H
Surface Mount Flip Chip LEDs
Technical Data
•Improved Reliability Through Elimination of Internal Wire Bond
•-40 to 85°C Operating Temperature Range
•Small Size
•Industry Standard Footprint
•Diffused Optics
•Compatible with IR Solder Process
•Four Colors Available
•Available in 8 mm Tape on 7" (178 mm) Diameter Reels
•Keypad Backlighting
•LCD Backlighting
•Symbol Backlighting
•Front Panel Indicator
The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.
The HSMX-H670 and HSMX-H690 are available in four colors. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. The HSMX-H690 adheres to the 1.6 x 0.8 mm
HSMX-H670 Series
HSMX-H690 Series
industry standard footprint. The low 0.6 mm profile make this excellent for designs where space is limited.
Both packages are compatible with IR and convective reflow soldering processes.
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High |
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Footprint |
Efficiency |
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(mm)[1][2] |
Red |
Orange |
Yellow |
Green |
1.6 x 0.8 x 0.6 |
HSMS-H690 |
HSMD-H690 |
HSMY-H690 |
HSMG-H690 |
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2.0 x 1.25 x 1.1 |
HSMS-H670 |
HSMD-H670 |
HSMY-H670 |
HSMG-H670 |
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Notes:
1.Dimensions in mm.
2.Tolerance ± 0.1 mm unless otherwise noted.
0.40
(0.016)
HSMX-H670 Series |
HSMX-H690 Series |
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CATHODE MARK |
POLARITY |
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POLARITY |
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2.00 |
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(0.079) |
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1.00 |
0.60 |
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1.10 |
1.25 |
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1.27 |
(0.043) |
(0.049) |
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(0.050) |
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0.30 |
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0.50 (0.020) |
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TOPSIDE |
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CATHODE |
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0.80 |
MARK |
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0.40 (0.016) |
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0.48 (0.019) |
1.60 |
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BOTTOMSIDE CATHODE MARK |
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NOTES:
1.DIMENSIONS ARE IN MILLIMETERS (INCHES).
2.TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH).
3.THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05 MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.
Absolute Maximum Ratings at TA = 25°C
Parameter |
HSMX-H670 |
HSMX-H690 |
Units |
DC Forward Current[1] |
20 |
20 |
mA |
Power Dissipation |
50 |
50 |
mW |
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Reverse Voltage (IR = 100 μA) |
5 |
5 |
V |
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Operating Temperature Range |
-40 to +85 |
-40 to +85 |
°C |
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Storage Temperature Range[2] |
-40 to +85 |
-40 to +85 |
°C |
Notes:
1.Derate linearly as shown in Figure 4 for temperatures above 25°C.
2.Maximum temperature for tape and reel packaging is 60°C.
Optical Characteristics at TA = 25°C
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Luminous |
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Color, |
Viewing |
Luminous |
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Intensity |
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Peak |
Dominant |
Angle |
Efficacy |
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IV (mcd) |
Wavelength |
Wavelength |
2θ1/2 |
ηv |
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Part |
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@ I = 20 mA[1] |
λ |
peak |
(nm) |
λ [2] (nm) |
Degrees[3] |
(lm/W) |
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F |
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d |
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Number |
Color |
Min. |
Typ. |
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Typ. |
Typ. |
Typ. |
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HSMS-H6X0 |
High |
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Efficiency |
1.6 |
5.0 |
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639 |
626 |
165 |
145 |
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Red |
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HSMD-H6X0 |
Orange |
1.6 |
4.0 |
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606 |
604 |
165 |
380 |
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HSMY-H6X0 |
Yellow |
1.6 |
5.0 |
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584 |
586 |
165 |
500 |
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HSMG-H6X0 |
Green |
4.0 |
9.0 |
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566 |
571 |
165 |
595 |
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Notes:
1.The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
2.The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3.θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA = 25°C
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Forward |
Reverse |
Capacitance |
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Voltage |
Breakdown |
C (pF), |
Thermal |
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VF (Volts) |
VR (Volts) |
VF = 0, |
Resistance |
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Part |
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@ IF = 20 mA |
@ IR = 100 μA |
f = 1 MHz |
RθJ-PIN (°C/W) |
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Number |
Color |
Typ. |
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Max. |
Min. |
Typ. |
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HSMS-H670 |
High Efficiency |
2.0 |
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2.6 |
5 |
6 |
250 |
HSMS-H690 |
Red |
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HSMD-H670 |
Orange |
2.0 |
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2.6 |
5 |
5 |
250 |
HSMD-H690 |
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HSMY-H670 |
Yellow |
2.1 |
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2.6 |
5 |
5 |
250 |
HSMY-H690 |
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HSMG-H670 |
Green |
2.3 |
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2.6 |
5 |
5 |
250 |
HSMG-H690 |
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