ATMEL ATmega32, ATmega32L User Manual

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Features

High-performance, Low-power AVR® 8-bit Microcontroller

Advanced RISC Architecture

131 Powerful Instructions – Most Single-clock Cycle Execution

32 x 8 General Purpose Working Registers

Fully Static Operation

Up to 16 MIPS Throughput at 16 MHz

On-chip 2-cycle Multiplier

Nonvolatile Program and Data Memories

32K Bytes of In-System Self-Programmable Flash

Endurance: 10,000 Write/Erase Cycles

Optional Boot Code Section with Independent Lock Bits In-System Programming by On-chip Boot Program True Read-While-Write Operation

1024 Bytes EEPROM

Endurance: 100,000 Write/Erase Cycles

2K Byte Internal SRAM

Programming Lock for Software Security

JTAG (IEEE std. 1149.1 Compliant) Interface

Boundary-scan Capabilities According to the JTAG Standard

Extensive On-chip Debug Support

Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface

Peripheral Features

Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes

One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode

Real Time Counter with Separate Oscillator

Four PWM Channels

8-channel, 10-bit ADC

8 Single-ended Channels

7 Differential Channels in TQFP Package Only

2 Differential Channels with Programmable Gain at 1x, 10x, or 200x

Byte-oriented Two-wire Serial Interface

Programmable Serial USART

Master/Slave SPI Serial Interface

Programmable Watchdog Timer with Separate On-chip Oscillator

On-chip Analog Comparator

Special Microcontroller Features

Power-on Reset and Programmable Brown-out Detection

Internal Calibrated RC Oscillator

External and Internal Interrupt Sources

Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby and Extended Standby

I/O and Packages

32 Programmable I/O Lines

40-pin PDIP, 44-lead TQFP, and 44-pad MLF

Operating Voltages

2.7 - 5.5V for ATmega32L

4.5 - 5.5V for ATmega32

Speed Grades

0 - 8 MHz for ATmega32L

0 - 16 MHz for ATmega32

Power Consumption at 1 MHz, 3V, 25°C for ATmega32L

Active: 1.1 mA

Idle Mode: 0.35 mA

Power-down Mode: < 1 µA

8-bit Microcontroller with 32K Bytes In-System Programmable Flash

ATmega32

ATmega32L

2503G–AVR–11/04

Pin Configurations

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 1. Pinout ATmega32

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PDIP

 

(XCK/T0) PB0

 

 

 

 

PA0 (ADC0)

 

 

 

 

 

 

 

 

 

 

(T1) PB1

 

 

 

 

PA1 (ADC1)

 

 

 

 

 

 

 

 

 

 

(INT2/AIN0) PB2

 

 

 

 

PA2 (ADC2)

 

 

 

 

 

 

 

 

 

 

(OC0/AIN1) PB3

 

 

 

 

PA3 (ADC3)

 

 

 

 

 

 

 

 

 

 

 

(SS)

PB4

 

 

 

 

PA4 (ADC4)

 

 

 

 

 

 

 

 

 

 

(MOSI) PB5

 

 

 

 

PA5 (ADC5)

 

 

 

 

 

 

 

 

 

 

(MISO) PB6

 

 

 

 

PA6 (ADC6)

 

 

 

 

 

 

 

 

 

 

(SCK) PB7

 

 

 

 

PA7 (ADC7)

 

 

 

 

 

 

 

 

 

 

 

 

RESET

 

 

 

 

 

AREF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GND

 

 

 

 

AVCC

 

 

 

 

 

 

 

 

 

 

 

 

XTAL2

 

 

 

 

PC7 (TOSC2)

 

 

 

 

 

 

 

 

XTAL1

 

 

 

 

PC6 (TOSC1)

 

 

 

 

 

 

(RXD) PD0

 

 

 

 

PC5 (TDI)

 

 

 

 

 

 

(TXD) PD1

 

 

 

 

PC4 (TDO)

 

 

 

 

 

 

(INT0) PD2

 

 

 

 

PC3 (TMS)

 

 

 

 

 

 

(INT1) PD3

 

 

 

 

PC2 (TCK)

 

 

 

 

 

 

(OC1B) PD4

 

 

 

 

PC1 (SDA)

 

 

 

 

 

 

(OC1A) PD5

 

 

 

 

PC0 (SCL)

 

 

 

 

 

 

(ICP1) PD6

 

 

 

 

PD7 (OC2)

 

 

 

 

 

 

 

 

 

 

TQFP/MLF

 

 

 

 

(SS)

(AIN1/OC0)

(AIN0/INT2)

(T1) (XCK/T0)

 

 

 

(ADC0) (ADC1)

(ADC2)

(ADC3)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PB4 PB3 PB2 PB1 PB0 GND VCC PA0 PA1 PA2 PA3

(MOSI) PB5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PA4 (ADC4)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(MISO) PB6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PA5 (ADC5)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(SCK) PB7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PA6 (ADC6)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RESET

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PA7 (ADC7)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AREF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

XTAL2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AVCC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

XTAL1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PC7 (TOSC2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(RXD) PD0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PC6 (TOSC1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(TXD) PD1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PC5 (TDI)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(INT0) PD2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PC4 (TDO)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PD3 PD4 PD5 PD6 PD7

VCC GND PC0 PC1 PC2 PC3

 

 

 

 

(INT1)

(OC1B)

(OC1A)

(ICP1) (OC2)

 

 

 

(SCL) (SDA)

(TCK)

(TMS)

2 ATmega32(L)

2503G–AVR–11/04

ATMEL ATmega32, ATmega32L User Manual

ATmega32(L)

Overview

Block Diagram

The ATmega32 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATmega32 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.

Figure 2. Block Diagram

PA0 - PA7

VCC

 

PORTA DRIVERS/BUFFERS

GND

PORTA DIGITAL INTERFACE

AVCC

 

 

 

MUX &

ADC

 

ADC

INTERFACE

 

 

AREF

 

 

 

PROGRAM

STACK

 

COUNTER

POINTER

 

PROGRAM

SRAM

 

FLASH

 

 

 

INSTRUCTION

GENERAL

 

REGISTER

 

PURPOSE

 

 

REGISTERS

 

 

X

 

INSTRUCTION

Y

 

DECODER

 

 

 

 

Z

 

CONTROL

 

 

LINES

ALU

 

AVR CPU

STATUS

 

REGISTER

 

 

 

PROGRAMMING

SPI

 

LOGIC

 

 

 

+

COMP.

 

-

INTERFACE

 

PORTB DIGITAL INTERFACE

 

PORTB DRIVERS/BUFFERS

 

 

PB0 - PB7

 

PC0 - PC7

 

PORTC DRIVERS/BUFFERS

 

PORTC DIGITAL INTERFACE

 

TWI

 

 

TIMERS/

OSCILLATOR

 

COUNTERS

 

 

 

INTERNAL

 

 

OSCILLATOR

 

 

 

 

XTAL1

WATCHDOG

OSCILLATOR

 

TIMER

 

 

 

 

 

XTAL2

MCU CTRL.

