Atmel SAM9G15-EK, SAM9G25-EK, SAM9G35-EK, SAM9X25-EK, SAM9X35-EK User guide

SAM9G15-EK

SAM9G25-EK

SAM9G35-EK

SAM9X25-EK

SAM9X35-EK

...................................................................................................................

User Guide

11115A–ATARM–27-Jul-11

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Section 1
Introduction.................................................................................................................			1-1
1.1	Scope .................................................................................................................................		1-1
1.2	Applicable Documents .......................................................................................................		1-2
Section 2
Kit Contents ................................................................................................................			2-1
2.1	Deliverables .......................................................................................................................		2-1
2.2	Evaluation Board Specifications.........................................................................................		2-2
2.3	Electrostatic Warning .........................................................................................................		2-3
Section 3
Power Up	....................................................................................................................		3-1
3.1	Power Up the Board...........................................................................................................		3-1
3.2	DevStart	.............................................................................................................................	3-1
3.3	Recovery Procedure ..........................................................................................................		3-2
3.4	Sample Code and Technical Support ................................................................................		3-2
Section 4
Evaluation Kit Hardware .............................................................................................			4-1
4.1	Introduction ........................................................................................................................		4-1
4.2	Computer Module (CM)......................................................................................................		4-3
	4.2.1	CM Board Overview.............................................................................................	4-3
	4.2.2	Equipment List .....................................................................................................	4-3
	4.2.3	Function Blocks ...................................................................................................	4-5
	4.2.4	Configuration .....................................................................................................	4-14
	4.2.5	Connectors ........................................................................................................	4-15
	4.2.6	Schematics ........................................................................................................	4-16
4.3	EK Board Description.......................................................................................................		4-21
	4.3.1	EK Board Overview ...........................................................................................	4-21
	4.3.2	Equipment List ...................................................................................................	4-22
	4.3.3	Function Blocks .................................................................................................	4-23
	4.3.4	Configuration .....................................................................................................	4-39
	4.3.5	Connectors ........................................................................................................	4-45
	4.3.6	Schematics ........................................................................................................	4-63
4.4	Optional Display Module (DM) Board Hardware ..............................................................		4-78
	4.4.1	DM Board Overview...........................................................................................	4-78
	4.4.2	Equipment List ...................................................................................................	4-78
	4.4.3	Function Blocks .................................................................................................	4-78
Evaluation Kit (EK) User Guide					i

11115A–ATARM–27-Jul-11

4.4.4 Schematics ........................................................................................................

4-82

Section 5
Revision History..........................................................................................................	5-1
5.1 Revision History .................................................................................................................	5-1

ii	Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

Section 1

Introduction

1.1Scope

This User Guide introduces the Evaluation Kit and describes the development and debugging capabilities running on an AT91SAM9 ARM®-based Embedded MPUs as listed below:

SAM9G15

SAM9G25

SAM9X25

SAM9G35

SAM9X35

The User Guide pertains to the following Evaluation Kit references:

SAM9G15-EK

SAM9G25-EK

SAM9X25-EK

SAM9G35-EK

SAM9X35-EK

This User Guide gives design details on the Evaluation Kit and is made up of 5 sections:

Section 1 includes a photo of the board, device and kit references and applicable documents.

Section 2 describes the kit contents, its main features.

Section 3 provides instructions to power up the Evaluation Kit and describes how to use it.

Section 4 describes the CPU Module (CM), the Main Board (MB) and optional Display Module (DM).

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Introduction

Figure 1-1. Board Photo (Display module is optional)

1.2Applicable Documents

Table 1-1. Applicable Documents

Reference	Title	Comment
Atmel lit° 11052	SAM9G15 datasheet	These documents provide technical support for each one of the
Atmel lit° 11032	SAM9G25 datasheet	Atmel ARM-based Embedded MPU products supported by these
Atmel lit° 11054	SAM9X25 datasheet	Evaluation Kits.
Atmel lit° 11053	SAM9G35 datasheet	The datasheets can be found on www.atmel.com in the
Atmel lit° 11055	SAM9X35 datasheet	SAM9G/SAM9X product families by means of the link below:

http://www.atmel.com/products/at91/default.asp?category_id=163&family_id=605&source=global_nav

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Section 2

Kit Contents

2.1Deliverables

The Evaluation Kits include:

Board

–One EK board

–One of the five available CPU modules (CM) SAM9G15-CM

SAM9G35-CM SAM9X35-CM SAM9G25-CM SAM9X25-CM

–One optional DM board featured in SAM9G15, SAM9G35, SAM9X35 kits only.

Power supply

–Universal input AC/DC power supply with US, Europe and UK plug adapters

–One 3V Lithium Battery type CR1225

Cables

–One serial RS232 cable

–One micro A/B-type USB cable

–One RJ45 crossed cable

A Welcome Letter

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Kit Contents

Figure 2-1. Unpacked Evaluation Kit

Unpack and inspect the kit carefully. Contact your local Atmel distributor, should there be issues concerning the contents of the kit.

2.2Evaluation Board Specifications

Table 2-1. Evaluation Kit Specifications

Characteristics	Specifications
Clock speed	400 MHz PCK, 133 MHz MCK
Ports	Ethernet, USB, RS232, DBGU, JTAG, CAN, Audio, SD Card
Board supply voltage	5 VDC from connector
Temperature
- operating	-10° to +50° C
- storage	-40° to +85° C
Relative humidity	0 to 90% (non condensing)
Dimensions
EK (Evaluation Kit)	165 mm x 135 mm
CM (Computer Module)	67.6 mm x 35 mm
DM (Display Module)	135 mm x 80 mm
RoHS status	Compliant

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Kit Contents

2.3Electrostatic Warning

The Evaluation Kit is shipped in a protective anti-static package. The board system must not be subjected to high electrostatic potentials. A grounding strap or similar ESD protective device should be worn when handling the board in hostile ESD environments (offices with synthetic carpet, for example). Avoid touching the component pins or any other metallic element on the board.

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Section 3

Power Up

3.1Power Up the Board

Unpack the board taking care to avoid electrostatic discharge. Unpack the power supply, select the right power plug adapter corresponding to that of your country, and insert it in the power supply.

Connect the power supply DC connector to the board and plug the power supply to an AC power plug.

The board LCD should light up and display a welcome page. Then, click or touch icons displayed on the screen and enjoy the demo.

3.2DevStart

The on-board NAND Flash contains an installation guide named: “SAM9x5-EK DevStart”.

It is stored in the “SAM9x5-EK DevStart” folder on the USB Flash disk available when the Evaluation Kit is connected to a host computer.

Click the file “welcome.html” in this folder to launch the SAM9x5-EK DevStart.

DevStart guides the user through the installation processes of IAR™ EWARM, Keil™ MDK and GNU toolkits. Then, it gives step-by-step instructions on how to rebuild a single example project and how to program it into the Evaluation Kit. Optionally, if the user has a SAM-ICE™ interface, instructions are also given about how to debug the code.

It is strongly recommended that users backup the “SAM9x5-EK DevStart” folder on their computer before launching it.

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Power Up

3.3Recovery Procedure

The DevStart ends by giving step-by-step instructions on how to recover the Evaluation Kit to the state as it was when shipped by Atmel.

Follow the instructions if contents of the NAND Flash or the SPI DataFlash® have been deleted, in order to recover from this situation.

3.4Sample Code and Technical Support

After boot up, designers can run sample code or their own application, on the development kit. Users can download sample code and get technical support from the Atmel web site:

http://www.atmel.com/products/at91/default.asp?category_id=163&family_id=605&source=global_nav

Figure 3-1. Atmel Web Site

Note: Different interfaces on the EK boards share the same connections to the CPU module. Therefore the actual

usage depends on the CPU module featured in the evaluation kit.

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Section 4

Evaluation Kit Hardware

4.1Introduction

The Evaluation Kit is a fully-featured evaluation platform for the Atmel MPU. The Evaluation Kit enables users to extensively evaluate, prototype and create application-specific designs.

The Evaluation Kit is a new platform architecture based on a Main Board (MB), a CPU Module (CM) equipped with one of the five processors and an optional Display Module (DM).

The Evaluation Kit consists of three boards:

1.The CPU Module (CM) board, is a single-board computer that integrates all the core components and is mounted onto an application-specific carrier board (EK board). The CPU Module has specified pinouts based on the SODIMM200 connector. It provides the functional requirements for an embedded application. These functions include, but are not limited to, graphics, audio, mass storage, network and multiple serial and USB ports. A single SODIMM200 connector provides an interface for the carrier board to carry all the I/O signals to and from the CPU Module.

2.The Evaluation Kit board (EK Main Board) provides all the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a densely packed solution, which results in a more reliable product while simplifying system integration.

3.The optional Display Module (DM) board integrates LCD, TouchScreen and Qtouch® technology.

