Loading...
HCD-LX5/LX6/LX30/LX50
SERVICE MANUAL
US Model
HCD-LX30/LX50
HCD-LX5/LX6/LX30/LX50 are the
Amplifier, CD player, Tape Deck and Tuner section in LBT-LX5/LX6/LX30/LX50.
Canadian Model
HCD-LX50
AEP Model
UK Model
HCD-LX5
E Model
Australian Model
HCD-LX6
Photo: HCD-LX50
Dolby noise reduction manufactured under license from Dolby Laboratories Licensing Corporation. “DOLBY” and the double-D symbol; are trademarks of Dolby Laboratories Licensing Corporation.
|
Model Name Using Similar Mechanism |
HCD-D290/G3300/XB3 |
|
|
|
|
|
CD |
CD Mechanism Type |
CDM37M-5BD32L |
|
|
|
||
Base Unit Name |
BU-5BD32L |
||
Section |
|||
|
Optical Pick-up Name |
KSS-213D/Q-NP |
|
|
|
|
|
TAPE |
Model Name Using Similar Mechanism |
HCD-DR4 |
|
|
|
||
Section |
Tape Transport Mechanism Type |
TCM-230PWR1 |
|
|
|
|
SPECIFICATIONS
next page –
COMPACT Hi-Fi STEREO SYSTEM
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
2
|
TABLE OF CONTENTS |
|
1. |
SERVICING NOTES ............................................... |
3 |
2. |
GENERAL |
|
|
Location of Controls ....................................................... |
4 |
|
Setting the Time .............................................................. |
6 |
3. |
DISASSEMBLY ......................................................... |
7 |
4.DIAGRAMS
4-1. Note for Printed Wiring Boards and |
|
|
|
Schematic Diagrams ....................................................... |
11 |
4-2. Printed Wiring Board – BD Board – .............................. |
12 |
|
4-3. |
Schematic Diagram – BD Board – ................................ |
13 |
4-4. |
Printed Wiring Boards – CD MOTOR Section – .......... |
14 |
4-5. |
Schematic Diagram – CD MOTOR Section – .............. |
15 |
4-6. |
Printed Wiring Board – AUDIO Board – ...................... |
16 |
4-7. |
Schematic Diagram – AUDIO Board – ......................... |
17 |
4-8. |
Printed Wiring Board – LEAF SW Board – .................. |
18 |
4-9. |
Schematic Diagram – LEAF SW Board – ..................... |
18 |
4-10. |
Printed Wiring Board – MAIN Board – ........................ |
19 |
4-11. Schematic Diagram – MAIN Board (1/3) – .................. |
20 |
|
4-12. |
Schematic Diagram – MAIN Board (2/3) – .................. |
21 |
4-13. |
Schematic Diagram – MAIN Board (3/3) – .................. |
22 |
4-14. |
Printed Wiring Board – PANEL FL Board – ................. |
24 |
4-15. |
Schematic Diagram – PANEL FL Board – .................... |
25 |
4-16. |
Printed Wiring Board – PANEL VR Board – ................ |
26 |
4-17. |
Schematic Diagram – PANEL VR Board – ................... |
27 |
4-18. |
Printed Wiring Boards – TC-A/TC-B/CD-L/ |
|
|
CD-L2/CD-R/CD-R2 Boards – ...................................... |
28 |
4-19. |
Schematic Diagram – TC-A/TC-B/CD-L/ |
|
|
CD-L2/CD-R/CD-R2 Boards – ...................................... |
29 |
4-20. |
Printed Wiring Boards – FRONT INPUT/ |
|
|
HEADPHONE/MIC Boards – ........................................ |
30 |
4-21. |
Schematic Diagram – FRONT INPUT/ |
|
|
HEADPHONE/MIC Boards – ........................................ |
31 |
4-22. Printed Wiring Board – PA Board – .............................. |
32 |
|
4-23. Schematic Diagram – PA Board – ................................. |
33 |
|
4-24. |
Printed Wiring Boards – TRANS/SUB TRANS |
|
|
(LX5/LX30/LX50) Boards – .......................................... |
34 |
4-25. |
Schematic Diagram – TRANS/SUB TRANS |
|
|
(LX5/LX30/LX50) Boards – .......................................... |
35 |
5. |
EXPLODED VIEWS ................................................ |
38 |
6. |
ELECTRICAL PARTS LIST ............................... |
46 |
SECTION 1
SERVICING NOTES
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.
