HP HSMH-T400, HSMH-T500, HSMH-T600, HSMH-T700, HSME-T700 Datasheet

H

Surface Mount LED Indicator

Technical Data

Features

•Compatible with Automatic Placement Equipment

•Compatible with Infrared and Vapor Phase Reflow Solder Processes

•Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels

•EIA Standard Package

•Low Package Profile

•Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes

Description

These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes.

The package size and configuration conform to the EIA-535 BAAC standard specification for case size 3528 tantalum capacitors. The folded leads

HSMD-TX00

HSME-TX00

HSMG-TX00

HSMH-TX00

HSMS-TX00

HSMY-TX00

permit dense placement and provide an external solder joint for ease of inspection.

These devices are nondiffused, providing high intensity for applications such as backlighting, light pipe illumination, and front panel indication.

Device Selection Guide

DH AS	High			High
AlGaAs	Efficiency			Performance	Emerald
Red	Red	Orange	Yellow	Green	Green
HSMH-	HSMS-	HSMD-	HSMY-	HSMG-	HSME-	Description
T400	T400	T400	T400	T400	T400	12 mm Tape, 7" Reel,
						2000 Devices
T500	T500	T500	T500	T500	T500	12 mm Tape, 13" Reel,
						8000 Devices
T600	T600	T600	T600	T600	T600	8 mm Tape, 7" Reel,
						2000 Devices
T700	T700	T700	T700	T700	T700	8 mm Tape, 13" Reel,
						8000 Devices

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5964-9359E

Package Dimensions

3.5 ± 0.2

(0.138 ± 0.008)

2.8 ± 0.2
	2.2				2.7		NOM.
			NOM.
(0.110 ± 0.008)	(0.087)				(0.106)

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.

CATHODE NOTCH

3.1 NOM.

(0.122)

1.9 ± 0.2

(0.075 ± 0.008)

0.7 MIN.

(0.028)

0.1

(0.004)

NOM.

	0.8 ± 0.3	1.3	2.2 ± 0.1
	(0.031 ± 0.012)		(0.087	± 0.004)
		(0.050)
	(2 PLACES)
		MIN.

Tape and Reel

Specifications

Hewlett Packard surface mount LEDs are packaged tape and reel in accordance with EIA-481A,

Taping of Surface Mount

Components for Automatic Placement. This packaging system is compatible with tapefed automatic pick and place systems. Each reel is sealed in a

vapor barrier bag for added protection. Bulk packaging in vapor barrier bags is available upon special request.

USER FEED DIRECTION

CATHODE

PITCH: 4 mm (0.157 IN.)

hp

HEWLETTPACKARD

REEL DIAMETER:

178 mm (7 IN.) OR 330 mm (13 IN.)

CARRIER TAPE WIDTH:

12 mm (0.472 IN.) OR 8 mm (0.315 IN.)

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Absolute Maximum Ratings at TA = 25°C

	DH AS	High			High
	AlGaAs	Efficiency			Perf.	Emerald
Parameter	Red	Red	Orange	Yellow	Green	Green	Units
DC Forward	30	30	30	30	30	30	mA
Current[1]
Peak Forward	300	90	90	60	90	90	mA
Current[2]
Average	20	25	25	20	25	25	mA
Forward
Current[2]
LED Junction			95				°C
Temperature
Transient
Forward
Current[3]
(10 μs Pulse)			500				mA
Reverse Voltage			5				V
(IR = 100 mA)
Operating			-40 to +85			-20 to +85	°C
Temperature
Range
Storage			-40 to +85				°C
Temperature
Range
Reflow Soldering
Temperature		235°C Peak, above 185°C for 90 seconds.
Convective IR
Vapor Phase			215°C for 3 minutes.

Notes:

1.Derate dc current linearly from 50°C: For AlGaAs red, high efficiency red, and green devices at 0.67 mA/°C. For yellow devices at 0.44 mA/°C.

2.Refer to Figure 5 showing Maximum Tolerable Peak Current vs. Pulse duration to establish pulsed operating conditions.

3.The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bond. The device should not be operated at peak currents above the Absolute Maximum Peak Forward Current.

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