MOTOROLA MC10E160FNR2, MC100E160FNR2, MC10E160FN, MC100E160FN Datasheet



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 2

 Motorola, Inc. 1996

12/93

 


The MC10E/100E160 is a 12-bit parity generator/checker. The Q
output is HIGH when an odd number of inputs are HIGH. A HIGH on the
Enable input (EN) forces the Q output LOW.

The E160 also features an output register. Multiplexers direct the
register input, giving the option of holding present data by asserting
HOLD

LOW, or of shifting data in through the S-IN pin by asserting SHIFT
HIGH. The output register itself is clocked by a positive edge on CLK1 or
CLK2 (or both). A HIGH on the reset pin (R) overrides to force the Y
output LOW.

• Provides Odd-HIGH Parity of 12 Inputs

• Shiftable Output Register with Hold

• 900ps Max. D to Q/Q Output

• Enable

• Asynchronous Register Reset

• Dual Clocks

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

PIN NAMES

Pin Function

D0– D

11

Data Inputs
S-IN Serial Data Input
EN Enable, active LOW
HOLD Hold, active LOW
SHIFT Shift, active HIGH
CLK1, CLK2 Clock Inputs
R Reset Inputs
Q, Q Direct Output
Y, Y Register Output





12-BIT PARITY

GENERATOR/CHECKER

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

D

1

D11HOLD

S-IN SHIFT CLK1 CLK2

EN

V

CCO

D

0

D

2

D

3

D

4

LOGIC DIAGRAM

D

5

D

6

D

7

V

EE

D

8

D

9

D

10

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

Q

Q

V

CC

Y

Y

V

CCO

NC

R

D

0

D

1

D

2

D

3

D

4

D

5

D

6

D

7

D

8

D

9

D

10

EN

HOLD

S-IN

SHIFT

CLK1
CLK2

R

D

11

D

R

Y
Y

Q

0
1

1

MUX

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.

SEL

0
1

MUX

SEL

MC10E160 MC100E160

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

I

IH

Input HIGH Current µA

CLK1, CLK2 200 200 200
R 300 300 300

All Other Inputs 150 150 150

I

EE

Power Supply Current mA

10E 82 98 82 98 82 98
100E 82 98 82 98 94 113

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

t

PLH

Propagation Delay to Output ps

t

PHL

D to Q 400 650 950 400 650 950 400 650 950
En to Q 300 550 750 300 550 750 300 550 750
CLK to Y 275 500 700 275 500 700 275 500 700

R to Y 275 500 725 275 500 725 275 500 725

t

s

Setup Time ps

D 1200 900 1200 900 1200 900
HOLD 600 300 600 300 600 300
S-IN 350 150 350 150 350 150

SHIFT 500 250 500 250 500 250

t

h

Hold Time ps

D – 400 – 900 – 400 – 900 – 400 – 900
HOLD 100 –300 100 – 300 100 – 300
S-IN 300 –150 300 –150 300 –150

SHIFT 200 –250 200 – 250 200 – 250

t

r

Rise/Fall Time ps

t

f

20 - 80% 300 450 650 300 450 650 300 450 650

1. Within a device skew is guaranteed for identical transitions on similar paths through a device.

MC10E160 MC100E160

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E160 MC100E160

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

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specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MC10E160/D

*MC10E160/D*

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