1.A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.
2.A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.
3.Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate lowvoltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A)
To Exposed Metal
Parts on Set
|
|
|
|
|
AC |
0.15 µ F |
|
|
|
1.5 kΩ |
voltmeter |
|
|
|
|
|
(0.75 V) |
|
|
|
|
|
|
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
3
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.
Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
The following caution label is located inside the unit.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.
The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C during repairing.
•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
SECTION 2
GENERAL
LOCATION OF CONTROLS
– Front Panel –
2 3 4
1
wf wd
ws wa w; ql
qk
qj
qh qg qf
– Rear Panel –
2
1
9
8
7
6
5
43
5
6
7
8
9
0
qa qs
qd
4
1 |
?/1 (POWER) button |
|
|
2 |
DAILY button |
|
|
|
REC button |
|
|
|
SLEEP button |
|
|
|
c/CLOCK SET button |
|
|
3 |
Display |
|
|
4 |
SYNC EQ button |
|
|
|
SYNC BASS button |
|
|
|
SURROUND button |
|
|
|
MIX GUITAR/KARAOKE button |
|
|
5 |
FUNCTION button |
|
|
6 |
v/B/V/b button |
|
|
7 |
VOLUME control |
|
|
8 |
DECK B |
|
|
9 |
PHONES jack |
|
|
0 |
DECK B operating button |
|
|
|
g button |
G button |
x button |
|
m button |
M button |
X button |
|
z REC button |
HI SPEED DUB button |
|
|
CD SYNC button |
|
|
qa .AMS > control |
|
||
qs |
CD operating button |
|
|
|
G X button |
x button |
m button |
|
M button |
DISC SKIP button |
|
qd VIDEO 2 INPUT jack |
|
||
qf |
PLAY MODE button |
|
|
|
REPEAT button |
|
|
qg |
ZA EJECT |
|
|
|
Z B EJECT |
|
|
1 DJ MIX jack
2 ANTENNA terminal
3 REAR SURROUND SPEAKER terminal (LX50 only)
4 FRONT SPEAKER terminal
5 CD DIGITAL OUT terminal
6 VIDEO OUT jack
7 VIDEO 1 jack
8 MD IN/OUT jack
9 PHONO IN jack
qh |
DISC1-5 button |
|
|
qj |
LOOP button |
|
|
|
FLASH button |
|
|
|
NON-STOP button |
|
|
|
EDIT button |
|
|
qk DECK A operating button |
|
||
|
g button |
G button |
x button |
|
m button |
M button |
|
DIRECTION button DOLBY NR button
ql MIC MIX jack GUITAR jack
w; DECK A
wa SUPPER WOOFER MODE button MIC LEVEL control
GUITAR LEVEL control ws EJECT button
GROOVE button SUPER WOOFER button
wd TUNER/BAND button TUNING +/– button ENTER/NEXT button TUNER MEMORY button STEREO/MONO button TUNING MODE button PTY button (LX5 only)
wf POWER SAVE/DEMO (STAND BY) button DISPLAY button
SPECTRUM ANALYZER button
5
6
SECTION 3
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
CASE
2 five screws
(BVTT3 × 6)
6 case
1 three screws (CASE3 TP2)
|
3 two screws |
4 |
(BVTP3 × 8) |
5
5 4
1 three screws (CASE3 TP2)
FRONT PANEL SECTION
1 wire (flat type)
(15 core) (CN303)
|
1 wire (flat type) |
2 two connectors |
|
(17 core) (CN304) |
|
|
(CN452, 702) |
|
|
|
|
|
1 wire (flat type) |
|
3 three screws |
(13 core) (CN431) |
|
|
MAIN BOARD (Page 8) |
|
(BVTP3 × 8) |
|
|
|
|
CD MECHANISM DECK |
|
|
(Page 9) |
3 screw (BVTP3 × 8)
4 two lugs
4 lug 
2 connector (CN802)
5 screw (BVTP3 × 8)
6 claw
7 front panel section
5four screws (BVTP3 × 8)
7
TAPE MECHANISM DECK (TCM-230PWR1)
2two screws (BVTP3 × 8)
1 wire (flat type) (17 core) (CN1001)
1 wire (flat type) (15 core) (CN601)
2 two screws (BVTP3 × 8)
3 tape mechanism deck (TCM-230PWR1)
MAIN BOARD
|
1 wire (flat type) (15 core) (LX5) |
