HIT 4AC12 Datasheet

Application
Low frequency power amplifier
Outline
SP-10
4AC12
Silicon NPN Epitaxial
1
1, 10 Emitter 2, 4, 6, 8 Base 3, 5, 7, 9 Collector
10
3
2
1
6
7
4
I
D
8
I
D
5
I
D
9
I
D
10
4AC12
Absolute Maximum Ratings (for each device, Ta = 25°C)
Item Symbol Ratings Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector peak current I Diode current I Collector power dissipation PC*
CBO
CEO
EBO
C
C(peak)
D
1
1
P
*
(TC = 25°C) 28
C
Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. 4 devices operation.
Electrical Characteristics (for each device, Ta = 25°C)
27 V 27 V 7V 2A 4A 2A 4W
Item Symbol Min Typ Max Unit Test conditions
Collector to emitter breakdown
V
(BR)CBO
27 V IC = 1 mA, IE = 0
voltage Collector to emitter sustain
V
CEO(SUS)
28 36 V IC = 1 A, L = 20 mH, RBE =
voltage Emitter to base breakdown
V
(BR)EBO
7——VI
= 5 mA, IC = 0
E
voltage Collector cutoff current I
DC current transfer ratio h
Collector to emitter saturation
I
h V
CBO
CEO
FE
FE
CE(sat)
——10µAVCB = 20 V, IE = 0 — 10 VCE = 20 V, RBE = 7000 30000 VCE = 2 V, IC = 0.5 A 2000 VCE = 2 V, IC = 2 A* — 1.5 V IC = 2 A, IB = 2 mA*
voltage Base to emitter saturation
V
BE(sat)
2.0 V IC = 2 A, IB = 2 mA*
voltage C to E diode forward current V
D
3.5 V ID = 2 A
Note: 1. Pulse test.
1
1
1
2
Maximum Collector Dissipation Curve
6
(W)
C
4 device operation 3 device operation
4
2 device operation
1 device operation
2
Maximum Collector Dissipation Curve
30
4 device operation
(W)
C
20
3 device operation
2 device operation
4AC12
Collector power dissipation P
0 50 100 150
Ambient temperature Ta (°C)
Note: Collector power dissipation of each devices
is identical.
Area of Safe Operation
10
i
(A)
C
3.0
1.0
C(peak)
I
C(max)
DC Operation
(T
C
= 25°C)
1 ms
PW = 10 ms
0.3
0.1
Collector current I
0.03
Ta = 25°C 1 shot pulse
0.01
1.0 50100.5 2 205
Collector to emitter voltage V
CE
(V)
10
Collector power dissipation P
1 device operation
0 50 100 150
Case temperature T
(°C)
C
Typical Output Characteristics
(A)
C
2.0
1.6
90
80
70
60
50
40
1.2
0.8
30 µA
Collector current I
0.4 TC = 25°C
I
= 0
B
01 4325
Collector to emitter voltage VCE (V)
3
4AC12
DC Current Transfer Ratio
vs. Collector Current
100,000
FE
30,000
10,000
Ta = 75°C
3,000
1,000
300
DC current transfer ratio h
–25°C
100
0.03 0.1 1.0 Collector current I
Base to Emitter Saturatiion Voltage
vs. Collector Current
10
(V)
BE(sat)
Ta = –25°C
3.0
1.0
25°C
VCE = 2 V
0.3 3.0 (A)
C
25°C
75°C
Collector to Emitter Saturatiion Voltage
vs. Collector Current
10
(V)
CE(sat)
3
Ta = –25°C
25°C
75°C
1.0
0.3 IC = 1000 I
0.1
0.03 0.3
Collector to emitter saturation voltage V
Collector current IC (A)
Typical Transfer Characteristics
2.0
1.6
(A)
C
1.2
0.8
VCE = 2 V
Ta = 75°C
25°C
–25°C
B
1.00.1 3.0
0.3
IC = 1000 I
0.1
Base to emitter saturation voltage V
0.03 0.3 Collector current IC (A)
B
1.00.1 3.0
Collector current I
0.4
0 0.4 0.8
Base to emitter voltage V
1.2 2.01.6
BE
(V)
4
Zener Voltage vs. Case Temperature
60
4AC12
Transient Thermal Resistance
10
50
(V)
Z
40
30
Zener voltage V
20
10
0 25 75 125
50 100
Case temperature TC (°C)
IC = 1 mA
26.5 ± 0.3
(°C/W)
j-c
1.0
0.1
Thermal resistance θ
0.02
0.01 0.1 1.0 10 (s)
0.01 0.1 1.0 10 (ms)
10 ms to 10 s
10 µs to 10 ms
TC = 25°C
Time t
4.0 ± 0.2
10.0 ± 0.310.5 ± 0.5
2.5
1.5 ± 0.2
110
1.82 2.54 1.4
1234
Pin No.
56
1E2B3C4B5C6B7C8B9C10
1.2 0.55
8910
7
0.55 ± 0.1
Electrode Note: B:
C: E:
Base Collector Emitter
E
5
Unit: mm
26.5 ± 0.3
1.82 2.54 1.4
1234
56
8910
7
10.0 ± 0.310.5 ± 0.5
2.5
0.55 ± 0.1
4.0 ± 0.2
1.5 ± 0.2
0.55
Hitachi Code JEDEC EIAJ Weight
(reference value)
+0.1 –0.06
SP-10 — —
2.9 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533
Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Loading...