 

RESET

& TIMING

 

 

 

INTERRUPT

INTERNAL

 

CALIBRATED

 

UNIT

 

OSCILLATOR

 

 

 

EEPROM

 

 

USART

 

 

PORTD DIGITAL INTERFACE

PORTD DRIVERS/BUFFERS

PD0 - PD7

3

2503G–AVR–11/04

 

 

 

 

 

 

 

 

 

 

 

 

 

The AVR core combines a rich instruction set with 32 general purpose working registers.

 

All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing

 

two independent registers to be accessed in one single instruction executed in one clock

 

cycle. The resulting architecture is more code efficient while achieving throughputs up to

 

ten times faster than conventional CISC microcontrollers.

 

The ATmega32 provides the following features: 32K bytes of In-System Programmable

 

Flash Program memory with Read-While-Write capabilities, 1024 bytes EEPROM, 2K

 

byte SRAM, 32 general purpose I/O lines, 32 general purpose working registers, a

 

JTAG interface for Boundary-scan, On-chip Debugging support and programming, three

 

flexible Timer/Counters with compare modes, Internal and External Interrupts, a serial

 

programmable USART, a byte oriented Two-wire Serial Interface, an 8-channel, 10-bit

 

ADC with optional differential input stage with programmable gain (TQFP package only),

 

a programmable Watchdog Timer with Internal Oscillator, an SPI serial port, and six

 

software selectable power saving modes. The Idle mode stops the CPU while allowing

 

the USART, Two-wire interface, A/D Converter, SRAM, Timer/Counters, SPI port, and

 

interrupt system to continue functioning. The Power-down mode saves the register con-

 

tents but freezes the Oscillator, disabling all other chip functions until the next External

 

Interrupt or Hardware Reset. In Power-save mode, the Asynchronous Timer continues

 

to run, allowing the user to maintain a timer base while the rest of the device is sleeping.

 

The ADC Noise Reduction mode stops the CPU and all I/O modules except Asynchro-

 

nous Timer and ADC, to minimize switching noise during ADC conversions. In Standby

 

mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping.

 

This allows very fast start-up combined with low-power consumption. In Extended

 

Standby mode, both the main Oscillator and the Asynchronous Timer continue to run.

 

The device is manufactured using Atmel’s high density nonvolatile memory technology.

 

The On-chip ISP Flash allows the program memory to be reprogrammed in-system

 

through an SPI serial interface, by a conventional nonvolatile memory programmer, or

 

by an On-chip Boot program running on the AVR core. The boot program can use any

 

interface to download the application program in the Application Flash memory. Soft-

 

ware in the Boot Flash section will continue to run while the Application Flash section is

 

updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU

 

with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega32 is

 

a powerful microcontroller that provides a highly-flexible and cost-effective solution to

 

many embedded control applications.

 

The ATmega32 AVR is supported with a full suite of program and system development

 

tools including: C compilers, macro assemblers, program debugger/simulators, in-circuit

 

emulators, and evaluation kits.

Pin Descriptions

 

 

 

 

 

VCC

Digital supply voltage.

GND

Ground.

Port A (PA7..PA0)

Port A serves as the analog inputs to the A/D Converter.

 

Port A also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used.

 

Port pins can provide internal pull-up resistors (selected for each bit). The Port A output

 

buffers have symmetrical drive characteristics with both high sink and source capability.

 

When pins PA0 to PA7 are used as inputs and are externally pulled low, they will source

 

current if the internal pull-up resistors are activated. The Port A pins are tri-stated when

 

a reset condition becomes active, even if the clock is not running.

4 ATmega32(L)

2503G–AVR–11/04

 

 

 

 

ATmega32(L)

 

 

 

 

 

Port B (PB7..PB0)

 

 

Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each

 

 

 

 

bit). The Port B output buffers have symmetrical drive characteristics with both high sink

 

 

 

and source capability. As inputs, Port B pins that are externally pulled low will source

 

 

 

current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset

 

 

 

condition becomes active, even if the clock is not running.

 

 

 

Port B also serves the functions of various special features of the ATmega32 as listed

 

 

 

on page 55.

 

Port C (PC7..PC0)

Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each

 

 

 

bit). The Port C output buffers have symmetrical drive characteristics with both high sink

 

 

 

and source capability. As inputs, Port C pins that are externally pulled low will source

 

 

 

current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset

 

 

 

condition becomes active, even if the clock is not running. If the JTAG interface is

 

 

 

enabled, the pull-up resistors on pins PC5(TDI), PC3(TMS) and PC2(TCK) will be acti-

 

 

 

vated even if a reset occurs.

 

 

 

The TD0 pin is tri-stated unless TAP states that shift out data are entered.

 

 

 

Port C also serves the functions of the JTAG interface and other special features of the

 

 

 

ATmega32 as listed on page 58.

 

Port D (PD7..PD0)

Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each

 

 

 

bit). The Port D output buffers have symmetrical drive characteristics with both high sink

 

 

 

and source capability. As inputs, Port D pins that are externally pulled low will source

 

 

 

current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset

 

 

 

condition becomes active, even if the clock is not running.

 

 

 

Port D also serves the functions of various special features of the ATmega32 as listed

 

 

 

on page 60.

 

 

 

Reset Input. A low level on this pin for longer than the minimum pulse length will gener-

 

RESET

 

 

 

ate a reset, even if the clock is not running. The minimum pulse length is given in Table

 

 

 

15 on page 35. Shorter pulses are not guaranteed to generate a reset.

 

XTAL1

Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.

 

XTAL2

Output from the inverting Oscillator amplifier.

 

AVCC

AVCC is the supply voltage pin for Port A and the A/D Converter. It should be externally

 

 

 

connected to VCC, even if the ADC is not used. If the ADC is used, it should be con-

 

 

 

nected to VCC through a low-pass filter.

AREF

About Code

Examples

AREF is the analog reference pin for the A/D Converter.

This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C Compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C Compiler documentation for more details.

5

2503G–AVR–11/04

AVR CPU Core

Introduction

Architectural Overview

This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts.

Figure 3. Block Diagram of the AVR MCU Architecture

 

 

 

Data Bus 8-bit

 

Flash

Program

 

Status

 

Counter

 

and Control

 

Program

 

 

 

 

 

 

Memory

 

 

 

 

 

 

 

32 x 8

Interrupt

Instruction

 

 

Unit

 

 

General

 

Register

 

 

Purpose

SPI

 

 

 

Registrers

 

 

 

Unit

 

 

 

 

Instruction

 

 

 

Watchdog

Decoder

AddressingDirect

AddressingIndirect

 

Timer

 

ALU

Analog

 

 

 

 

Control Lines

 

 

 

Comparator

 

 

 

 

I/O Module1

 

 

 

Data

I/O Module 2

 

 

 

SRAM

 

 

 

 

 

 

 

 

I/O Module n

 

 

 

EEPROM

 

 

 

 

I/O Lines

 

In order to maximize performance and parallelism, the AVR uses a Harvard architecture

– with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This concept enables instructions to be executed in every clock cycle. The program memory is InSystem Reprogrammable Flash memory.