|
wire (flat type) (13 core) (LX6/LX30/LX50) |
6 back panel |
(CN441) |
|
|
|
3 jumper plug |
|
(LX5/LX6: Mexican/LX30/LX50) |
2nine screws (BVTP3 × 8)
|
2 screw (BVTP3 × |
8) |
|
(LX5/LX6: Mexican/ |
|
|
LX30/LX50) |
|
7 wire (flat type) (19 core) |
2 three screws (BVTP3 × 8) |
|
(CN411) |
|
|
|
2 screw (BVTP3 × |
8) |
|
(LX50) |
|
4 |
2 two screws (BVTP3 × 8) |
|
|
5 connector (CN903) |
|
qa MAIN board
9 two screws (BVTP3 × 8)
0 two connector
8 connector (CN803, 804) (CN412)
8
CD MECHANISM DECK (CDM37M-5BD32L)
1wire (flat type) (19 core) (CN411)
3 three screws |
|
3 three screws |
|
|
(BVTP3 × |
8) |
|
(BVTP3 × 8) |
|
||
|
4 |
|
|
|
|
5 Open the two cable clamps. |
|
2 connector |
6 |
4 |
|
(CN412) |
|
||
|
|
||
|
|
3 two screws |
|
|
|
(BVTP3 × |
8) |
7five screws (BVTP3 × 8)
8 CD mechanism deck (CDM37M-5BD32L)
9
BASE UNIT (BU-5BD32L)
3 base unit 
(BU-5BD32L)
2 boss
1 BU fitting screw
DISC TABLE
Note: When the disc table is installed, adjust the positions of roller cam and mark B as shown in the figure, then set to the groove of disc table.
A
3 step screw
1 two screws (BVTP3 × 8)
2 two brackets (BU)
4 disc table
A
10
SECTION 4
DIAGRAMS
4-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS (In addition to this, the necessary note is printed in each block)
Note on Printed Wiring Board:
•X : parts extracted from the component side.
•Y : parts extracted from the conductor side.
•f : internal component.
•b: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)
Caution: |
|
Pattern face side: |
Parts on the pattern face side seen from |
(Side B) |
the pattern face are indicated. |
Parts face side: |
Parts on the parts face side seen from |
(Side A) |
the parts face are indicated. |
|
|
• Indication of transisitor.
Q
B C E
These are omitted.
Q
B C E
These are omitted.
C 
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Q |
|
|
These are omitted. |
||||
|
|
|
|
|
||||||
B E
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
•All resistors are in Ω and 1/4 W or less unless otherwise specified.
•f : internal component.
•2: nonflammable resistor.
•5: fusible resistor.
•C : panel designation.
Note: |
Note: |
The components identi- |
Les composants identifiés par |
fied by mark 0or dotted |
une marque 0sont critiques |
line with mark 0are criti- |
pour la sécurité. |
cal for safety. |
Ne les remplacer que par une |
Replace only with part |
pièce portant le numéro |
number specified. |
spécifié. |
|
|
•U : B+ Line.
•V : B– Line.
•H: adjustment for repair.
•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
•Circled numbers refer to waveforms.
•Signal path.
F : TUNER (FM/AM)
E : PLAYBACK (DECK A) d : PLAYBACK (DECK B)
G : RECORD
J : CD PLAY (ANALOG OUT) c : CD PLAY (DIGITAL OUT)
N : MIC INPUT
•Abbreviation
AUS |
: Australian model |
AR |
: Argentine model |
EA |
: Saudi Arabia model |
MY |
: Malaysia model |
MX |
: Mexican model |
SP |
: Singapore model |
• Circuit Boards Location
SUB TRANS board (LX5/LX30/LX50)
TRANS board
TUNER (FM/AM)
PANEL FL board
MAIN board
MIC board |
PA board |
TC-A board 
HEADPHONE board
CD-L board
TC-B board
PANEL VR board
FRONT INPUT board
CD-R board
LEAF SW board |
TABLE SENSOR board |
CD MOTOR board |
BD board |
|
AUDIO board
LED board
11 11
HCD-LX5/LX6/LX30/LX50
4-2. PRINTED WIRING BOARD – BD Board – See• page 11 for Circuit Boards Location.
