Model Name Using Similar MechanismHCD-GPX555
CD Mechanism TypeCDM90-DVBU204//M
Optical Pick-up NameCMS-S76RFS7G
Amplifi er section
The following are measured at
AC 120 V – 240 V, 50/60 Hz
Power output (rated)
Left/Right Channel: 120 W + 120 W
(at 2 ohms, 1 kHz, 1% THD)
RMS output power (reference)
Left/Right Channel: 180 W + 180 W
(per channel at 2 ohms, 1 kHz)
Subwoofer: 360 W (at 4 ohms, 100 Hz)
Speaker section
Speaker system
Subwoofer, Sound Pressure Horn
Speaker unit
200 mm, cone type
Rated impedance
4 ohms
Inputs
AUDIO IN/PARTY CHAIN IN L/R
Voltage 2 V, impedance 47 kilohms
OPTICAL IN
Supported audio signal:
2-channel Linear PCM
MIC 1, MIC 2
Sensitivity 1 mV, impedance 10 kilohms
(USB) port
Type A
Outputs
AUDIO OUT/PARTY CHAIN OUT L/R
Voltage 2 V, impedance 1 kilohm
VIDEO OUT
Max. output level 1 Vp-p, unbalanced,
Sync. negative load impedance 75 ohms
USB section
Supported bit rate
WMA:
48 kbps – 192 kbps, VBR, CBR
AAC:
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
WMA: 44.1 kHz
AAC: 44.1 kHz
Supported USB device
Mass Storage Class
SPECIFICATIONS
Maximum current
1 A
Disc/USB section
Supported bit rate
MPEG1 Layer-3:
32 kbps – 320 kbps, VBR
Sampling frequencies
MPEG1 Layer-3:
32 kHz/44.1 kHz/48 kHz
Xvid
Video codec: Xvid
Bit rate: 4.854 Mbps (MAX)
Resolution/Frame rate:
720 × 480, 30 fps
720 × 576, 25 fps
Audio codec: MP3
MPEG4
File format: MP4 File Format
Video codec:
MPEG4 Simple Profile
(AVC is not compatible.)
Bit rate: 4 Mbps
Resolution/Frame rate:
720 × 576, 30 fps
Audio codec: AAC-LC
(HE-AAC is not compatible.)
DRM: Not compatible
Disc player section
System
Compact disc and digital audio and
video system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW* This output is the value
measurement at a distance of
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Video color system format
NTSC and PAL
FM tuner section
System
PLL quartz-locked digital synthesizer
Antenna
FM lead antenna
Tuning range
87.5 MHz – 108.0 MHz (50 kHz step)
BLUETOOTH section
Communication system
BLUETOOTH Standard version 3.0
Output
BLUETOOTH Standard Power
Class 2
Maximum communication range
Line of sight approx. 10 m
Frequency band
Control Profile)
SPP (Serial Port Profile)
Supported codecs
SBC (Sub Band Codec)
AAC (Advanced Audio Coding)
1)
The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2)
BLUETOOTH standard profiles indicate
the purpose of BLUETOOTH communication between devices.
General
Power requirements
AC 120 V – 240 V, 50/60 Hz
Power consumption
120 W
1)
2)
Power consumption (at the Power Saving
mode)
0.5 W
(When “BT STBY” is set to “OFF”)
6 W
(When “BT STBY” is set to “ON”)
Dimensions (w/h/d) (Approx.)
DVD Receiver (subwoofer unit):
305 mm × 636 mm × 355 mm
Mass (Approx.)
DVD Receiver (subwoofer unit):
14.5 kg
Design and specifications are subject to
change without notice.
is a trademark of DVD Format/Logo Licensing Corporation.
•
“DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”,
the “CD” logos are trademarks.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is either a registered trademark or trademark of
Microsoft Corporation in the United States and/or other countries.
• This product is protected by certain intellectual property rights of
Microsoft Corporation. Use or distribution of such technology outside
of this product is prohibited without a license from Microsoft or an
authorized Microsoft subsidiary.
• “WALKMAN” and “WALKMAN” logo are registered trademarks of
Sony Corporation.
• This system incorporates Dolby* Digital.
* Manufactured under license from Dolby Laboratories. Dolby and
the double-D symbol are trademarks of Dolby Laboratories.
• The BLUETOOTH
owned by Bluetooth SIG, Inc. and any use of such marks by Sony
Corporation is under license. Other trademarks and trade names are
those of their respective owners.
• The N Mark is a trademark or registered trademark of NFC Forum,
Inc. in the United States and in other countries.
• Android™ is a trademark of Google Inc.
• Google Play™ is a trademark of Google Inc.
• Apple, the Apple logo, iPhone, and iPod touch are trademarks of
Apple Inc., registered in the U.S. and other countries. App Store is a
service mark of Apple Inc.
• “Made for iPod” and “Made for iPhone” mean that an electronic
accessory has been designed to connect specifi cally to iPod or iPhone,
respectively, and has been certifi ed by the developer to meet Apple
performance standards. Apple is not responsible for the operation of
this device or its compliance with safety and regulatory standards.
Please note that the use of this accessory with iPod or iPhone may
affect wireless performance.
• THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL
PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND
NON-COMMERCIAL USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE WITH THE MPEG-4
VISUAL STANDARD (“MPEG-4 VIDEO”)
AND/OR
(ii) DECODING MPEG-4 VIDEO THAT WAS ENCODED BY
A CONSUMER ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS OBTAINED FROM
A VIDEO PROVIDER LICENSED TO PROVIDE MPEG-4
VIDEO.
NO LICENSE IS GRANTED OR SHALL BE IMPLIED FOR ANY
OTHER USE. ADDITIONAL INFORMATION INCLUDING THAT
RELATING TO PROMOTIONAL, INTERNAL AND COMMERCIAL USES AND LICENSING MAY BE OBTAINED FROM MPEG
LA, L.L.C.
HTTP://WWW.MPEGLA.COM
• All other trademarks are trademarks of their respective owners.
• In this manual, ™ and ® marks are not specified.
®
word mark and logos are registered trademarks
“DVD VIDEO”, and
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
AC
1.5 kΩ0.15 μF
voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
8. ELECTRICAL PARTS LIST .............................. 80
3
Page 4
HCD-GT3D
Ver. 1.1
SECTION 1
SERVICING NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
This appliance is classifi ed as
a CLASS 1 LASER product
under IEC 60825-1:2007.
This marking is located on
the rear exterior.
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
• JIG
When disassembling the set, use the following jig (for front
panel removal).
Part No.: J-2501-238-A JIG FOR SPEAKER REMOVAL
PLAYABLE DISCS
• DVD+R/DVD+RW
• AUDIO CD
• CD-R/CD-RW/DVD-R/DVD-RW
– audio data
– MP3 fi les that conforms to ISO9660 Level 1/Level 2, or
Joliet (expansion format).
Notes
• MP3 (MPEG 1 Audio Layer-3) is a standard format defi ned
by ISO (International Organization for Standardization) which
compresses audio data. MP3 fi les must be in MPEG 1 Audio
Layer-3 format.
• The system can only play back MP3 fi les that have a fi le
extension of “.mp3”.
4
Page 5
HCD-GT3D
Ver. 1.1
NOTE OF REPLACING THE IC001, IC002, IC101, IC105,
IC106, IC301, IC302 AND IC303 ON THE MOTHERBOARD
BOARD
IC001, IC002, IC101, IC105, IC106, IC301, IC302 and IC303
on the MOTHERBOARD board cannot exchange with single.
When these parts on the MOTHERBOARD board are damaged,
exchange the entire mounted board.
NOTE OF REPLACEMENT OF THE MS-476 BOARD
When the MS-476 board is defective, exchange the entire
LOADING COMPLETE ASSY (T).
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press [\/1] button to turn the power on.
2. Press [FUNCTION] button and turn the [MULTI CONTROL]
knob to select “DVD/CD” function, then press [ENTER]
button.
3. Press the [ENTER] button and [VOCAL FADER] button
simultaneously and hold down for around 3 seconds.
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When “LOCKED” is displayed, the slot lock is not released by
turning power on/off with the [\/1] button.
NOTE OF REPLACING THE IC1001 ON THE DAMP
BOARD AND THE COMPLETE DAMP BOARD
When IC1001 on the DAMP board and the complete DAMP board
are replaced, it is necessary to spread the compound between parts
and heat sink.
Part No. Description
7-300-009-67 THERMAL COMPOUND (TIG2000)
Spread the compound referring to the fi gure below.
– DAMP Board (Component Side) –
NOTE OF REPLACING MOTHERBOARD BOARD OR
BLUETOOTH MODULE OR RC-S730 (WW) BOARD
When the MOTHERBOARD board or BLUETOOTH module
or RC-S730 (WW) board are replaced, please execute the below
service mode.
Pairing this system with a
1. Press the [\/1] button to turn the power on.
2. Place the Bluetooth device within 1 meter (3 feet) from the
system.
3. Press BLUETOOTH on the unit to select Bluetooth function.
“BT AUDIO” appears in the display panel.
4. Hold down BLUETOOTH on the unit for 2 seconds or more.
“PAIRING” fl ashes in the display panel.
5. Perform the pairing procedure on the Bluetooth device.
6. Select the model number of the unit on the display of the
Bluetooth device.
For example, select “SONY : MHC-GT3D”. If passkey is
required on the Bluetooth device, enter “0000”.
7. Perform the Bluetooth connection on the Bluetooth device.
8. When pairing is completed and the Bluetooth connection is
established, the Bluetooth device name appears in the display
panel.
9. To cancel pairing operation, hold down BLUETOOTH on the
unit for 2 seconds or more until “BT AUDIO” appears in the
display panel.
Bluetooth
device
Connecting with a smartphone by one touch (NFC)
Note: The operation in this mode must use a NFC-compatible smartphone
(Smartphones with a built-in NFC function [OS: Android 2.3.3 or
later, excluding Android 3.x])
1. Press the [\/1] button to turn the power on.
2. Download and install the app “NFC Easy Connect”.
Download the free Android app from Google Play by searching
for “NFC Easy Connect”.
3. Start the app “NFC Easy Connect” on the smartphone.
Make sure that the application screen is displayed.
4. Touch the smartphone to the N-Mark on the system until the
smartphone vibrates.
thermal compound (TIG2000)
IC1001
Complete the connection by following the instructions
displayed on the smartphone.
5. When pairing is completed and the Bluetooth connection is
established, the Bluetooth device name appears in the display
panel.
5
Page 6
HCD-GT3D
Ver. 1.2
Playing music from a
Bluetooth
device
For a Bluetooth device
1. Press the [
\/1] button to turn the power on.
2. Press BLUETOOTH on the unit to select Bluetooth function.
“BT AUDIO” appears in the display panel.
3. Establish connection with the Bluetooth device.
Press BLUETOOTH on the unit to connect to the last
connected Bluetooth device.
Perform the Bluetooth connection from the Bluetooth device if
the device is not connected.
Once the connection is established, the Bluetooth device name
appears in the display panel.
4. Press N.Depending on the Bluetooth device,
– you may have to press N twice.
– you may need to start playback of an audio source on the
Bluetooth device.
For an NFC-compatible smartphone
1. Press the [\/1] button to turn the power on.
Touch the smartphone to the N-Mark on the system to establish
the Bluetooth connection.
Start playback of an audio source on the smartphone. For
details on playback, refer to the operating instructions of your
smartphone.
To disconnect the Bluetooth device
For a Bluetooth device
Press BLUETOOTH on the unit.
“BT AUDIO” appears in the display panel.
For an NFC-compatible smartphone
Touch the smartphone to the N-Mark on the system again.
To erase all the pairing registration information perform
COLD RESET test mode (Refer to page 21).
NOTE OF DISASSEMBLE THE PANEL, SIDE
To disassemble the PANEL, SIDE, hexagon key is required to
unscrew the SCREW, TAPPING (HEX) (Type A).
hexagon key
hexagon key
BOND FIXATION OF ELECTRIC PARTS
When DAMP board is replaced or the following object parts are
replaced, it is necessary to fi x parts to the boards by using a speci-fi ed bond without fail.
• Object boards
Complete DAMP board
• Object parts
BoardRef. No.
DAMP
C1126, C1127, C1128, C1129, C1142,
L1010, RY001
SCREW TYPE DISCRIMINATION BEFORE DISASSEMBLE THE PANEL, SIDE
In this set, the screw type which screw between “PANEL, SIDE
and P ANEL, T OP” and “PANEL, SIDE and CHASSIS” have been
changed in the midway of production.
Repair after distinguishing the screw type referring to the
following.
Type A or Type B
Type A or Type B
TypeScrew P/NScrew Shape
A4-546-397-01
B4-162-271-01
• Use bond
Part No.Description
7-600-020-70 ADHESIVE (SC608Z2) 180ML
• Parts position
Complete DAMP board (page 6)
DAMP board
– DAMP Board (Component Side) –
RY001
C1142
C1128
C1127
C1129
L1010
The portion which applies bond:
C1126
6
Page 7
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note 1: After the side panel and top panel are removed, this work is done.
Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).
1 Remove the side (L) panel, side (R) panel, top panel section.
(Illustration of disassembly is omitted.)
hole
– Left view –
Insert the clip etc. processed to the
length of 8 cm or more in the hole
on the side of the chassis and push.
CD/DVD mechanism deck
HCD-GT3D
Ver. 1.2
3
8 cm or more
Note: Push after it inserts it
in this hole well.
tray
– Top view –
2 Insert the clip etc.
NOTE OF REPLACING THE VOLUME KNOB ASSY OR MIC KNOB
When VOLUME knob assy or MIC knob is replaced, it is necessary to apply lubricant on the knob.
Part No.Description
7-651-000-63 Lubricant (SFL-7A)1KG
Apply the lubricant referring to the fi gure below.