The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle.

Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash Program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section.

The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After

6 ATmega32(L)

2503G–AVR–11/04

ALU Arithmetic Logic

Unit

2503G–AVR–11/04

ATmega32(L)

an arithmetic operation, the Status Register is updated to reflect information about the result of the operation.

Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every program memory address contains a 16or 32-bit instruction.

Program Flash memory space is divided in two sections, the Boot program section and the Application Program section. Both sections have dedicated Lock bits for write and read/write protection. The SPM instruction that writes into the Application Flash memory section must reside in the Boot Program section.

During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the reset routine (before subroutines or interrupts are executed). The Stack Pointer SP is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture.

The memory spaces in the AVR architecture are all linear and regular memory maps.

A flexible interrupt module has its control registers in the I/O space with an additional global interrupt enable bit in the Status Register. All interrupts have a separate interrupt vector in the interrupt vector table. The interrupts have priority in accordance with their interrupt vector position. The lower the interrupt vector address, the higher the priority.

The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the Data Space locations following those of the Register File, $20 - $5F.

The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-func- tions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the “Instruction Set” section for a detailed description.

7

Status Register

The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code.

The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software.

The AVR Status Register – SREG – is defined as:

Bit

7

6

5

4

3

2

1

0

 

 

I

T

H

S

V

N

Z

C

SREG

 

 

 

 

 

 

 

 

 

 

Read/Write

R/W

R/W

R/W

R/W

R/W

R/W

R/W

R/W

 

Initial Value

0

0

0

0

0

0

0

0

 

• Bit 7 – I: Global Interrupt Enable

The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I- bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the instruction set reference.

• Bit 6 – T: Bit Copy Storage

The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction.

• Bit 5 – H: Half Carry Flag

The Half Carry Flag H indicates a half carry in some arithmetic operations. Half Carry is useful in BCD arithmetic. See the “Instruction Set Description” for detailed information.

• Bit 4 – S: Sign Bit, S = N V

The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See the “Instruction Set Description” for detailed information.

• Bit 3 – V: Two’s Complement Overflow Flag

The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction Set Description” for detailed information.

• Bit 2 – N: Negative Flag

The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information.

• Bit 1 – Z: Zero Flag

The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information.

8 ATmega32(L)

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General Purpose

Register File

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ATmega32(L)

• Bit 0 – C: Carry Flag

The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information.

The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File:

One 8-bit output operand and one 8-bit result input

Two 8-bit output operands and one 8-bit result input

Two 8-bit output operands and one 16-bit result input

One 16-bit output operand and one 16-bit result input

Figure 4 shows the structure of the 32 general purpose working registers in the CPU.

Figure 4. AVR CPU General Purpose Working Registers

7

0

Addr.

 

 

 

 

 

 

 

 

R0

$00

 

 

 

 

 

 

 

 

R1

$01

 

 

 

 

 

 

 

 

R2

$02

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

R13

$0D

 

 

 

 

 

 

General

 

R14

$0E

 

 

 

 

 

 

Purpose

 

R15

$0F

 

 

 

 

 

 

Working

 

R16

$10

 

 

 

 

 

 

Registers

 

R17

$11

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

R26

$1A

X-register Low Byte

 

 

 

 

 

 

 

R27

$1B

X-register High Byte

 

 

 

 

 

 

 

R28

$1C

Y-register Low Byte

 

 

 

 

 

 

 

R29

$1D

Y-register High Byte

 

 

 

 

 

 

 

R30

$1E

Z-register Low Byte

 

 

 

 

 

 

 

R31

$1F

Z-register High Byte

 

 

 

 

 

Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions.

As shown in Figure 4, each register is also assigned a data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y-, and Z-pointer Registers can be set to index any register in the file.

9

The X-register, Y-register and The registers R26..R31 have some added functions to their general purpose usage. Z-register These registers are 16-bit address pointers for indirect addressing of the Data Space.

The three indirect address registers X, Y, and Z are defined as described in Figure 5.

Figure 5. The X-, Y-, and Z-registers

 

 

15

XH

 

XL

0

X - register

7

 

0

7

0

 

 

R27 ($1B)

 

 

R26 ($1A)

 

 

 

15

YH

 

YL

0

Y - register

7

 

0

7

0

 

 

R29 ($1D)

 

 

R28 ($1C)

 

 

 

15

ZH

 

ZL

0

 

 

 

 

 

 

Z - register

7

0

 

7

0

 

 

R31 ($1F)

 

 

R30 ($1E)

 

Stack Pointer

In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the Instruction Set Reference for details).

The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer.

The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above $60. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when data is popped from the Stack with return from subroutine RET or return from interrupt RETI.

The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present.

Bit

15

14

13

12

11

10

9

8

 

 

SP15

SP14

SP13

SP12

SP11

SP10

SP9

SP8

SPH

 

 

 

 

 

 

 

 

 

 

 

SP7

SP6

SP5

SP4

SP3

SP2

SP1

SP0

SPL

 

 

 

 

 

 

 

 

 

 

 

7

6

5

4

3

2

1

0

 

Read/Write

R/W

R/W

R/W

R/W

R/W

R/W

R/W

R/W

 

 

R/W

R/W

R/W

R/W

R/W

R/W

R/W

R/W

 

Initial Value

0

0

0

0

0

0

0

0

 

 

0

0

0

0

0

0

0

0

 

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Instruction Execution

Timing

Reset and Interrupt

Handling

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ATmega32(L)

This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used.

Figure 6 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast-access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit.

Figure 6. The Parallel Instruction Fetches and Instruction Executions

T1

T2

T3

T4

clkCPU

1st Instruction Fetch

1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch

Figure 7 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register.

Figure 7. Single Cycle ALU Operation

T1

T2

T3

T4

clkCPU Total Execution Time

Register Operands Fetch

ALU Operation Execute

Result Write Back

The AVR provides several different interrupt sources. These interrupts and the separate reset vector each have a separate program vector in the program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. Depending on the Program Counter value, interrupts may be automatically disabled when Boot Lock bits BLB02 or BLB12 are programmed. This feature improves software security. See the section “Memory Programming” on page 254 for details.

The lowest addresses in the program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 42. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0

11

– the External Interrupt Request 0. The Interrupt Vectors can be moved to the start of the Boot Flash section by setting the IVSEL bit in the General Interrupt Control Register (GICR). Refer to “Interrupts” on page 42 for more information. The Reset Vector can also be moved to the start of the boot Flash section by programming the BOOTRST fuse, see “Boot Loader Support – Read-While-Write Self-Programming” on page 242.

When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed.

There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the global interrupt enable bit is set, and will then be executed by order of priority.

The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered.

When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served.

Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software.

When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence.