05
• Semiconductor
Location
(Side A)
Ref. No. Location
Q101 C-3
21 , 31
21 , 31
( )
TP(GND)
( )
TP(VC)
( )
TP(RF)
TP (AGCCON)
TP(FE)
TP(TE)
TP(FE1) |
(Page 19) |
19
21 , 31
21 , 31
05
KSS-213D/Q-NP |
• Semiconductor |
|||
Location |
||||
|
||||
|
(Side B) |
|
||
|
|
|
|
|
|
Ref. No. |
|
Location |
|
|
|
|
|
|
|
IC101 |
|
C-2 |
|
|
IC102 |
|
B-1 |
|
|
IC103 |
|
B-1 |
|
|
|
|
|
|
12 12
HCD-LX5/LX6/LX30/LX50
4-3. SCHEMATIC DIAGRAM – BD Board – See• page 23 for Waveforms. •See page 36 for IC Block Diagrams.
(Page 21)
• Voltages and waveforms are dc with respect to ground
under no-signal conditions. |
|
|
no mark : CD STOP |
|
|
( |
) : CD PLAY |
|
|
|
|
The components identified by mark 0or dotted |
Les composants identifiés par une marque 0sont |
|
line with mark 0are critical for safety. |
critiques pour la sécurité. Ne les remplacer que |
|
Replace only with part number specified. |
par une pièce portant le numéro spécifié. |
|
|
|
|
13 13
HCD-LX5/LX6/LX30/LX50
4-4. PRINTED WIRING BOARDS – CD MOTOR Section – See• page 11 for Circuit Boards Location.
C
TO
LED BOARD
TO
TABLE SENSOR BOARD
D
C
TO
CD MOTOR BOARD
B
(Page 19)
D
TO
CD MOTOR BOARD
14 14
4-5. SCHEMATIC DIAGRAM – CD MOTOR Section – •See page 36 for IC Block Diagrams.
B |
(Page 21)
HCD-LX5/LX6/LX30/LX50
•Voltages are dc with respect to ground under no-signal conditions.
no mark : CD STOP
15 15
HCD-LX5/LX6/LX30/LX50
4-6. PRINTED WIRING BOARD – AUDIO Board – See• page 11 for Circuit Boards Location.
( |
) |
05
E
(Page 19)
16 16
4-7. SCHEMATIC DIAGRAM – AUDIO Board – See• page 36 for IC Block Diagrams.
(PLAYBACK) |
PB EQ AMP |
|
(DECK A) |
PB LEVEL (L)
(DECK A)
PB LEVEL (R)
(DECK A)
PB EQ AMP (DECK B)
PB LEVEL (L)
(DECK B)
PB LEVEL (R)
(DECK B)
SWITCHING
REC BIAS (R) |
REC BIAS (L) |
(DECK B) |
(DECK B) |
REC BIAS
-6.8
BIAS OSC
HCD-LX5/LX6/LX30/LX50
NC
A +7.5V
APB–LCH
APB–RCH
AGND
BPB–LCH
BPB–RCH
A –7.5V |
E |
(Page21)
–VBIAS (–7.5V) +VBIAS (+7.5V) B–REC–RCH B–REC–LCH TC–HEAD–GND
•Voltages are dc with respect to ground under no-signal conditions.
no mark : TAPE PLAY
( ) : RECORD
The components identified by mark 0or dotted |
Les composants identifiés par une marque 0sont |
line with mark 0are critical for safety. |
critiques pour la sécurité. Ne les remplacer que |
Replace only with part number specified. |
par une pièce portant le numéro spécifié. |
|
|
17 17
HCD-LX5/LX6/LX30/LX50
4-8. PRINTED WIRING BOARD – LEAF SW Board – See• page 11 for Circuit Boards Location.