– VOLUME KNOB ASSY –– MIC KNOB ASSY –
Lubricant (SFL-7A)1KG
7
Page 8
HCD-GT3D
CAPACITOR DISCHARGE FOR ELECTRIC SHOCK PREVENTION
SMPS Board (Conductor side view)
In checking the SMPS board, make 3 capacitors discharge of C914, C1003 and C1006 for eletrical shock prevention.
800 :/5 W
800 :/5 W
C1003
800 :/5 W
C914
C1006
8
Page 9
Note: Disassemble the unit in the order as shown below.
Note: Follow the disassembly procedure in the numerical order given.
2-2. SIDE (L) PANEL, SIDE (R) PANEL
1 two screws
(TAPPING (HEX)
(Type A) or TAPPING
(Type B))
5 panel, side (L)
4 Remove the panel, side (L)
in the direction of the arrow.
3 three claws
2 three screws (+BVTP 3 × 8)
2 three screws (+BVTP 3 × 8)
3 three claws
5 panel, side (R)
1 two screws (TAPPING (HEX)
(Type A) or TAPPING (Type B))
4 Remove the panel, side (R)
in the direction of the arrow.
Note 1: The screw type which screw between “PANEL, SIDE and PANEL,
TOP” and “PANEL, SIDE and CHASSIS” for this unit have been
changed in the midway of production. About the screw type discrimination, refer to “SCREW TYPE DISCRIMINATION BEFORE
DISASSEMBLE THE PANEL, SIDE” on servicing notes (page 6).
10
Page 11
2-3. TOP PANEL SECTION
HCD-GT3D
Ver. 1.2
4 one screw (+BVTP 3 × 8)
9 wire (flat type) (11 core) (CN3402)
7 Remove the top panel section
in the direction of the arrow.
5 one screw (+BVTP 3 × 8)
2 one screw (+BVTP 3 × 8)
3 two screws (+BVTP 3 × 8)
D
F
C
B
G
6 three claws
qa CN3200 (4P)
D
F
C
B
E
0 CN451 (8P)
G
A
A
E
1 three screws (+BVTP 3 × 8)
qs top panel section
8 Remove the wires from pin, lead.
4 one screw (+BVTP 3 × 8)
:LUHVHWWLQJ
front side
MIC board
pin, lead
MOTHERBOARD
board
5 one screw (+BVTP 3 × 8)
11
Page 12
HCD-GT3D
Ver. 1.2
2-4. OPTICAL BOARD
4 one screw (+BVTP 3 × 8)
5 OPTICAL board
A
1 Remove the wire from pin, lead.
A
2 CN602 (3P)
3 one screw
(+BVTP 3 × 8)
:LUHVHWWLQJ
OPTICAL board
pin, lead
front side
MOTHERBOARD board
2-5. LOADING PANEL ASSY
– Left view –
Insert the clip etc. processed to the
length of 8 cm or more in the hole
on the side of the chassis and push.
8 cm or more
4 panel, loading assy
3 three claws
hole
CD/DVD mechanism deck
2 Draw out the tray.
1 Insert the clip etc.
Note: Push after it inserts it
in this hole well.
12
tray
– Top view –
Page 13
2-6. CDM SECTION
HCD-GT3D
Ver. 1.2
1 two screws (+BVTP 3 × 8)
6 wire (flat type) (5 core) (CN303)
4 Remove the CDM section
in the direction of the arrow.
A
5 CN401 (6P)
A
8 CDM section
7 wire (flat type) (24 core) (CN302)
3 two claws
2 two screws (+BVTP 3 × 8)
2-7. BACK PANEL
2 one screw (+BVTP 3 × 8)
1 two screws (+BVTP 3 × 8)
3 four screws (+BVTP 3 × 8)
4 five screws (+BVTP 3 × 8)
5 panel, back
13
Page 14
HCD-GT3D
Ver. 1.2
2-8. DAMP BOARD
:LUHVHWWLQJ
DAMP board
rear side
1 Remove the wires
from holder, wire.
5 wire (flat type) (19 core) (CN1001)
chassis, sub
holder, wire
8 heatsink
Note:
referring to “NOTE OF REPLACING THE IC1001
ON THE DAMP BOARD AND THE COMPLETE
DAMP BOARD” on servicing notes (page 5).
When you install the heatsink, spread the compound
6 four screws (+BVTP 3 × 8)
9 DAMP board
7 two screws (+BVTP 3 × 8)
3 CN1005 (8P)
2 CN1007 (2P)
4 CN1004 (2P)
14
– Rear view –
Page 15
2-9. MOTHERBOARD BOARD, SPLITTER BOARD
0 two screws (+BVTP 3 × 8)
B
qa SPLITTER board
5 wire (flat type) (25 core) (CN118)
7 five screws (+BVTP 3 × 8)
HCD-GT3D
Ver. 1.2
A
8 MOTHERBOARD board
4 wire (flat type) (6 core) (CN105)
9 wire (flat type) (13 core) (CN3401)
6 wire (flat type) (10 core) (CN102)
3 CN001 (9P)
1 Remove the wires from holder, wire.
A
B
2 CN517 (4P)
– Rear view –
:LUHVHWWLQJ
front side
MOTHERBOARD
board
chassis, sub
holder, wire
15
Page 16
HCD-GT3D
Ver. 1.2
2-10. SUB CHASSIS SECTION
:LUHVHWWLQJ
clamp
front side
2 three screws (+BV3 (3-CR))
3 clamp
1 Remove the wire from clamp.
4 four screws (+BV3 (3-CR))
5 Remove the sub chassis section
in the direction of the arrow.
B
fan, DC
bracket, fan
chassis, sub
7 sub chassis section
6 Draw out the wires from chassis, sub.
A
:LUHVHWWLQJ
chassis, sub
front side
B
A
chassis
16
Page 17
2-11. SMPS BOARD
HCD-GT3D
Ver. 1.2
3 nine screws (+PWH 3 × 8 (SUMITITE))
2 AC inlet
1 CN901 (2P)
4 SMPS board
2-12. CHASSIS
1 one screw (+BVTP 3 × 8)
3 one claw
A
4 nine damper chassis
A
2 seven step screws (M4)
5 chassis
B
3 one claw
B
1 one screw (+BVTP 3 × 8)
17
Page 18
HCD-GT3D
Ver. 1.2
2-13. FRONT PANEL SECTION
2 Insert the jig into a space and slowly
remove the front panel section.
Note : When using a jig, please work
so as not to injure front panel
section and speaker cabinet.
3 All bosses are removed while moving
jig in the direction of the arrow, and
front panel section is removed.
1 one screw ((4 × 13) (TR-184A))
5 front panel section
total fourteen bosses
4 Remove the front panel section
in the direction of the arrow.
2 Insert the jig into a space and slowly
remove the front panel section.
Note : When using a jig, please work
so as not to injure front panel
section and speaker cabinet.
3 All bosses are removed while moving
jig in the direction of the arrow, and
front panel section is removed.
Note: This illustration sees the loading assy (T) from bottom side.
loading assy (T)
terminal face
2 Through the hole
5 tray
1 wire (flat type) (24 core)
3 Through the hole
qf wire(flat type) (5 core)
5 two claws
loading assy (T)
– Bottom view –
5 three claws
6 holder, FFC
4
7 wire (flat type) (24 core)
8 wire (flat type) (5 core)
20
Under the guide
(Fold area)
Under the guide
Page 21
SECTION 3
TEST MODE
HCD-GT3D
[PANEL TEST MODE]
This mode is used to check the fl uorescent indicator tube, LEDs,
keys, [VOLUME/DJ CONTROL] jog, model, destination and
software version.
Procedure:
1. Press [] button and [S3
and hold 3 seconds.
2. All LEDs and segments in fl uorescent indicator tube are
lighted up.
3. When you want to enter to the software version display mode,
press [S2 +] button.
The model information appears on the fl uorescent indicator
tube.
Press [S2 +] button again to view the destination information.
4. During the destination information display, press [S2 +]
button. Each time [S2 +] button is pressed, the fl uorescent
indicator tube shows the version of each category software
in the following sequence: SC, MTK, OPU, UI, PF, SUB,
SYS, CD, CMA, CMB, ST, TA, TM and return back to model
information display.
5. When [] button is pressed while the version numbers are
being displayed except model and destination, the date of the
software creation appears. When [] button is pressed again,
the display returns to the software version display.
6. When [ENTER] button is pressed after all LEDs and segments
in fl uorescent indicator tube light up, alternate segments in fl uorescent indicator tube and LEDs would light up, all Party
Light LEDs would light up in red color. If you press [ENTER]
button again, another half of alternate segments in fl uorescent
indicator tube and LEDs would light up, all Party Light LEDs
would light up in green color. Pressing [ENTER] button
again would cause all segments in fl uorescent indicator tube
and LEDs light up, all Party Light LEDs would light up in
blue color. Pressing [ENTER] button again would turn off all
segments in fl uorescent indicator tube and all LEDs including
Party Light LEDs.
7. Press [S1 –] button, the key check mode is activated.
8. In the key check mode, the fl uorescent indicator tube displays
“K0 V0E0”.
Each time a button is pressed, “K” value increases. However,
once a button has been pressed, it is no longer taken into
account. After all the buttons have been pressed, "K" value will
toggle between "OK" and "K24".
“V” value increases in the manner of 0, 1, 2, 3 ... if [VOLUME/
DJ CONTROL] knob is turned clockwise, or it decreases in the
manner of 0, 9, 8, 7 ... if [VOLUME/DJ CONTROL] knob is
turned counterclockwise.
“E” value increases in the manner of 0, 1, 2, 3 ... if [MULTI
CONTROL] knob is turned clockwise, or it decreases in the
manner of 0, 9, 8, 7 ... if [MULTI CONTROL] knob is turned
counterclockwise.
9. To release from this mode, press the buttons in the same
manner as step 1, or disconnect the power cord.
TUNING –
.] button simultaneously
[COLD RESET]
The cold reset clears all data including preset data stored in the
data fl ash to initial conditions included history mode data. Execute
this mode when returning the set to the customer.
Procedure:
1. Press [\/1] button to turn on the system.
2. Press [] button and [S4
simultaneously for 3 seconds.
3. “COLD RST” appears on the fl uorescent indicator tube.
After that, the fl uorescent indicator tube will display “SONY
DEMO”. The set will automatically Power ON and Power
OFF again, and the system is reset.
[DISC TRAY LOCK MODE]
This mode let you lock the disc tray. When this mode is activated,
the disc tray will not open when [Z] button is pressed. The message “LOCKED” will be displayed on the fl uorescent indicator
tube. This mode only applied when there is disc on the tray.
Procedure:
1. Press [\/1] button to turn on the system.
2. Press [FUNCTION] button and turn the [MULTI CONTROL]
knob to select “DVD/CD” function, then press [ENTER]
button.
3. Press [ENTER] button and [VOCAL FADER] button
simultaneously and hold down until “LOCKED” or
“UNLOCKED” displayed on the fl uorescent indicator tube
(around 3 seconds).
Bluetooth PAIRING HISTORY CLEAR
It can clear the Bluetooth pairing history.
Procedure:
1. Press [\/1] button to turn on the system.
2. Press [-PAIRING BLUETOOTH] button to turn the Bluetooth
function.
3. Press two buttons of [ENTER] and [S1 –] simultaneously
for 3 seconds.
4. The message “BT HIST” → “CLEAR” is displayed on the
fl uorescent indicator tube, and the pairing history of Bluetooth
is cleared.
TUNING +
>] button
[USER RESET]
The user reset clears all data including preset data stored in the data
fl ash to initial conditions exclude history mode data.
Procedure:
1. Press [\/1] button to turn on the system.
2. Press [ENTER] button and [S4
taneously for 3 seconds.
3. “RESET” appears on the fl uorescent indicator tube. After that,
the fl uorescent indicator tube becomes blank for a while, and
the system goes to demo mode.
TUNING +
>] button simul-
21
Page 22
HCD-GT3D
[HISTORY MODE]
This mode is used to check important data stored in the system when PROTECTOR happened.
Procedure:
1. During demo mode, press [] button and [S2 +] button for 5 seconds to mode into history mode.
2.
Press the [S4 TUNING + >] button or [S3 TUNING – .] button to check history data stored.
Display on fl uorescent indicator tubeDescription
PCOUNT
PT
1 *h*h*h*h*h*m*m
2 *h*h*h*h*h*m*m
F
VOL
SW
BASS
※※※※※※
※※※※
※※
※※※
※※※
No. of time protector happened (0 ~ 99)
Refer to protect type description
Single Power On Time until protector happened (0~99999 hours,
0~99 minutes)
Total Power On Time [ no consider protector happened ]
(0~99999 hours, 0~99 minutes)
Input Function during protector happened
Volume setting (MIN / 1 - 50 / MAX)
Subwoofer setting (0 ~ 4)
※
MEGA BASS setting (OFF / ON)
To release from History Mode.
To release from this mode, press [
Protect T ype Description:
Error Code Description
01The over current condition to MOSFET occurs by defect of MOSFET or defect of PS output line.
or
Unusual heat up of MOSFET by improper assembly of heat sink, destruction of MOSFET etc.
02Defect of thermistor IC or charging circuit used by SPM (Sound Pressure Management) system.
03Defect of power supply circuit to AMP. There is possibility of unusual power supply of any of the AMP IC or Pre-
amplifi er.
04DC appears in SP terminal by defect of AMP IC and MOSFET.
06Defect of DC FAN and DC FAN driver circuit.
If speaker does not have output even if the set status is not in PROTECT mode, the following defect might be possible:
DefectsPossible cause
RESET defectReset signal status from micom is not ‘H’.
\/1] button.
22
Page 23
HCD-GT3D
Ver. 1.1
[DVD COLOR SYSTEM MODE]
This mode let you change the color system of the video output
from PAL to NTSC or vice-versa.
Procedure:
1. Press [\/1] button to turn on the system.
2. Press [FUNCTION] button and turn the [MULTI CONTROL]
knob to select “DVD/CD” function, then press [ENTER]
button.
3. Press [ENTER] button and [MIC ECHO] button
simultaneously and hold for 3 seconds.