Assembly Code Example

in

r16, SREG

; store

SREG value

cli

; disable interrupts during timed sequence

sbi

EECR, EEMWE

;

start

EEPROM

write

sbi

EECR,

EEWE

 

 

 

 

out

SREG,

r16

;

restore SREG

value (I-bit)

C Code Example

char cSREG;

cSREG = SREG; /* store SREG value */

/* disable interrupts during timed sequence */

_CLI();

EECR |= (1<<EEMWE); /* start EEPROM write */

EECR |= (1<<EEWE);

SREG = cSREG; /* restore SREG value (I-bit) */

12 ATmega32(L)

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ATmega32(L)

When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in this example.

Assembly Code Example

sei ; set global interrupt enable

sleep ; enter sleep, waiting for interrupt

;note: will enter sleep before any pending

;interrupt(s)

C Code Example

_SEI(); /* set global interrupt enable */

_SLEEP(); /* enter sleep, waiting for interrupt */

/* note: will enter sleep before any pending interrupt(s) */

Interrupt Response Time The interrupt execution response for all the enabled AVR interrupts is four clock cycles minimum. After four clock cycles the program vector address for the actual interrupt handling routine is executed. During this four clock cycle period, the Program Counter is pushed onto the Stack. The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. If an interrupt occurs during execution of a multi-cycle instruction, this instruction is completed before the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interrupt execution response time is increased by four clock cycles. This increase comes in addition to the start-up time from the selected sleep mode.

A return from an interrupt handling routine takes four clock cycles. During these four clock cycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer is incremented by two, and the I-bit in SREG is set.

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AVR ATmega32

Memories

In-System

Reprogrammable Flash

Program Memory

This section describes the different memories in the ATmega32. The AVR architecture has two main memory spaces, the Data Memory and the Program Memory space. In addition, the ATmega32 features an EEPROM Memory for data storage. All three memory spaces are linear and regular.

The ATmega32 contains 32K bytes On-chip In-System Reprogrammable Flash memory for program storage. Since all AVR instructions are 16 or 32 bits wide, the Flash is organized as 16K x 16. For software security, the Flash Program memory space is divided into two sections, Boot Program section and Application Program section.

The Flash memory has an endurance of at least 10,000 write/erase cycles. The ATmega32 Program Counter (PC) is 14 bits wide, thus addressing the 16K program memory locations. The operation of Boot Program section and associated Boot Lock bits for software protection are described in detail in “Boot Loader Support – Read- While-Write Self-Programming” on page 242. “Memory Programming” on page 254 contains a detailed description on Flash Programming in SPI, JTAG, or Parallell Programming mode.

Constant tables can be allocated within the entire program memory address space (see the LPM – Load Program Memory Instruction Description).

Timing diagrams for instruction fetch and execution are presented in “Instruction Execution Timing” on page 11.

Figure 8. Program Memory Map

$0000

Application Flash Section

Boot Flash Section

$3FFF

14 ATmega32(L)

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ATmega32(L)

SRAM Data Memory

Figure 9 shows how the ATmega32 SRAM Memory is organized.

The lower 2144 Data Memory locations address the Register File, the I/O Memory, and the internal data SRAM. The first 96 locations address the Register File and I/O Memory, and the next 2048 locations address the internal data SRAM.

The five different addressing modes for the data memory cover: Direct, Indirect with Displacement, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In the Register File, registers R26 to R31 feature the indirect Addressing Pointer Registers.

The direct addressing reaches the entire data space.

The Indirect with Displacement mode reaches 63 address locations from the base address given by the Y- or Z-register.

When using register indirect addressing modes with automatic pre-decrement and postincrement, the address registers X, Y, and Z are decremented or incremented.

The 32 general purpose working registers, 64 I/O Registers, and the 2048 bytes of internal data SRAM in the ATmega32 are all accessible through all these addressing modes. The Register File is described in “General Purpose Register File” on page 9.

Figure 9. Data Memory Map

Register File

R0

R1

R2

...

R29

R30

R31

I/O Registers

$00

$01

$02

...

$3D

$3E

$3F

Data Address Space

$0000

$0001

$0002

...

$001D

$001E

$001F

$0020

$0021

$0022

...

$005D

$005E

$005F

Internal SRAM

$0060

$0061

...

$085E

$085F

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2503G–AVR–11/04

Data Memory Access Times This section describes the general access timing concepts for internal memory access. The internal data SRAM access is performed in two clkCPU cycles as described in Figure 10.

Figure 10. On-chip Data SRAM Access Cycles

T1

T2

T3

clkCPU

Address

Compute Address

Address Valid

Data

WR

Data

RD

Read Write

Memory Access Instruction

Next Instruction

EEPROM Data Memory The ATmega32 contains 1024 bytes of data EEPROM memory. It is organized as a separate data space, in which single bytes can be read and written. The EEPROM has an endurance of at least 100,000 write/erase cycles. The access between the EEPROM and the CPU is described in the following, specifying the EEPROM Address Registers, the EEPROM Data Register, and the EEPROM Control Register.

“Memory Programming” on page 254 contains a detailed description on EEPROM Programming in SPI, JTAG, or Parallell Programming mode.

EEPROM Read/Write Access The EEPROM Access Registers are accessible in the I/O space.

The write access time for the EEPROM is given in Table 1. A self-timing function, however, lets the user software detect when the next byte can be written. If the user code contains instructions that write the EEPROM, some precautions must be taken. In heavily filtered power supplies, VCC is likely to rise or fall slowly on Power-up/down. This causes the device for some period of time to run at a voltage lower than specified as minimum for the clock frequency used. See “Preventing EEPROM Corruption” on page 20 for details on how to avoid problems in these situations.

In order to prevent unintentional EEPROM writes, a specific write procedure must be followed. Refer to the description of the EEPROM Control Register for details on this.

When the EEPROM is read, the CPU is halted for four clock cycles before the next instruction is executed. When the EEPROM is written, the CPU is halted for two clock cycles before the next instruction is executed.

16 ATmega32(L)

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ATmega32(L)

The EEPROM Address

Register – EEARH and EEARL

Bit

15

14

13

12

11

10

9

8

 

 

EEAR9

EEAR8

EEARH

 

 

 

 

 

 

 

 

 

 

 

EEAR7

EEAR6

EEAR5

EEAR4

EEAR3

EEAR2

EEAR1

EEAR0

EEARL

 

 

 

 

 

 

 

 

 

 

 

7

6

5

4

3

2

1

0

 

Read/Write

R

R

R

R

R

R

R/W

R/W

 

 

R/W

R/W

R/W

R/W

R/W

R/W

R/W

R/W

 

Initial Value

0

0

0

0

0

0

0

X

 

 

X

X

X

X

X

X

X

X

 

The EEPROM Data Register –

EEDR

• Bits 15..10 – Res: Reserved Bits

These bits are reserved bits in the ATmega32 and will always read as zero.

• Bits 9..0 – EEAR9..0: EEPROM Address

The EEPROM Address Registers EEARH and EEARL – specify the EEPROM address in the 1024 bytes EEPROM space. The EEPROM data bytes are addressed linearly between 0 and 1023. The initial value of EEAR is undefined. A proper value must be written before the EEPROM may be accessed.