|
|
DECK A |
( |
) |
|
DECK B |
|
|
|
|
PLUNGER |
|
|||
|
|
PLUNGER |
|
|
|
|
|
|
|
|
|
|
|
|
|
4 |
3 |
|
|
4 |
3 |
|
|
|
|
|
|
(DECK B PLAY) |
|
|
REC) |
1 |
2 |
|
|
1 |
2 |
|
|
(DECK A PLAY) |
|
|
|
|
|
(DECK B 120/70) |
(DECK B |
|
|
|
|
|
|
||
|
|
|
(DECK B HALF) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
12 |
05 |
(DECK A HALF) |
(DECK A 120/70) |
|
(DECK A REC) |
|
|
12 |
|
|
|
|
|
|
F
(Page 19)
4-9. SCHEMATIC DIAGRAM – LEAF SW Board –
CONTROL SWITCH
(CAPSTAN)
DECK B |
DECK A |
PLUNGER |
PLUNGER |
ROTATION DETECT SENSOR
(DECK A)
(DECK A 120/70)
ROTATION DETECT
SENSOR (DECK B)
(DECK A HALF)
(DECK A REC)
(DECK B HALF)
(DECK B REC)
(DECK B 120/70)
|
(DECK A PLAY) |
(DECK B PLAY) |
||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CAPM–
CAPM+
CAPM–H/L
A–TRGM
TRGM–GND
B–TRGM
A–SHUT
DGND
A–HALF
+5V
A–120/70
B–SHUT
A PLAY
B–HALF / REC–A / REC–B B–120/70
B PALY
NC
F
(Page 21)
•Voltages are dc with respect to ground under no-signal conditions.
no mark : TAPE PLAY ( ) : RECORD
: Impossible to measure
18 18
HCD-LX5/LX6/LX30/LX50
4-10. PRINTED WIRING BOARD – MAIN Board – See• page 11 for Circuit Boards Location.
(Page 30)
(Page 32)
(Page 26)
(Page 16)
(Page 32)
(Page 18)
(Page 24) |
(Page 12) |
(Page 14) |
• Semiconductor
Location
Ref. No. |
Location |
|
|
D191 |
B-7 |
D192 |
B-7 |
D193 |
A-6 |
D194 |
B-6 |
D333 |
I-3 |
D334 |
I-3 |
D335 |
I-4 |
D336 |
I-4 |
D501 |
I-6 |
D534 |
G-7 |
D801 |
I-6 |
D802 |
H-7 |
D803 |
H-8 |
D804 |
I-7 |
D805 |
H-8 |
D806 |
H-7 |
D807 |
H-8 |
D808 |
I-6 |
D911 |
E-10 |
D912 |
F-9 |
D913 |
F-10 |
D931 |
G-10 |
D951 |
B-10 |
IC101 |
D-3 |
IC181 |
B-5 |
IC191 |
B-7 |
IC301 |
G-2 |
IC501 |
H-6 |
IC601 |
B-1 |
IC781 |
A-12 |
IC801 |
I-7 |
IC901 |
C-11 |
IC911 |
E-10 |
IC931 |
G-10 |
IC932 |
G-11 |
IC932 |
G-12 |
IC933 |
H-11 |
IC951 |
B-11 |
Q111 |
D-5 |
Q112 |
D-5 |
Q113 |
D-5 |
Q115 |
D-4 |
Q161 |
E-5 |
Q162 |
E-5 |
Q163 |
E-5 |
Q165 |
E-3 |
Q331 |
I-2 |
Q332 |
I-2 |
Q333 |
I-2 |
Q334 |
I-2 |
Q335 |
I-4 |
Q336 |
I-3 |
Q337 |
I-3 |
Q338 |
I-4 |
Q339 |
I-4 |
Q340 |
I-3 |
Q341 |
I-3 |
Q342 |
I-3 |
Q343 |
I-3 |
Q801 |
H-7 |
Q802 |
H-9 |
Q803 |
H-8 |
Q804 |
I-8 |
Q901 |
C-11 |
Q902 |
B-11 |
Q903 |
B-11 |
Q904 |
B-11 |
Q905 |
B-11 |
Q906 |
B-11 |
Q911 |
F-9 |
Q912 |
F-9 |
Q913 |
F-9 |
Q914 |
F-9 |
Q931 |
G-10 |
Q932 |
G-9 |
Q961 |
A-10 |
Q962 |
A-10 |
|
|
19 19
Loading...