ANPEC APA4863RI-TY, APA4863RI-TU, APA4863OI-TU, APA4863OI-TR, APA4863KI-TR Datasheet

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001

APA4863

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.

Stereo 2.2W Audio Power Amplifier

Features

••

•

Depop Circuitry Integrated

••

•

Thermal Shutdown Circuitry Integrated

••

•

Bridge-Tied Load (BTL) or Single-Ended (SE) Modes Operation

••

•

Output Power at 1% THD+N, VDD=5V

- 2.2W/Ch (typ) into a 3 Ω Load

- 1.8W/Ch (typ) into a 4 Ω Load

- 1.2 W/Ch (typ) into a 8 Ω Load

••

• Shutdown Control Mode, I

SD

= 0.5 µA

••

• Output Power (SE) at 0.5% THD+N, V

DD

=5V

- 90mW/Ch (typ.) into a 32Ω Load

••

• Various Power Packages Available

SOP, TSSOP, TSSOP-P

Applications

••

• Stereo Audio Power Amplifier for Notebook

Computer

••

• Portable Televisions

••

• Portable and Desktop Computers

General Description

Ordering Information

The APA4863 is a stereo bridge-tied audio power amplifier in various power packages , including SOP , TSSOP and TSSOP-P . When connecting to a 5V voltage supply , the APA4863 is capable of delivering

2.2W/1.8W/1.2W of continuous RMS power per channel into 3Ω/4Ω/8Ω bridge-tied loads with less than 1% THD+N respectively . When APA4863 operates in the single-ended load , it is capable of delivering 90mW of continuous RMS power per channel into 32Ω load . The APA4863 simplifies design and frees up board space for other features .

The APA4863 also served well in low-voltage applications , which provides 750mW (1% THD+N) per channel into 4Ω loads with a 3.3V supply voltage . Both of the depop circuitry and the thermal shutdown protection circuitry are integrated in the APA4863 , that reduces pops and clicks noise during power up and when using the shutdown mode and protects the chip from being destroyed by over-temperature failure . To simplify the audio system design in notebook computer applications , the APA4863 combines a stereo bridge-tied loads mode for speaker drive and a stereo single-end mode for headphone drive into a single chip , where both modes are easily switched by the HP-IN input control pin signal . For power sensitive applications , the APA4863 also features a shutdown function which keeps the supply current only

0.5 µA (typ.) .

Package Code K: SOP O: TSSOP R: TSSOP-P* Temp. Range I : -40 to 85 C Handling Code TU : Tube TR : Tape & Reel TY: Tray

APA4863

Handling Code Temp. Range Package Code

°

* TSSOP-P is a standard TSSOP package with a thermal pad exposed on the bottom of the package.

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001

APA4863

www.anpec.com.tw2

Block Diagram

(Over operating free-air temperature range unless otherwise noted.)

Absolute Maximum Ratings

Ring

10

4, 13

V

DD

5

0ΚΩ

50K

Ω

+

5

3

- IN A

+ OUT A

R

L

100µF

To HP-IN Circuit

8

Ω

20K

Ω

20K

Ω

20K

Ω

+

12

14

+ OUT B

R

L

8

Ω

20K

Ω

20K

Ω

20K

Ω

- OUT B

- OUT A

C

O

+

1K

Ω

100µF

C

O

+

1K

Ω

C

S

0.1µF

V

DD

/ 2

6

C

B

2.2µF

8 + IN A*

Bypass

11

9

- IN B

+ IN B*

GND

2,7,15

20K

Ω

R

F

20K

Ω

R

F

C

1

R

1

Audio

Input

20K

Ω

1 µF

C

1

R

1

Audio

Input

20K

Ω

1 µF

16

1

100K

Ω

Shutdown

HP-IN

To Control Pin on

Headphone Jack

1

00ΚΩ

Headphone Jack

Sleeve

Control

Tip

V

DD

* +INA and +INB pins are connected to Bypass pin inside the IC.