4. T he message “PAL” or “NTSC” appe ars on the fl uoresce nt
indicator tube.
• To release from DVD Color System Mode
1. Once the color system h as been select ed, the mode is fi xed
there after. If you wish to change the mode again, perform the
above item 2 again.
[DVD SERVICE MODE]
This mode let you make diagnosis and adjustment easily by using
the remote commander and the TV. The instructions, diagnostic
results, etc. are given on the on-screen display.
• TEST DISC LIST
Be sure to use the DVD disc that matches the signal standards
2. Press [FUNCTION] button and turn the [MULTI CONTROL]
knob to select “DVD/CD” function, then press [ENTER]
button.
3. Press [SOUND FIELD] button and [VOCAL F ADER] button
simultaneously and hold 3 seconds.
4. The message “SERVICE IN” appears on the fl uorescent
indicator tube.
The display of the “Model Name” of the “Remocon Diagnosis
Menu” change with the model and the destination appears on
screen display. Refer to below on the model name.
MHC-GT3D: GV2
Remocon Diagnosis Menu
0. External Chip Check
1. Servo Parameter Check
2. Drive Manual Operation
3. Emergency History
4. Version Information
Model Name
IF-con
Syscon
: MHC-GT3D_ XX
: Ver. XX.XX (XXXX)
: Ver. X.XXX
*1
*1: Changes depending on destination
5. To execute each fu nct ion , pr es s its number by using nu meric
button on the remote commander.
6. To release from t his mode, press [\/1] button to turn off t he
system.
• Execute IOP Measurement
In order to execute IOP measurem ent, the following standard
procedures must be followed.
1. From the Top Menu of Remocon Diagnosis Menu, select
“2. Dr ive Manual Oper ation” by pressing t he [2] button on
the remote commander. The following sc ree n ap pea r s on the
onscreen display.
Drive Manual Operation
1. Servo Control
2. Track/Layer Jump
3. Manual Adjustment
4. Tray Aging Mode
5. MIRR time Adjust
0. Return to Top Menu
2. Select “3. Manu al Adjust me nt ” by pre ssi ng t he [3] button on
the remote commander. The following sc ree n ap pea r s on the
on-screen display.
Manual Adjust
1. Track Balance Adjust:
2. Track Gain Adjust:
3. Focus Balance Adjust:
4. Focus Gain Adjust:
5. Eq Boost Adjust:
6. Iop:
7. TRV. Level:
8. S curve (FE) Level:
9. RFL (PI) Level:
0. MIRR Time:
Oo Change Value
RETURN Return to previous menu
3. Select “6. Iop:” by pressing the [6] button on the remote
commander.
4. Wait until a hexa decimal number app ears in the on-sc reen
display as below:
Manual Adjust
1. Track Balance Adjust:
2. Track Gain Adjust:
3. Focus Balance Adjust:
4. Focus Gain Adjust:
5. Eq Boost Adjust:
6. Iop. ED
7. TRV. Level:
8. S curve (FE) Level:
9. RFL (PI) Level:
0. MIRR Time:
Oo Change Value
RETURN Return to previous menu
5. Convert data from hexadecimal to decimal by using
conversion table.
6. Please fi nd the label on the rear of the BU (Base Unit).
The default IOP value is written in the label.
7. Subtract between these two values.
8. If the remainder is smaller than 93 (decimal), then it is OK.
However if the value is higher than 93, then the BU is defective
and need to be change.
9. Press [RETURN] button on the remote commander to return
to previous menu.
23
Page 24
HCD-GT3D
Ver. 1.1
10. Press the [0] button on the remote commander to return to the
Top Menu of Remocon Diagnosis Menu.
11. Press [\/1] button to turn off the system.
• Check Emergency History
To check the emer gency hi stor y, please follow the following
procedure.
1. From the Top Menu of Remocon Diagnosis Menu, select
“3. Emergency History” by pressing the [3] button on the
remote com mander. The following screen app e a r s on t he onscreen display.
Emg. History Check
Laser HoursCD999h59min
1. 01 05 04 04
00 00 00 00
2. 02 02 01 0100 A9 4B 00
00 00 00 00
Next Next PagePrev Prev Page
O Return to Top Menu
DVD999h59min
00 92 46 00
00 00 23 45
00 00 23 45
(Displayed values in the above fi gure are example)
2. You can check the total time when the laser is turned on
duri ng playba ck of DVD and CD fr om the above menu. T he
maximum time, which can be displayed are 999h 59min.
3. You can check the e r ror code of late st 10 emergency h istor y
from the ab ove menu. To view the previou s or next page of
emergency h istory, press t he [.] button or [>] butt on
on the remote com m and er. The er r or code c onsis ts of “Er ror
Code”, “Parameter of error code” and “Time of error code”.
• Error Code
Example of Error code
• Parameter of error code
This is the detail of error code.
Example of Error code
1. 01 05 04 0400 92 46 00
00 00 00 0000 00 23 45
• Time of error code
This is the laser time when an error occurred.
Example of Error code
1. 01 05 04 0400 92 46 00
00 00 00 0000 00 23 45
To clear the Laser Hours
Press the [ DISPLAY] button and then press the [CLEAR]
button. The data for both CD and DVD data are reset.
Emg. History Check
Laser HoursCD0h0min
1. 01 05 04 04
00 00 00 0000 00 23 45
2. 02 02 01 0100 A9 4B 00
00 00 00 0000 00 23 45
Next Next PagePrev Prev Page
O Return to Top Menu
DVD0h0min
00 92 46 00
To clear the Emergency History
Press the [DVD TOP MENU] button and then press the [CLEAR]
button.
The error code for all emergency history would be reset.
1. 01 05 04 0400 92 46 00
00 00 00 0000 00 23 45
The meaning of error code is as below:
01: Communication error (No reply from syscon)
02: Syscon hung up
03: Power OFF request when syscon hung up
19: Thermal shutdown
24: MoveSledHome error
25: Mechanical move error (5 Changer)
26: Mechanical move stack error
30: DC motor adjustment error
31: DPD offset adjustment error
32: TE balance adjustment error
33: TE sensor adjustment error
34: TE loop gain adjustment error
35: FE loop gain adjustment error
36: Bad jitter after adjustment
40: Focus NG
42: Focus layer jump NG
51: Spindle stop error
52: Open kick spindle error
60: Focus on error
61: Seek fail error
62: Read Q data/ID error
70: Lead in data read fail
71: TOC read time out (CD)
80: Can’t buffering
81: Unknown media type
Emg. History Check
Laser HoursCD999h59min
1. 00 00 00 00
00 00 00 00
2. 00 00 00 0000 00 00 00
00 00 00 0000 00 00 00
Next Next PagePrev Prev Page
O Return to Top Menu
DVD999h59min
00 00 00 00
00 00 00 00
To clear the Initialize Setup Data
Press the [DVD/TUNER MENU] button and then press the
[CLEAR] button on the remote commander.
Emg. History Check
Laser HoursCD999h59min
Initialize setup data...
Next Next PagePrev Prev Page
O Return to Top Menu
DVD999h59min
24
Page 25
To return to the Top Menu of Remocon Diagnosis Menu
Press the [0] button on the remote commander.
• Check Version Information
To check the version information, please follow the following
procedure.
1. From the Top Menu of Remocon Diagnosis Menu , select “4.
Version information” by pressing the [4] button on the remote
comma nder. The following scree n appear s on the on-scre en
display.
To return to the Top Menu of Remocon Diagnosis Menu, press
the [0] button on the remote commander.
25
Page 26
HCD-GT3D
SECTION 4
ELECTRICAL CHECK
TUNER SECTION
0 dB = 1 μV
FM AUTO STOP CHECK
signal
generator
set
+
75
–
Procedure:
1. Turn the power on.
2. Input the following signal from Signal Generator to FM
antenna input directly.
Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz
Deviation : 75 kHz
Modulation : 1 kHz
ANT input : 35 dBu (EMF)
Note: Please use 75 ohm “coaxial cable” to connect SG and the
set. You cannot use video cable for checking.
Please use SG whose output impedance is 75 ohm.
FOCUS BIAS CHECK
oscilloscope
(DC range)
MOTHERBOARD board
CN302 pin 17 (RF)
CN302 pin 1 (GND)
+
–
Procedure:
1. Connect the oscilloscope to CN302 pin 17 (RF) and CN302
pin 1 (GND) on the MOTHERBOARD board.
2. Press the [
] button to turn the power on, and press the
?/1
[FUNCTION] button to select CD function.
3. Set the test disc (CD: YEDS-18) on the tray and press [B]
button to playback.
4. Confi rm that oscilloscope waveform is as shown in the fi gure
below (eye pattern).
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
level:
1.1 ± 0.25 Vp-p (DVDSL)
1.0 ± 0.25 Vp-p (CD)
3. Set to FM tuner function and scan the input FM signal with
automatic scanning.
4. Confi rm that input Frequency of A, B and C detected andautomatic scanning stops.
The stop of automatic scanning means “The station signal is
received in good condition”.
CD/DVD SECTION
[TEST DISC LIST]
Use the following test disc on test mode.
• CD: YEDS-18 (PART No. 3-702-101-01)
or
PATD-012 (PART No. 4-225-203-01)
or
HLX-A1 (PART No. J-2501-307-A)
• DVD (SL)
NTSC HLX-503 (PART No. J-6090-069-A)
or
HLX-504 (PART No. J-6090-088-A)
or
HLX-513 (PART No. J-2501-305-A)
PAL HLX-506 (PART No. J-6090-077-A)
• DVD (DL)
NTSC HLX-501 (PART No. J-6090-071-A)
or
HLX-505 (PART No. J-6090-089-A)
or
HLX-514 (PART No. J-2501-306-A)
PAL HLX-507 (PART No. J-6090-078-A)
Note: When the BASE UNIT is replaced, perform the Execute
IOP measurement
(Refer to page 24).
Checking Location:
– MOTHERBOARD Board (Component Side) –
pin 17 (RF)pin 1 (GND)
CN302
26
Page 27
SECTION 5
TROUBLESHOOTING
Checks whether the state of a Cable and Outlet are normal.
If there are no problems, checks circumference circuit for
Main on Output of Main mount side.
Replaces SMPS Board if it is not up to standard.
HCD-GT3D
No
Hi (3.3V)
Power OnDemo mode
Low (0V)Low (0V)
Yes
AC IN
Standby
The Power Control signal to SMPS Board is checked.
Is following power voltage OK?
Main on
CN2005: pin9
(6)
(4)
(5)
(3)
No
50V±5%
Power OnDemo mode
13.5V±0.5V
13.5V±0.5V
Yes
END
0V0V
Standby
13.5V±0.5V
The Output from SMPS Board is checked.
Is following power voltage up to standard?
CN2005 pin1,4,5
CN4 pin5
(1)
(2)
SMPS Board Diagnosis Flow
(1) AC input
(2) Fuse
(3) Sub Power transformer
(4) CN2005 Connector
pin1: 13.5V
pin3: AGND
pin4-5: 13.5V
pin6-7: M/DGND
pin8: AC-DET
pin9: MAIN-ON
(5) MAIN Power transformer
(6) CN4 Connector
pin1-5: V1 (50V)
pin6-9: V1_GND
27
Page 28
HCD-GT3D
Checks IC303 circumference circuit for +1.2V.
Checks IC002 (JL040) circumference circuit for
+3.3V.
Checks circumference circuit for SL+/SL- of IC401.
Checks circumference circuit of IC301 FMO Signal.
No
Checks CL335 for +3.3V and +1.2V REG IC303.
Does it output the power voltage of 3.3V and 1.2V?
No
No
Yes
Yes
Does it output the signal?
Checks CN401 SL+/SL- signal.
The Sled motor has a problem.
Replaces BU.
Checks circumference circuit for SP+/SP of IC401.
Checks circumference circuit of IC301 DMO Signal.
No
Does it output the signal?
Checks CN401 SP+/SP- signal.
No
Checks circumference circuit for FCS+/FCS- of IC401.
Checks circumference circuit of IC301 FOO Signal.
No
Yes
The Spindle motor has a problem.
Replaces BU.
Yes
Does it output the signal?
Checks CN302 FCS+/FCS- signal.
No
The Optical pickup has a problem.
Replaces BU.
TURN ON
TRAY IN
REMOVE TOP PANEL
REMOVE SIDE PANEL
Optical Block Diagnosis Flow (1/2)
Does Optical pickup move to inner circumference?
28
Yes
(Visual check)
Yes
Does Spindle motor rotate?
(Visual check)
Yes
Does Optical pickup do focus search?
(Visual check)
A
Page 29
Checks circumference circuit of IC301 LD01.
Checks circumference circuit of Q402.
HCD-GT3D
Replaces BU if it is not up to standard.
No
Yes
The Optical pickup has a problem.
Does it output 2V when laser become luminous?
Checks JL306 (LD780) signal.
No
Replaces BU.
If it is not up to standard,
No
No
Yes
Lens cleaning is performed.
Is output level of RF signal (JL317) up to standard?
RF Level = 1.05 ±0.45 Vpp
Yes
Test disc (CD: YEDS-18, DVD: HLX-503 (NTSC) or HLX-504 (PAL))
No
The Optical pickup has a problem.
Replaces BU.
A
Does laser diode become luminous?
Optical Block Diagnosis Flow (2/2)
(Visual check)
Yes
Yes
DISC IN
Yes
Is output level of RF signal (JL317) up to standard?
