Sirona Orthophos SL Service manual

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ORTHOPHOS SL / Ceph Service Manual
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Sirona Dental Systems GmbH Table of contents
Service Manual ORTHOPHOS SL

Table of contents

1
2
About this Service Manual........................................................................................ 13
1.1 Other relevant documents............................................................................. 13
1.2 Scope ............................................................................................................ 13
1.3 Tools and auxiliary materials......................................................................... 13
1.4 Structure of the document............................................................................. 14
1.4.1 Identification of the danger levels..................................................... 14
1.4.2 Formats and symbols used .............................................................. 14
Safety instructions .................................................................................................... 15
2.1 Potentially lethal shock hazard...................................................................... 15
2.2 Modifications to the unit ................................................................................ 15
2.3 Fixed connection ........................................................................................... 15
2.4 Electromagnetic compatibility........................................................................ 15
2.5 Electrostatic discharge .................................................................................. 16
2.6 Switching the unit on ..................................................................................... 16
2.7 Condensation ................................................................................................ 16
2.8 Laser light localizer ....................................................................................... 16
2.9 Ventilation slots ............................................................................................. 16
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2.10 Qualifications of service personnel ............................................................... 16
2.11 Radiation protection ...................................................................................... 17
2.12 Safety checks................................................................................................ 17
2.13 Functional check ........................................................................................... 17
3
Unit description......................................................................................................... 18
3.1 Hardware....................................................................................................... 18
3.1.1 Information on the unit ..................................................................... 18
3.1.2 System version................................................................................. 19
3.1.3 Sensor versions ............................................................................... 20
3.1.4 Installation versions.......................................................................... 21
3.1.5 Modules and components ................................................................ 22
3.1.5.1 Slide................................................................................ 23
3.1.5.2 Stand .............................................................................. 24
3.1.5.3 Cephalometer ................................................................. 25
3.1.5.4 Remote control ............................................................... 25
3.1.6 Cabling overview.............................................................................. 26
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3.1.7 Board photos.................................................................................... 30
3.1.7.1 Boards in the slide .......................................................... 30
3.1.7.2 Boards in the stand......................................................... 36
3.1.7.3 Boards in the cephalometer (left- and right-arm
36
versions)
3.1.7.4 Board in the remote control ............................................ 37
3.1.8 Covers.............................................................................................. 37
3.1.9 Technical data.................................................................................. 40
3.1.9.1 Unit data ......................................................................... 40
3.1.9.2 Operating and transport conditions ................................ 42
3.1.9.3 Diagrams ........................................................................ 43
3.1.9.4 Requirements for the PC system.................................... 44
3.2 Firmware ....................................................................................................... 45
4
General operating procedures.................................................................................. 47
4.1 Switching the unit on ..................................................................................... 47
4.1.1 Factory setting after switch-on ......................................................... 48
4.2 Setting up the X-ray component.................................................................... 49
4.3 Opening / saving "Unit information"............................................................... 59
4.4 Activating functions ....................................................................................... 62
4.4.1 Activation via Easypad ..................................................................... 62
4.4.2 Activation via PC .............................................................................. 64
4.5 Updating the unit firmware ............................................................................ 68
4.6 Backing up / restoring / installing sensor data............................................... 71
4.6.1 Access the “Backup / restore sensor data” menu ............................ 71
4.6.2 Backing up sensor data.................................................................... 73
4.6.3 Restoring sensor data ...................................................................... 74
4.6.4 Installing sensor data ....................................................................... 75
4.7 Calling the Info screen .................................................................................. 76
4.8 Using demo mode – operation without radiation release .............................. 77
4.8.1 Switching on demo mode................................................................. 77
4.8.2 Switching off demo mode................................................................. 78
4.8.3 Important information for repacking and transport ........................... 79
5
Messages ................................................................................................................. 80
5.1 Help messages ............................................................................................. 80
5.2 Status displays .............................................................................................. 81
5.3 Error messages............................................................................................. 82
5.3.1 Error code: Ex yy zz ......................................................................... 82
5.3.2 Ex - Error type .................................................................................. 82
5.3.3 yy - Location..................................................................................... 83
5.3.4 General handling of error messages................................................ 83
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5.4 List of error messages.................................................................................. 84
5.4.1 Location 06: Tube assembly/DX6 ................................................... 84
5.4.2 Location 07: Easypad/DX7.............................................................. 90
5.4.3 Location 10: System hardware........................................................ 93
5.4.4 Location 11: Power PC/Board DX11 ............................................... 94
5.4.5 Location 12: CAN bus ..................................................................... 96
5.4.6 Location 13: Stand/Peripherals ....................................................... 97
5.4.7 Location 14: Digital extension, SIDEXIS 4 ...................................... 110
5.4.8 Location 15: Configuration, update ................................................. 112
5.4.9 Location 20: Sensor unit, general.................................................... 113
5.4.10 Location 22: DCS sensor ................................................................ 118
