H
Surface Mount LED Indicator
Technical Data
•Compatible with Automatic Placement Equipment
•Compatible with Infrared and Vapor Phase Reflow Solder Processes
•Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels
•EIA Standard Package
•Low Package Profile
•Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes
These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes.
The package size and configuration conform to the EIA-535 BAAC standard specification for case size 3528 tantalum capacitors. The folded leads
HSMD-TX00
HSME-TX00
HSMG-TX00
HSMH-TX00
HSMS-TX00
HSMY-TX00
permit dense placement and provide an external solder joint for ease of inspection.
These devices are nondiffused, providing high intensity for applications such as backlighting, light pipe illumination, and front panel indication.
DH AS |
High |
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High |
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AlGaAs |
Efficiency |
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Performance |
Emerald |
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Red |
Red |
Orange |
Yellow |
Green |
Green |
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HSMH- |
HSMS- |
HSMD- |
HSMY- |
HSMG- |
HSME- |
Description |
T400 |
T400 |
T400 |
T400 |
T400 |
T400 |
12 mm Tape, 7" Reel, |
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2000 Devices |
T500 |
T500 |
T500 |
T500 |
T500 |
T500 |
12 mm Tape, 13" Reel, |
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8000 Devices |
T600 |
T600 |
T600 |
T600 |
T600 |
T600 |
8 mm Tape, 7" Reel, |
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2000 Devices |
T700 |
T700 |
T700 |
T700 |
T700 |
T700 |
8 mm Tape, 13" Reel, |
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8000 Devices |
1-204 |
5964-9359E |
3.5 ± 0.2
(0.138 ± 0.008)
2.8 ± 0.2 |
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2.2 |
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2.7 |
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NOM. |
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NOM. |
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(0.110 ± 0.008) |
(0.087) |
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(0.106) |
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NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.
CATHODE NOTCH
3.1 NOM.
(0.122)
1.9 ± 0.2
(0.075 ± 0.008)
0.7 MIN.
(0.028)
0.1
(0.004)
NOM.
0.8 ± 0.3 |
1.3 |
2.2 ± 0.1 |
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(0.031 ± 0.012) |
(0.087 |
± 0.004) |
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(0.050) |
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(2 PLACES) |
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MIN. |
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Tape and Reel
Specifications
Hewlett Packard surface mount LEDs are packaged tape and reel in accordance with EIA-481A,
Taping of Surface Mount
Components for Automatic Placement. This packaging system is compatible with tapefed automatic pick and place systems. Each reel is sealed in a
vapor barrier bag for added protection. Bulk packaging in vapor barrier bags is available upon special request.
USER FEED DIRECTION
CATHODE
PITCH: 4 mm (0.157 IN.)
hp
HEWLETTPACKARD
REEL DIAMETER:
178 mm (7 IN.) OR 330 mm (13 IN.)
CARRIER TAPE WIDTH:
12 mm (0.472 IN.) OR 8 mm (0.315 IN.)
1-205
Absolute Maximum Ratings at TA = 25°C
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DH AS |
High |
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High |
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AlGaAs |
Efficiency |
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Perf. |
Emerald |
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Parameter |
Red |
Red |
Orange |
Yellow |
Green |
Green |
Units |
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DC Forward |
30 |
30 |
30 |
30 |
30 |
30 |
mA |
Current[1] |
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Peak Forward |
300 |
90 |
90 |
60 |
90 |
90 |
mA |
Current[2] |
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Average |
20 |
25 |
25 |
20 |
25 |
25 |
mA |
Forward |
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Current[2] |
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LED Junction |
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95 |
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°C |
Temperature |
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Transient |
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Forward |
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Current[3] |
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(10 μs Pulse) |
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500 |
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mA |
Reverse Voltage |
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5 |
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V |
(IR = 100 mA) |
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Operating |
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-40 to +85 |
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-20 to +85 |
°C |
Temperature |
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Range |
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Storage |
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-40 to +85 |
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°C |
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Temperature |
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Range |
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Reflow Soldering |
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Temperature |
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235°C Peak, above 185°C for 90 seconds. |
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Convective IR |
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Vapor Phase |
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215°C for 3 minutes. |
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Notes:
1.Derate dc current linearly from 50°C: For AlGaAs red, high efficiency red, and green devices at 0.67 mA/°C. For yellow devices at 0.44 mA/°C.
2.Refer to Figure 5 showing Maximum Tolerable Peak Current vs. Pulse duration to establish pulsed operating conditions.
3.The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bond. The device should not be operated at peak currents above the Absolute Maximum Peak Forward Current.
1-206