RF Level = 1.05 ±0.45 Vpp
Test disc (CD: YEDS-18, DVD: HLX-503 (NTSC) or HLX-504 (PAL))
Yes
Is there no problem with Long term Aging Test (60min)?
f : TUNER
N : MIC
F : AUDIO (ANALOG)
L : AUDIO (DIGITAL)
IN
AUDIO
PARTY CHAIN
RV3100
MIC LEVEL
A/D CONVERTER
IC606
9
DOUT
6
SCKI
7
LRCK
8
BCK
1
SIGNAL SELECTOR
3
1B
10
3B
13
4B
17
18
19
24
25
34
1
2
2
1A
11
3A
14
4A
COPROCESSOR
SDA
SERIAL FLASH
PWR SUPPLY
PWR SUPPLY
5
2A
BUS BUFFER
VINL
VINR
IC912
SELECT
IC105
SCL
2
IC106
SI/SIO0
SO/SIO1
WP/SIO2
HOLD/SIO3
SCLK
CONTROL
Q104
+3.3V
Q103
IC102
(2/3)
6
CS
2Y
1Y
3Y
4Y
13
14
4
9
12
1
32.768kHz
12.288MHz
13.333MHz
5
2
3
7
6
1
6
X101
X103
X102
E+3.3V
SYSTEM CONTROLLER
IC101
(2/4)
ST-DATA
ST-CLK
ST-RDS
SSI1_DI
SSI0_DO
SSI1_DO
SSI2_DO
LINK-DET
LINK-SET
128
127
114
173
176
175
41
42
55
14
29
30
32
54
33
51
59
94
AUDIO SELECTOR
DRIVER
Q604
A/D CONVERTER
IC609
9
DOUT
6
SCKI
8
BCK
7
LRCK
D/A CONVERTER
IC914
14
DIN
12
SCK
13
BCK
15
LRCK
D/A CONVERTER
IC615
2
DATA
16
SCK
1
BCK
3
LRCK
D/A CONVERTER
IC604
2
DATA
16
SCK
1
BCK
3
LRCK
AUDIO SELECTOR
DRIVER
Q611
VINL
VINR
OUTL
OUTR
VOUTL
VOUTL
VOUTR
13
14
6
7
7
7
8
164
ANALOG-CSEL
2
VIDEO-MUTE
28
SSI3_DI
26
SSI3_LRCKO
24
SSI3_BCKO
111
3D-RESET_ANALOG-DSEL/SD_D1_0
RTC-X167
RTC-X268
AUDIO-X1
91
AUDIO-X292
126
DIR_CP-DATA
125
DIR_CP-CLK
165
DIR_RESET
130
DIR_INT0/EVOL_DATA
136
DIR_INT1/AMP-CLK-FR
EXTAL
70
XTAL71
170
4
Q-FLASH-SIO0
172
Q-FLASH-SIO1
166
Q-FLASH-SIO2
167
Q-FLASH-SIO3
168
Q-FLASH-CLK
169
Q-FLASH-CS
131
NFC_CLK
132
NFC_DATA
12
NFC-INT
53
NFC-RF-DET
8
BT-ON
5
BT-RESET
133
BT-TXD
65
BT-RXD(MD-CLK)
ANALOG-ASEL
ANALOG-BSEL
MIC-DETECT
AUDIO_CLK_OUT
SSI0_BCKO
SSI0_LRCKO
LINK-OUT-A
LINK-OUT-B
/LINK-MUTE
AUDIO SELECTOR
IC605
13
X0
X
3
Y0
Y
X3
Y3
10
X1
A
9
Y1
B
OP AMP
IC603
12
1
11
4
14
5
X600
12MHz
AUDIO SELECTOR
IC602
1
Y1
Y0
12
X1
X0
10
Y
A
9
X
B
13
LRCK/LOUT
12
BCLK/ROUT
X116
X217
11
DA
8
CK
6
IIC/RDSI
FM RECEIVER
5
14
3
13
IC902
FRF1
1
OP AMP
IC601
MIC AMP
IC3200
7
OUT2
3
OUT1
+IN1
GAIN CONTROL
Q3200, Q3201
BIAS DETECTION
Q605, Q607
+IN2
5
1
D3201
MUTING
Q602, Q606
E : VIDEO
HCD-GT3D
3434
Page 35
6-3. BLOCK DIAGRAM - AMP Section -
SW
PRE AMP
IC1005
4
5
INPUT_A
INPUT_B
POWER AMP
IC1001
OUT_A_52
OUT_A_53
OUT_B_44
OUT_B_45
HCD-GT3D
52
53
44
45
L1006
LOUDSPEAKER
>001B
AUDIO/VIDEO
SECTION
(Page 34)
FRONT-L
FRONT-R
PRE AMP
IC1004
BIAS
Q1022
56
SD-FAST
AMP RESET
SWITCH
Q1018, Q1019
120
/AMP-RESET
+12V
10
11
15
20
21
2
D1017
INPUT_C
INPUT_D
SD
M1
M2
RESET
OUT_C_36
OUT_C_37
OUT_D_28
OUT_D_29
EVOL_CLK/RELAY_CONTROL
129
TB001
+
36
37
28
29
L1007
SYSTEM CONTROLLER
IC101
(3/4)
OVERLOAD
DETECTION
Q1015, Q1014
OVERLOAD
DETECTION
Q1016, Q1017
DC
DETECTION
Q1006
78
AMP-PROTECT
OVERLOAD
DETECTION
Q1003, Q1004
D1008
FAN RESET
SWITCH
Q1023
FAN
PROTECTION
Q1011
RELAY DRIVER
Q1021
82
FAN_DET
RY001
FAN MOTOR
DRIVER
Q1010
CN1004
-
+
-
M+13V
1
2
PURPLE
DC FAN
L
GREY
IMPEDANCE USE 2ȍ
R
M
SLgQaOSaWK
MID/TWEETERS
F : AUDIO (ANALOG)
HCD-GT3D
3535
Page 36
HCD-GT3D
6-4. BLOCK DIAGRAM - POWER SUPPLY Section -
SMPS BOARD
13.5V
13.5V
+9V REG
A+13V
M+13V
M+13V
A+13V
V1
PVDD
M+13V
M+13V
+13V
PWR SUPPLY
Q004
PWR SUPPLY
CONTROL
Q461
PWR SUPPLY
CONTROL
Q012
+13V
PWR SUPPLY
Q011
DC-DC CONVERTER
IC002
1
SW1
VIN1
5
VBST1
EN1
16
VIN2
VBST2
12
EN2
SW2
DC-DC CONVERTER
IC001
1
SW1
VIN1
16
VBST1
VIN2
5
EN1
VBST2
12
EN2
SW2
A+13V_GV2
SW+13V
3
2
15
14
3
2
15
14
E+1.18V
E+3.3V
USB+5V
M+5.2V, LED+5.2V
A+13V_GV2
A+13V_GV2
E+3.3V
M+5.2V
E+3.3V
IC004
1
VIN
+12V REG
IC1003
8
VCC
5
EN
+3.3V
PWR SUPPLY
Q005
PWR SUPPLY
CONTROL
Q457
+5.2V
PWR SUPPLY
Q459
+3.3V
PWR SUPPLY
Q008
PWR SUPPLY
CONTROL
Q009
VOUT
VO 1
3
AVDD+9V , A+9V
+12V
DVDD3.3V, FE_3.3V, FE_3.3V_1
FE_5.2V_M, FE_5.2V_TRAY
D+3.3V
AVDD+9V
DVDD5V
DVDD3.3V
DVDD3.3V
AVDD+5V
AVDD+5V
AVDD+5V
+9V REG
IC006
1
VIN
+3.3V REG
IC305
1
VDD
3
CE
+1.2V REG
IC303
6
VCC
4
EN
PWR SUPPLY
CONTROL
Q006
+5V
PWR SUPPLY
Q007
+3.3V REG
IC008
4
VDD
1
CE
+3.3V REG
IC903
4
VDD
VOUT
VOUT 5
VO 1
VOUT 3
VOUT 3
CE 1
3
AVDD+5V
+3.3V
+1.2V
DVDD5V, FE_5V
AVDD+3.3V
+3.3V
SYSTEM CONTROLLER
IC101
(4/4)
57
PCONT-PSAVE-PROTECT
13
MTK-POWER-CTRL
115
ST-CE
~ AC IN
MAIN ON
AC-DET
E+3.3V
M+13V
PROTECTION
CONTROL
Q572
PROTECTION
CONTROL
Q574
PROTECTION
CONTROL
Q575
AC OFF
DETECT
Q107
E+3.3V
RESET
2
VDD
PROTECTION
CONTROL
PROTECTION
CONTROL
BUS BUFFER
12
4A
IC103
Q571
Q576
IC102
(3/3)
VOUT
96
PCONT-BTSTBY
52
VBUS-OE
4
TH571
11
4Y
76
REST
27
C-CONT
79
SPM-C-MON
80
SPM-AMBIENT-TEMP
117
PCONT-DAMP
63
AC-CUT(MD-BOOT0)
HCD-GT3D
3636
Page 37
HCD-GT3D
Ver. 1.1
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : Parts extracted from the conductor side.
•
(The other layer’s patterns are not indicated.)
• MOTHERBOARD board is multi-layer board.
• Indication of transistor.
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
: Pattern from the side which enables seeing.
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
However, the patterns of intermediate layers have not
been included in diagrams.
C
Q
B
E
CEB
These are omitted.
Q
B
CE
Note 1: When the MS-476 board is defective, exchange the
entire LOADING COMPLETE ASSY (T).
Note 2: When the complete DAMP board is replaced, refer to
“NOTE OF REPLACING THE IC1001 ON THE DAMP
BOARD AND THE COMPLETE DAMP BOARD” on
servicing notes (page 5).
Note 3: When the C1126, C1127, C1128, C1129, C1142,
L1010 and RY001 on the DAMP board are replaced,
spread the bond referring to “BOND FIXATION OF
ELECTRIC PARTS” on servicing notes (page 6).
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
These are omitted.
These are omitted.
Note on Schematic Diagram:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• Components for right channel have same values as for
left channel. Reference numbers are coded from
• C : panel designation.
Note: The components identifi ed by mark 0 or dotted line Replace only with part number specifi ed.
• A : B+ Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
c : CD/DVD PLAY
f : TUNER
N : MIC
F : AUDIO (ANALOG)
L : AUDIO (DIGITAL)
E : VIDEO
d : USB
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
Note 1: When the MS-476 board is defective, exchange the
Note 2: When the complete DAMP board is replaced, refer to
Note 3: When the C1126, C1127, C1128, C1129, C1142,
with mark 0 are critical for safety.
entire LOADING COMPLETE ASSY (T).
“NOTE OF REPLACING THE IC1001 ON THE DAMP
BOARD AND THE COMPLETE DAMP BOARD” on
servicing notes (page 5).
L1010 and RY001 on the DAMP board are replaced,
spread the bond referring to “BOND FIXATION OF
ELECTRIC PARTS” on servicing notes (page 6).