5.4.11 Location 23: Flat Panel Detector..................................................... 119
5.4.12 Location 42: Remote control ........................................................... 120
5.4.13 Location 61: Diaphragm control, board DX61 ................................. 124
5.4.14 Location 81, board DX81, ceph slot ................................................ 130
5.4.15 Location 83: Sensor unit.................................................................. 134
5.4.16 Location 91: Cephalometer, board DX91........................................ 135
6
Troubleshooting....................................................................................................... 139
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6.1 Error logging memory................................................................................... 139
6.1.1 Example of error logging data ......................................................... 140
6.2 Checking the CAN bus ................................................................................. 141
6.2.1 Checking the CAN bus with the diagnostic function of board DX1.. 145
6.2.2 Jumper positions in the CAN bus .................................................... 145
6.3 Checking the boards .................................................................................... 146
6.3.1 Checking board DX32 ..................................................................... 148
6.4 Checking the motors .................................................................................... 150
6.5 Checking the light barriers............................................................................ 151
6.6 Device leakage current too high................................................................... 152
6.7 Checking the cables ..................................................................................... 153
6.8 Checking fiber-optic cables .......................................................................... 154
6.9 Error analysis of X-RAY control signal path ................................................. 156
6.10 Checking the data paths............................................................................... 159
7
Unit adjustment and calibration ............................................................................... 160
7.1 General information on unit adjustment and calibration............................... 162
7.1.1 Displays and help messages during adjustment and calibration..... 163
7.1.2 Calibration menu ............................................................................. 164
7.1.2.1 Opening the calibration menu........................................ 164
7.1.2.2 Menu structure............................................................... 166
7.1.3 Enabling exposure readiness .......................................................... 175
7.1.4 Taking an exposure......................................................................... 175
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7.1.5 Save values..................................................................................... 175
7.1.6 Test phantom for adjustment and calibration .................................. 176
7.1.6.1 Needle phantom for panoramic adjustment................... 176
7.1.6.2 Adjustment phantom for adjustment of the cephalometer 178
7.1.6.3 Geometry phantom for volume calibration..................... 179
7.2 Adjustment and calibration via the calibration menu.................................... 181
7.2.1 2D adjustment/calibration................................................................ 181
7.2.1.1 Pan sensor adjustment.................................................. 181
7.2.1.2 Pan aperture adjustment ............................................... 187
7.2.1.3 Pan symmetry adjustment ............................................. 193
7.2.1.4 Pan sensor calibration (DCS) ........................................ 197
7.2.1.5 Adjustment of the ceph primary diaphragm................... 199
7.2.1.6 Adjustment of the ceph secondary diaphragm .............. 204
7.2.1.7 Adjustment of the ceph secondary diaphragm
212
(QuickShot)
7.2.1.8 Adjustment of the ceph main X-ray beam...................... 217
7.2.1.9 Adjusting the earplug alignment .................................... 221
7.2.2 3D adjustment/calibration................................................................ 226
7.2.2.1 Sensor adjustment......................................................... 226
7.2.2.2 Diaphragm adjustment................................................... 228
7.2.2.3 Sensor calibration.......................................................... 229
7.2.2.4 Diaphragm configuration................................................ 230
7.2.2.5 Geometry calibration...................................................... 232
7.2.2.6 Dosimetry....................................................................... 234
7.2.3 Resetting adjustment/calibration ..................................................... 235
7.3 Adjusting the touchscreen via the web service ............................................ 236
8
Service routines....................................................................................................... 240
8.1 Perform service routines via the control panel ............................................. 240
8.1.1 Overview of service routines ........................................................... 240
8.1.1.1 List of all service routines available for selection........... 240
8.1.1.2 Alphabetical list of service routine functions.................. 243
8.1.2 Service menu and service routines ................................................. 246
8.1.2.1 Displays and symbols in the service menu.................... 246
8.1.3 Basic operating procedures in the service menu of the control panel 248
8.1.3.1 Calling the service menu ............................................... 248
8.1.3.2 Selecting service routines and test steps ...................... 249
8.1.3.3 Select parameters.......................................................... 251
8.1.3.4 Saving parameters......................................................... 251
8.1.3.5 Exiting the test step and service routine........................ 252
8.1.4 S001: Radiation without rotary movement, fixed maximum radiation
253
time
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8.1.5 S002: Radiation without rotary movement, selectable kV/mA level
255
and maximum radiation time
8.1.5.1 S002: Test step 1 ........................................................... 255
8.1.5.2 S002: Test step 3 ........................................................... 256
8.1.5.3 S002: Test step 4 ........................................................... 258
8.1.6 S005: General X-ray tube assembly service.................................... 260
8.1.6.1 S005: Test step 2 ........................................................... 260
8.1.6.2 S005: Test step 4 ........................................................... 261
8.1.6.3 S005: Test step 5 ........................................................... 262
8.1.6.4 S005: Test step 6 ........................................................... 262
8.1.6.5 S005: Test step 7 ........................................................... 264
8.1.7 S007: Fault buffer............................................................................. 265
8.1.7.1 S007: Test step 1 ........................................................... 265
8.1.7.2 S007: Test step 2 ........................................................... 266
8.1.8 S008: Update service....................................................................... 267
8.1.8.1 S008: Test step 2 ........................................................... 267
8.1.8.2 S008: Test step 3 ........................................................... 267
8.1.9 S009: Flash file system .................................................................... 268
8.1.9.1 S009: Test step 4 ........................................................... 268
8.1.9.2 S009: Test step 5 ........................................................... 268
8.1.10 S011: Dosimetry (without ring movement) ....................................... 269
8.1.10.1 S011: Test step 14 ......................................................... 269
8.1.10.2 S011: Test step 24 ......................................................... 271
8.1.11 S012: CAN bus service .................................................................... 272
8.1.11.1 S012: Test step 1 ........................................................... 272
8.1.11.2 S012: Test step 2 ........................................................... 273
8.1.11.3 S012: Test step 3 ........................................................... 274
8.1.11.4 S012: Test step 4 ........................................................... 274
8.1.12 S014: Rotation motor service........................................................... 275