Bit

7

6

5

4

3

2

1

0

 

 

MSB

 

 

 

 

 

 

LSB

EEDR

 

 

 

 

 

 

 

 

 

 

Read/Write

R/W

R/W

R/W

R/W

R/W

R/W

R/W

R/W

 

Initial Value

0

0

0

0

0

0

0

0

 

• Bits 7..0 – EEDR7.0: EEPROM Data

The EEPROM Control Register

– EECR

For the EEPROM write operation, the EEDR Register contains the data to be written to the EEPROM in the address given by the EEAR Register. For the EEPROM read operation, the EEDR contains the data read out from the EEPROM at the address given by EEAR.

Bit

7

6

5

4

3

2

1

0

 

 

EERIE

EEMWE

EEWE

EERE

EECR

 

 

 

 

 

 

 

 

 

 

Read/Write

R

R

R

R

R/W

R/W

R/W

R/W

 

Initial Value

0

0

0

0

0

0

X

0

 

• Bits 7..4 – Res: Reserved Bits

These bits are reserved bits in the ATmega32 and will always read as zero.

• Bit 3 – EERIE: EEPROM Ready Interrupt Enable

Writing EERIE to one enables the EEPROM Ready Interrupt if the I bit in SREG is set. Writing EERIE to zero disables the interrupt. The EEPROM Ready interrupt generates a constant interrupt when EEWE is cleared.

• Bit 2 – EEMWE: EEPROM Master Write Enable

The EEMWE bit determines whether setting EEWE to one causes the EEPROM to be written. When EEMWE is set, setting EEWE within four clock cycles will write data to the EEPROM at the selected address If EEMWE is zero, setting EEWE will have no effect.

17

2503G–AVR–11/04

When EEMWE has been written to one by software, hardware clears the bit to zero after four clock cycles. See the description of the EEWE bit for an EEPROM write procedure.

• Bit 1 – EEWE: EEPROM Write Enable

The EEPROM Write Enable Signal EEWE is the write strobe to the EEPROM. When address and data are correctly set up, the EEWE bit must be written to one to write the value into the EEPROM. The EEMWE bit must be written to one before a logical one is written to EEWE, otherwise no EEPROM write takes place. The following procedure should be followed when writing the EEPROM (the order of steps 3 and 4 is not essential):

1.Wait until EEWE becomes zero.

2.Wait until SPMEN in SPMCR becomes zero.

3.Write new EEPROM address to EEAR (optional).

4.Write new EEPROM data to EEDR (optional).

5.Write a logical one to the EEMWE bit while writing a zero to EEWE in EECR.

6.Within four clock cycles after setting EEMWE, write a logical one to EEWE.

The EEPROM can not be programmed during a CPU write to the Flash memory. The software must check that the Flash programming is completed before initiating a new EEPROM write. Step 2 is only relevant if the software contains a Boot Loader allowing the CPU to program the Flash. If the Flash is never being updated by the CPU, step 2 can be omitted. See “Boot Loader Support – Read-While-Write Self-Programming” on page 242 for details about boot programming.

Caution: An interrupt between step 5 and step 6 will make the write cycle fail, since the EEPROM Master Write Enable will time-out. If an interrupt routine accessing the EEPROM is interrupting another EEPROM Access, the EEAR or EEDR reGister will be modified, causing the interrupted EEPROM Access to fail. It is recommended to have the Global Interrupt Flag cleared during all the steps to avoid these problems.

When the write access time has elapsed, the EEWE bit is cleared by hardware. The user software can poll this bit and wait for a zero before writing the next byte. When EEWE has been set, the CPU is halted for two cycles before the next instruction is executed.

• Bit 0 – EERE: EEPROM Read Enable

The EEPROM Read Enable Signal – EERE – is the read strobe to the EEPROM. When the correct address is set up in the EEAR Register, the EERE bit must be written to a logic one to trigger the EEPROM read. The EEPROM read access takes one instruction, and the requested data is available immediately. When the EEPROM is read, the CPU is halted for four cycles before the next instruction is executed.

The user should poll the EEWE bit before starting the read operation. If a write operation is in progress, it is neither possible to read the EEPROM, nor to change the EEAR Register.

The calibrated Oscillator is used to time the EEPROM accesses. Table 1 lists the typical programming time for EEPROM access from the CPU.

Table 1. EEPROM Programming Time

 

Number of Calibrated RC

 

Symbol

Oscillator Cycles(1)

Typ Programming Time

EEPROM write (from CPU)

8448

8.5 ms

 

 

 

18 ATmega32(L)

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ATmega32(L)

Note: 1. Uses 1 MHz clock, independent of CKSEL Fuse setting.

The following code examples show one assembly and one C function for writing to the EEPROM. The examples assume that interrupts are controlled (for example by disabling interrupts globally) so that no interrupts will occur during execution of these functions. The examples also assume that no Flash Boot Loader is present in the software. If such code is present, the EEPROM write function must also wait for any ongoing SPM command to finish.

Assembly Code Example

EEPROM_write:

; Wait for completion of previous write sbic EECR,EEWE

rjmp EEPROM_write

; Set up address (r18:r17) in address register out EEARH, r18

out EEARL, r17

; Write data (r16) to data register out EEDR,r16

; Write logical one to EEMWE sbi EECR,EEMWE

; Start eeprom write by setting EEWE sbi EECR,EEWE

ret

C Code Example

void EEPROM_write(unsigned int uiAddress, unsigned char ucData)

{

/* Wait for completion of previous write */ while(EECR & (1<<EEWE))

;

/* Set up address and data registers */ EEAR = uiAddress;

EEDR = ucData;

/* Write logical one to EEMWE */

EECR |= (1<<EEMWE);

/* Start eeprom write by setting EEWE */

EECR |= (1<<EEWE);

}

19

2503G–AVR–11/04

The next code examples show assembly and C functions for reading the EEPROM. The examples assume that interrupts are controlled so that no interrupts will occur during execution of these functions.

Assembly Code Example

EEPROM_read:

; Wait for completion of previous write sbic EECR,EEWE

rjmp EEPROM_read

; Set up address (r18:r17) in address register out EEARH, r18

out EEARL, r17

; Start eeprom read by writing EERE sbi EECR,EERE

; Read data from data register in r16,EEDR

ret

C Code Example

unsigned char EEPROM_read(unsigned int uiAddress)

{

/* Wait for completion of previous write */ while(EECR & (1<<EEWE))

;

/* Set up address register */ EEAR = uiAddress;

/* Start eeprom read by writing EERE */

EECR |= (1<<EERE);

/* Return data from data register */ return EEDR;

}

EEPROM Write During Power- When entering Power-down Sleep mode while an EEPROM write operation is active,

down Sleep Mode

the EEPROM write operation will continue, and will complete before the Write Access

 

time has passed. However, when the write operation is completed, the Oscillator contin-

 

ues running, and as a consequence, the device does not enter Power-down entirely. It is

 

therefore recommended to verify that the EEPROM write operation is completed before

 

entering Power-down.

