HP HSMD-H670, HSMD-H690, HSMG-H670, HSMG-H690, HSMY-H670 Datasheet

H

Surface Mount Flip Chip LEDs

Technical Data

Features

•Improved Reliability Through Elimination of Internal Wire Bond

•-40 to 85°C Operating Temperature Range

•Small Size

•Industry Standard Footprint

•Diffused Optics

•Compatible with IR Solder Process

•Four Colors Available

•Available in 8 mm Tape on 7" (178 mm) Diameter Reels

Applications

•Keypad Backlighting

•LCD Backlighting

•Symbol Backlighting

•Front Panel Indicator

Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.

The HSMX-H670 and HSMX-H690 are available in four colors. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. The HSMX-H690 adheres to the 1.6 x 0.8 mm

HSMX-H670 Series

HSMX-H690 Series

industry standard footprint. The low 0.6 mm profile make this excellent for designs where space is limited.

Both packages are compatible with IR and convective reflow soldering processes.

Device Selection Guide

	High
Footprint	Efficiency
(mm)[1][2]	Red	Orange	Yellow	Green
1.6 x 0.8 x 0.6	HSMS-H690	HSMD-H690	HSMY-H690	HSMG-H690
2.0 x 1.25 x 1.1	HSMS-H670	HSMD-H670	HSMY-H670	HSMG-H670

Notes:

1.Dimensions in mm.

2.Tolerance ± 0.1 mm unless otherwise noted.

Package Dimensions

0.40

(0.016)

HSMX-H670 Series		HSMX-H690 Series
	CATHODE MARK	POLARITY
	POLARITY
2.00
(0.079)		1.00	0.60
	1.10	1.25
1.27	(0.043)	(0.049)
(0.050)		0.30
	0.50 (0.020)
			TOPSIDE
			CATHODE
		0.80	MARK
	0.40 (0.016)
	0.48 (0.019)	1.60
		BOTTOMSIDE CATHODE MARK

NOTES:

1.DIMENSIONS ARE IN MILLIMETERS (INCHES).

2.TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH).

3.THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05 MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.

Absolute Maximum Ratings at TA = 25°C

Parameter	HSMX-H670	HSMX-H690	Units
DC Forward Current[1]	20	20	mA
Power Dissipation	50	50	mW
Reverse Voltage (IR = 100 μA)	5	5	V
Operating Temperature Range	-40 to +85	-40 to +85	°C
Storage Temperature Range[2]	-40 to +85	-40 to +85	°C

Notes:

1.Derate linearly as shown in Figure 4 for temperatures above 25°C.

2.Maximum temperature for tape and reel packaging is 60°C.

Optical Characteristics at TA = 25°C

		Luminous					Color,	Viewing	Luminous
		Intensity			Peak		Dominant	Angle	Efficacy
		IV (mcd)		Wavelength			Wavelength	2θ1/2	ηv
Part		@ I = 20 mA[1]		λ	peak	(nm)	λ [2] (nm)	Degrees[3]	(lm/W)
		F					d
Number	Color	Min.	Typ.		Typ.		Typ.	Typ.
HSMS-H6X0	High
	Efficiency	1.6	5.0		639		626	165	145
	Red
HSMD-H6X0	Orange	1.6	4.0		606		604	165	380
HSMY-H6X0	Yellow	1.6	5.0		584		586	165	500
HSMG-H6X0	Green	4.0	9.0		566		571	165	595

Notes:

1.The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.

2.The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

3.θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.

Electrical Characteristics at TA = 25°C

		Forward			Reverse	Capacitance
		Voltage			Breakdown	C (pF),	Thermal
		VF (Volts)			VR (Volts)	VF = 0,	Resistance
Part		@ IF = 20 mA			@ IR = 100 μA	f = 1 MHz	RθJ-PIN (°C/W)
Number	Color	Typ.		Max.	Min.	Typ.
HSMS-H670	High Efficiency	2.0		2.6	5	6	250
HSMS-H690	Red
HSMD-H670	Orange	2.0		2.6	5	5	250
HSMD-H690
HSMY-H670	Yellow	2.1		2.6	5	5	250
HSMY-H690
HSMG-H670	Green	2.3		2.6	5	5	250
HSMG-H690