8.1.12.1 S014: Test step 3 ........................................................... 275
8.1.12.2 S014: Test step 4 ........................................................... 275
8.1.13 S015: Actuator service ..................................................................... 276
8.1.13.1 S015: Test step 5 ........................................................... 276
8.1.14 S017: Configuration service ............................................................. 277
8.1.14.1 S017: Test step 2 ........................................................... 278
8.1.14.2 S017: Test step 3 ........................................................... 281
8.1.14.3 S017: Test step 4 ........................................................... 282
8.1.14.4 S017: Test step 6 ........................................................... 283
8.1.14.5 S017: Test step 8 ........................................................... 284
8.1.14.6 S017: Test step 13 ......................................................... 285
8.1.14.7 S017: Test step 14 ......................................................... 286
8.1.14.8 S017: Test step 15 ......................................................... 287
8.1.14.9 S017: Test step 18 ......................................................... 288
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8.1.15 S018: Service for height adjustment ............................................... 289
8.1.15.1 S018: Test step 2........................................................... 289
8.1.15.2 S018: Test step 3........................................................... 290
8.1.15.3 S018: Test step 4........................................................... 291
8.1.15.4 S018: Test step 5........................................................... 292
8.1.15.5 S018: Test step 6........................................................... 292
8.1.15.6 S018: Test step 7........................................................... 293
8.1.15.7 S018: Test step 8........................................................... 295
8.1.15.8 S018: Test step 9........................................................... 297
8.1.15.9 S018: Test step 10......................................................... 299
8.1.16 S020: Service for temple support.................................................... 300
8.1.16.1 S020: Test step 1........................................................... 300
8.1.17 S021: Service for the packing position............................................ 302
8.1.17.1 S021: Test step 3........................................................... 302
8.1.17.2 S021: Test step 4........................................................... 303
8.1.18 S032: Sensor test............................................................................ 304
8.1.18.1 S032: Test step 10......................................................... 304
8.1.18.2 S032: Test step 50......................................................... 305
8.1.18.3 Explanations on the test procedure ............................... 305
8.1.18.4 Possible results of self-test and troubleshooting
306
measures
8.1.19 S033: Test of ceph image path (for ceph units only)....................... 307
8.1.19.1 S033: Test step 10......................................................... 307
8.1.20 S034: Service for the digital cephalometer...................................... 309
8.1.20.1 S034: Test step 4........................................................... 309
8.1.20.2 S034: Test step 5........................................................... 313
8.1.20.3 S034: Test step 6........................................................... 316
8.1.20.4 S034: Test step 8........................................................... 317
8.1.20.5 S034: Test step 9........................................................... 318
8.1.21 S037: Network service .................................................................... 320
8.1.21.1 S037: Test step 1........................................................... 320
8.1.21.2 S037: Test step 2........................................................... 322
8.1.21.3 S037: Test step 3........................................................... 323
8.1.21.4 S037: Test step 4........................................................... 324
8.2 Running service routines via the web service .............................................. 327
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9
Repair...................................................................................................................... 330
9.1 Safety checks ............................................................................................... 331
9.2 Height adjustment motor (M1_4)/spindle...................................................... 332
9.2.1 Preparing for motor replacement..................................................... 332
9.2.1.1 Moving the slide manually ............................................. 332
9.2.2 Removing board DX32 .................................................................... 335
9.2.3 Replacing the height adjustment motor/spindle .............................. 337
9.2.4 Laying of cables when replacing the height adjustment motor........ 339
9.2.5 What has to be done after replacing the height adjustment motor (M1_4) or the spindle?
9.3 Ring motor (M1_3)........................................................................................ 342
9.3.1 Replacing the ring motor ................................................................. 342
9.3.2 Replacing the pinion at the ring motor............................................. 342
9.3.3 Laying of cables when replacing the ring motor .............................. 344
9.3.4 What has to be done after replacing the ring motor (M1_3)/pinion? 344
9.4 Pan actuators (M1_1/2) ................................................................................ 345
9.4.1 Replacing actuators......................................................................... 345
9.4.2 Laying of cables when replacing the actuator ................................. 346
9.4.3 What has to be done after replacing the actuators?........................ 346
341
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9.5 Head support................................................................................................ 347
9.5.1 Replacing the headrest ................................................................... 347
9.5.2 Laying of cables when replacing the headrest ................................ 348
9.5.3 What has to be done after replacing the headrest? ........................ 348
9.6 Control panel ................................................................................................ 349
9.6.1 Replacing the user interface............................................................ 349
9.6.1.1 What has to be done after replacing the user interface? 350
9.6.2 Replacing the control panel............................................................. 351
9.6.2.1 What has to be done after replacing the control panel? 352
9.6.3 Laying cables for control panel replacement................................... 352
9.7 Laser light localizers..................................................................................... 353
9.7.1 FH laser light localizer (Pan) ........................................................... 353
9.7.1.1 Replacing the laser module in the FH (Pan) laser light
localizer
9.7.1.2 Adjusting the laser light localizer FH (PAN)................... 354
9.7.2 FH laser light localizer (Ceph)......................................................... 356
9.7.2.1 Replacing the ceph laser module in the FH laser light
localizer (ceph)
9.7.2.2 Adjusting the FH laser light localizer (Ceph).................. 357
9.7.3 MS laser light localizer (pan) ........................................................... 359
9.7.3.1 Replacing the laser module in the MS laser light localizer
(pan)
9.7.3.2 Adjusting the MS laser light localizer (PAN) .................. 360
353
356
359
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9.7.4 Laser area display (VOL) ................................................................ 362
9.7.4.1 Replacing the laser area display (VOL)......................... 362
9.7.4.2 Adjusting the laser area display (VOL) .......................... 364
9.7.5 Checking the connection of the MS and FH (pan) laser light
366
localizers
9.8 Occlusal bite block ....................................................................................... 367
9.8.1 Replacing the occlusal bite block .................................................... 367
9.8.2 What has to be done after replacing the occlusal bite block? ......... 367
9.9 Bite block holder........................................................................................... 368
9.9.1 Replacing the bite block holder ....................................................... 368
9.9.2 Replacing the silicone rings............................................................. 369