Preventing EEPROM

During periods of low VCC, the EEPROM data can be corrupted because the supply volt-

Corruption

age is too low for the CPU and the EEPROM to operate properly. These issues are the

 

same as for board level systems using EEPROM, and the same design solutions should

 

be applied.

 

An EEPROM data corruption can be caused by two situations when the voltage is too

 

low. First, a regular write sequence to the EEPROM requires a minimum voltage to

 

operate correctly. Secondly, the CPU itself can execute instructions incorrectly, if the

 

supply voltage is too low.

20 ATmega32(L)

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ATmega32(L)

EEPROM data corruption can easily be avoided by following this design recommendation:

I/O Memory

Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be done by enabling the internal Brown-out Detector (BOD). If the detection level of the internal BOD does not match the needed detection level, an external low VCC Reset Protection circuit can be used. If a reset occurs while a write operation is in progress, the write operation will be completed provided that the power supply voltage is sufficient.

The I/O space definition of the ATmega32 is shown in “Register Summary” on page 325.

All ATmega32 I/Os and peripherals are placed in the I/O space. The I/O locations are accessed by the IN and OUT instructions, transferring data between the 32 general purpose working registers and the I/O space. I/O Registers within the address range $00 - $1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. Refer to the Instruction Set section for more details. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O Registers as data space using LD and ST instructions, $20 must be added to these addresses.

For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written.

Some of the Status Flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on all bits in the I/O Register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions work with registers $00 to $1F only.

The I/O and Peripherals Control Registers are explained in later sections.

21

2503G–AVR–11/04

System Clock and

Clock Options

Clock Systems and their Distribution

Figure 11 presents the principal clock systems in the AVR and their distribution. All of the clocks need not be active at a given time. In order to reduce power consumption, the clocks to modules not being used can be halted by using different sleep modes, as described in “Power Management and Sleep Modes” on page 30. The clock systems are detailed Figure 11.

Figure 11. Clock Distribution

Asynchronous

 

General I/O

Timer/Counter

 

Modules

 

 

 

clkI/O

clkASY

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Timer/Counter

 

External RC

 

Oscillator

 

Oscillator

 

 

 

 

 

 

 

 

ADC

CPU Core

 

RAM

Flash and

 

EEPROM

 

 

 

 

clkADC

 

 

 

 

AVR Clock

clkCPU

 

 

 

Control Unit

 

 

 

 

 

clkFLASH

 

 

 

 

Reset Logic

Watchdog Timer

Source Clock

Watchdog Clock

 

Clock

 

 

Watchdog

 

Multiplexer

 

 

Oscillator

 

External Clock

Crystal

 

Low-frequency

Calibrated RC

 

Oscillator

 

Crystal Oscillator

Oscillator

CPU Clock – clkCPU

The CPU clock is routed to parts of the system concerned with operation of the AVR

 

core. Examples of such modules are the General Purpose Register File, the Status Reg-

 

ister and the data memory holding the Stack Pointer. Halting the CPU clock inhibits the

 

core from performing general operations and calculations.

I/O Clock – clkI/O

The I/O clock is used by the majority of the I/O modules, like Timer/Counters, SPI, and

 

USART. The I/O clock is also used by the External Interrupt module, but note that some

 

external interrupts are detected by asynchronous logic, allowing such interrupts to be

 

detected even if the I/O clock is halted. Also note that address recognition in the TWI

 

module is carried out asynchronously when clkI/O is halted, enabling TWI address recep-

 

tion in all sleep modes.

Flash Clock – clkFLASH

The Flash clock controls operation of the Flash interface. The Flash clock is usually

 

active simultaneously with the CPU clock.

22 ATmega32(L)

2503G–AVR–11/04

ATmega32(L)

Asynchronous Timer Clock – The Asynchronous Timer clock allows the Asynchronous Timer/Counter to be clocked

clkASY

directly from an external 32 kHz clock crystal. The dedicated clock domain allows using

 

this Timer/Counter as a real-time counter even when the device is in sleep mode.

ADC Clock – clkADC

The ADC is provided with a dedicated clock domain. This allows halting the CPU and

 

I/O clocks in order to reduce noise generated by digital circuitry. This gives more accu-

 

rate ADC conversion results.

Clock Sources

Default Clock Source

The device has the following clock source options, selectable by Flash Fuse bits as shown below. The clock from the selected source is input to the AVR clock generator, and routed to the appropriate modules.

Table 2. Device Clocking Options Select(1)

Device Clocking Option

CKSEL3..0

 

 

External Crystal/Ceramic Resonator

1111 - 1010

 

 

External Low-frequency Crystal

1001

 

 

External RC Oscillator

1000 - 0101

 

 

Calibrated Internal RC Oscillator

0100 - 0001

 

 

External Clock

0000

 

 

Note: 1. For all fuses “1” means unprogrammed while “0” means programmed.

The various choices for each clocking option is given in the following sections. When the CPU wakes up from Power-down or Power-save, the selected clock source is used to time the start-up, ensuring stable Oscillator operation before instruction execution starts. When the CPU starts from Reset, there is as an additional delay allowing the power to reach a stable level before commencing normal operation. The Watchdog Oscillator is used for timing this real-time part of the start-up time. The number of WDT Oscillator cycles used for each time-out is shown in Table 3. The frequency of the Watchdog Oscillator is voltage dependent as shown in “Register Summary” on page 325.

Table 3. Number of Watchdog Oscillator Cycles

Typ Time-out (VCC = 5.0V)

Typ Time-out (VCC = 3.0V)

Number of Cycles

4.1 ms

4.3 ms

4K

(4,096)

 

 

 

 

65 ms

69 ms

64K

(65,536)

 

 

 

 

The device is shipped with CKSEL = “0001” and SUT = “10”. The default clock source setting is therefore the 1 MHz Internal RC Oscillator with longest startup time. This default setting ensures that all users can make their desired clock source setting using an In-System or Parallel Programmer.

23

2503G–AVR–11/04

Crystal Oscillator

XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which can be configured for use as an On-chip Oscillator, as shown in Figure 12. Either a quartz crystal or a ceramic resonator may be used. The CKOPT Fuse selects between two different Oscillator amplifier modes. When CKOPT is programmed, the Oscillator output will oscillate will a full rail-to-rail swing on the output. This mode is suitable when operating in a very noisy environment or when the output from XTAL2 drives a second clock buffer. This mode has a wide frequency range. When CKOPT is unprogrammed, the Oscillator has a smaller output swing. This reduces power consumption considerably. This mode has a limited frequency range and it can not be used to drive other clock buffers.

For resonators, the maximum frequency is 8 MHz with CKOPT unprogrammed and 16 MHz with CKOPT programmed. C1 and C2 should always be equal for both crystals and resonators. The optimal value of the capacitors depends on the crystal or resonator in use, the amount of stray capacitance, and the electromagnetic noise of the environment. Some initial guidelines for choosing capacitors for use with crystals are given in Table 4. For ceramic resonators, the capacitor values given by the manufacturer should be used.