Note: *1. Human body model : C=100pF, R=1500Ω, 3 positive pulses plus 3 negative pulses

Symbol Parameter Rating Unit

V

DD

Sup ply Voltage 6 V

T

A

Operating Ambient Temperature Range -40 to 85

°

C

T

J

Maximum Junction Temperature 150

°

C

T

STG

Storage Temperature Range -65 to +150

°

C

T

S

Soldering Temperature,10 seconds 260

°

C

V

ESD

Electrostatic Discharge -2000 to 2000

*1

V

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001

APA4863

www.anpec.com.tw3

Min. Typ. Max. Unit

Supply Voltag e, V

DD

355.5V VDD=5V, 250mW/Ch average

power

4-Ω stereo BTL drive , with proper PCB design

-20 85Operatin g fr ee-air

temper atu r e , T

A

VDD=5V,

1.8 W/Ch average power

4-Ω stereo BTL drive , with proper PCB design and 300 CFM forced-a ir coo ling

-20 85

°

C

VDD=5 V 1.25 4.5Common mode

input vo lt age, V

ICM

VDD=3.3V 1.25 2.7

V

Recommended Operating Conditions

Dissipation Rating Table

Package Air Flow

(CFM)

Thermal Resistance

θθθθ

JA

(°°°°C/W)

T

A

≤≤≤≤25°°°°CT

A

=70°°°°C

SO16 + 0 50 2.5W 1.6W

TSSOP ++ 0

200

73.2

66.6

1.7W

1.8W

1.1W

1.2W

TSSOP-P ++ 0

200

37.6

32.3

3.3W

3.8W

2.1W

2.4W

+ : The parameter is measured with the recommended copper heat sink pattern on an 2-layer PCB, 11.7 in

2

3.0×2.4 in2 in PCB,

1oz. copper, 3.0×1.5 in2 in coverage at Top-layer and Bottom-layer at 100% coverage (7.2in2). ++:The parameter is measured with the JEDEC standard test boards (multi-layer PCB).

APA4863

Symbol Parameter Test Conditions

Min. Typ. Max.

Unit

V

DD

Supply Voltage 3 5.5 V

I

DD

Quiescent Power Supply

Current

VIN=0V, IO=0A, HP-IN=0V V

IN

=0V, IO=0A, HP-IN=4V

9 5

13.5

7.5

mA

I

SD

Shutdown Current V

PIN1

= V

DD

50.5

µ

A

V

IH

Headphone High Input Voltage 4 V

V

IL

Headphone Low Input Voltage 0.8 V

Electical Characteristics

Electrical Characteristics for Entire IC

The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001

APA4863

www.anpec.com.tw4

Truth Table for Logic Inputs

Shutdown HP-IN APA4863 Mode

Low Low Bridge -Tied Low High Single-Ended High Low APA4863 Shutdown High High APA4863 Shutdown

Electical Characteristics Cont.

APA4863Symbol Parameter Test Conditions

Typ.

Unit

V

OS

Output Offset Voltage VIN=0V 5 mV

THD=0.5% , f=1kHz,

R

L

=32

Ω

90

THD=1%, f=1kHz,

R

L

=8

Ω

320

P

O

Output Power

THD=10%, f=1kHz,

R

L

=8

Ω

400

mW

THD+N Total Harmonic Distortion

plus Noise

A

V

= -1 , PO=75mW, f=1kHz, RL=32

Ω

0.02 %

RSRR Power Supply Rejection

Ratio

V

RIPPLE

=200mV

RMS

, f=1kHz, CB=2.2µF, RL=8

Ω

49 dB

X

TALK

Channel Separation

f=1kHz , C

B

=2.2µF, PO=32mW, RL=32

Ω

85 dB

SNR Sig nal - to- N oise Ratio

V

DD

=5V , PO =340mW, RL=8

Ω

95 dB

Electrical Characteristics for SE Mode Operation

The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C

Electrical Characteristics for BTL Mode Operation

The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C

APA4863 UnitSymbol Parameter Test Conditions

Typ.