Table 4-1, on the page that follows, lists the features provided on the Evaluation Kit:

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Evaluation Kit Hardware

Table 4-1. Evaluation Kit Features

	Supported modules			SAM9 products
	Expansion Slot	SO-DIMM200
				SAM9	SAM9	SAM9	SAM9	SAM9
	Processor options			G15	G25	G35	X25	X35
		MII/RMII Ethernet 10/100 w/PHY and three	ETH0		X	X	X	X
		Led status
	LAN
		RMII Ethernet 10/100 w/PHY and three Led	ETH1				X
		status
		RS232 four wires/RS485	COM0	X	X	X	X	X
		Shared interface
	USART/UART
		RS232 four wires	COM3		X		X
		RS232 two wires	DBGU	X	X	X	X	X
	CAN	CAN interface Shared interface	CAN0				X	X
			CAN1				X	X
	USB	2 * USB 2.0 Host		X	X	X	X	X
		1 * USB 2.0 Host/Device		X	X	X	X	X
	SMD	Software Modem Device		X	X	X	X	X
		µSD Card Slot Onboard	HSMCI	X	X	X	X	X
			0
	Memory Card Support
		MMC/MMC+/SD/SDIO/CE-ATA	HSMCI	X	X	X	X	X
			1
	ISI				X
	LCD + Touch Screen	24-bit Output Mode		X		X		X
	ZigBee®			X	X	X	X	X
	SPI			X	X	X	X	X
	TWI			X	X	X	X	X
	DEBUG	JTAG Test Access Port		X	X	X	X	X

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Evaluation Kit Hardware

4.2Computer Module (CM)

4.2.1CM Board Overview

The CM board is the CPU module at the heart of the system. It connects to the EK board through a SODIMM200 interface. It carries the processor and external memories. The CM board serves as a minimal CPU sub-system. All five processors:SAM9G15, SAM9G25, SAM9X25,SAM9G35 and SAM9X35 share the same CM circuitry with minor configuration settings.

Note: There are three CM boards from three different manufacturers. The five processors are implemented as shown in Table 4-2 below:

Table 4-2. CM Board Implementation

	Manufacturer &	SAM9G15-CM	SAM9G25-CM	SAM9G35-CM	SAM9X25-CM	SAM9X35-CM
	Module kind
	mfg 1	x		x
	mfg 2				x	x
	mfg 3	x	x	x	x	x

The three CM boards share the same circuitry design but with different designator information and PCB layouts. The circuitry reference in this guide, for common design parts, refers to schematics from SAM9G25-CM (mfg 3). All the other schematics are provided in Section 4.2.6 ”Schematics”.

Figure 4-1. Board Architecture

4.2.2Equipment List

The CM board is built around the integration of an ARM926-based microcontroller (BGA217 package) with external memory and optional Ethernet PHYsical Layer Transceiver.

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Evaluation Kit Hardware

4.2.2.1Devices

Following is the list of the CM board components:

One SAM9 Embedded MPU from the list below

–SAM9G15

–SAM9G25

–SAM9G35

–SAM9X25

–SAM9X35

12 MHz crystal

32.768 KHz crystal

1 Gbit DDR2 memory

2 Gits NAND Flash memory with Chip Selection control switch

32 Mbits SPI Serial DataFlash with Chip Selection control switch

512 Kbits EEPROM

1 Kbyte 1-Wire EEPROM

On-board power regulation

Two user LEDs

Optional PHY

4.2.2.2Interface Connection

SODIMM200 card edge interface

4.2.2.3Configuration Items

Dual ON/OFF switch for NAND Flash and SPI DataFlash Chip Select connection

Figure 4-2. CM Board Layout Commented

NAND Flash

DDR2 SDRAM

Sodimm200 card edge	SAM9 chip	PHY

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Evaluation Kit Hardware

4.2.3Function Blocks

4.2.3.1Processor

The CM Board is equipped with an Atmel ARM-based embedded MPU, as listed below, in a 217-ball BGA package. The five devices share an identical footprint. All five share the same CM Board PCB with minor configuration differences.

The five devices are:

SAM9G15

SAM9G25

SAM9G35

SAM9X25

SAM9X35

As different interfaces can be defined using the same pins, it depends on the actual configuration of the CPU as to which functions are in fact available to the EK board.

Refer to Section 4.2.4.1 ”Chip Identification” for details. The processor runs at a nominal frequency of 400 MHz for the core and 133 MHz for the system bus.

The peripheral configuration possibilities and implementation requirements of the CM are dependent on the module's chipset. Two configuration resistors are implemented on board in order to select the mode of configuration.

4.2.3.2Clock Circuitry

The CM includes 3 clock sources:

Two are alternatives for the processor main clock

One crystal and one crystal oscillator are used for the Ethernet MII/RMII chip

Table 4-3. Main Components Associated with the Clock Systems

Quantity	Description	Component assignment
1	Crystal for Internal Clock, 12 MHz	Y1
1	Crystal for RTC Clock, 32.768 kHz	Y2
1	Oscillator for Ethernet Clock RMII, 50 MHz	Y3

4.2.3.3Reset Circuitry

The reset sources for the CM board are:

Power on reset

Push button reset (Push button is equipped on EK board)

JTAG reset from an in-circuit emulator (JTAG interface is equipped on EK board)

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Evaluation Kit Hardware

4.2.3.4Power Supplies

The CM Board is driven by +3V3 input power rail from the EK board through the SODIMM200 connector. The CM Board embeds all the necessary power rails required for the micro processor.

When additional voltages are required, for example VDDCORE, they are generated on board from the 3.3V supply. The detailed power supply requirements for any given module are specified within the corresponding product documentation. The following table summarizes the power specifications.

Table 4-4. Power Rails Associated with the Systems

	Nominal	Name	Powers	Component
	3.3v	VDDNF	the NAND Flash I/O and control, D16-D32 and	From SODIMM200 connector
			multiplexed SMC lines
	3.3v	VDDIOP0	Partial Peripheral I/O lines	From SODIMM200 connector
	3.3v	VDDIOP1	Partial Peripheral I/O lines	From SODIMM200 connector
			the Slow Clock oscillator, the internal 32 kHz
	3.0v	VDDBU	RC, the internal 12 MHz RC and a part of the	From SODIMM200 connector
			System Controller
	3.3v	VDDUTMII	the USB device and host UTMI+ interface	From SODIMM200 connector
	3.3v	VDDOSC	the Main Oscillator cells	From SODIMM200 connector
	3.3v	VDDANA	the Analog to Digital Converter	From SODIMM200 connector
	1.8v	VDDIOM	the External Memory Interface I/O lines	on-board
	1.0v	VDDUTMIC	DC Supply UDPHS and UHPHS UTMI+ Core	on-board
	3.3v	VDDPLLUTMI	DC Supply UDPHS and UHPHS UTMI+	From SODIMM200 connector
			Interface
	1.0v	VDDPLLA	the PLLA cell	on-board
	1.0v	VDDCORE	the core, including the processor, the	on-board
			embedded memories and the peripherals
	3.0V or 3.3V	ADVREF	ADC Reference voltage	From SODIMM200 connector
	configurable

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Evaluation Kit Hardware

Figure 4-3. CM Power Supply

+3V3	MN3				L2
4	AS1301EHT-adj			3
	IN		LX
				2.2uH	3D16
C10
4.7uF		<![if ! IE]> <![endif]>GND
PWR_EN1	EN		FB	5
		<![if ! IE]> <![endif]>2
		MN1
		AS1301EHT-adj			3
		4		LX
C1		IN			2.2uH
4.7uF
PWR_EN		EN	<![if ! IE]> <![endif]>GND	FB	5
		1
			<![if ! IE]> <![endif]>2

	MN4
1	TPS71710DCK
	IN		5
		<![if ! IE]> <![endif]>GND	OUT
1uF	EN		NR
C17 PWR_EN3			4
	<![if ! IE]> <![endif]>2		C18
			10nF
ADVREF			ADVREF
C35
100nF
VDDBU			VDDBU
C36	C37
1uF	100nF

										VDDCORE
	R2					C6		C7		C8
C11			C12		C3	100nF		100nF		100nF
22pF	39.2K 1%		10uF		4.7uF
	R4
	59K 1%
L1										VDDIOM
3D16
						C13	C14		C15
		R1
	C9			C2		100nF	100nF		100nF
	22pF	118K 1%		10uF
		R3
		59K 1%
B2	2									VDDNF
1
120 OHM@100MHZ				C4		C5
				100nF		100nF
			L5
			10uH/150mA							VDDUTMII
	C38				R22
	100nF
					1R
				C39						C40
				4.7uF
										100nF
			L6
			10uH/150mA							VDDOSC
	C41				R25					C42
	100nF									100nF
					1R
				C43
				4.7uF
				L4
+1V				10uH/150mA						VDDPLLA
C16	C32					R17
1uF	100nF									C33
						1R
										100nF
					C34
					4.7uF
										VDDUTMIC
										C30
										100nF

VDDIOP0		VDDIOP0	VDDANA	L3			VDDANA
C20	C21		C27	10uH/150mA	R10	C25	C26
						100nF	100nF
100nF	100nF	VDDIOP1	100nF		1R
		VDDIOP1			C28
		C23
					4.7uF
		100nF

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Evaluation Kit Hardware

4.2.3.5Memory

The Device serial processor features a DDR/SDR memory interface and an External Bus Interface (EBI) to enable interfacing to a wide range of external memories and to almost any kind of parallel peripheral.