Figure 12. Crystal Oscillator Connections

C2

XTAL2

C1

XTAL1

GND

The Oscillator can operate in three different modes, each optimized for a specific frequency range. The operating mode is selected by the fuses CKSEL3..1 as shown in Table 4.

Table 4. Crystal Oscillator Operating Modes

 

 

Frequency Range

Recommended Range for Capacitors

CKOPT

CKSEL3..1

(MHz)

C1 and C2 for Use with Crystals (pF)

 

 

 

 

1

101(1)

0.4 - 0.9

1

110

0.9 - 3.0

12 - 22

 

 

 

 

1

111

3.0 - 8.0

12 - 22

 

 

 

 

0

101, 110, 111

1.0 ≤

12 - 22

 

 

 

 

Note: 1.

This option should not be used with crystals, only with ceramic resonators.

24 ATmega32(L)

2503G–AVR–11/04

ATmega32(L)

The CKSEL0 Fuse together with the SUT1..0 fuses select the start-up times as shown in

Table 5.

Table 5. Start-up Times for the Crystal Oscillator Clock Selection

 

 

Start-up Time from

Additional Delay

 

 

 

Power-down and

from Reset

 

CKSEL0

SUT1..0

Power-save

(VCC = 5.0V)

Recommended Usage

0

00

258 CK(1)

4.1 ms

Ceramic resonator, fast

rising power

 

 

 

 

 

 

 

 

 

0

01

258 CK(1)

65 ms

Ceramic resonator, slowly

rising power

 

 

 

 

 

 

 

 

 

0

10

1K CK(2)

Ceramic resonator, BOD

enabled

 

 

 

 

 

 

 

 

 

0

11

1K CK(2)

4.1 ms

Ceramic resonator, fast

rising power

 

 

 

 

 

 

 

 

 

1

00

1K CK(2)

65 ms

Ceramic resonator, slowly

rising power

 

 

 

 

 

 

 

 

 

1

01

16K CK

Crystal Oscillator, BOD

enabled

 

 

 

 

 

 

 

 

 

1

10

16K CK

4.1 ms

Crystal Oscillator, fast

rising power

 

 

 

 

 

 

 

 

 

1

11

16K CK

65 ms

Crystal Oscillator, slowly

rising power

 

 

 

 

 

 

 

 

 

Notes: 1. These options should only be used when not operating close to the maximum frequency of the device, and only if frequency stability at start-up is not important for the application. These options are not suitable for crystals.

2.These options are intended for use with ceramic resonators and will ensure frequency stability at start-up. They can also be used with crystals when not operating close to the maximum frequency of the device, and if frequency stability at start-up is not important for the application.

25

2503G–AVR–11/04

Low-frequency Crystal

Oscillator

External RC Oscillator

To use a 32.768 kHz watch crystal as the clock source for the device, the Low-fre- quency Crystal Oscillator must be selected by setting the CKSEL fuses to “1001”. The crystal should be connected as shown in Figure 12. By programming the CKOPT Fuse, the user can enable internal capacitors on XTAL1 and XTAL2, thereby removing the need for external capacitors. The internal capacitors have a nominal value of 36 pF.

When this Oscillator is selected, start-up times are determined by the SUT fuses as shown in Table 6.

Table 6. Start-up Times for the Low-frequency Crystal Oscillator Clock Selection

 

Start-up Time from

Additional Delay

 

 

 

Power-down and

from Reset

 

 

SUT1..0

Power-save

(VCC = 5.0V)

 

Recommended Usage

00

1K CK(1)

4.1 ms

 

Fast rising power or BOD enabled

01

1K CK(1)

65 ms

 

Slowly rising power

10

32K CK

65 ms

 

Stable frequency at start-up

 

 

 

 

 

11

 

Reserved

 

 

 

 

 

 

Note: 1. These options should only be used if frequency stability at start-up is not important for the application.

For timing insensitive applications, the external RC configuration shown in Figure 13 can be used. The frequency is roughly estimated by the equation f = 1/(3RC). C should be at least 22 pF. By programming the CKOPT Fuse, the user can enable an internal 36 pF capacitor between XTAL1 and GND, thereby removing the need for an external capacitor. For more information on Oscillator operation and details on how to choose R and C, refer to the External RC Oscillator application note.

Figure 13. External RC Configuration

 

VCC

 

R

NC

XTAL2

 

 

 

 

XTAL1

C

 

 

 

 

GND

The Oscillator can operate in four different modes, each optimized for a specific frequency range. The operating mode is selected by the fuses CKSEL3..0 as shown in Table 7.

26 ATmega32(L)

2503G–AVR–11/04

Calibrated Internal RC

Oscillator

2503G–AVR–11/04

 

 

ATmega32(L)

Table 7. External RC Oscillator Operating Modes

 

 

 

 

CKSEL3..0

 

Frequency Range (MHz)

 

 

 

0101

 

0.1 - 0.9

 

 

 

0110

 

0.9 - 3.0

 

 

 

0111

 

3.0 - 8.0

 

 

 

1000

 

8.0 - 12.0

 

 

 

When this Oscillator is selected, start-up times are determined by the SUT fuses as shown in Table 8.

Table 8. Start-up Times for the External RC Oscillator Clock Selection

 

Start-up Time from

Additional Delay

 

 

Power-down and

from Reset

 

SUT1..0

Power-save

(VCC = 5.0V)

Recommended Usage

00

18 CK

BOD enabled

 

 

 

 

01

18 CK

4.1 ms

Fast rising power

 

 

 

 

10

18 CK

65 ms

Slowly rising power

 

 

 

 

11

6 CK(1)

4.1 ms

Fast rising power or BOD enabled

Note: 1. This option should not be used when operating close to the maximum frequency of the device.

The Calibrated Internal RC Oscillator provides a fixed 1.0, 2.0, 4.0, or 8.0 MHz clock. All frequencies are nominal values at 5V and 25°C. This clock may be selected as the system clock by programming the CKSEL fuses as shown in Table 9. If selected, it will operate with no external components. The CKOPT Fuse should always be unprogrammed when using this clock option. During Reset, hardware loads the calibration byte for the 1MHz into the OSCCAL Register and thereby automatically calibrates the RC Oscillator. At 5V, 25°C and 1.0 MHz Oscillator frequency selected, this calibration gives a frequency within ± 3% of the nominal frequency. Using calibration methods as described in application notes available at www.atmel.com/avr it is possible to achieve ± 1% accuracy at any given VCC and Temperature. When this Oscillator is used as the Chip Clock, the Watchdog Oscillator will still be used for the Watchdog Timer and for the reset time-out. For more information on the pre-programmed calibration value, see the section “Calibration Byte” on page 256.