9.9.3 What has to be done after replacing the bite block holder / silicone
369
ring?
9.10 Diaphragm unit ............................................................................................. 370
9.10.1 Replacing the diaphragm unit.......................................................... 370
9.10.2 What has to be done after replacing the diaphragm unit?............... 371
9.11 X-ray tube unit.............................................................................................. 372
9.11.1 Replacing the X-ray tube assembly................................................. 372
9.11.2 Replacing the fan in the X-ray tube assembly................................. 374
9.11.2.1 Replacing the fan........................................................... 374
9.11.2.2 What has to be done after replacing the fan?................ 374
9.11.3 Cables and connectors for replacement of the X-ray tube assembly 375
9.11.4 What has to be done after replacing the X-ray tube assembly?...... 377
9.12 Sensor unit ................................................................................................... 378
9.12.1 Flat Panel Detector.......................................................................... 378
9.12.1.1 Replacing the flat panel detector ................................... 378
9.12.1.2 Connecting a sensor unit............................................... 380
9.12.1.3 What has to be done after replacing the flat panel
381
detector?
9.12.2 DCS sensor ..................................................................................... 382
9.12.2.1 Replacing the DCS sensor ............................................ 382
9.12.2.2 Connecting a sensor unit............................................... 384
9.12.2.3 What has to be done after replacing the DCS sensor? . 385
9.12.3 Replace board DX83....................................................................... 386
9.12.4 Replacing fan package.................................................................... 390
9.13 Cephalometer............................................................................................... 391
9.13.1 Replacing the ceph sensor holder................................................... 391
9.13.1.1 What has to be done after replacing the ceph sensor
391
holder?
9.13.2 Replacing the ceph sensor.............................................................. 392
9.13.2.1 What has to be done after replacing the ceph sensor? . 392
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9.14 Light barriers ................................................................................................. 393
9.14.1 Replacing the light barriers .............................................................. 393
9.14.2 What has to be done after replacing the light barriers? ................... 394
9.15 Boards........................................................................................................... 395
9.15.1 Important notes about replacing boards........................................... 395
9.15.2 Replacing boards ............................................................................. 396
9.15.2.1 Replacing PC board DX1 ............................................... 396
9.15.2.2 Replacing board DX11 ................................................... 397
9.15.2.3 Replacing board DX32 ................................................... 397
9.15.3 Measures following replacement of boards...................................... 398
9.15.3.1 After changing the DX11 board ...................................... 398
9.16 Cable............................................................................................................. 400
9.16.1 Replacing energy chain 1 completely .............................................. 400
9.16.2 Replacing cables.............................................................................. 404
9.16.2.1 Replacing fiber-optic cable L5, L6 or L15 ....................... 405
9.16.2.2 Cable exchange (L3, L5, L6, L11, L12, and L15)/Laying the cable/corrugated tube at the rotation unit
9.16.2.3 Replacing cable L117 or L108 in cable track 2............... 408
9.16.2.4 Replacing cable L1 or grounding strap in cable track 1.. 410
406
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10
Maintenance............................................................................................................. 411
10.1 Calibrating the unit ........................................................................................ 411
10.2 Checking the height adjustment.................................................................... 412
10.3 Checking the forehead and temple supports ................................................ 413
10.4 Check rotation unit on the sensor unit for ease of access ............................ 414
10.5 Testing the rotating unit for smooth running.................................................. 414
10.6 Inspecting the bite block holder..................................................................... 415
10.7 Checking the ceph sensor holder.................................................................. 416
10.8 Checking the laser light localizers................................................................. 417
10.9 Checking the X-ray images ........................................................................... 420
10.10 Checking the tube data ................................................................................. 421
10.10.1 Checking the tube voltage................................................................ 421
10.10.2 Checking the tube current ................................................................ 422
10.10.3 Checking the fan and temperature sensor in the tube assembly housing
10.10.4 Checking the radiation time.............................................................. 426
425
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10.11 Test exposures/Test images ......................................................................... 427
10.11.1 Calling "Test exposures" menu ........................................................ 428
10.11.2 2D test exposures ............................................................................ 429
10.11.2.1 Pan - diaphragm test exposure (2D) .............................. 429
10.11.2.2 Pan - Symmetrical test exposure (2D)............................ 430
10.11.2.3 Pan - quality test exposure (2D) ..................................... 431
10.11.2.4 Pan - test image (2D) ..................................................... 433
10.11.2.5 Pan - dark current exposure (2D) ................................... 435
10.11.2.6 Ceph - secondary diaphragm (2D) ................................. 437
10.11.2.7 Ceph - quality test exposure (2D)................................... 438
10.11.2.8 Ceph - test image (2D) ................................................... 441
10.11.3 3D test exposures ............................................................................ 443
10.11.3.1 Diaphragm test exposure (open) (3D) ............................ 443
10.11.3.2 Diaphragm test exposure (collimated) (3D).................... 445
10.11.3.3 Diaphragm test exposure (standard) (3D)...................... 447
10.11.3.4 Quality test exposure (3D).............................................. 449
10.11.3.5 Quality test exposure DIN 6868-161 (3D) ...................... 451
10.11.3.6 Test image (3D).............................................................. 452
10.11.3.7 Dosimetry (3D) ............................................................... 454
10.11.3.8 Dosimetry DIN 6868-161 (3D) ........................................ 455
10.11.3.9 Dark current exposure (3D) ............................................ 456
11
12
10.12 Checking the cables for damage................................................................... 458
10.13 Checking the idling rollers ............................................................................. 459
10.14 Checking the grounding straps ..................................................................... 460
10.15 Checking the cable shields ........................................................................... 461
10.16 Checking the protective ground wires ........................................................... 462
10.17 Checking the device leakage current ............................................................ 466
Dismantling and disposal ......................................................................................... 467
11.1 Dismantling and reinstallation ....................................................................... 467
11.2 Disposal ........................................................................................................ 467
Service Manual History ............................................................................................ 469
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Sirona Dental Systems GmbH 1About this Service Manual
Service Manual ORTHOPHOS SL 1.1Other relevant documents