• IC Pin Function Descriptions
MOTHERBOARD BOARD (9/10) IC101 R7S7200032CFP-A (SYSTEM CONTROLLER)
Pin No.Pin NameI/ODescription
1SRC-RST0-Not used
2VIDEO-MUTEOMuting Control for Video
3CDM-UNLOAD-SWICDM UNLOAD SW
4CDM-LOAD-SWICDM LOAD SW
5BT-RESETOReset signal output to Bluetooth section
6LCD_BCKLEDOFL Backlight
7Vcc-Power supply terminal (+3.3V)
8BT-ONOBluetooth on/off control signal output terminal for bluetooth section
9Vss-Ground terminal
10LCD-OSCOFL Frame Rate EXT CLOCK
11PVcc-Power supply terminal (+3.3V)
12NFC-INTINFC Interrupt
13MTK-POWER-CTRLOPower Control pin for MTK
14AUDIO_CLK_OUTOClock Signal from Aragon to MTK master clock
15MTK-RESETOMTK Reset pin
16MTK-BUSYOBUSY Signal communication between MTK
17MTK-CLKIClock Signal from MTK
18Vss-Ground terminal
19MTK-XIFCSIMTK CHIP SELECT
20MTK-SDIIData In Signal from MTK
21Vcc-Power supply terminal (+3.3V)
22MTK-SDOOData Out Signal to MTK
23Vss-Ground terminal
24SSI3_BCK0IBit clock signal from MTK or DIR to Aragon
25PVcc-Power supply terminal (+3.3V)
26SSI3_LRCKOILR clock signal from MTK or DIR to Aragon
27C-CONTOTrigger port to start charging of SPM
28SSI3_DIIData signal from MTK or DIR to Aragon
29SSI0_BCKOOClock signal from Aragon to Wf DAC BCK
30SSI0_LRCKOOClock signal from Aragon to Wf DAC LRCK
31Vss-Ground terminal
32SSI0_DOOData Out from Aragon to Wf DAC
33SSI2_DOOData Out from Aragon to AUX OUT DAC
34Vcc-Power supply terminal (+3.3V)
35LCD-CLKOFL CIG serial data clock output
36Vss-Ground terminal
37CKIO-Not used
38LCD-CSBOFL CHIP SELECT
39PVcc-Power supply terminal (+3.3V)
40LCD-SDAOFL CIG serial data output
41ANALOG-ASELOMultiplexer selector A for Analog input
42ANALOG-BSELOMultiplexer selector B for Analog input
43DEBUG-TxDOTxD (for Debug)
44JOG+OFILE SEARCH JOG POS
45POWER-KEYIPower Key input terminal
46Vss-Ground terminal
47USB-OCIUSB Overcurrent Detection input port
48RGB-SOUTOSerial data output to RGB driver
49JOG-OFILE SEARCH JOG NEG
50PVcc-Power supply terminal (+3.3V)
51LINK-OUT-BOSelector B for Party Chain Signal
52VBUS-OEOMTK Vbus Output enable control pin
53NFC-RF-DETINFC RF signal detection signal input from the NFC section
54SSI1_DOOData Out signal from Aragon to SWF DAC
66
Page 67
Pin No.Pin NameI/ODescription
55SSI1_DIIData In Signal from ADC to Aragon
56SD_FASTISD FAST DETECT
57
58Vcc-Power supply terminal (+3.3V)
59LINK-DETIParty Chain input bias detection pin
60USB_HOST_SELOUSB UPDATE SELECTOR
61Vss-Ground terminal
62PVcc-Power supply terminal (+3.3V)
63AC-CUTIAC off detection signal input from the reset signal IC “L”: AC Cut detected
64DEBUG-RxDIRxD (for Debug)
65BT-RxDIRX input signal from Bluetooth section
66MD-CLKSOFor ARAGON Internal SRC
67RTC_X1IRTC clock input terminal
68RTC_X2ORTC clock output terminal
69PLLVcc-Power supply terminal (+3.3V)
70EXTALISystem clock input terminal
71XTALOSystem clock output terminal
72Vss-Ground terminal
73Vss-Ground terminal
74NMI-Non-maskable interrupt input terminal
75Vss-Ground terminal
76RESIReset signal
77PVcc-Power supply terminal (+3.3V)
78AMP PROTECTICombination of TEMP, PS, SD & DC PROTECT
79SPM-C-MONIVoice coil temperature monitor pin
80
81MODEL-DEST-INIModel and Destination setting terminal (A/D input)
82FAN-DETIFan speed detect
83MASTER-VOLUMEIJog dial pulse input from the MASTER VOLUME encoder (A/D input)
84AD-KEY0IKey input terminal (A/D input)
85AD-KEY1IKey input terminal (A/D input)
86AVcc-Power supply terminal (+3.3V)
87AVss-Ground terminal
88AVref-A/D Converter reference voltage input terminal (+3.3V)
89BSCANP-Boundary scan setting pin
90PVcc-Power supply terminal (+3.3V)
91AUDIO_X1IAudio clock input terminal
92AUDIO_X2OAudio clock output terminal
93Vss-Ground terminal
94/LINE-MUTEOMuting Control Switch for Party Chain. “L”: mute On
95Vcc-Power supply terminal (+3.3V)
96PCONT-BTSTBYOBT Standby Power Control Pin. “H”: ON
97TRSTIDebugging interface: Initialization-signal input pin
98TDOODebugging interface: Serial output pin for instructions and data
99TDIIDebugging interface: Serial input pin for instructions and data
100TMSIDebugging interface: Test-mode select signal input pin
101TCKIDebugging interface: Test-clock input pin
102Vss-Ground terminal
103
104
105Vcc-Power supply terminal (+3.3V)
106
PCONT-PSAVE-
PROTECT
SPM-AMBIENT-
TEMP
TEST-MON103/
SD_D2_0
TEST-MON104/
SD_D3_0
TEST-MON106/
SD_CMD_0
OMain power on/off control signal output “H”:power on
113
114ST-RDSIInput for RDS Text Detect Signal (L: RDS Detect)
115ST-CEOTuner IC: Tuner enable input pin
116Vss-Ground terminal
117PCONT-DAMPODigital Amp Module Power Control Pin. “H”: ON
118RGB-PWM-CLKOPWM clock signal to RGB driver
119Vcc-Power supply terminal (+3.3V)
120/AMP-RESETODigital Amp Reset Pin
121Vss-Ground terminal
122CD-MOTOR+OCDM turning motor control signal output
123PVcc-Power supply terminal (+3.3V)
124CD-MOTOR-OCDM turning motor control signal output
125DIR_CP-CLKODIR & CP share clock
126DIR_CP-DATAI/ODIR & CP share data
127ST-CLKOTuner IC: Clock signal for IIC communication
128ST-DATAI/OTuner IC: Data signal for IIC communication
129RELAY CONTROLORelay control
130DIR INT0IDIR INTERRUPT 0
131NFC_CLKONFC CLOCK
132NFC_DATAI/OTwo-way data bus with the NFC
133BT-TxDOTX signal output terminal for Bluetooth section
134LCD_INHBOFL inhibit pin
135SIRCSIRemote control signal input
136DIR INT1IDIR INTERRUPT 1
137RGB-SCLKOSerial clock output to RGB driver
138Vss-Ground terminal
139USB_X1IUSB clock input terminal
140USB_X2OUSB clock output terminal
141USBDPVcc-Power supply terminal (+3.3V)
142USBDPVss-Ground terminal
143DM1-Not used
144DP1-Not used
145VBUSIN1-Not used
146USBDVcc-Power supply terminal (+3.3V)
147USBDVss-Ground terminal
148USBDPVcc-Power supply terminal (+3.3V)
149USBDPVss-Ground terminal
150USB_DM0I/OD- PIN FOR USB 2.0
151USB_DP0I/OD+ PIN FOR USB 2.0
152VBUSIN0OVBUS +5.0V supply monitoring pin
153USBDVcc-Power supply terminal (+3.3V)
154USBDVss-Ground terminal
155REFRINIReference input
156USBAPVss-Ground terminal
157USBAPVcc-Power supply terminal (+3.3V)
158USBAVcc-Power supply terminal (+3.3V)
TEST-MON108/
SD_CLK
TEST-MON110/
SD_D0_0
ANALOG-DSEL/
SD_D1_0
RGB-TRANS-LED-
SPK/SD_WP_0
RGB-TRANS-LED/
SD_CD_0
OTest port for software checking
OTest port for software checking
OANALOG INPUT SELECTOR D
OTransfer signal to RGB driver (driver for Speaker LED)
OTransfer signal to RGB driver
68
Page 69
Pin No.Pin NameI/ODescription
159USBAVss-Ground terminal
160USBUVcc-Power supply terminal (+3.3V)
161USBUVss-Ground terminal
162Vss-Ground terminal
163Vss-Ground terminal
164ANALOG-CSELOANALOG INPUT SELECTOR C
165DIR-RESETODIR RESET
166Q-FLASH-SIO2I/OQSPI: Data I/O pins for channel 0
167Q-FLASH-SIO3I/OQSPI: Data I/O pins for channel 0
168Q-FLASH-CLKOClock signal to QSPI
169Q-FLASH-CSOSlave select pin to QSPI
170Q-FLASH-SIO0I/OQSPI: Data I/O pins for channel 0
171Vss-Ground terminal
172Q-FLASH-SIO1I/OQSPI: Data I/O pins for channel 0
173MIC-DETECTIMic Input Detection pin. “H”: Mic detected
174PVcc-Power supply terminal (+3.3V)
175LINK-SETOParty Chain output bias pin
176LINK-OUT-AOSelector A for Party Chain Signal
HCD-GT3D
69
Page 70
HCD-GT3D
MOTHERBOARD BOARD (5/10) IC301 CXD9990R (CD RF AMP FOCUS/TRACKING ERROR AMP, CD SYSTEM
PROCESSOR, DIGITAL SERVO PROCESSOR)
Pin No.Pin NameI/ODescription
1RF_CIRF main beam C input from the optical pick-up block
2RF_DIRF main beam D input from the optical pick-up block
3RF_EIRF sub beam E input from the optical pick-up block
4RF_FIRF sub beam F input from the optical pick-up block
5AVDD12_2-Power supply terminal (+1.2V) (for analog system)
6AVDD33_1-Power supply terminal (+3.3V) (for analog system)
7XTALIISystem clock input terminal (27 MHz)
8XTALOOSystem clock output terminal (27 MHz)
9AGND33-Ground terminal (for analog system)
10V20OReference voltage (+2V) output to the optical pick-up block
11V14/VREF0OReference voltage (+1.4V) output to the coil / motor driver
12REXTICurrent reference input terminal
13MDI1ILaser power monitor input from the optical pick-up block
14LDO1OLaser diode drive signal output to the optical pick-up block (for CD)
15LDO2OLaser diode drive signal output to the optical pick-up block (for DVD)
16AVDD33_2-Power supply terminal (+3.3V) (for analog system)
17DMOOSpindle motor control signal output to the motor driver
18FMOOSled motor control signal output to the motor driver
19CD_VROVariable resistor control signal output to the optical pick-up block (for CD)
20DVD_VROVariable resistor control signal output to the optical pick-up block (for DVD)
21TROOTracking coil control signal output to the coil / motor driver
22FOOOFocus coil control signal output to the coil / motor driver
23MSWOCD/DVD selection signal output terminal “L”: DVD, “H”: CD
24USB_DMI/OTwo-way USB data (-) bus terminal
25USB_DPI/OTwo-way USB data (+) bus terminal
26VDD33_USB-Power supply terminal (+3.3V) (for USB)
27VSS33_USB-Ground terminal (for USB)
28PAD_VRTI/OUSB generating reference current terminal
29VDD12_USB-Power supply terminal (+1.2V) (for USB)
30SF_CS#OChip select signal output to the serial fl ash
31SF_DOOSerial data output to the serial fl ash
32SF_DIISerial data input from the serial fl ash
33SF_CKOSerial clock signal output to the serial fl ash
34IFSCKOSerial data transfer clock signal output to the system controller
35IFSDOOSerial data output to the system controller
36RXISerial data input terminal for fl ash writing
37TXOSerial data output terminal for fl ash writing
38PRST#IReset signal input from the system controller “L”: reset
39NC-Not used
40IFSDIISerial data input from the system controller
41IFBSYICommunication initialization request signal input from the system controller
42IFCS#OCommunication initialization request acknowledge signal output to the system controller
43MFISW-Not used
44LIMITSW-Not used
45MUTEOMuting signal output to the coil/motor driver (for focus/tracking coil and sled motor)
46EEWPOWrite protect signal output with the EEPROM
47SDAI/OTwo-way I2C data signal with EEPROM
48SCLI/OTwo-way I2C clock signal with EEPROM
49NC-Not used
50DVSS33-Ground terminal (for digital system)
51DVDD33-Power supply terminal (+3.3V) (for digital system)
52 to 55RD0 to RD3I/OTwo-way data bus with the SD-RAM
56DVDD12-Power supply terminal (+1.2V) (for digital system)
57 to 60RD4 to RD7I/OTwo-way data bus with the SD-RAM
70
Page 71
Pin No.Pin NameI/ODescription
61DQM0OData mask signal output to the SD-RAM
62 to 69RD15 to RD8I/OTwo-way data bus with the SD-RAM
70DQM1OData mask signal output to the SD-RAM
71DVDD33-Power supply terminal (+3.3V) (for digital system)
72RCLKOClock signal output to the SD-RAM
73 to 79RA11, RA9 to RA4OAddress signal output to the SD-RAM
80RWE#OWrite enable signal output to the SD-RAM
81DVSS12-Ground terminal (for digital system)
82CAS#OColumn address strobe signal output to the SD-RAM
83RAS#ORow address strobe signal output to the SD-RAM
84DVDD33-Power supply terminal (+3.3V) (for digital system)
85BA0OBank address signal output to the SD-RAM
86BA1OBank address signal output to the SD-RAM
87DVDD12-Power supply terminal (+1.2V) (for digital system)
88 to 92RA10, RA0 to RA3OAddress signal output to the SD-RAM
93SPDIF-Not used
94XMAMUTE-Not used
95NC-Not used
96DACVDDC-Power supply terminal (+3.3V) (for D/A converter)
97VREFIBand gap reference voltage terminal
98FSIFull scale adjustment terminal
99DACVSSC-Ground terminal (for D/A converter)
100CVBSOComposite video signal output terminal
101DACVDDB-Power supply terminal (+3.3V) (for D/A converter)
102SY/Y/G-Not used
103SC/CB/B-Not used
104CR/R-Not used
105AADVSS-Ground terminal (for D/A converter)
106ADINIAudio data input from the A/D converter
107NC-Not used
108NC-Not used
109AADVDD-Power supply terminal (+3.3V) (for D/A converter)
110ADACVSS2-Ground terminal (for D/A converter)
111ADACVSS1-Ground terminal (for D/A converter)
112ACLKOMaster clock signal output
113ABCKOBit clock signal output
114NC-Not used
115AVCMIAudio D/A converter reference voltage terminal
116NC-Not used
117ALRCKOL/R sampling clock signal output
118ASDATA0OAudio data output
119ADACVDD1-Power supply terminal (+3.3V) (for D/A converter)
120ADACVDD2-Power supply terminal (+3.3V) (for D/A converter)
121AVDD12_1-Power supply terminal (+1.2V) (for analog system)
122AGND12-Ground terminal (for analog system)
123RFIPIAC coupled RF signal input from the optical pick-up block
124OPDISTIOptical pick-up block type selection
125IOPMON/OPOIPower monitor terminal
126SPFG/OPISpindle motor hall sensor input from the motor driver
127RF_AIRF main beam A input from the optical pick-up block
128RF_BIRF main beam B input from the optical pick-up block
HCD-GT3D
71
Page 72
HCD-GT3D
Ver. 1.2
Note:
• The mechanical parts with no reference
number in the exploded views are not sup-
plied.
• Items marked “*” are not stocked since
they are seldom required for routine
service.
Some delay should be anticipated
when ordering these items.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
7-1. SIDE PANEL SECTION
SECTION 7
EXPLODED VIEWS
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
The components identifi ed by mark 9 con-
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
1
2
loading panel section
#1
#1
D
F
#1
D
C
F
C
B
#2
B
G
G
E
A
#1
A
E
#1
top panel section
#1
#2
#1
3
1
1 (Type A) 1 (Type B)
Note 1: The screw type which screw between “PANEL, SIDE and PANEL, TOP” and “PANEL, SIDE and CHASSIS” for
this unit have been changed in the midway of production. About the screw type discrimination, refer to “SCREW
TYPE DISCRIMINATION BEFORE DISASSEMBLE THE PANEL, SIDE” on servicing notes (page 6).
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 4-546-397-01 SCREW, TAPPING (HEX) (Type A)
1 4-162-271-01 SCREW, TAPPING (Type B)
2 X-2590-652-2 PANEL, SIDE (L) ASSY
3 X-2590-653-2 PANEL, SIDE (R) ASSY
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor .
F: nonfl ammable.
• Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
BUTTON BOARD
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
SECTION 8
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
When indicating parts by reference number, please include the board name.