The External Bus Interface (EBI) is connected to two kinds of memory devices:

One 1 Gbyte DDR2 SDRAM

One 2 Gbytes (or 4 Gbytes depending on supplier) NAND Flash

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<![endif]>Guide User (EK) Kit Evaluation

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<![if ! IE]> <![endif]>9-4

MN2F

SAM9x5_LBGA217 - EBI

D0

D1

D2

D3

D4

D5

D6

D7

D8

D9

D10

D11

D12

D13

D14

D15

A0/NBS0

A1/NBS2/DQM2/NWR2

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

A12

A13

A14

A15

A16/BA0

A17/BA1

A18/BA2

A19

DQM0

DQM1

DQS0

DQS1

RAS

CAS

SDWE SDCKE SDA10 SDCK #SDCK

NCS0

NCS1/SDCS

NWR0/NWRE

NWR1/NBS1

NWR3/NBS3/DQM3

NRD

MN2E

D14			EBI_D0
		D15	EBI_D1
		A16	EBI_D2
		B16	EBI_D3
		A17	EBI_D4
		B15	EBI_D5
		C14	EBI_D6
		B14	EBI_D7
		A15	EBI_D8
		C15	EBI_D9
		D12	EBI_D10
		C13	EBI_D11
		A14	EBI_D12
		B13	EBI_D13
		A13	EBI_D14
		C12	EBI_D15
J15
	H16
	H15		EBI_A2
		H17	EBI_A3
		G17	EBI_A4
		G16	EBI_A5
		F17	EBI_A6
		E17	EBI_A7
		F16	EBI_A8
		G15	EBI_A9
		G14	EBI_A10
		F15	EBI_A11
		D17
	C17		EBI_A13
		E16	EBI_A14
		D16	EBI_A15
		C16	EBI_A16
		B17	EBI_A17
		E15	EBI_A18
		E14
A10			EBI_DQM0
		B10	EBI_DQM1
		A11	EBI_DQS0
A9			EBI_DQS1
B11			EBI_RAS
		C10	EBI_CAS
A12			EBI_SDWE
		B12	EBI_SDCKE
C8			EBI_SDA10
		D11	EBI_SDCK
		C11	EBI_NSDCK
B9			NCS0

B8		EBI_NCS1_SDCS
C9
C7
A8
D9

SAM9x5_LBGA217 - PIOD

P13 PD0 (NANDOE) PD0/NANDOE R14 PD1 (NANDWE) PD1/NANDWE R13 PD2 (NANDALE)

PD2/A21/NANDALE P15 PD3 (NANDCLE) PD3/A22/NANDCLE P12 PD4 (NANDCS)

PD4/NCS3 P14 PD5

PD5/NWAIT N14 PD6

PD6/D16 R15 PD7

PD7/D17 M14 PD8

PD8/D18 N16 PD9

PD9/D19 N17 PD10

PD10/D20 N15 PD11

PD11/D21 K15 PD12

PD12/D22 M15 PD13

PD13/D23 L14 PD14

PD14/D24 M16 PD15

PD15/D25/A20 L16 PD16

PD16/D26/A23 L15 PD17

PD17/D27/A24 K17 PD18

PD18/D28/A25 J17 PD19

PD19/D29/NCS2 K16 PD20

PD20/D30/NCS4 J16 PD21

PD21/D31/NCS5

EBI_D0	2	RR1B	7	DDR2_D0
EBI_D1	1	RR1A	8	DDR2_D1
EBI_D2	3	RR2C	6	DDR2_D2
EBI_D3	4	RR1D	5	DDR2_D3
EBI_D4	1	RR2A	8	DDR2_D4
EBI_D5	3	RR1C	6	DDR2_D5
EBI_D6	2	RR2B	7	DDR2_D6
EBI_D7	4	RR2D	5	DDR2_D7
EBI_D8	4	RR3D	5	DDR2_D8
EBI_D9	2	RR4B	7	DDR2_D9
EBI_D10	1	RR4A	8	DDR2_D10
EBI_D11	2	RR3B	7	DDR2_D11
EBI_D12	3	RR3C	6	DDR2_D12
EBI_D13	4	RR4D	5	DDR2_D13
EBI_D14	1	RR3A	8	DDR2_D14
EBI_D15	3	RR4C	6	DDR2_D15

EBI_DQM0	R26	27R	DDR2_DQM0
EBI_DQM1	R27	27R	DDR2_DQM1
EBI_DQS0	R28	27R	DDR2_DQS0
EBI_DQS1	R29	27R	DDR2_DQS1
EBI_RAS	R30	27R	DDR2_RAS
EBI_CAS	R31	27R	DDR2_CAS
EBI_SDWE	R32	27R	DDR2_SDWE
EBI_SDCKE	R35	27R	DDR2_SDCKE
EBI_SDCK	R36	27R	DDR2_SDCK
EBI_NSDCK	R37	27R	DDR2_NSDCK
EBI_NCS1_SDCS R38		27R	DDR2_NCS1
VDDIOM	L7
	10uH
C61	150mA
		R33		R34
4.7uF			C62
		1R		1.5K 1%
			104
		C63	C64	R39
		4.7uF	104
				1.5K 1%

SW1A

SWITCH-2-1.27mm

PD4

1

<![if ! IE]> <![endif]>1

<![if ! IE]> <![endif]>ON

4

VDDNF

PD[5..21] {3,5}

VDDNF

PD6

1

RR17A

8

NAND_FSH_D0

PD7

2

RR17B

7

NAND_FSH_D1

PD8

3

RR17C

6

NAND_FSH_D2

PD9

4

RR17D

5

NAND_FSH_D3

PD10

1

RR16A

8

NAND_FSH_D4

PD11

2

RR16B

7

NAND_FSH_D5

PD12

3

RR16C

6

NAND_FSH_D6

PD13

4

RR16D

5

NAND_FSH_D7

PD0	(NANDOE)	R50	0R
PD1	(NANDWE)	R51	0R
PD2	(NANDALE)	R52	0R
PD3	(NANDCLE)	R53	0R
PD4	(NANDCS)	R54	0R
PD6	(NANDR/B)	R55	0R