About this Service Manual

1
1.1
1.2
1.3

Other relevant documents

In addition to this manual, you need the following documents:
Spare parts list
● ORTHOPHOS XG/SL List of Spare Parts: REF 59 38 423
Orthophos SL wiring diagrams
Wiring diagrams
● ORTHOPHOS SL Wiring References: REF 64 95 233
Installation Instructions
● ORTHOPHOS SL Software Installation: REF 65 44 287
● SIDEXIS 4 Installation Instructions: REF 64 47 200
DVD text
Current Service Documentation, such as the Service Manual, can be downloaded from the Sirona dealer website.

Scope

This Service Manual describes the servicing of the ORTHOPHOS SL digital volume tomograph. It is intended for use exclusively by trained and authorized distributors and service technicians.

Tools and auxiliary materials

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● Screwdriver set (slot and Phillips)
● Torx offset screwdrivers TX10, TX20, TX25 (included in the scope of supply)
● Open-end wrench, SW13
● Socket wrench, SW13
● Side cutting pliers
● Caliper gage
● Spirit level
● Digital Multimeter, Accuracy Class 1
● Mult-O-Meter 512L
● Fiber test device [e.g. Fiberpoint
● Soldering tool for repairing cables
● Cable ties
● Teflon tape
● Loctite
®
250MD
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1About this Service Manual Sirona Dental Systems GmbH
1.4Structure of the document Service Manual ORTHOPHOS SL
1.4

Structure of the document

1.4.1 Identification of the danger levels

To prevent personal injury and material damage, please observe the warning and safety information provided in these operating instructions. Such information is highlighted as follows:
DANGER
An imminent danger that could result in serious bodily injury or death.
WARNING
A possibly dangerous situation that could result in serious bodily injury or death.
CAUTION
A possibly dangerous situation that could result in slight bodily injury.
NOTICE
A possibly harmful situation which could lead to damage of the product or an object in its environment.
IMPORTANT
Application instructions and other important information.
Tip: Information on making work easier.