The components identifi ed by mark 9
contain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
R3141 1-216-835-11 METAL CHIP 15K 5% 1/10W
R3142 1-216-819-11 METAL CHIP 680 5% 1/10W
R3143 1-216-821-11 METAL CHIP 1K 5% 1/10W
R3144 1-216-823-11 METAL CHIP 1.5K 5% 1/10W
R3145 1-216-823-11 METAL CHIP 1.5K 5% 1/10W
R3146 1-216-825-11 METAL CHIP 2.2K 5% 1/10W
R3147 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R3148 1-216-829-11 METAL CHIP 4.7K 5% 1/10W
R3149 1-218-867-11 METAL CHIP 6.8K 0.5% 1/10W
D1008 6-500-400-01 DIODE BAV99-215
D1013 6-502-961-01 DI DA2J10100L
D1014 6-502-970-01 DI DZ2J068M0L
D1016 6-503-987-01 DI RF05VAM2STR
D1017 8-719-073-35 DIODE RB551V-30TE-17
Note 2:
When the C1126, C1127, C1128, C1129 and C1142 on the
DAMP board are replaced, spread the bond referring to “BOND
FIXATION OF ELECTRIC PARTS” on servicing notes (page 6).
81
Page 82
HCD-GT3D
Ver. 1.1
DAMP
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
< IC >
IC1001 6-716-817-01 IC TAS5630BPHDR
IC1003 6-716-462-01 IC BD00GA3WEFJ-E2
IC1004 8-759-274-71 IC NJM4565M (TE2)
IC1005 8-759-274-71 IC NJM4565M (TE2)
FL601 1-234-494-21 FILTER, EMI REMOVAL (SMD)
< IC >
IC001 (Not supplied) IC TPS542941PWPR
IC002 (Not supplied) IC TPS542941PWPR
IC004 6-721-872-01 IC 78D09AG-TN3-R
IC006 6-721-766-01 IC 78D05AG-TN3-R
IC008 6-719-198-01 IC MM3411A33URE
IC101 (Not supplied) IC R7S7200032CFP-A
IC102 6-707-866-01 IC TC74VHC126FT (EK)
IC103 6-719-856-01 IC BU4229F-TR
IC105 (Not supplied) IC MFI337S3959
IC106 (Not supplied) IC MX25L3235EM2I-10G
IC301 (Not supplied) IC CXD9990R
IC302 (Not supplied) IC MX25L3235EM2I-10G
IC303 (Not supplied) IC BD00IC0WHFV-GTR
IC304 6-714-351-01 IC R1EX24016ASAS0A
IC305 6-717-694-01 IC BU33TD3WG-TR
IC306 6-720-801-01 IC EM638165TSD-6G
IC401 6-720-195-01 IC AM5890S
IC452 6-721-822-01 IC NJM2903CV (TE1)
IC453 6-721-811-01 IC TC7USB40FT
IC502 6-719-142-01 IC TC62D723FNG
IC601 8-759-909-71 IC BA4558F
IC602 8-759-596-39 IC SN74LV4052APWR
IC603 8-759-909-71 IC BA4558F
IC604 6-705-973-01 IC PCM1754DBQR
IC605 8-759-596-39 IC SN74LV4052APWR
IC606 6-710-554-01 IC PCM1808PWR
IC609 6-710-554-01 IC PCM1808PWR
IC615 6-705-973-01 IC PCM1754DBQR
IC901 6-720-187-01 IC NJM41031F1 (TE2)
IC902 6-720-234-01 IC RN5B801-0002
IC903 6-719-198-01 IC MM3411A33URE
IC904 6-716-745-01 IC PCM9211PTR
IC912 6-707-870-01 IC TC74VHC157FT (EK)
IC913 8-759-680-48 IC TC7WH157FK
IC914 6-721-848-01 IC PCM5101
87
Page 88
HCD-GT3D
Ver. 1.1
MOTHERBOARD
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
< JACK >
R002 1-208-709-11 METAL CHIP 12K 0.50% 1/16W
R003 1-208-923-11 METAL CHIP 33K 0.50% 1/16W
R006 1-208-911-11 METAL CHIP 10K 0.50% 1/16W
R020 1-216-864-11 SHORT CHIP 0
R023 1-218-974-11 METAL CHIP 56K 5% 1/16W
R024 1-208-895-81 METAL CHIP 2.2K 0.50% 1/16W
R028 1-218-965-11 METAL CHIP 10K 5% 1/16W
R029 1-216-843-11 METAL CHIP 68K 5% 1/10W
R030 1-218-843-11 METAL CHIP 680 0.50% 1/10W
R031 1-208-911-11 METAL CHIP 10K 0.50% 1/16W
R033 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R034 1-216-813-11 METAL CHIP 220 5% 1/10W
R035 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R036 1-216-864-11 SHORT CHIP 0
R037 1-218-965-11 METAL CHIP 10K 5% 1/16W
R039 1-218-965-11 METAL CHIP 10K 5% 1/16W
R040 1-216-817-11 METAL CHIP 470 5% 1/10W
R041 1-208-709-11 METAL CHIP 12K 0.50% 1/16W
R043 1-208-715-11 METAL CHIP 22K 0.50% 1/16W
R048 1-216-864-11 SHORT CHIP 0
R051 1-216-295-91 SHORT CHIP 0
R052 1-216-295-91 SHORT CHIP 0
R053 1-216-864-11 SHORT CHIP 0
R054 1-216-864-11 SHORT CHIP 0
R059 1-208-931-11 METAL CHIP 68K 0.50% 1/16W
R061 1-218-965-11 METAL CHIP 10K 5% 1/16W
R062 1-216-813-11 METAL CHIP 220 5% 1/10W
R063 1-216-864-11 SHORT CHIP 0
R064 1-216-843-11 METAL CHIP 68K 5% 1/10W
R065 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R066 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R080 1-216-864-11 SHORT CHIP 0
R085 1-257-604-11 RES-CHIP 47 5% 2W
R086 1-216-295-91 SHORT CHIP 0
R087 1-216-295-91 SHORT CHIP 0
R099 1-216-864-11 SHORT CHIP 0
R100 1-218-937-11 METAL CHIP 47 5% 1/16W
R102 1-218-941-81 METAL CHIP 100 5% 1/16W
R103 1-218-965-11 METAL CHIP 10K 5% 1/16W
R104 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R105 1-218-941-81 METAL CHIP 100 5% 1/16W
R106 1-218-965-11 METAL CHIP 10K 5% 1/16W
R107 1-218-965-11 METAL CHIP 10K 5% 1/16W
R108 1-218-965-11 METAL CHIP 10K 5% 1/16W
R109 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R110 1-218-977-11 METAL CHIP 100K 5% 1/16W
R111 1-218-977-11 METAL CHIP 100K 5% 1/16W
R112 1-218-977-11 METAL CHIP 100K 5% 1/16W
R113 1-216-864-11 SHORT CHIP 0
R114 1-216-864-11 SHORT CHIP 0
R115 1-218-953-11 METAL CHIP 1K 5% 1/16W
R116 1-218-973-11 METAL CHIP 47K 5% 1/16W
R117 1-218-963-11 METAL CHIP 6.8K 5% 1/16W
R119 1-218-965-11 METAL CHIP 10K 5% 1/16W
R120 1-218-973-11 METAL CHIP 47K 5% 1/16W
R122 1-218-990-81 SHORT CHIP 0
R123 1-218-965-11 METAL CHIP 10K 5% 1/16W
R125 1-218-973-11 METAL CHIP 47K 5% 1/16W
R126 1-218-990-81 SHORT CHIP 0
88
Page 89
HCD-GT3D
Ver. 1.1
MOTHERBOARD
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R127 1-218-965-11 METAL CHIP 10K 5% 1/16W
R201 1-218-941-81 METAL CHIP 100 5% 1/16W
R128 1-218-953-11 METAL CHIP 1K 5% 1/16W
R129 1-218-941-81 METAL CHIP 100 5% 1/16W
R131 1-218-941-81 METAL CHIP 100 5% 1/16W
R132 1-218-937-11 METAL CHIP 47 5% 1/16W
R133 1-218-937-11 METAL CHIP 47 5% 1/16W
R134 1-218-937-11 METAL CHIP 47 5% 1/16W
R135 1-218-937-11 METAL CHIP 47 5% 1/16W
R137 1-218-969-11 METAL CHIP 22K 5% 1/16W
R139 1-218-969-11 METAL CHIP 22K 5% 1/16W
R140 1-218-969-11 METAL CHIP 22K 5% 1/16W
R142 1-216-295-91 SHORT CHIP 0
R143 1-218-969-11 METAL CHIP 22K 5% 1/16W
R144 1-218-967-11 METAL CHIP 15K 5% 1/16W
R145 1-218-967-11 METAL CHIP 15K 5% 1/16W
R146 1-218-965-11 METAL CHIP 10K 5% 1/16W
R149 1-218-965-11 METAL CHIP 10K 5% 1/16W
R150 1-218-941-81 METAL CHIP 100 5% 1/16W
R153 1-218-941-81 METAL CHIP 100 5% 1/16W
R154 1-218-941-81 METAL CHIP 100 5% 1/16W
R155 1-218-941-81 METAL CHIP 100 5% 1/16W
R156 1-218-941-81 METAL CHIP 100 5% 1/16W
R157 1-218-953-11 METAL CHIP 1K 5% 1/16W
R158 1-218-949-11 METAL CHIP 470 5% 1/16W
R159 1-218-949-11 METAL CHIP 470 5% 1/16W
R160 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R161 1-218-965-11 METAL CHIP 10K 5% 1/16W
R163 1-218-990-81 SHORT CHIP 0
R164 1-218-941-81 METAL CHIP 100 5% 1/16W
R166 1-218-941-81 METAL CHIP 100 5% 1/16W
R167 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R202 1-218-965-11 METAL CHIP 10K 5% 1/16W
R203 1-218-941-81 METAL CHIP 100 5% 1/16W
R204 1-218-965-11 METAL CHIP 10K 5% 1/16W
R206 1-218-965-11 METAL CHIP 10K 5% 1/16W
R210 1-218-937-11 METAL CHIP 47 5% 1/16W
R211 1-218-941-81 METAL CHIP 100 5% 1/16W
R212 1-218-937-11 METAL CHIP 47 5% 1/16W
R213 1-218-941-81 METAL CHIP 100 5% 1/16W
R214 1-218-937-11 METAL CHIP 47 5% 1/16W
R215 1-218-941-81 METAL CHIP 100 5% 1/16W
R216 1-218-965-11 METAL CHIP 10K 5% 1/16W
R217 1-218-937-11 METAL CHIP 47 5% 1/16W
R218 1-218-941-81 METAL CHIP 100 5% 1/16W
R219 1-218-941-81 METAL CHIP 100 5% 1/16W
R220 1-218-937-11 METAL CHIP 47 5% 1/16W
R221 1-218-941-81 METAL CHIP 100 5% 1/16W
R222 1-218-965-11 METAL CHIP 10K 5% 1/16W
R223 1-218-941-81 METAL CHIP 100 5% 1/16W
R224 1-218-990-81 SHORT CHIP 0
R225 1-218-941-81 METAL CHIP 100 5% 1/16W
R226 1-218-941-81 METAL CHIP 100 5% 1/16W
R227 1-218-941-81 METAL CHIP 100 5% 1/16W
R228 1-218-941-81 METAL CHIP 100 5% 1/16W
R229 1-218-941-81 METAL CHIP 100 5% 1/16W
R230 1-218-941-81 METAL CHIP 100 5% 1/16W
R232 1-218-937-11 METAL CHIP 47 5% 1/16W
R233 1-218-941-81 METAL CHIP 100 5% 1/16W
R234 1-218-941-81 METAL CHIP 100 5% 1/16W
R236 1-218-941-81 METAL CHIP 100 5% 1/16W
R237 1-218-941-81 METAL CHIP 100 5% 1/16W
R168 1-218-941-81 METAL CHIP 100 5% 1/16W
R169 1-218-937-11 METAL CHIP 47 5% 1/16W
R170 1-218-937-11 METAL CHIP 47 5% 1/16W
R171 1-218-941-81 METAL CHIP 100 5% 1/16W
R172 1-218-941-81 METAL CHIP 100 5% 1/16W
R173 1-218-941-81 METAL CHIP 100 5% 1/16W
R174 1-218-941-81 METAL CHIP 100 5% 1/16W
R175 1-218-965-11 METAL CHIP 10K 5% 1/16W
R176 1-218-941-81 METAL CHIP 100 5% 1/16W
R177 1-218-941-81 METAL CHIP 100 5% 1/16W
R178 1-218-941-81 METAL CHIP 100 5% 1/16W
R179 1-218-941-81 METAL CHIP 100 5% 1/16W
R180 1-218-941-81 METAL CHIP 100 5% 1/16W
R181 1-218-941-81 METAL CHIP 100 5% 1/16W
R183 1-218-965-11 METAL CHIP 10K 5% 1/16W
R185 1-218-990-81 SHORT CHIP 0
R186 1-218-990-81 SHORT CHIP 0
R188 1-218-989-11 METAL CHIP 1M 5% 1/16W
R189 1-218-941-81 METAL CHIP 100 5% 1/16W
R190 1-218-977-11 METAL CHIP 100K 5% 1/16W
R191 1-218-941-81 METAL CHIP 100 5% 1/16W
R192 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R193 1-218-941-81 METAL CHIP 100 5% 1/16W
R194 1-218-965-11 METAL CHIP 10K 5% 1/16W
R195 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R196 1-250-567-11 METAL CHIP 1M 1% 1/16W
R197 1-218-941-81 METAL CHIP 100 5% 1/16W
R198 1-218-990-81 SHORT CHIP 0
R200 1-218-990-81 SHORT CHIP 0
R238 1-218-941-81 METAL CHIP 100 5% 1/16W
R241 1-218-941-81 METAL CHIP 100 5% 1/16W
R242 1-218-941-81 METAL CHIP 100 5% 1/16W
R243 1-218-941-81 METAL CHIP 100 5% 1/16W
R244 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R245 1-218-941-81 METAL CHIP 100 5% 1/16W
R246 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R247 1-218-941-81 METAL CHIP 100 5% 1/16W
R248 1-218-941-81 METAL CHIP 100 5% 1/16W
R250 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R251 1-218-941-81 METAL CHIP 100 5% 1/16W
R252 1-218-941-81 METAL CHIP 100 5% 1/16W
