0.8
1
T2R
8000
−0.5
−0.3
0.18
−
−0.5
61.1
1.2
Unit
V
−
V
mA
µA
−
−
MHz
−
kΩ
−
Typ. Max.
−
−
−0.1
−
−
−
250
47
1
Taping
3000
−10m
−5m
−2m
(A)
−1m
−500µ
−200µ
−100µ
−50µ
−20µ
−10µ
OUTPUT CURRENT : Io
−5µ
−2µ
−1µ
3000
VCC=−5V
Ta=100˚C
25˚C
−40˚C
−0.5 −1 −1.5 −2 −2.5
0 −3
INPUT VOLTAGE : V
Fig.2 Output current vs. input voltage
(OFF characteristics)
CC
=
−5V, I
V
O
=
−0.3V, I
V
IO/I
I
=
−10mA/−0.5mA
I
=
−5V
V
CC
=
−50V, V
V
V
O
=
−5V, I
CE
=
−10V, I
V
I (off)
Conditions
O
=
−100µA
O
=
−2mA
I
=
0V
O
=
−5mA
E
=
5mA, f=100MH
(V)
EMB2 / UMB2N / IMB2A
Z
∗
−
−
1k
500
Ta=100˚C
200
25˚C
−40˚C
100
50
20
10
5
DC CURRENT GAIN : GI
2
1
−100µ−1m −10m −100m
−200µ−2m −20m−500µ−5m −50m
OUTPUT CURRENT : IO
Fig.3 DC current gain vs. output
current
VO=−5V
(A)
Rev.A 2/2