EBI_A2

M8

MN5

G8

DDR2_D0

A0

DQ0

G2

DDR2_D1

EBI_A3

M3

DDR2 SDRAM

A1

DQ1

EBI_A4

M7

H7

DDR2_D2

A2

MT47H64M16HR

DQ2

EBI_A5

N2

H3

DDR2_D3

EBI_A6

N8

A3

DQ3

H1

DDR2_D4

EBI_A7

N3

A4

DQ4

H9

DDR2_D5

EBI_A8

N7

A5

DQ5

F1

DDR2_D6

A6

DQ6

EBI_A9

P2

F9

DDR2_D7

A7

DQ7

EBI_A10

P8

C8

DDR2_D8

A8

DQ8

EBI_A11

P3

C2

DDR2_D9

A9

DQ9

EBI_SDA10

M2

D7

DDR2_D10

A10

DQ10

EBI_A13

P7

D3

DDR2_D11

EBI_A14

R2

A11

DQ11

D1

DDR2_D12

A12

DQ12

D9

DDR2_D13

EBI_A16

L2

DQ13

B1

DDR2_D14

EBI_A17

BA0

DQ14

L3

B9

DDR2_D15

BA1

DQ15

EBI_A18

L1

BA2

VDDIOM

K9

A1

C44 100nF

ODT

VDD

E1

VDD

C45 100nF

J9

VDD

C46 100nF

M9

DDR2_SDCKE

K2

VDD

C47 100nF

R1

CKE

VDD

C48 100nF

DDR2_SDCK

J8

J1

CK

VDDL

C49 100nF

DDR2_NSDCK

K8

CK

VDDQ

A9

C50 100nF

C1

DDR2_NCS1

L8

VDDQ

C3

C51 100nF

CS

VDDQ

C52 100nF

C7

VDDQ

C53 100nF

C9

DDR2_CAS

L7

VDDQ

C54 100nF

E9

CAS

VDDQ

G1

C55 100nF

DDR2_RAS

K7

RAS

VDDQ

C56 100nF

G3

DDR2_SDWE

K3

VDDQ

G7

C57 100nF

WE

VDDQ

G9

C58 100nF

VDDQ

C59 100nF

B7

J2

DDR2_DQS1

UDQS

VREF

DDR_VREF

A8

UDQS

VSS

A3

C60

E3

DDR2_DQS0

F7

VSS

J3

100nF

LDQS

VSS

E8

N1

LDQS

VSS

P9

VSS

DDR2_DQM1

B3

A7

UDM

VSSQ

DDR2_DQM0

F3

B2

LDM

VSSQ

B8

VSSQ

D2

DDR2 SDRAM

VSSQ

E2

RFU1

D8

VSSQ

F2

A2

VSSQ

E7

R3

RFU2

VSSQ

F8

R7

RFU3

VSSQ

H2

EBI_A15

R8

RFU4

VSSQ

H8

RFU5

VSSQ

J7

VSSDL

16

MN11

29

PD3 R40

0R

CLE

NAND_FSH_D0

CLE

I/O0

PD2 R43

0R

ALE

17

30

NAND_FSH_D1

PD0 R44

0R

RE

8

ALE

I/O1

31

NAND_FSH_D2

PD1 R41

0R

WE

18

RE

I/O2

32

NAND_FSH_D3

CE

9

WE

I/O3

41

NAND_FSH_D4

R46

470K

CE

I/O4

42

NAND_FSH_D5

PD5 R42

0R

RB

7

I/O5

43

NAND_FSH_D6

R47

470K

R/B

I/O6

44

NAND_FSH_D7

R48

470K

WP

19

I/O7

26

WP

I/O8_N.C

27

I/O9_N.C

28

1

I/O10_N.C

33

2

N.C1

I/O11_N.C

40

NAND FLASH

R49

3

N.C2

I/O12_N.C

45

DNP

5

N.C4

I/O14_N.C

47

4

N.C3

I/O13_N.C

46

N.C5

I/O15_N.C

6

N.C6

VDDNF

10

11

N.C7

12

14

N.C8

VCC

37

15

N.C9

VCC

34

20

N.C10

VCC_N.C

39

23

N.C11

VCC_N.C

C65

C66

24

N.C12

100nF

100nF

NANDOE

35

N.C13

13

21

N.C14

VSS

36

NANDWE

22

DNU1

VSS

25

NANDALE

38

DNU2

VSS_N.C

48

NANDCLE

DNU3

VSS_N.C

NANDCS

MT29F2G08AAD

NANDR_B

<![if ! IE]>

<![endif]>Memory External Board CM .4-4 Figure

<![if ! IE]>

<![endif]>Hardware Kit Evaluation

Evaluation Kit Hardware

4.2.3.6Serial Peripheral Interface (SPI) Controller

The serial processor provides two high-speed Serial Peripheral Interface (SPI) controllers. One port is used to interface with the on-board serial DataFlash®.

Figure 4-5. SPI

PA14

2

						VDDIOP0
						R56
						470K	MN7
									VDDIOP0
							AT25DF321
		PA12	(SPI0_MOSI)	R57	0R	5		8
		PA11	(SPI0_MIS0)	R58	0R	2	SI	VCC
SW1B		PA13	(SPI0_SPCK) R59		0R	6	SO	3	C69
SWITCH-2-1.27mm							SCK	WP 7	100nF
<![if ! IE]> <![endif]>2	<![if ! IE]> <![endif]>ON	3	(SPI0_NPCS0)			1	CS	HOLD
								4
								GND

4.2.3.7Two Wire Interface (TWI)

The serial processor has a full speed (400 kHz) master/slave TWI Serial Controller. The controller is mostly compatible with industry standard I2C and SMBus Interfaces. This port is used to interface with the on-board Serial EEPROM, ISI, QTouch device and audio codec interface.

Figure 4-6. TWI

VDDIOP0	VDDIOP0	VDDIOP0
R61	R62	R63
4.7K	4.7K	10K
		MN8

AT24C512BN-SH25-B

PA31	(TWCKO)	6	SCL	A0	1
PA30	(TWDO)	5			2
			SDA	A1	3
	VDDIOP0	8	VCC	A3	R64
	C70				DNP
		4			7
	100nF		GND	WP

4.2.3.81-Wire EEPROM

The Evaluation Kit uses a 1-Wire device as “firmware label” to store the information such as chip type, manufacturer’s name, production date etc.

Figure 4-7. 1-Wire Device

			VDDANA
			R65
			1.5K
			MN9
			DS2431P+		3
				NC1
PB18	R66	0R	2		4
			IO	NC2	5
				GNDNC4	6
				NC3
				<![if ! IE]> <![endif]>1

4-10	Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

4.2.3.9Optional PHY

Some of the device modules provide a location for a 10/100 Ethernet MAC/PHY interface.

For more information about the Ethernet controller device, refer to the Davicom DM9161 controller manufacturer's datasheet.

Evaluation Kit (EK) User Guide

4-11

11115A–ATARM–27-Jul-11

	<![if ! IE]> <![endif]>Ethernet
<![if ! IE]> <![endif]>Hardware	<![if ! IE]> <![endif]>Figure 4-8.
<![if ! IE]> <![endif]>Evaluation Kit

VDDANA

R70

10K

		DNP to remain
		single PHY
		connection on
		EK board
PB[0..18]
PB4	E0_TXCK	R73	22R
PB10	E0_TX1	2	RR13B	7
PB9	E0_TX0	3	RR13C	6
PB7	E0_TXEN	4	RR13D	5
PB1	E0_RX1	3	RR14C	6
PB0	E0_RX0	4	RR14D	5
PB3	E0_RXDV	2	RR15B	7
PB2	E0_RXER	3	RR15C	6
PB6	E0_MDC	1	RR14A	8
PB5	E0_MDIO	2	RR14B	7
PB8	E0_INTR	1	RR15A	8

<![if ! IE]> <![endif]>8 7 6 5	<![if ! IE]> <![endif]>8
<![if ! IE]> <![endif]>1 2 3 4	<![if ! IE]> <![endif]>1
RR7
10KX4

VDDANA

NRST

1

2

<![if ! IE]>

<![endif]>2 7 3 6 4 5

RR8

10KX4

Y3		4
OE	VDD
50MHz		3						C71
VSS	OUT							100nF

					R74	22R	42	MN10
								REF_CLK/XT2		XT1
							17	TXD3
							18
							19	TXD2
							20	TXD1		TX+
							21	TXD0
					TP27		22	TX_EN
					SMD			TX_CLK/ISOLATE		TX-
							26
								RXD3/PHYAD3
							27
							28	RXD2/PHYAD2
							29	RXD1/PHYAD1		RX+
								RXD0/PHYAD0
							34	RX_CLK/10BTSER
							37
								RX_DV/TESTMODE		RX-
							16	TX_ER/TXD4
							38
								RX_ER/RXD4/RPTR
							36	COL/RMII		AVDDR
							35
				VDDANA	R86	1.5K		CRS/PHYAD4		AVDDR
							24
								MDC
							25		DM9161AEP
							32	MDIO		AVDDT
								MDINTR
							39	DISMDIX		AGND
<![if ! IE]> <![endif]>DNP	<![if ! IE]> <![endif]>4.7K	<![if ! IE]> <![endif]>10K	<![if ! IE]> <![endif]>10K	<![if ! IE]> <![endif]>DNP		VDDANA				AGND
										AGND
					C79	100nF	41	DVDD		BGRESG
<![if ! IE]> <![endif]>R91	<![if ! IE]> <![endif]>R92	<![if ! IE]> <![endif]>R93	<![if ! IE]> <![endif]>R94	<![if ! IE]> <![endif]>R95	C80	100nF	30	DVDD
					C81	100nF	23	DVDD
										BGRES
							15
							33	DGND		LEDMODE
							44	DGND		LED0/OP0
								DGND		LED1/OP1
					R99	0R	10	PWRDWN		LED2/OP2
									CABLESTS/LINKSTS
							40	RESET		N.C
							VDDANA

43

7

8

3

4

1

C73

100nF

2

C74

100nF

9	AVDDT
	C77	100nF

5

6

46

47

R96

0R

R97

6.8K

48

31

11

12

13

14

45

+ C82

10uF

R100

0R

GND_ETH

		C72	100nF	GND_ETH
		R71	R72
		49.9R 1%	49.9R 1%
				ETH0_TX+
				ETH0_TX-
				ETH0_RX+
B1	AVDDT			ETH0_RX-
		TP28
BLM21BD222TN1		SMD
		R83	R84
+ C75	+ C76	49.9R 1%	49.9R 1%
10uF	10uF
			C78
			100nF
VDDANA
<![if ! IE]> <![endif]>8 7 6 5	GND_ETH	GND_ETH
R98	RR9
10K	10KX4
<![if ! IE]> <![endif]>1 2 3 4
				LED0
				LED1
				LED2

<![if ! IE]>

<![endif]>Evaluation Kit (EK) User Guide

<![if ! IE]> <![endif]>4-12

<![if ! IE]> <![endif]>11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

4.2.3.10 SODIMM200 Interface

The CM board uses SODIMM200 card edge connector to interface with the EK board.