R253 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R254 1-218-941-81 METAL CHIP 100 5% 1/16W
R255 1-218-941-81 METAL CHIP 100 5% 1/16W
R256 1-218-965-11 METAL CHIP 10K 5% 1/16W
R257 1-218-941-81 METAL CHIP 100 5% 1/16W
R259 1-218-965-11 METAL CHIP 10K 5% 1/16W
R260 1-216-864-11 SHORT CHIP 0
R261 1-218-990-81 SHORT CHIP 0
R263 1-218-965-11 METAL CHIP 10K 5% 1/16W
R264 1-216-864-11 SHORT CHIP 0
R265 1-250-471-11 METAL CHIP 100 1% 1/16W
R267 1-218-965-11 METAL CHIP 10K 5% 1/16W
R268 1-218-965-11 METAL CHIP 10K 5% 1/16W
R269 1-218-989-11 METAL CHIP 1M 5% 1/16W
R270 1-218-941-81 METAL CHIP 100 5% 1/16W
R271 1-218-941-81 METAL CHIP 100 5% 1/16W
R272 1-218-941-81 METAL CHIP 100 5% 1/16W
89
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HCD-GT3D
Ver. 1.1
MOTHERBOARD
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R273 1-218-941-81 METAL CHIP 100 5% 1/16W
R354 1-218-990-81 SHORT CHIP 0
R274 1-218-941-81 METAL CHIP 100 5% 1/16W
R275 1-218-949-11 METAL CHIP 470 5% 1/16W
R276 1-218-941-81 METAL CHIP 100 5% 1/16W
R278 1-218-941-81 METAL CHIP 100 5% 1/16W
R279 1-218-941-81 METAL CHIP 100 5% 1/16W
R280 1-218-941-81 METAL CHIP 100 5% 1/16W
R282 1-218-965-11 METAL CHIP 10K 5% 1/16W
R283 1-218-965-11 METAL CHIP 10K 5% 1/16W
R284 1-218-965-11 METAL CHIP 10K 5% 1/16W
R285 1-208-905-11 METAL CHIP 5.6K 0.50% 1/16W
R286 1-218-977-11 METAL CHIP 100K 5% 1/16W
R287 1-218-977-11 METAL CHIP 100K 5% 1/16W
R288 1-218-937-11 METAL CHIP 47 5% 1/16W
R289 1-218-937-11 METAL CHIP 47 5% 1/16W
R290 1-218-937-11 METAL CHIP 47 5% 1/16W
R291 1-218-937-11 METAL CHIP 47 5% 1/16W
R292 1-218-937-11 METAL CHIP 47 5% 1/16W
R293 1-218-937-11 METAL CHIP 47 5% 1/16W
R294 1-218-977-11 METAL CHIP 100K 5% 1/16W
R295 1-218-941-81 METAL CHIP 100 5% 1/16W
R297 1-218-941-81 METAL CHIP 100 5% 1/16W
R298 1-218-965-11 METAL CHIP 10K 5% 1/16W
R299 1-218-965-11 METAL CHIP 10K 5% 1/16W
R300 1-218-965-11 METAL CHIP 10K 5% 1/16W
R301 1-218-941-81 METAL CHIP 100 5% 1/16W
* R302 1-250-529-11 METAL CHIP 27K 1% 1/16W
R303 1-250-535-11 METAL CHIP 47K 1% 1/16W
R310 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R312 1-218-953-11 METAL CHIP 1K 5% 1/16W
R313 1-218-953-11 METAL CHIP 1K 5% 1/16W
R355 1-218-990-81 SHORT CHIP 0
R356 1-218-937-11 METAL CHIP 47 5% 1/16W
R357 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R358 1-218-941-81 METAL CHIP 100 5% 1/16W
R359 1-218-953-11 METAL CHIP 1K 5% 1/16W
R360 1-218-941-81 METAL CHIP 100 5% 1/16W
R361 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R362 1-218-965-11 METAL CHIP 10K 5% 1/16W
R363 1-218-990-81 SHORT CHIP 0
R364 1-218-990-81 SHORT CHIP 0
R365 1-218-937-11 METAL CHIP 47 5% 1/16W
R366 1-218-990-81 SHORT CHIP 0
R367 1-218-947-11 METAL CHIP 330 5% 1/16W
R368 1-250-475-11 METAL CHIP 150 1% 1/16W
R369 1-218-933-11 METAL CHIP 22 5% 1/16W
* R370 1-250-489-11 METAL CHIP 560 1% 1/16W
R371 1-216-864-11 SHORT CHIP 0
R372 1-218-965-11 METAL CHIP 10K 5% 1/16W
R373 1-216-864-11 SHORT CHIP 0
R374 1-218-965-11 METAL CHIP 10K 5% 1/16W
R376 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R377 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R378 1-216-864-11 SHORT CHIP 0
R379 1-218-933-11 METAL CHIP 22 5% 1/16W
R380 1-218-941-81 METAL CHIP 100 5% 1/16W
R381 1-218-965-11 METAL CHIP 10K 5% 1/16W
R382 1-218-965-11 METAL CHIP 10K 5% 1/16W
R386 1-216-295-91 SHORT CHIP 0
R387 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R388 1-218-977-11 METAL CHIP 100K 5% 1/16W
R316 1-218-953-11 METAL CHIP 1K 5% 1/16W
R317 1-218-953-11 METAL CHIP 1K 5% 1/16W
R318 1-218-965-11 METAL CHIP 10K 5% 1/16W
R319 1-218-965-11 METAL CHIP 10K 5% 1/16W
R321 1-218-941-81 METAL CHIP 100 5% 1/16W
R322 1-216-864-11 SHORT CHIP 0
R326 1-216-864-11 SHORT CHIP 0
R327 1-218-937-11 METAL CHIP 47 5% 1/16W
R328 1-216-798-11 METAL CHIP 12 5% 1/10W
R329 1-216-864-11 SHORT CHIP 0
R330 1-218-967-11 METAL CHIP 15K 5% 1/16W
R331 1-218-937-11 METAL CHIP 47 5% 1/16W
R332 1-250-483-11 METAL CHIP 330 1% 1/16W
* R334 1-250-543-11 METAL CHIP 100K 1% 1/16W
R335 1-216-864-11 SHORT CHIP 0
R337 1-216-864-11 SHORT CHIP 0
R339 1-250-512-11 METAL CHIP 5.1K 1% 1/16W
R340 1-218-937-11 METAL CHIP 47 5% 1/16W
R342 1-218-937-11 METAL CHIP 47 5% 1/16W
R343 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R344 1-218-941-81 METAL CHIP 100 5% 1/16W
R345 1-218-941-81 METAL CHIP 100 5% 1/16W
R346 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R347 1-218-990-81 SHORT CHIP 0
R348 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R349 1-218-941-81 METAL CHIP 100 5% 1/16W
R350 1-218-990-81 SHORT CHIP 0
R351 1-218-965-11 METAL CHIP 10K 5% 1/16W
R352 1-218-941-81 METAL CHIP 100 5% 1/16W
R389 1-218-941-81 METAL CHIP 100 5% 1/16W
R390 1-218-929-11 METAL CHIP 10 5% 1/16W
R401 1-218-965-11 METAL CHIP 10K 5% 1/16W
R402 1-218-970-81 METAL CHIP 27K 5% 1/16W
R404 1-257-362-21 METAL CHIP 1 5% 1/2W
R406 1-218-990-81 SHORT CHIP 0
R407 1-218-990-81 SHORT CHIP 0
R408 1-218-965-11 METAL CHIP 10K 5% 1/16W
R409 1-218-965-11 METAL CHIP 10K 5% 1/16W
R410 1-218-965-11 METAL CHIP 10K 5% 1/16W
R411 1-218-965-11 METAL CHIP 10K 5% 1/16W
R415 1-218-970-81 METAL CHIP 27K 5% 1/16W
R418 1-218-967-11 METAL CHIP 15K 5% 1/16W
R421 1-218-941-81 METAL CHIP 100 5% 1/16W
R422 1-218-973-11 METAL CHIP 47K 5% 1/16W
* R423 1-250-572-11 METAL CHIP 15 1% 1/10W
R424 1-218-977-11 METAL CHIP 100K 5% 1/16W
* R425 1-250-572-11 METAL CHIP 15 1% 1/10W
* R426 1-250-572-11 METAL CHIP 15 1% 1/10W
* R427 1-250-572-11 METAL CHIP 15 1% 1/10W
* R428 1-250-572-11 METAL CHIP 15 1% 1/10W
R429 1-218-977-11 METAL CHIP 100K 5% 1/16W
* R430 1-250-572-11 METAL CHIP 15 1% 1/10W
R431 1-218-973-11 METAL CHIP 47K 5% 1/16W
R432 1-218-941-81 METAL CHIP 100 5% 1/16W
R433 1-216-295-91 SHORT CHIP 0
R463 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R464 1-218-971-81 METAL CHIP 33K 5% 1/16W
R465 1-218-941-81 METAL CHIP 100 5% 1/16W
90
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HCD-GT3D
Ver. 1.1
MOTHERBOARD
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R466 1-216-295-91 SHORT CHIP 0
R607 1-218-985-11 METAL CHIP 470K 5% 1/16W
R467 1-216-295-91 SHORT CHIP 0
R470 1-218-990-81 SHORT CHIP 0
R471 1-218-990-81 SHORT CHIP 0
R472 1-218-990-81 SHORT CHIP 0
R478 1-216-864-11 SHORT CHIP 0
R479 1-218-981-81 METAL CHIP 220K 5% 1/16W
R480 1-218-990-81 SHORT CHIP 0
R483 1-218-953-11 METAL CHIP 1K 5% 1/16W
R485 1-218-953-11 METAL CHIP 1K 5% 1/16W
R487 1-220-804-11 METAL CHIP 2.2M 5% 1/16W
R489 1-250-515-11 METAL CHIP 6.8K 1% 1/16W
R491 1-218-965-11 METAL CHIP 10K 5% 1/16W
R496 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R498 1-248-311-11 RES-CHIP 0.1 1% 1/4W
R500 1-218-990-81 SHORT CHIP 0
R503 1-218-935-11 METAL CHIP 33 5% 1/16W
R504 1-218-935-11 METAL CHIP 33 5% 1/16W
R506 1-218-935-11 METAL CHIP 33 5% 1/16W
R507 1-218-935-11 METAL CHIP 33 5% 1/16W
R510 1-218-933-11 METAL CHIP 22 5% 1/16W
R511 1-218-933-11 METAL CHIP 22 5% 1/16W
R514 1-218-933-11 METAL CHIP 22 5% 1/16W
R515 1-218-933-11 METAL CHIP 22 5% 1/16W
R534 1-218-951-11 METAL CHIP 680 5% 1/16W
R538 1-216-295-91 SHORT CHIP 0
R541 1-216-809-11 METAL CHIP 100 5% 1/10W
R542 1-216-809-11 METAL CHIP 100 5% 1/10W
R543 1-216-809-11 METAL CHIP 100 5% 1/10W
R549 1-218-933-11 METAL CHIP 22 5% 1/16W
R552 1-218-933-11 METAL CHIP 22 5% 1/16W
R608 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R609 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R610 1-218-973-11 METAL CHIP 47K 5% 1/16W
R611 1-218-973-11 METAL CHIP 47K 5% 1/16W
R612 1-218-973-11 METAL CHIP 47K 5% 1/16W
R613 1-218-989-11 METAL CHIP 1M 5% 1/16W
R614 1-218-965-11 METAL CHIP 10K 5% 1/16W
R615 1-218-985-11 METAL CHIP 470K 5% 1/16W
R616 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R617 1-218-955-11 METAL CHIP 1.5K 5% 1/16W
R618 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R619 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R620 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R621 1-218-990-81 SHORT CHIP 0
R622 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R624 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R625 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R626 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R627 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R628 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R629 1-216-864-11 SHORT CHIP 0
R630 1-218-929-11 METAL CHIP 10 5% 1/16W
R631 1-218-929-11 METAL CHIP 10 5% 1/16W
R632 1-218-929-11 METAL CHIP 10 5% 1/16W
R633 1-218-973-11 METAL CHIP 47K 5% 1/16W
R634 1-218-989-11 METAL CHIP 1M 5% 1/16W
R635 1-218-973-11 METAL CHIP 47K 5% 1/16W
R636 1-218-973-11 METAL CHIP 47K 5% 1/16W
R638 1-218-955-11 METAL CHIP 1.5K 5% 1/16W
R639 1-218-973-11 METAL CHIP 47K 5% 1/16W
R555 1-218-933-11 METAL CHIP 22 5% 1/16W
R559 1-218-965-11 METAL CHIP 10K 5% 1/16W
R564 1-218-933-11 METAL CHIP 22 5% 1/16W
R566 1-218-933-11 METAL CHIP 22 5% 1/16W
R567 1-218-935-11 METAL CHIP 33 5% 1/16W
R569 1-216-809-11 METAL CHIP 100 5% 1/10W
R571 1-218-981-81 METAL CHIP 220K 5% 1/16W
R572 1-218-941-81 METAL CHIP 100 5% 1/16W
R574 1-218-937-11 METAL CHIP 47 5% 1/16W
R575 1-218-941-81 METAL CHIP 100 5% 1/16W
R576 1-218-941-81 METAL CHIP 100 5% 1/16W
R577 1-218-949-11 METAL CHIP 470 5% 1/16W
R579 1-218-990-81 SHORT CHIP 0
R580 1-218-990-81 SHORT CHIP 0
R581 1-218-941-81 METAL CHIP 100 5% 1/16W
R582 1-218-941-81 METAL CHIP 100 5% 1/16W
R583 1-248-311-11 RES-CHIP 0.1 1% 1/4W
R585 1-218-990-81 SHORT CHIP 0
R586 1-218-990-81 SHORT CHIP 0
