Silicon N Channel MOS FET
High Speed Switching
Features
• Low on-resistance
RDS = 2.8 Ω typ. (at VGS = 4 V , ID = 25 mA)
RDS = 4.8 Ω typ. (at VGS = 2.5 V , ID = 10 mA)
• 2.5 V gate drive device
• Small package (SMPAK)
Outline
2SK3349
ADE-208-804 (Z)
1st.Edition.
June 1999
SMPAK
G
3
1
2
D
1. Source
2. Gate
3. Drain
S
2SK3349
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note1
Note 2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value on the alumina ceramic board (12.5x20x0.7 mm)
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage
Gate to source breakdown
V
(BR)GSS
voltage
Gate to source leak current I
Zero gate voltege drain
GSS
I
DSS
current
Gate to source cutoff voltage V
Static drain to source on state R
resistance R
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs|5685—mSI
Input capacitance Ciss — 6 — pF VDS = 10 V
Output capacitance Coss — 7 — pF VGS = 0
Reverse transfer capacitance Crss — 1.2 — pF f = 1 MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
d(on)
r
d(off)
f
Note: 3. Pulse test
4. Marking is DN
20——V I
±10——V I
——±5 µAV
——1 µAV
0.8 — 1.8 V ID = 10 µA, VDS = 5 V
— 2.8 3.6 Ω I
— 4.8 7.2 Ω I
— 120 — ns ID = 25 mA, VGS = 4 V
— 450 — ns RL = 400 Ω
— 480 — ns
— 500 — ns
20 V
±10 V
50 mA
200 mA
50 mA
100 mW
= 100 µA, VGS = 0
D
= ±100 µA, VDS = 0
G
= ±8 V, VDS = 0
GS
= 20 V, VGS = 0
DS
= 25 mA,VGS = 4 V
D
= 10 mA,VGS = 2.5 V
D
= 25 mA, VDS = 10 V
D
Note 3
Note 3
Note 3
2
Main Characteristics
2SK3349
200
Power vs. Temperature Derating
150
100
50
Channel Dissipation *Pch (mW)
0
50 100 150 200
Ambient Temperature Ta ( °C)
*Value on the alumina ceramic boad.(12.5x20x0.7mm)
Typical Output Characteristics
5 V
0.2
4 V
Pulse Test
3 V
0.16
D
0.12
Maximum Safe Operation Area
5
2
1.0
0.5
D
0.2
0.1
0.05
0.02
0.01
0.005
Drain Current I (A)
0.002
0.001
0.0005
Operation in this area
is limited by RDS(on)
0.05
0.1 1.0 10 50
0.2 0.5
Drain to Source Voltage V (V)
Value on the alumina ceramic boad.(12.5x20x0.7mm)
DC Operation
25
DS
PW = 10 ms
(1 shot)
20
Typical Transfer Characteristics
0.2
V = 10 V
DS
Pulse Test
0.16
D
0.12
10 µs
100 µs
1 ms
0.08
Drain Current I (A)
0.04
0
246810
Drain to Source Voltage V (V)
V = 2V
GS
DS
0.08
Drain Current I (A)
0.04
0
75 °C
12345
Gate to Source Voltage V (V)
25 °C
Tc = –25 °C
GS
3