Figure 4-9.	SODIMM200 Interface on CM Board
				+3V3				VDDBU
				C83			+3V3		C84
				10uF	J1		2		1uF
				1	VCC_3V3	VCC_3V3
				3			4
				5	VCC_3V3	VCC_3V3	6
	HHSDPC			7	GND	VBAT	8			JTAGSEL
				9	USBC_DP	JTAGSEL	10
	HHSDMC			11	USBC_DM	WKUP	12			WKUP
				13	GND	SHDN	14			SHDN
	HHSDMB			15	USBB_DM	BMS	16			BMS
	HHSDPB			17	USBB_DP	nRST	18			NRST
				19	GND	nTRST	20			NTRST
	DIBP			21	DIBP	TDI	22			TDI
	DIBN			23	DIBN	TCK	24			TCK
				25	GND	TMS	26			TMS
	HHSDMA			27	USBA_DM	TDO	28			TDO
	HHSDPA			29	USBA_DP	RTCK	30			RTCK
				31	GND	PWR_EN	32			PWR_EN
				33	RFU1	RFU2	34
				35	RFU3	RFU4	36
				37	RFU5	RFU6	38
				39	RFU7	RFU8	40
					RFU9	RFU10		VDDNF
				41			42
					GND	GND
				43			44
				45	RFU11	RFU12	46
				47	RFU13	RFU14	48
			VDDNF	49	RFU15	RFU16	50		C85
				51	RFU17	RFU18	52		4.7uF
				53	GND	GND	54
				55	RFU19	RFU20	56
				57	RFU21	RFU22	58
				59	RFU23	RFU24	60
				61	RFU25	RFU26	62
	NANDOE			63	VDDNF	VDDNF	64			NANDWE
				65	PD0	PD1	66
	NANDALE			67	PD2	PD3	68		PD5	NANDCLE
	NANDCS			69	PD4	PD5	70		PD7
	NANDR_B	PD8		71	PD6	PD7	72		PD9
				73	PD8	PD9	74
		PD10		75	NC	GND	76		PD11
		PD12		77	PD10	PD11	78		PD13
		PD14		79	PD12	PD13	80		PD15
		PD16		81	PD14	PD15	82		PD17
		PD18		83	PD16	PD17	84		PD19
VDDIOP0		PD20		85	PD18	PD19	86		PD21	VDDIOP0
				87	PD20	PD21	88
		PA0		89	VDDIOP0	VDDIOP0	90		PA1
		PA2		91	PA0	PA1	92		PA3
		PA4		93	PA2	PA3	94			C86
		PA11		95	PA4	GND	96		PA12	4.7uF
		PA13		97	PA11	PA12	98		PA14
				99	PA13	PA14	100		PA7
		PA8		101	GND	PA7	102		PA21
		PA22		103	PA8	PA21	104		PA23
		PA31		105	PA22	PA23	106		PA30
				107	PA31	PA30	108		PA15
		PA16		109	GND	PA15	110		PA17
		PA18		111	PA16	PA17	112		PA19
		PA20		113	PA18	PA19	114
		PA5		115	PA20	GND	116		PA6
		PA10		117	PA5	PA6	118		PA9
				119	PA10	PA9	120		PA24
		PA25		121	GND	PA24	122		PA26
		PA27		123	PA25	PA26	124		PA28
VDDIOP1		PA29		125	PA27	PA28	126			VDDIOP1
				127	PA29	GND	128
		PC0		129	VDDIOP1	VDDIOP1	130		PC1
		PC2		131	PC0	PC1	132		PC3
		PC4		133	PC2	PC3	134		PC5	C87
		PC7		135	PC4	PC5	136		PC6	4.7uF
				137	GND	PC6	138		PC8
		PC9		139	PC7	PC8	140		PC10
		PC11		141	PC9	PC10	142
		PC12		143	PC11	GND	144		PC13
		PC14		145	PC12	PC13	146		PC15
				147	PC14	PC15	148		PC16
		PC17		149	GND	PC16	150		PC18		+3V3
		PC19		151	PC17	PC18	152		PC20
		PC21		153	PC19	PC20	154
		PC22		155	PC21	GND	156		PC23
		PC24		157	PC22	PC23	158		PC25		R101
		PC26		159	PC24	PC25	160		PC27
				161	PC26	PC27	162		PC28		DNP
		PC29		163	GND	PC28	164		PC30
		PC31		165	PC29	PC30	166
			VDDANA	167	PC31	SELCONFIG0	168	VDDANA
		PB0		169	VDDANA	VDDANA	170		PB1
		PB2		171	PB0	PB1	172		PB3		R102
		PB4		173	PB2	PB3	174		PB5	ADVREF
											0R
		PB6		175	PB4	PB5	176		PB7
		PB8		177	PB6	PB7	178
		PB9		179	PB8	GNDANA	180		PB10
		PB11		181	PB9	PB10	182		PB12	C88
		PB13		183	PB11	PB12	184		PB14	1uF
		PB15		185	PB13	PB14	186		PB16
		PB17		187	PB15	PB16	188
		PB18		189	PB17	GNDANA	190				R101 only if G15, G35, X35
				191	PB18	ADVREF	192			LED0
				193	GND	LED0	194				R102 only if G25, X25
	ETH0_TX+			195	ETH0_TX+	LED1	196			LED1
	ETH0_TX-			197	ETH0_TX-	LED2	198		AVDDT	LED2
	ETH0_RX+			199	ETH0_RX+	AVDDT	200
	ETH0_RX-				ETH0_RX-	GND_ETH
					PIO 200-pin SODIMM
								GND_ETH

Evaluation Kit (EK) User Guide

4-13

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

4.2.4Configuration

4.2.4.1Chip Identification

The CM board may be equipped with any of the five processors, all sharing an identical BGA217 footprint. There are two resistors on the CM board for the purpose of identifying which of the five is the one actually mounted.

The tables below show in detail how the CM board, relative to different processors, determines the dedicated “SELCONFIG” logic.

Table 4-5. Resistor Identification

Resistor	SAM9G15	SAM9G25	SAM9G35	SAM9X25	SAM9X35
R49				Populated	Not Populated
R50				Not Populated	Populated
R87	Populated		Populated
R88	Not Populated		Not Populated
R101	Populated	Not Populated	Populated	Not Populated	Populated
R102	Not Populated	Populated	Not Populated	Populated	Not Populated

Table 4-6. Module Configuration Identification

			SAM9G15	SAM9G35	SAM9X35	SAM9G25	SAM9X25
			module	module	module	module	module
		R101	Populated	Populated	Populated	Not Populated	Not Populated
	CM	R102	Not Populated	Not Populated	Not Populated	Populated	Populated
		SELCONFIG
	Setting
		(SODIMM200	High	High	High	Low	Low
		pin 166)
	EK	USART3	Not Selected	Not Selected	Not Selected	Selected	Selected
	Setting	ETH1	Not Selected	Not Selected	Not Selected	Not Selected	Selected
	DM	LCD	Selected	Selected	Selected	Not Selected	Not Selected
	Setting

4-14	Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

4.2.4.2Boot Configuration

In order to use SAM-BA boot, the NAND Flash and SPI DataFlash must be deselected. SW1 is dedicated to this purpose.

Table 4-7. Boot Configuration

Designation	Default Setting	Feature
SW1 (1, 4)	ON	Set to OFF disables the NAND flash
SW1 (2, 3)	ON	Set to OFF disables the SPI DataFlash

4.2.5Connectors

Figure 4-10. CM Board Dimensions

Evaluation Kit (EK) User Guide

4-15

11115A–ATARM–27-Jul-11

<![if ! IE]> <![endif]>11-Jul-27–ATARM–11115A

<![if ! IE]> <![endif]>16-4

<![if ! IE]>

<![endif]>Guide User (EK) Kit Evaluation

5

4

D

{5} PWR_EN

{5}	HHSDMA
{5}	HHSDPA

C

{5} BMS

B

{5}	HHSDMB
{5}	HHSDPB
{5}	HHSDMC
{5}	HHSDPC
{5}	DIBN
{5}	DIBP

A

+3V3	MN1					VDDIOM
	AS1301EHT-adj			L1
	4		LX	3		TP2
	IN			2.2uH 3D16		SMD
	C1			C9	R1	C2
					118K 1%
	4.7uF	<![if ! IE]> <![endif]>GND		22pF		10uF
	EN		FB	5
	1					+3V3

	<![if ! IE]> <![endif]>2			R3
				59K 1%
				R6
				DNP
	PWR_EN
			MN2G
R7	39R	T15	SAM9x5_LBGA217 - INTERFACE
			HFSDMA
R8	39R	T14		T12
			HFSDPA	XIN
		U15	HHSDMA
		U14
			HHSDPA	U12
				XOUT

		B7
		TST
		A6
		XIN32
		A5
VDDIOP0		XOUT32
R11	100K	P9
		BMS
		U17
		VBG

	R16	C31
	6.8K	10pF
				JTAGSEL	D7
				NTRST	T11
					T9
				TDI	U11
				TMS	U10
				TCK	R10
				RTCK	T10
				TDO
R19	39R	P16	HFSDMB	NRST	P10
R20	39R	R16
			HFSDPB
		P17	HHSDMB
		R17
			HHSDPB
				WKUP	A7
R23	27R	M17	HFSDMC
R24	27R	L17
			HFSDPC