R587 1-218-965-11 METAL CHIP 10K 5% 1/16W
R588 1-218-965-11 METAL CHIP 10K 5% 1/16W
R589 1-218-965-11 METAL CHIP 10K 5% 1/16W
R590 1-218-990-81 SHORT CHIP 0
R600 1-208-931-11 METAL CHIP 68K 0.50% 1/16W
R602 1-218-973-11 METAL CHIP 47K 5% 1/16W
R603 1-218-973-11 METAL CHIP 47K 5% 1/16W
R604 1-218-973-11 METAL CHIP 47K 5% 1/16W
R605 1-218-989-11 METAL CHIP 1M 5% 1/16W
R606 1-218-990-81 SHORT CHIP 0
R640 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R641 1-218-967-11 METAL CHIP 15K 5% 1/16W
R642 1-218-970-11 METAL CHIP 27K 5% 1/16W
R643 1-216-864-11 SHORT CHIP 0
R644 1-208-931-11 METAL CHIP 68K 0.50% 1/16W
R645 1-218-973-11 METAL CHIP 47K 5% 1/16W
R646 1-218-989-11 METAL CHIP 1M 5% 1/16W
R647 1-218-973-11 METAL CHIP 47K 5% 1/16W
R648 1-218-973-11 METAL CHIP 47K 5% 1/16W
R649 1-218-970-11 METAL CHIP 27K 5% 1/16W
R650 1-218-969-11 METAL CHIP 22K 5% 1/16W
R651 1-218-979-11 METAL CHIP 150K 5% 1/16W
R652 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R653 1-250-515-11 METAL CHIP 6.8K 1% 1/16W
R654 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R655 1-218-965-11 METAL CHIP 10K 5% 1/16W
R656 1-218-959-11 METAL CHIP 3.3K 5% 1/16W
R658 1-218-989-11 METAL CHIP 1M 5% 1/16W
R659 1-218-973-11 METAL CHIP 47K 5% 1/16W
R661 1-218-941-81 METAL CHIP 100 5% 1/16W
R662 1-218-974-11 METAL CHIP 56K 5% 1/16W
R663 1-218-987-11 METAL CHIP 680K 5% 1/16W
R665 1-218-989-11 METAL CHIP 1M 5% 1/16W
R666 1-218-973-11 METAL CHIP 47K 5% 1/16W
R669 1-218-987-11 METAL CHIP 680K 5% 1/16W
R671 1-218-974-11 METAL CHIP 56K 5% 1/16W
R674 1-218-941-81 METAL CHIP 100 5% 1/16W
R677 1-218-990-81 SHORT CHIP 0
R681 1-218-989-11 METAL CHIP 1M 5% 1/16W
91
Page 92
HCD-GT3D
Ver. 1.1
MOTHERBOARD
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R682 1-218-973-11 METAL CHIP 47K 5% 1/16W
R840 1-218-933-11 METAL CHIP 22 5% 1/16W
R684 1-218-973-11 METAL CHIP 47K 5% 1/16W
R685 1-218-978-11 METAL CHIP 120K 5% 1/16W
R686 1-218-978-11 METAL CHIP 120K 5% 1/16W
R687 1-218-933-11 METAL CHIP 22 5% 1/16W
R688 1-218-929-11 METAL CHIP 10 5% 1/16W
R689 1-218-979-11 METAL CHIP 150K 5% 1/16W
R690 1-218-929-11 METAL CHIP 10 5% 1/16W
R691 1-218-929-11 METAL CHIP 10 5% 1/16W
R692 1-218-969-11 METAL CHIP 22K 5% 1/16W
R693 1-218-989-11 METAL CHIP 1M 5% 1/16W
R694 1-218-973-11 METAL CHIP 47K 5% 1/16W
R696 1-218-973-11 METAL CHIP 47K 5% 1/16W
R697 1-218-973-11 METAL CHIP 47K 5% 1/16W
R698 1-218-973-11 METAL CHIP 47K 5% 1/16W
R700 1-218-969-11 METAL CHIP 22K 5% 1/16W
R701 1-218-929-11 METAL CHIP 10 5% 1/16W
R702 1-218-929-11 METAL CHIP 10 5% 1/16W
R708 1-218-937-11 METAL CHIP 47 5% 1/16W
R709 1-218-937-11 METAL CHIP 47 5% 1/16W
R711 1-218-953-11 METAL CHIP 1K 5% 1/16W
R716 1-218-953-11 METAL CHIP 1K 5% 1/16W
R718 1-218-990-81 SHORT CHIP 0
R719 1-218-929-11 METAL CHIP 10 5% 1/16W
R720 1-218-929-11 METAL CHIP 10 5% 1/16W
R722 1-218-929-11 METAL CHIP 10 5% 1/16W
R723 1-218-929-11 METAL CHIP 10 5% 1/16W
R733 1-216-864-11 SHORT CHIP 0
R747 1-216-864-11 SHORT CHIP 0
R750 1-218-941-81 METAL CHIP 100 5% 1/16W
R751 1-218-941-81 METAL CHIP 100 5% 1/16W
R857 1-216-864-11 SHORT CHIP 0
R859 1-216-864-11 SHORT CHIP 0
R905 1-218-990-81 SHORT CHIP 0
R909 1-218-990-81 SHORT CHIP 0
R911 1-218-985-11 METAL CHIP 470K 5% 1/16W
R912 1-218-985-11 METAL CHIP 470K 5% 1/16W
R913 1-218-975-11 METAL CHIP 68K 5% 1/16W
R914 1-218-975-11 METAL CHIP 68K 5% 1/16W
R915 1-208-699-11 METAL CHIP 4.7K 0.50% 1/16W
R916 1-208-699-11 METAL CHIP 4.7K 0.50% 1/16W
R935 1-250-468-11 METAL CHIP 75 1% 1/16W
R937 1-218-941-81 METAL CHIP 100 5% 1/16W
R938 1-216-864-11 SHORT CHIP 0
R939 1-218-965-11 METAL CHIP 10K 5% 1/16W
R940 1-218-941-81 METAL CHIP 100 5% 1/16W
R943 1-218-933-11 METAL CHIP 22 5% 1/16W
R944 1-218-933-11 METAL CHIP 22 5% 1/16W
R948 1-218-990-81 SHORT CHIP 0
R949 1-216-809-11 METAL CHIP 100 5% 1/10W
R950 1-216-797-11 METAL CHIP 10 5% 1/10W
R951 1-216-797-11 METAL CHIP 10 5% 1/10W
R952 1-216-797-11 METAL CHIP 10 5% 1/10W
R953 1-218-950-11 METAL CHIP 560 5% 1/16W
R954 1-218-989-11 METAL CHIP 1M 5% 1/16W
R955 1-216-819-11 METAL CHIP 680 5% 1/10W
R957 1-216-797-11 METAL CHIP 10 5% 1/10W
R959 1-216-797-11 METAL CHIP 10 5% 1/10W
R963 1-218-929-11 METAL CHIP 10 5% 1/16W
R964 1-218-929-11 METAL CHIP 10 5% 1/16W
R965 1-218-941-81 METAL CHIP 100 5% 1/16W
R752 1-218-941-81 METAL CHIP 100 5% 1/16W
R753 1-218-941-81 METAL CHIP 100 5% 1/16W
R756 1-250-515-11 METAL CHIP 6.8K 1% 1/16W
R760 1-218-929-11 METAL CHIP 10 5% 1/16W
R761 1-218-929-11 METAL CHIP 10 5% 1/16W
R762 1-218-929-11 METAL CHIP 10 5% 1/16W
R763 1-216-864-11 SHORT CHIP 0
R791 1-218-990-81 SHORT CHIP 0
R792 1-216-864-11 SHORT CHIP 0
R793 1-216-864-11 SHORT CHIP 0
R794 1-216-864-11 SHORT CHIP 0
R795 1-218-929-11 METAL CHIP 10 5% 1/16W
R796 1-218-929-11 METAL CHIP 10 5% 1/16W
R797 1-218-929-11 METAL CHIP 10 5% 1/16W
R801 1-218-941-81 METAL CHIP 100 5% 1/16W
R802 1-218-933-11 METAL CHIP 22 5% 1/16W
R817 1-218-929-11 METAL CHIP 10 5% 1/16W
R819 1-218-929-11 METAL CHIP 10 5% 1/16W
R820 1-218-929-11 METAL CHIP 10 5% 1/16W
R826 1-218-949-11 METAL CHIP 470 5% 1/16W
R827 1-216-833-11 METAL CHIP 10K 5% 1/10W
R829 1-218-949-11 METAL CHIP 470 5% 1/16W
R830 1-216-833-11 METAL CHIP 10K 5% 1/10W
R831 1-218-941-81 METAL CHIP 100 5% 1/16W
R835 1-218-929-11 METAL CHIP 10 5% 1/16W
R836 1-218-929-11 METAL CHIP 10 5% 1/16W
R837 1-218-933-11 METAL CHIP 22 5% 1/16W
R838 1-218-929-11 METAL CHIP 10 5% 1/16W
R839 1-218-929-11 METAL CHIP 10 5% 1/16W
R966 1-218-929-11 METAL CHIP 10 5% 1/16W
R978 1-218-990-81 SHORT CHIP 0
R980 1-218-990-81 SHORT CHIP 0
R981 1-218-990-81 SHORT CHIP 0
R982 1-218-990-81 SHORT CHIP 0
R995 1-218-990-81 SHORT CHIP 0
R996 1-218-990-81 SHORT CHIP 0
Note : If cable, fl exible fl at and wire (fl at type) is replaced,
install it after bending it in the same form as that
before replacement.
93
Page 94
HCD-GT3D
Ver. 1.2
MEMO
94
Page 95
REVISION HISTORY
Ver.DateDescription of Revision
1.02015.02New
1.12015.06Addition of African, Argentina, Malaysia, Russian, Saudi Arabia and Thai models.
Add note for IC101 in page 5, 39, 48 and 87.
Change description of IC303, IC601 and IC603 in MOTHERBOARD board.
Change description of IC3004 in LCD board.
Change description of IC3200 in MIC board.
Change description of Ref. No. R3137 and R3149 in BUTTON board.
Change description of Ref. No. Q1003, Q1004, Q1014, Q1015, Q1016 and Q1017 in DAMP board.
Change description of Ref. No. C3204 in MIC board.
Change description of Ref. No. C105, C953, Q605, R023, R642 and R649 in MOTHERBOARD board.
Change illustration of CDM in page 13, 20, 74 and 78.
Change note for “BOND FIXATION OF ELECTRIC PARTS” in page 37, 50, 51, 81, 82 and 83.
Change of DAMP, SPK_HLED and SPLITTER boards (Suffi x 12).
Change of unit name in SPECIFICATIONS.
Change illustration of IC902 in page 64.
Change P/N of Ref. No. 57 in page 73.
Change P/N of Ref. No. 101 in page 74.
Change P/N of Ref. No. 258 in page 77.
Delete of “MODEL & DEST WRITE MODE” in page 23.
Delete note for “BOND FIXATION OF ELECTRIC PARTS” in page 75.
1.22015.08Add illustration of CORE, FERRITE and CUSHION, SARANET (30X50) on WIRE (FLAT TYPE)
(24 CORE) in page 13, 20, 74, 78 and 79.
Add note of “SCREW TYPE DISCRIMINATION BEFORE DISASSEMBLE THE PANEL, SIDE” in
page 6, 10 and 72.
Add P/N and description for CORE, FERRITE in page 79 and 93.
Add P/N, description and illustration of Ref. No. 1 in page 72.
Change description of disassembly step (1) in page 10.
Change P/N and description of CN101 in MOTHERBOARD board.
Change P/N and description of CN102 in MOTHERBOARD board.
Change P/N and description of CN601 in MOTHERBOARD board.
Change P/N and description of IC306 in MOTHERBOARD board.
Change P/N and description of D3100 in BUTTON board.
Change P/N and description of D3105 in BUTTON board.
Change P/N and illustration of Ref. No. 57 in page 73.
Change P/N of Ref. No. 2 and 3 in page 72.
Change P/N of Ref. No. 258 in page 77.
Change illustration of PANEL, SIDE (L) ASSY in page 10 and 72.
Change illustration of PANEL, FRONT (SW) ASSY in page 7, 10, 11, 12, 13, 14, 15, 16, 17, 18, 72, 74,
75, 76 and 77.
Delete CN105 in MOTHERBOARD board for Electrical Part List section (Service code changed).
Delete CN451 in MOTHERBOARD board for Electrical Part List section (Service code changed).
Delete CUSHION, WIRE 1.0T on WIRE (FLAT TYPE) (24 CORE) in page 13, 20, 74, 78 and 79.
HCD-GT3D
Page 96
HCD-GT3D
Ver.DateDescription of Revision
Delete four pieces of CUSHION (D-AMP) on SUB CHASSIS in page 15, 16, 75 and 76.
Delete four pieces of CUSHION (SMPS) on CHASSIS in page 17 and 76.
Delete four pieces of CUSHION, BUTTON on CDM section in page 13, 74 and 78.
Delete T CUSHION on PANEL, FRONT (SW) ASSY in page 14, 15, 75 and 77.
Delete HEMILON, 10XLX0.4 in page 13, 74 and 78.
Delete CLAMP, SLEEVE FERRITE for Argentina, Latin-American and Thai models in page 76 and 93.
How to search for a contact point of signal lines or the like in DIAGRAMS SECTION
If a contact point of a BLOCK DIAGRAM, PRINTED WIRING BOARD or SCHEMATIC DIAGRAM is shown in a different page, use
the PDF fi le search function to fi nd one.
e.g.) If a contact point is shown as
Procedure:
1. Press the [F] key while pressing the [Ctrl] key.
2. Input “>001Z” in the search box and press the [Enter] key.
3. The relevant part (page), where the contact point is shown, appears.
Note: If you still see the original page, press the [Enter] key again.
, follow the procedure below.
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