Table 9. Internal Calibrated RC Oscillator Operating Modes

CKSEL3..0

Nominal Frequency (MHz)

 

 

0001(1)

1.0

0010

2.0

 

 

0011

4.0

 

 

0100

8.0

 

 

Note: 1. The device is shipped with this option selected.

27

Oscillator Calibration Register

– OSCCAL

When this Oscillator is selected, start-up times are determined by the SUT fuses as shown in Table 10. XTAL1 and XTAL2 should be left unconnected (NC).

Table 10. Start-up Times for the Internal Calibrated RC Oscillator Clock Selection

 

 

Start-up Time from

Additional Delay

 

 

 

 

 

 

Power-down and

from Reset

 

 

 

 

 

SUT1..0

 

 

Power-save

 

(VCC = 5.0V)

 

Recommended Usage

00

 

 

 

6 CK

 

 

 

BOD enabled

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

01

 

 

 

6 CK

 

 

4.1 ms

 

Fast rising power

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10(1)

 

 

 

6 CK

 

 

65 ms

 

Slowly rising power

11

 

 

 

 

 

 

 

Reserved

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note: 1.

The device is shipped with this option selected.

 

 

 

 

 

Bit

7

6

 

5

4

3

 

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAL7

 

CAL6

 

CAL5

CAL4

CAL3

 

CAL2

 

CAL1

CAL0

OSCCAL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Read/Write

 

R/W

 

R/W

R/W

R/W

R/W

R/W

 

R/W

R/W

Initial Value

 

 

 

 

 

Device Specific Calibration Value

 

 

 

 

• Bits 7..0 – CAL7..0: Oscillator Calibration Value

Writing the calibration byte to this address will trim the Internal Oscillator to remove process variations from the Oscillator frequency. During Reset, the 1 MHz calibration value which is located in the signature row High Byte (address 0x00) is automatically loaded into the OSCCAL Register. If the internal RC is used at other frequencies, the calibration values must be loaded manually. This can be done by first reading the signature row by a programmer, and then store the calibration values in the Flash or EEPROM. Then the value can be read by software and loaded into the OSCCAL Register. When OSCCAL is zero, the lowest available frequency is chosen. Writing non-zero values to this register will increase the frequency of the Internal Oscillator. Writing $FF to the register gives the highest available frequency. The calibrated Oscillator is used to time EEPROM and Flash access. If EEPROM or Flash is written, do not calibrate to more than 10% above the nominal frequency. Otherwise, the EEPROM or Flash write may fail. Note that the Oscillator is intended for calibration to 1.0, 2.0, 4.0, or 8.0 MHz. Tuning to other values is not guaranteed, as indicated in Table 11.

Table 11. Internal RC Oscillator Frequency Range.

 

Min Frequency in Percentage of

Max Frequency in Percentage of

OSCCAL Value

Nominal Frequency (%)

Nominal Frequency (%)

 

 

 

$00

50

100

 

 

 

$7F

75

150

 

 

 

$FF

100

200

 

 

 

28 ATmega32(L)

2503G–AVR–11/04

ATmega32(L)

External Clock

To drive the device from an external clock source, XTAL1 should be driven as shown in Figure 14. To run the device on an external clock, the CKSEL fuses must be programmed to “0000”. By programming the CKOPT Fuse, the user can enable an internal 36 pF capacitor between XTAL1 and GND.

Figure 14. External Clock Drive Configuration

EXTERNAL

CLOCK

SIGNAL

When this clock source is selected, start-up times are determined by the SUT fuses as shown in Table 12.

Table 12. Start-up Times for the External Clock Selection

 

Start-up Time from

Additional Delay

 

 

Power-down and

from Reset

 

SUT1..0

Power-save

(VCC = 5.0V)

Recommended Usage

00

6 CK

BOD enabled

 

 

 

 

01

6 CK

4.1 ms

Fast rising power

 

 

 

 

10

6 CK

65 ms

Slowly rising power

 

 

 

 

11

 

Reserved

 

 

 

 

 

When applying an external clock, it is required to avoid sudden changes in the applied clock frequency to ensure stable operation of the MCU. A variation in frequency of more than 2% from one clock cycle to the next can lead to unpredictable behavior. It is required to ensure that the MCU is kept in reset during such changes in the clock frequency.

Timer/Counter Oscillator For AVR microcontrollers with Timer/Counter Oscillator pins (TOSC1 and TOSC2), the crystal is connected directly between the pins. No external capacitors are needed. The Oscillator is optimized for use with a 32.768 kHz watch crystal. Applying an external clock source to TOSC1 is not recommended.

29

2503G–AVR–11/04

Power Management

and Sleep Modes

MCU Control Register –

MCUCR

Sleep modes enable the application to shut down unused modules in the MCU, thereby saving power. The AVR provides various sleep modes allowing the user to tailor the power consumption to the application’s requirements.

To enter any of the six sleep modes, the SE bit in MCUCR must be written to logic one and a SLEEP instruction must be executed. The SM2, SM1, and SM0 bits in the MCUCR Register select which sleep mode (Idle, ADC Noise Reduction, Power-down, Power-save, Standby, or Extended Standby) will be activated by the SLEEP instruction. See Table 13 for a summary. If an enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up. The MCU is then halted for four cycles in addition to the start-up time, it executes the interrupt routine, and resumes execution from the instruction following SLEEP. The contents of the Register File and SRAM are unaltered when the device wakes up from sleep. If a Reset occurs during sleep mode, the MCU wakes up and executes from the Reset Vector.

Figure 11 on page 22 presents the different clock systems in the ATmega32, and their distribution. The figure is helpful in selecting an appropriate sleep mode.

The MCU Control Register contains control bits for power management.

Bit

7

6

5

4

3

2

1

0

 

 

SE

SM2

SM1

SM0

ISC11

ISC10

ISC01

ISC00

MCUCR

Read/Write

R/W

R/W

R/W

R/W

R/W

R/W

R/W

R/W

 

Initial Value

0

0

0

0

0

0

0

0

 

• Bit 7 – SE: Sleep Enable

The SE bit must be written to logic one to make the MCU enter the sleep mode when the SLEEP instruction is executed. To avoid the MCU entering the sleep mode unless it is the programmers purpose, it is recommended to write the Sleep Enable (SE) bit to one just before the execution of the SLEEP instruction and to clear it immediately after waking up.

• Bits 6...4 – SM2..0: Sleep Mode Select Bits 2, 1, and 0

These bits select between the six available sleep modes as shown in Table 13.

Table 13. Sleep Mode Select

SM2

SM1

SM0

Sleep Mode

 

 

 

 

0

0

0

Idle

 

 

 

 

0

0

1

ADC Noise Reduction

 

 

 

 

0

1

0

Power-down

 

 

 

 

0

1

1

Power-save

 

 

 

 

1

0

0

Reserved

 

 

 

 

1

0

1

Reserved

 

 

 

 

1

1

0

Standby(1)

1

1

1

Extended Standby(1)

Note: 1. Standby mode and Extended Standby mode are only available with external crystals or resonators.

30 ATmega32(L)

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