1.4.2 Formats and symbols used

The formats and symbols used in this document have the following meaning:
Prerequisite
1. First action step
2. Second action step
or
Alternative action
Result
➢ Individual action step
See "Formats and symbols used [ → 14]"
● List Designates a list.
"Command / menu item" Indicates commands, menu items or
Prompts you to do something.
Identifies a reference to another text passage and specifies its page number.
quotations.
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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS SL 2.1Potentially lethal shock hazard

Safety instructions

2
2.1
2.2
2.3

Potentially lethal shock hazard

XGPF-36475; Risk of electric shoc k
DANGER
Perilous shock hazard!
When replacing parts or in the event of extensions in the power supply line, power switch, board DX32, or X-ray tube assembly area, there is danger to life due to a potentially lethal shock hazard.
Before you start:
➢ It is essential to ensure the unit is not supplied with voltage.
➢ Always disconnect the unit from the junction box of the building
installation.

Modifications to the unit

Modifications to this unit which might affect the safety of the system owner, patients or other persons are prohibited by law!
For reasons of product safety, this product may be operated only with original Sirona accessories or third-party accessories expressly approved by Sirona. The user is responsible for any damage resulting from the use of non-approved accessories.

Fixed connection

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2.4
DANGER
Potentially lethal shock hazard!
Fixed connection! Installing a mains plug instead of the specified fixed connection infringes international medical regulatory actions and is prohibited. In case of error, this puts patients, users, and other parties seriously at risk.

Electromagnetic compatibility

The unit complies with the requirements of standard IEC 60601-1-2.
Medical electrical equipment is subject to special EMC-related precautions. It must be installed and operated as specified in the document "Installation Requirements".
If high-voltage systems, radio link systems or MRI systems are located within 5 m of the unit, please observe the specifications stated in the installation requirements.
Portable and mobile RF communications equipment may affect medical electrical equipment. Therefore, the use of mobile wireless phones in medical office or hospital environments must be prohibited.
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2Safety instructions Sirona Dental Systems GmbH
2.5Electrostatic discharge Service Manual ORTHOPHOS SL
2.5
2.6
2.7
2.8

Electrostatic discharge

Electrostatic discharge (abbreviated: ESD – ElectroStatic Discharge)
Electrostatic discharge from people can damage electronic components when the components are touched.
Touch a ground point to discharge static electricity before touching any boards.

Switching the unit on

Safety information for switching o n the unit: Service engineer XGPF-63464; Patient pos ition when switching on
Due to the risk of injury caused by malfunction, no person may be positioned in the unit when it is switched on.

Condensation

Safety information for condensation: Service engineer
Extreme fluctuations of temperature may cause condensation inside the unit. Do not switch the unit on before it has reached normal room temperature. See also the chapter "Technical details"

Laser light localizer

Safety information for light loca lizer: Service engineer
The system incorporates Class 1 laser products.
A minimum distance of 10 cm (4") is required between the eye and the laser. Do not stare into the beam.
2.9
2.10
Do not use the system with any other lasers, and do not make any changes to settings or processes that are not described in these operating instructions. This may lead to a dangerous exposure to radiation.

Ventilation slots

Ventilation slots
Never cover the ventilation slots on the unit under any circumstances, since this may obstruct air circulation. This can cause the unit to overheat.
SL sensor ventilation sl ots
Under no circumstances may the ventilation slots on the sensor unit be covered, since otherwise the air circulation in the sensor unit will be obstructed. This can cause the sensor unit to overheat.

Qualifications of service personnel

Installation and startup may be carried out only by personnel specifically authorized by Sirona.
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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS SL 2.11Radiation protection
2.11

Radiation protection

Safety information for rad iation protection: Service engine er
The valid radiation protection regulations and measures must be observed. The statutory radiation protection equipment must be used.
During an exposure, the service engineer should move as far away from the X-ray tube assembly as the coiled cable of the manual release permits.
With the exception of the service engineer, no other persons are allowed to stay in the room during an exposure.
In case of malfunctions, cancel the exposure immediately by letting go of the exposure release button.
Information about radiat ion protection for Canada
NOTICE
3D imaging should not be used for screening examinations. 3D imaging examinations must be clinically warranted and each exam must be justified by demonstrating that the benefits outweigh the risks.
NOTICE
Where it is likely that evaluation of soft tissues will be required as part of the patient's radiological assessment, the appropriate imaging should be conventional medical CT or MR, rather than 3D imaging using Cone Beam technology.
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2.12
2.13

Safety checks

Safety checks
Once repairs are completed, the circuit breaker test and unit leakage current test must be carried out (see chapter "Checking the circuit breaker" and "Checking the unit leakage current").

