M O T H E R B O A R D
B550-A PRO
B U S I N E S S E L E G A N C E
FEATURE
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Core Boost |
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With premium layout and fully digital power design to support |
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more cores and provide better performance. |
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DDR4 Boost |
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Advanced technology to deliver pure data signals for the |
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best gaming performance and stability. |
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Lightning Gen4 solution |
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The latest Gen4 PCI-E and M.2 solution with up to 64GB/s |
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bandwidth for maximum transfer speed. |
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M.2 Shield FROZR |
SPECIFICATION |
Strengthened built-in M.2 thermal solution. Keeps M.2 SSDs |
safe while preventing throttling, making them run faster. |
|
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2oz Thickened Copper PCB |
Model Name
CPU Support
CPU Socket
Chipset
Graphics Interface
Display Interface
Memory Support
Expansion Slots
Storage
USB ports
LAN
Audio
B550-A PRO
Support for 3rd Gen AMD® Ryzenth processors and future AMD® Ryzen™ processors with BIOS update
AMD Socket AM4
AMD® B550 Chipset
1x PCIe 4.0 / 3.0 x16 slot + 1x PCIe 3.0 x16 slot Support 2-way AMD® CrossFire™ Technology
DisplayPort, HDMI – Requires Processor Graphics
4 DIMMs, Dual Channel DDR4-4400 MHz (OC)
2x PCI-E 3.0 x1 slots
1 x M.2 Gen4 x4, 1 x M.2 Gen3 x4 slot 6x SATA 6Gb/s ports
2x USB 3.2 Gen 2 10Gbps (1 Type-A + 1 Type-C)
+5x USB 3.2 Gen 1 5Gbps (4 Type-A+ 1 Type-C)
+8 x USB 2.0
Realtek® RTL8111H Gigabit LAN
8-Channel (7.1) HD Audio with Audio Boost
An enhanced PCB design improves heat dissipation and performance reliability.
PCI-E Steel Armor
Protecting VGA cards against bending and EMI
EZ Debug LED
Easiest way to troubleshoot.
Audio Boost
Reward your ears with studio grade sound quality for the most immersive audio experience.
CONNECTIONS
1. |
Keyboard / Mouse |
6. |
USB 2.0 |
2. |
DisplayPort |
7. |
HDMI |
3. |
LAN |
8. |
USB 2.0 |
4. |
HD Audio Connectors |
9. |
USB 3.2 Gen 1 5Gbps Type-A |
5. |
Flash BIOS Button |
10. |
USB 3.2 Gen 2 10Gbps Type-A+C |
© 2018 Micro-Star Int'l Co.Ltd. MSI is a registered trademark of Micro-Star Int'l Co.Ltd. All rights reserved.
Generated 2020-05-22, check for the latest version www.msi.com/datasheet. The information provided in this document is intended for informational purposes only and is subject to change without notice.