R11

DIBN

P11

DIBP

D8

SHDN

+3V3

TP14

SMD

+1V

TP17

SMD

VDDANA

TP20

SMD

5

4

3

2

TP1

SMD

+3V3

MN3

VDDCORE

4

AS1301EHT-adj

3

L2

IN

LX

2.2uH

3D16

R2

C6

C7

C8

C10

C11

C12

C3

100nF

100nF

100nF

4.7uF

<![if ! IE]> <![endif]>GND

22pF

39.2K 1%

10uF

4.7uF

1

EN

FB

5

<![if ! IE]> <![endif]>2

R4

VDDIOM

59K 1%

C13

C14

C15

100nF

100nF

100nF

+3V3

B2

VDDNF

1

2

MN4

120 OHM@100MHZ

C4

C5

+3V3

TPS71710DCK

+1V

100nF

100nF

1

IN

5

OUT

<![if ! IE]> <![endif]>GND

C16

PWR_EN 3

EN

NR 4

1uF

VDDIOP0

C17

C18

C19

20pF

<![if ! IE]> <![endif]>2

1uF

10nF

<![if ! IE]> <![endif]>1

<![if ! IE]> <![endif]>2

C20

C21

VDDIOP1

Y1

100nF

100nF

12MHz

C23

<![if ! IE]> <![endif]>4

<![if ! IE]> <![endif]>3

100nF

C22

20pF

VDDANA

L3

C24

20pF

C27

10uH/150mA

R10

C25

C26

<![if ! IE]> <![endif]>1

100nF

100nF

100nF

1R

Y2

32.768 kHz

C28

<![if ! IE]> <![endif]>2

C29

20pF

4.7uF

+1V

C30

VDDBU

VDDIOP0

L4

100nF

+1V

10uH/150mA

R12	R13	R14	R15
DNP	100K	100K	100K	R17
			C32
			100nF

				JTAGSEL	{5}	1R	C33
							100nF
	NTRST			NTRST	{5}	C34
	TDI					4.7uF
				TDI	{5}
	TMS
				TMS	{5}
	TCK
				TCK	{5}
	RTCK			RTCK	{5}
	TDO			TDO	{5}		ADVREF
						TP7
R18	100K
		VDDIOP0				SMD	C35
	NRST
		NRST	{4,5}
							100nF
	VDDBU						TP11
						VDDBU	SMD
	R21			+3V3		L5
						10uH/150mA
	100K
						C36	C37
				C38		1uF	100nF
	WKUP	WKUP	{5}			R22
				100nF
						1R
						C39	C40
						4.7uF
							100nF
				+3V3		L6
	SHDN					10uH/150mA
		SHDN	{5}
				C41		R25	C42
				100nF			100nF
						1R
		VDDIOP0				C43
TP15				TP16		4.7uF
SMD		VDDIOP1		SMD
TP18				TP19
SMD		VDDNF		SMD
TP21				TP22
SMD				SMD
				3		2

1

	MN2A
H14	SAM9X5_LBGA217 - POWER			H8
	VDDCORE		GNDCORE
K8				J8
K9	VDDCORE		GNDCORE	K10
	VDDCORE		GNDCORE
						D
D10	VDDIOM
D13				H9
F14	VDDIOM		GNDIOM	H10
	VDDIOM		GNDIOM	J9
			GNDIOM	J10
			GNDIOM
J14	VDDNF
K14
	VDDNF
			GNDIOP	M4
P7				P6
	VDDIOP0		GNDIOP
H4	VDDIOP1		GNDANA	D6
						C
C6	VDDANA		GNDUTMI	T16
T17	VDDUTMIC
R12	VDDPLLA
					NTRST	TP3
						SMD
					TDI	TP4
						SMD
					TMS	TP5
						SMD
					TCK	TP6
						SMD
						B
A4	ADVREF				RTCK	TP8
						SMD
			GNDBU	B6	TDO	TP9
						SMD
					NRST	TP10
						SMD
B5					WKUP	TP12
	VDDBU					SMD
					SHDN	TP13
				U13		SMD
			GNDOSC
U16	VDDUTMII
T13	VDDOSC
						A
				Title:
				MBC-SAM9X5
	Size:	Document Number:				Rev:
	A3		AT91SAM9G45-I&POWER			A
	Draw By:	Zhu Xueliang Date:		Thursday, November 04, 2010		Sheet: 1 of 5
				1

<![if ! IE]> <![endif]>Schematics Board CM .11-4 Figure	<![if ! IE]> <![endif]>Schematics 6.2.4	<![if ! IE]> <![endif]>Hardware Kit Evaluation
<![if ! IE]> <![endif]>5 1of –

<![if ! IE]>

<![endif]>Guide User (EK) Kit Evaluation

<![if ! IE]> <![endif]>11-Jul-27–ATARM–11115A

<![if ! IE]> <![endif]>17-4

5

4

3

MN2F

SAM9x5_LBGA217 - EBI

D14

EBI_D0

D0

D15

EBI_D1

D1

A16

EBI_D2

D2

B16

EBI_D3

D3

A17

EBI_D4

EBI_D0

2

RR1B

7

DDR2_D0

D4

B15

EBI_D5

EBI_D1

1

RR1A

8

DDR2_D1

D5

C14

EBI_D6

EBI_D2

3

RR2C

6

DDR2_D2

D

D6

B14

EBI_D7

EBI_D3

4

RR1D

5

DDR2_D3

D7

A15

EBI_D8

EBI_D4

1

RR2A

8

DDR2_D4

D8

C15

EBI_D9

EBI_D5

3

RR1C

6

DDR2_D5

D9

D12

EBI_D10

EBI_D6

2

RR2B

7

DDR2_D6

D10

C13

EBI_D11

EBI_D7

4

RR2D

5

DDR2_D7

D11

A14

EBI_D12

EBI_D8

4

RR3D

5

DDR2_D8

D12

B13

EBI_D13

EBI_D9

2

RR4B

7

DDR2_D9

D13

A13

EBI_D14

EBI_D10

1

RR4A

8

DDR2_D10

D14

C12

EBI_D15

EBI_D11

2

RR3B

7

DDR2_D11

D15

EBI_D12

3

RR3C

6

DDR2_D12

A0/NBS0

J15

EBI_D13

4

RR4D

5

DDR2_D13

H16

EBI_D14

1

RR3A

8

DDR2_D14

A1/NBS2/DQM2/NWR2

H15

EBI_A2

EBI_D15

3

RR4C

6

DDR2_D15

A2

H17

EBI_A3

A3

G17

EBI_A4

A4

G16

EBI_A5

A5

F17

EBI_A6

A6

E17

EBI_A7

A7

F16

EBI_A8

A8

G15

EBI_A9

A9

G14

EBI_A10

A10

F15

EBI_A11

A11

D17

A12

C17

EBI_A13

A13

E16

EBI_A14

A14

D16

EBI_A15

EBI_DQM0

R26

27R

DDR2_DQM0

A15

C16

EBI_A16

EBI_DQM1

R27

27R

DDR2_DQM1

A16/BA0

B17

EBI_A17

EBI_DQS0

R28

27R

DDR2_DQS0

A17/BA1

E15

EBI_A18

EBI_DQS1

R29

27R

DDR2_DQS1

C

A18/BA2

E14

A19

EBI_RAS

R30

27R

DDR2_RAS

A10

DQM0

EBI_DQM0

EBI_CAS

R31

27R

DDR2_CAS

B10

EBI_DQM1

DQM1

A11

EBI_DQS0

EBI_SDWE

R32

27R

DDR2_SDWE

DQS0

A9

EBI_DQS1

EBI_SDCKE

R35

27R

DDR2_SDCKE

DQS1

RAS

B11

EBI_RAS

EBI_SDCK

R36

27R

DDR2_SDCK

C10

EBI_CAS

EBI_NSDCK

R37

27R

DDR2_NSDCK

CAS

SDWE

A12

EBI_SDWE

B12

EBI_SDCKE

EBI_NCS1_SDCS

R38

27R

DDR2_NCS1

SDCKE

C8

EBI_SDA10

SDA10

D11

EBI_SDCK

SDCK

C11

EBI_NSDCK

#SDCK

NCS0

B9

NCS0

B8 EBI_NCS1_SDCS

NCS1/SDCS

NWR0/NWRE

C9

C7

NWR1/NBS1

A8

NWR3/NBS3/DQM3

D9

NCS0

TP24

NRD

SMD

B

SW1A

SWITCH-2-1.27mm

PD4

1

<![if ! IE]> <![endif]>ON

4

<![if ! IE]> <![endif]>1

VDDNF

MN2E

SAM9x5_LBGA217 - PIOD

P13

PD0

(NANDOE)

