CRS08
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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS08
CRS08
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
· Forward voltage: V
· Average forward current: I
· Repetitive peak reverse voltage: V
· Suitable for compact assembly due to small surface-mount package
TM
“S−FLAT
” (Toshiba package name)
Maximum Ratings
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V
Average forward current I
Peak one cycle surge forward current
(non-repetitive)
Junction temperature Tj -40~125 °C
Storage temperature T
= 0.36 V (max)
FM
F (AV)
(Ta ==== 25°C)
= 1.5 A
RRM
F (AV)
I
FSM
= 30 V
RRM
30 (50 Hz) A
stg
30 V
1.5 (Note) A
-40~150 °C
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 3-2A1A
Note: Tℓ = 86°C: Rectangular waveform (a = 180°C), VR = 15 V
Weight: 0.013 g (typ.)
Electrical Characteristics
Characteristics Symbol Test Condition Min Typ. Max Unit
Peak forward voltage
Repetitive peak reverse current
Junction capacitance Cj VR = 10 V, f = 1.0 MHz ¾ 90 ¾ pF
Thermal resistance (junction to ambient) R
Thermal resistance (junction to lead) R
(Ta ==== 25°C)
V
IFM = 0.1 A ¾ 0.23 ¾
FM (1)
V
IFM = 1.0 A ¾ 0.32 ¾
FM (2)
IFM = 1.5 A ¾ 0.345 0.36
V
FM (3)
I
V
RRM (1)
V
I
RRM (2)
th (j-a)
¾ ¾ ¾ 20 °C/W
th (j-ℓ)
= 5 V ¾ 50 ¾ mA
RRM
= 30 V ¾ ¾ 1.0 mA
RRM
Device mounted on a ceramic board
(soldering land: 2 mm ´ 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm ´ 6 mm)
¾ ¾ 70
¾ ¾ 140
°C/W
V
1
2003-02-17
CRS08
y
Marking Following Indicates the Date of
Manufacture
1 2 3 4
Type Code
Lot No.
0
S8
Cathode mark
Month of
manufacture
Year of
manufacture
January to December
are denoted by letter A
to L respectivel
Last decimal digit of
the year of
manufacture
.
5 6 7 8 9
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier
products. This current leakage and improper operating temperature or voltage may cause thermal runaway.
Please take forward and reverse loss into consideration when you design.
2
2003-02-17
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