V

OS

Output Offset Voltage VIN=0V 5 mV

THD=1% , f=1kHz R

L

=3

Ω

R

L

=4

Ω

R

L

=8

Ω

2.2

1.8

1.2

P

O

Output Power

THD=10% , f=1kHz R

L

=3

Ω

R

L

=4

Ω

R

L

=8

Ω

2.7

2.3

1.5

W

THD+N Total Harmonic Distortion + Noise AVD=2, f= 1 k Hz

R

L

=4Ω , PO=1.8W

R

L

=8Ω , PO =1W

0.3

0.15

%

RSRR Power Supply Rejection Ratio

V

DD

=5V, V

RIPPLE

=200Mv

Rms

, RL=8

Ω

C

B

=2.2µF

64 dB

X

TALK

Channel Separation

f=1k Hz , C

B

=2.2µF, PO=1W, RL=8

Ω

90 dB

SNR Signal-to-Noise Ratio

V

DD

=5V, PO =1.1 W, RL=8

Ω

95 dB

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001

APA4863

www.anpec.com.tw5

Pin Description

1

2 3 4 5 6

7 8

12 11

10

9

16

15 14 13

+ OUT A

SHUTDOWN

GND

V

DD

- IN A

- OUT A

GND

+ IN A

HP-IN GND

V

DD

- IN B

- OUT B

BYPASS + IN B

+ OUT B

1

2 3 4 5 6

7 8

12 11

16 15

14 13

+ OUT A

SHUTDOWN

GND

V

DD

- IN A

- OUT A

GND

+ IN A

HP-IN GND

V

DD

- IN B

- OUT B

BYPASS + IN B

+ OUT B

9

10

20 19 18 17

NC NC

Top View

for SOP

Top View

for TSSOP

1

2 3 4 5 6

7 8

12 11

16 15 14 13

+ OUT A

SHUTDOWN

GND

V

DD

- IN A

- OUT A

GND

+ IN A

HP-IN GND

V

DD

- IN B

- OUT B

BYPASS + IN B

+ OUT B

9

10

20 19 18

17

GND GND

Thermal

Pad

Pin Description

Bottom View

Top View

for TSSOP -P

for TSSOP-P

Name I/O Description

GND Ground conn ect io n of cir cuitry V

DD

I Supply v ol tage inpu t

+ INA I Non-inve rting in put of c h annel A, connecte d to bypa s s pi n in sid e th e IC

- INA I Input pin of channel A + OUT A O A chann el + out put in BTL mode, hig h im pedance in SE mode

- OUT A O A channel - outpu t i n BTL mode, + outp ut in SE mode + IN B I Non- i nve rti ng in put of c h annel B, connected to by pa s s pi n in s id e th e IC

- IN B I Input pin of channel B + OUT B O B chann el + out put in BTL mode, hig h im pedance in SE mode

- OUT B O B channel - outpu t i n BTL mode, + outp ut in SE mode BYPASS Connect to voltage divider for internal mid-supply bias HP-IN I Headphone control pin input, hold high for single-ended mode operation

SHUTDO WN I Shutdown mode control pin inpu t, plac e s e ntir e IC in s hutdown mode

when held hig h, I

DD

= 0.5µA

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001

APA4863

www.anpec.com.tw6

Typical Characteristics

10m 3100m 1

0.01

10

0.1

1

20Hz

20kHz 1kHz

VDD=5V, RL=4

Ω

BW<80kHz

Figure 1 : Output Power (W)

Figure 2 : Frequency (Hz)

THD+N vs Output Power

THD+N (%)

0.01

10

0.1

1

20 20k100 1k 10k

VDD=5V, PO=1.8W R

L

=4

Ω,

BW<80kHz

THD+N vs Frequency

THD+N (%)

0

0.4

0.8

1

1.2

1.4

0.6

0.2

0 0.5 1 1.5 2 2.5

0.01

10

0.1

1

20 20k100 1k 10k

AVD=10

AVD=2

VDD=5V, PO=1W R

L

=8

Ω,

BTL Mode

Figure 4 : Frequency (Hz)

Power Dissipation vs Output Power

Power Dissipation (W)

THD+N vs Frequency

THD+N (%)

RL=4

ΩΩ

Ω

VDD=5V

RL= 8

ΩΩ

Ω

Figure 3 : Output Power (W)