Functional check

CAUTION
Be sure to observe the descriptions and safety information given in the chapter titled "Switch on the unit" and "Test exposures / test images".
Following any form of service and maintenance work, a functional check must be performed on the device. Perform the following test steps:
1. Perform a restart of the unit: –Switch the unit off. – Wait 1 minute. –Switch the unit on. – Wait for the self-test.
2. Perform a 2D test exposure using the needle phantom included in the scope of supply.
3. Perform a 3D test exposure using the constancy test phantom / DIN DVT test phantom included in the scope of supply.
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3Unit description Sirona Dental Systems GmbH
3.1Hardware Service Manual ORTHOPHOS SL

Unit description

3
Electrostatic discharge (ESD)
Identification of single use devices
3.1

Hardware

3.1.1 Information on the unit

The following symbols are applied to the unit:
This symbol can be found next to the rating plate on the unit.
Meaning: Observe the Operating Instructions when operating the unit.
This symbol can be found on the rating plate on the unit.
Meaning: The accompanying documents are available on the Sirona homepage.
Connector pins or sockets bearing ESD warning labels must not be touched or interconnected without ESD protective measures. See also "Electrostatic Discharge" and "Electromagnetic Compatibility" [ → 15].
XGPF-36245; Single use hygienic protective sleeves
Prior to each exposure, the hygienic protective sleeves (single use devices) must be fitted.
Single use devices are identified with the symbol shown on the left. They must be disposed of immediately after use. Do not use single use devices more than once.
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Sirona Dental Systems GmbH 3Unit description
A
B
C
Service Manual ORTHOPHOS SL 3.1Hardware

3.1.2 System version

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Version Description
A ORTHOPHOS SL 2D
ORTHOPHOS SL 3D
Digital X-ray unit with DCS sensor
Pan sensor: Digital CdTe sensor with direct converter technology for panoramic exposure technology
Digital X-ray unit with digital Flat Panel Detector and DCS sensor
Flat Panel Detector: Digital Flat Panel Detector with a-Si technology (amorphous silicon) Pan sensor: Digital CdTe sensor with direct converter technology for panoramic exposure technology
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3Unit description Sirona Dental Systems GmbH
3.1Hardware Service Manual ORTHOPHOS SL
Version Description
B ORTHOPHOS SL 2D/3D
Ceph, left-arm version
C ORTHOPHOS SL 2D/3D
Ceph, right-arm version
Digital X-ray unit ORTHOPHOS SL (all variants A) with cephalometer, left-arm version
Digital X-ray unit ORTHOPHOS SL (all variants A) with cephalometer, right-arm version

3.1.3 Sensor versions

2D sensor unit: Sensor unit for panoramic X-ray (PAN): DCS sensor (2D)
2D/3D sensor unit: Sensor unit for panoramic X-ray (PAN) and volume exposures (3D): DCS sensor (2D) and flat panel detector (3D)
CEPH sensor: Sensor for cephalometric X-ray (Ceph) (2D)
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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS SL 3.1Hardware

3.1.4 Installation versions

A Standard installation
Unit
without remote control with release button on the coiled cable
in the treatment room.
B Installation version 1
Unit
with remote control
button on the coiled cable
C Installation version 2
outside the X-ray room
.
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without release
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with remote control
Unit
button on the coiled cable
outside the X-ray room
with release
.
21
3Unit description Sirona Dental Systems GmbH
D
A
B
C
3.1Hardware Service Manual ORTHOPHOS SL

3.1.5 Modules and components

A Slide [ → 23]
B Stand [ → 24]
C Cephalometer [ → 25]
D Remote control [ → 25]
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Sirona Dental Systems GmbH 3Unit description
DX1
M1, M2DX5
LS
DX6*
DX61*
DX51
DX77
DX83
M
U
LS
LS
M, M
AK1 AK2
DX78
DX7*
DX11
Service Manual ORTHOPHOS SL 3.1Hardware
3.1.5.1
Slide
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Component Designation Function
Boards DX1 Open loop/closed loop control in general
DX11 Controller board
DX5 Headrest adapter
DX51 Occlusal bite block
DX6 Open loop/closed loop tube assembly
DX7* Easypad touchscreen
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3Unit description Sirona Dental Systems GmbH
DX32
MHV
Netzfilter
Filtre secteur
Power Filter
Filtro de red
3.1Hardware Service Manual ORTHOPHOS SL
Component Designation Function
DX61* Diaphragm control
DX77 Control board ambient light
DX83 Control board sensor unit
Motor MU Rotary movement of rotating element
MAK1, MAK2 Linear movement of rotating element
M1, M2 Linear movement of headrest
Light barriers LS Position control of the ring cycle
*) not available as individual repair part (see spare parts list).
3.1.5.2
Stand
Component Designation Function
Boards DX32 Power supply board
Motor MHV Linear movement of height
adjustment
Line filter
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Sirona Dental Systems GmbH 3Unit description
LS
MS
DX91
DX42
Service Manual ORTHOPHOS SL 3.1Hardware
3.1.5.3
3.1.5.4
Cephalometer
Component Designation Function
Boards DX91 Cephalometer control
Motors MS Stepping motors: linear movement
of secondary diaphragm and sensor
Light barriers LS Position check
Remote control
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Component Designation Function
Board DX42 Display board for remote control
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3Unit description Sirona Dental Systems GmbH
Wagoklemme
T
Borne
erminal
Borne
DX1
Netzfilter
Power Filter
Filtre secteur
Filtro de red
DX32 / X2
DX6 / X3
DX32 / X1
DX1 / X100
DX1 / J302
DX6 / J6
L5
DX6
L4
L1
L3
DX32
L2
L1
L2
L3
L4
L5
Netzschalter / S1
Power switch / S1
Interrupteur á bascule / S1
Interruptor de red /S1
DX1 / X104
DX7 / X102
DX1 / X302
DX7 / X103
DX1 / X102
DX61 / X501
DX1 / J306 – J307
DX6 / J2 – J3
L6_XG
5922526
L6
5922526 DX1/J307
L6
5922526 DX1/J306
DX1
DX6
DX7
DX61
L10
L11
L6
L9
L6
L9
L10
L11
3.1Hardware Service Manual ORTHOPHOS SL