VDDNF

PD0/NANDOE

R14

PD1

(NANDWE)

PD1/NANDWE

R13

PD2

(NANDALE)

PD2/A21/NANDALE

P15

PD3

(NANDCLE)

PD[5..21] {3,5}

PD3/A22/NANDCLE

P12

PD4

(NANDCS)

PD4/NCS3

P14

PD5

PD5/NWAIT

N14

PD6

PD6/D16

R15

PD7

PD7/D17

M14

PD8

PD8/D18

N16

PD9

PD6

1

RR17A

8

NAND_FSH_D0

PD9/D19

N17

PD10

PD7

2

RR17B

7

NAND_FSH_D1

PD10/D20

N15

PD11

PD8

3

RR17C

6

NAND_FSH_D2

PD11/D21

K15

PD12

PD9

4

RR17D

5

NAND_FSH_D3

PD12/D22

M15

PD13

PD10

1

RR16A

8

NAND_FSH_D4

PD13/D23

L14

PD14

PD11

2

RR16B

7

NAND_FSH_D5

PD14/D24

M16

PD15

PD12

3

RR16C

6

NAND_FSH_D6

PD15/D25/A20

L16

PD16

PD13

4

RR16D

5

NAND_FSH_D7

PD16/D26/A23

L15

PD17

PD17/D27/A24

K17

PD18

A

PD18/D28/A25

J17

PD19

PD19/D29/NCS2

K16

PD20

PD20/D30/NCS4

J16

PD21

PD0

(NANDOE)

R50

0R

NANDOE

{5}

PD21/D31/NCS5

PD1

(NANDWE)

R51

0R

NANDWE

{5}

PD2

(NANDALE)

R52

0R

NANDALE

{5}

PD3

(NANDCLE)

R53

0R

NANDCLE

{5}

PD4

(NANDCS)

R54

0R

NANDCS

{5}

PD6

(NANDR/B)

R55

0R

NANDR_B

{5}

5

4

3

2

1

EBI_A2

M8

MN5

G8

DDR2_D0

A0

DDR2 SDRAM

DQ0

EBI_A3

M3

G2

DDR2_D1

EBI_A4

M7

A1

MT47H64M16HR

DQ1

H7

DDR2_D2

EBI_A5

N2

A2

DQ2

H3

DDR2_D3

EBI_A6

N8

A3

DQ3

H1

DDR2_D4

EBI_A7

N3

A4

DQ4

H9

DDR2_D5

EBI_A8

N7

A5

DQ5

F1

DDR2_D6

EBI_A9

P2

A6

DQ6

F9

DDR2_D7

EBI_A10

P8

A7

DQ7

C8

DDR2_D8

EBI_A11

P3

A8

DQ8

C2

DDR2_D9

EBI_SDA10

M2

A9

DQ9

D7

DDR2_D10

D

A10

DQ10

EBI_A13

P7

D3

DDR2_D11

EBI_A14

R2

A11

DQ11

D1

DDR2_D12

A12

DQ12

D9

DDR2_D13

EBI_A16

L2

DQ13

B1

DDR2_D14

EBI_A17

L3

BA0

DQ14

B9

DDR2_D15

EBI_A18

L1

BA1

DQ15

K9

BA2

A1

VDDIOM

ODT

VDD

C44

100nF

E1

VDD

C45

100nF

J9

VDD

C46

100nF

M9

VDD

C47

100nF

DDR2_SDCKE

K2

R1

CKE

VDD

C48

100nF

DDR2_SDCK

J8

CK

VDDL

J1

C49

100nF

DDR2_NSDCK

K8

CK

A9

DDR2 SDRAM

VDDQ

C50

100nF

C1

DDR2_NCS1

L8

CS

VDDQ

C52

100nF

C7

VDDQ

C3

C51

100nF

VDDQ

C9

C53

100nF

VDDQ

C54

100nF

DDR2_CAS

L7

E9

DDR2_RAS

K7

CAS

VDDQ

G1

C55

100nF

RAS

VDDQ

C56

100nF

G3

DDR2_SDWE

K3

VDDQ

G7

C57

100nF

WE

VDDQ

G9

C58

100nF

VDDIOM

VDDQ

C59

100nF

DDR2_DQS1

B7

UDQS

VREF

J2

DDR_VREF

A8

UDQS

VSS

A3

C

E3

C60

C61

L7

DDR2_DQS0

F7

VSS

J3

100nF

4.7uF

10uH

E8

LDQS

VSS

N1

150mA

LDQS

VSS

P9

VSS

DDR2_DQM1

B3

UDM

VSSQ

A7

DDR2_DQM0

F3

B2

LDM

VSSQ

B8

VSSQ

D2

R33

R34

VSSQ

D8

C62

A2

VSSQ

E7

1R

104

1.5K 1%

E2

RFU1

VSSQ

F2

R3

RFU2

VSSQ

F8

DDR_VREF

TP23

R7

RFU3

VSSQ

H2

SMD

EBI_A15

R8

RFU4

VSSQ

H8

RFU5

VSSQ

J7

C63

C64

R39

VSSDL

4.7uF

104

1.5K 1%

PD3 R40

0R

CLE

16

MN11

29

NAND_FSH_D0

B

CLE

I/O0

PD2 R43

0R

ALE

17

30

NAND_FSH_D1

PD0 R44

0R

RE

8

ALE

I/O1

31

NAND_FSH_D2

PD1 R41

0R

WE

18

RE

I/O2

32

NAND_FSH_D3

CE

9

WE

I/O3

41

NAND_FSH_D4

R46

470K

CE

I/O4

42

NAND_FSH_D5

PD5 R42

0R

RB

7

I/O5

43

NAND_FSH_D6

R47

470K

R/B

I/O6

44

NAND_FSH_D7

R48

470K

WP

19

I/O7

26

WP

I/O8_N.C

27

I/O9_N.C

28

1

I/O10_N.C

33

R49

2

N.C1

I/O11_N.C

40

3

N.C2

I/O12_N.C

45

NAND FLASH

DNP

N.C3

I/O13_N.C

4

46

6

N.C5

I/O15_N.C

47

5

N.C4

I/O14_N.C

10

N.C6

VDDNF

N.C7

11

12

14

N.C8

VCC

37

15

N.C9

VCC

34

20

N.C10

VCC_N.C

39

23

N.C11

VCC_N.C

C65

C66

24

N.C12

100nF

100nF

35

N.C13

13

21

N.C14

VSS

36

22

DNU1

VSS

25

DNU2

VSS_N.C

38

48

DNU3

VSS_N.C

A

MT29F2G08AAD

Title:

MBC-SAM9X5

Size:

Document Number:

Rev:

A3

AT91SAM9G45-II&DDR2&NAND FLASH

A

Draw By:

Zhu Xueliang

Date: Thursday, November 04, 2010

Sheet: 2 of 5

2

1

<![if ! IE]>

<![endif]>5 of 2 – Schematics Board CM .12-4 Figure

<![if ! IE]>

<![endif]>Hardware Kit Evaluation

<![if ! IE]> <![endif]>11-Jul-27–ATARM–11115A

<![if ! IE]> <![endif]>18-4

<![if ! IE]>

<![endif]>Guide User (EK) Kit Evaluation

5

4

3

MN2F

SAM9x5_LBGA217 - EBI

D14

EBI_D0

D0

D15

EBI_D1

D1

A16

EBI_D2

D2

B16

EBI_D3

D3

A17

EBI_D4

EBI_D0

2

RR1B

7

DDR2_D0

D4

B15

EBI_D5

EBI_D1

1

RR1A

8

DDR2_D1

D5

C14

EBI_D6

EBI_D2

3

RR2C

6

DDR2_D2

D

D6

B14

EBI_D7

EBI_D3

4

RR1D

5

DDR2_D3

D7

A15

EBI_D8

EBI_D4

1

RR2A

8

DDR2_D4

D8

C15

EBI_D9

EBI_D5

3

RR1C

6

DDR2_D5

D9

D12

EBI_D10

EBI_D6

2

RR2B

7

DDR2_D6

D10

C13

EBI_D11

EBI_D7

4

RR2D

5

DDR2_D7

D11

A14

EBI_D12

EBI_D8

4

RR3D

5

DDR2_D8

D12

B13

EBI_D13

EBI_D9

2

RR4B

7

DDR2_D9

D13

A13

EBI_D14

EBI_D10

1

RR4A

8

DDR2_D10

D14

C12

EBI_D15

EBI_D11

2

RR3B

7

DDR2_D11

D15

EBI_D12

3

RR3C

6

DDR2_D12

A0/NBS0

J15

EBI_D13

4

RR4D

5

DDR2_D13

H16

EBI_D14

1

RR3A

8

DDR2_D14

A1/NBS2/DQM2/NWR2

H15

EBI_A2

EBI_D15

3

RR4C

6

DDR2_D15

A2

H17

EBI_A3

A3

G17

EBI_A4

A4

G16

EBI_A5

A5

F17

EBI_A6

A6

E17

EBI_A7

A7

F16

EBI_A8

A8

G15

EBI_A9

A9

G14

EBI_A10

A10

F15

EBI_A11

A11

D17

A12

C17

EBI_A13

A13

E16

EBI_A14

A14

D16

EBI_A15

EBI_DQM0

R26

27R

DDR2_DQM0

A15

C16

EBI_A16

EBI_DQM1

R27

27R

DDR2_DQM1

A16/BA0

B17

EBI_A17

EBI_DQS0

R28

27R

DDR2_DQS0

A17/BA1

E15

EBI_A18

EBI_DQS1

R29

27R

DDR2_DQS1

C

A18/BA2

E14

A19

EBI_RAS

R30

27R

DDR2_RAS

A10

DQM0

EBI_DQM0

EBI_CAS

R31

27R

DDR2_CAS

B10

EBI_DQM1

DQM1

A11

EBI_DQS0

EBI_SDWE

R32

27R

DDR2_SDWE

DQS0

A9

EBI_DQS1

EBI_SDCKE

R35

27R

DDR2_SDCKE

DQS1

RAS

B11

EBI_RAS

EBI_SDCK

R36

27R

DDR2_SDCK

C10

EBI_CAS

EBI_NSDCK

R37

27R

DDR2_NSDCK

CAS

SDWE

A12

EBI_SDWE

B12

EBI_SDCKE

EBI_NCS1_SDCS

R38

27R

DDR2_NCS1

SDCKE

C8

EBI_SDA10

SDA10

D11

EBI_SDCK

SDCK

C11

EBI_NSDCK

#SDCK

NCS0

B9

NCS0

B8 EBI_NCS1_SDCS

NCS1/SDCS

NWR0/NWRE

C9

C7

NWR1/NBS1

A8

NWR3/NBS3/DQM3

D9

NCS0

TP24

NRD

SMD

B

SW1A

SWITCH-2-1.27mm

PD4

1

<![if ! IE]> <![endif]>ON

4

<![if ! IE]> <![endif]>1

VDDNF

MN2E

SAM9x5_LBGA217 - PIOD

P13

PD0

(NANDOE)

VDDNF

PD0/NANDOE

R14

PD1

(NANDWE)

PD1/NANDWE

R13

PD2

(NANDALE)

PD2/A21/NANDALE

P15

PD3

(NANDCLE)

PD[5..21] {3,5}

PD3/A22/NANDCLE

P12

PD4

(NANDCS)

PD4/NCS3

P14

PD5

PD5/NWAIT

N14

PD6

PD6/D16

R15

PD7

PD7/D17

M14

PD8

PD8/D18

N16

PD9

PD6

1

RR17A

8

NAND_FSH_D0

PD9/D19

N17

PD10

PD7

2

RR17B

7

NAND_FSH_D1

PD10/D20

N15

PD11

PD8

3

RR17C

6

NAND_FSH_D2

PD11/D21

K15

PD12

PD9

4

RR17D

5

NAND_FSH_D3

PD12/D22

M15

PD13

PD10

1

RR16A

8

NAND_FSH_D4

PD13/D23

L14

PD14

PD11

2

RR16B

7

NAND_FSH_D5

PD14/D24

M16

PD15

PD12

3

RR16C

6

NAND_FSH_D6

PD15/D25/A20

L16

PD16

PD13

4

RR16D

5

NAND_FSH_D7

PD16/D26/A23

L15

PD17

PD17/D27/A24

K17

PD18

A

PD18/D28/A25

J17

PD19

PD19/D29/NCS2

K16

PD20

PD20/D30/NCS4

J16

PD21

PD0

(NANDOE)

R50

0R

NANDOE

{5}

PD21/D31/NCS5

PD1

(NANDWE)

R51

0R

NANDWE

{5}

PD2

(NANDALE)

R52

0R

NANDALE

{5}

PD3

(NANDCLE)

R53

0R

NANDCLE

{5}

PD4

(NANDCS)

R54

0R

NANDCS

{5}

PD6

(NANDR/B)

R55

0R

NANDR_B

{5}

5

4

3

2

1

EBI_A2

M8

MN5

G8

DDR2_D0

A0

DDR2 SDRAM

DQ0

EBI_A3

M3

G2

DDR2_D1

EBI_A4

M7

A1

MT47H64M16HR

DQ1

H7

DDR2_D2

EBI_A5

N2

A2

DQ2

H3

DDR2_D3

EBI_A6

N8

A3

DQ3

H1

DDR2_D4

EBI_A7

N3

A4

DQ4

H9

DDR2_D5

EBI_A8

N7

A5

DQ5

F1

DDR2_D6

EBI_A9

P2

A6

DQ6

F9

DDR2_D7

EBI_A10

P8

A7

DQ7

C8

DDR2_D8

EBI_A11

P3

A8

DQ8

C2

DDR2_D9

EBI_SDA10

M2

A9

DQ9

D7

DDR2_D10

D

EBI_A13

P7

A10

DQ10

D3

DDR2_D11

EBI_A14

R2

A11

DQ11

D1

DDR2_D12

A12

DQ12

D9

DDR2_D13

EBI_A16

L2

DQ13

B1

DDR2_D14

EBI_A17

L3

BA0

DQ14

B9

DDR2_D15

EBI_A18

L1

BA1

DQ15

BA2

VDDIOM

K9

A1

ODT

VDD

C44

100nF

E1

VDD

C45

100nF

J9

VDD

C46

100nF

M9

VDD

C47

100nF

DDR2_SDCKE

K2

R1

CKE

VDD

C48

100nF

DDR2_SDCK

J8

CK

VDDL

J1

C49

100nF

DDR2_NSDCK

K8

CK

A9

DDR2 SDRAM

VDDQ

C50

100nF

C1

DDR2_NCS1

L8

CS

VDDQ

C7

C52

100nF

VDDQ

C3

C51

100nF

VDDQ

C9

C53

100nF

VDDQ

C54

100nF

DDR2_CAS

L7

E9

CAS

VDDQ

C55

100nF

DDR2_RAS

K7

G1

RAS

VDDQ

C56

100nF

G3

DDR2_SDWE

K3

VDDQ

G7

C57

100nF

WE

VDDQ

G9

C58

100nF

VDDIOM

VDDQ

C59

100nF

DDR2_DQS1

B7

UDQS

VREF

J2

DDR_VREF

A8

UDQS

VSS

A3

C

E3

C60

C61

L7

DDR2_DQS0

F7

VSS

J3

100nF

4.7uF

10uH

E8

LDQS

VSS

N1

150mA

LDQS

VSS

P9

VSS

DDR2_DQM1

B3

UDM

VSSQ

A7

DDR2_DQM0

F3

B2

LDM

VSSQ

B8

VSSQ

D2

R33

R34

VSSQ

D8

C62

VSSQ

1R

1.5K 1%

A2

E7

104

E2

RFU1

VSSQ

F2

R3

RFU2

VSSQ

F8

DDR_VREF

TP23

R7

RFU3

VSSQ

H2

SMD

EBI_A15

R8

RFU4

VSSQ

H8

RFU5

VSSQ

J7

C63

C64

R39

VSSDL

4.7uF

104

1.5K 1%

PD3 R40

0R

CLE

16

MN11

29

NAND_FSH_D0

B

CLE

I/O0

PD2 R43

0R

ALE

17

30

NAND_FSH_D1

PD0 R44

0R

RE

8

ALE

I/O1

31

NAND_FSH_D2

PD1 R41

0R

WE

18

RE

I/O2

32

NAND_FSH_D3

CE

9

WE

I/O3

41

NAND_FSH_D4

R46

470K

CE

I/O4

42

NAND_FSH_D5

PD5 R42

0R

RB

7

I/O5

43

NAND_FSH_D6

R47

470K

R/B

I/O6

44

NAND_FSH_D7

R48

470K

WP

19

I/O7

26

WP

I/O8_N.C

27

I/O9_N.C

28

1

I/O10_N.C

33

N.C1

I/O11_N.C

R49

2

40

3

N.C2

I/O12_N.C

45

NAND FLASH

DNP

4

N.C3

I/O13_N.C

46

6

N.C5

I/O15_N.C

47

5

N.C4

I/O14_N.C

10

N.C6

VDDNF

11

N.C7

12

14

N.C8

VCC

37

15

N.C9

VCC

34

20

N.C10

VCC_N.C

39

23

N.C11

VCC_N.C

C65

C66

24

N.C12

100nF

100nF

35

N.C13

13

21

N.C14

VSS

36

22

DNU1

VSS

25

38

DNU2

VSS_N.C

48

DNU3

VSS_N.C

A

MT29F2G08AAD

Title:

MBC-SAM9X5

Size:

Document Number:

Rev:

A3

AT91SAM9G45-II&DDR2&NAND FLASH

A

Draw By:

Zhu Xueliang

Date: Thursday, November 04, 2010

Sheet: 2 of 5

2

1

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