3.1.6 Cabling overview

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Sirona Dental Systems GmbH 3Unit description
DX1 / X306
DX61 / X101
DX1 / X404
DX5 / X1
DX1 / X610
DX1 / X403
HV-Motor / Filter
HV-Motor / Filter
Moteur HV / Filtre
Motor HV / Filtro
LS-Sensor, Endschalter oben und unten
LS-Sensor, Limit switch
above and down
Sensor LS, Interrupteur de fin en haut et en bas
Sensor LS, Conmutador de final arriba y abajo
DX5
L15 XG
6319185 DX1/J309
L15 XG
6319185 DX6/J5
Hersteller-
produktionsdaten
DX1 / J309
DX6 / J5
DX1
DX5
DX61
L18
L19
L16
L15
L12
L12
L15
L16
L18
L19
DX61 / X303 / 304
DX5
DX81 / X100
DX1 / X503
DX61 / X203
TSA Motor
LASER
LS
AMP
LS
L24_XG
6090760
L24_XG
6090760
DX91/
X407
DX91/
X302
AMP
DX91/X302
DX91/X407
LS Sensor
Laser
Lasermodul
Laser module
Module de laser
Módulo del laser
Potentiometer
Potentiometer
Potentiomètre
Potenciómetro
DX5
Motor / Motor
Moteur / Motor
LS-Sensor, Motor
LS-Sensor, Motor
Sensor LS, Moteur
Sensor LS, Motor
L23
DX1
L21 L20
DX61
L38
L35
DX81
DX91
L24
L20
L21
L31
L23
L24
L31
L35
L38
Service Manual ORTHOPHOS SL 3.1Hardware
bеЦдблЬ
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3Unit description Sirona Dental Systems GmbH
DX91
DX91 / X6
DX91 / X101
DX1 / X103
DX1 / X309
Haube, blau
Cover, blue
Capot, bleu
Tapa, azul
Haube, blau
Cover, blue
Capot, bleu
Tapa, azul
Schrumpfschlauch
Shrink hose
Gaine thermorétrac.
Macarrón termoencogible
DX1 / X1000
DX51 / X1
L41
DX1
DX51
L36
L37
L39 L40
L41
L36
L37
L39
L40
L41
Media Konverter
L108_XG
6094705
DX1/
X303
L117/
X103
L108_XG
6094705
DX1 / X303
L117 / X103
L117_XG
6094697
L117_XG
6094697
DX42 / X100
L108 / X103
DX1 / J901
Media Konverter
Media converter
Convertisseur de media
Convertidor de medios
DX83
DX1 / X500
DX83 / X100 (L83A)
X700
(LWL1)
X800
(LWL2)
DX83 (L83B)
DX42
DX1
L83
L81
L80
L25 L26
L108
L117
L83
L81
L80
L80
L25 L26
L108
L117
3.1Hardware Service Manual ORTHOPHOS SL
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Sirona Dental Systems GmbH 3Unit description
DX83 / X100
L83 (SUB-D)
DX83
DX83 / X800
DX83 / X700
L83 (LWL2)
L83 (LWL1)
Sensor
Sensor
Sensor
Sensor
DX83 / X602
DX83 / X601
Sensor
Sensor
Sensor
Sensor
DX1 / X1501
DX77 / X6
DX78
DX77
DX1
DX78
DX77
L88
L88
L87
L83.1 L83.2 L83.3 L84
L83.1
L83.2
L83.3
L84
L87
L88
Service Manual ORTHOPHOS SL 3.1Hardware
bеЦдблЬ
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3Unit description Sirona Dental Systems GmbH
3.1Hardware Service Manual ORTHOPHOS SL

3.1.7 Board photos

DX1/DX11 boards
3.1.7.1
Boards in the slide
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