Philips ES1B, ES1D, ES1C, ES1A Datasheet

DISCRETE SEMICONDUCTORS
SMA ES1 series
Ultra fast low-loss controlled avalanche rectifiers
Product specification
2000 Jan 19
Philips Semiconductors Product specification
FEATURES
Glass passivated
High maximum operating
temperature
Ideal for surface mount automotive applications
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
UL 94V-O classified plastic package
Shipped in 12 mm embossed tape
Marking: cathode, date code,
type code
Easy pick and place.
DESCRIPTION
DO-214AC surface mountable package with glass passivated chip.
SMA ES1 series
The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads.
Fig.1 Simplified outline (DO-214AC) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage
ES1A 50 V ES1B 100 V ES1C 150 V ES1D 200 V
V
R
continuous reverse voltage
ES1A 50 V ES1B 100 V ES1C 150 V ES1D 200 V
V
RMS
root mean square voltage
ES1A 35 V ES1B 70 V ES1C 105 V ES1D 140 V
I
F(AV)
average forward current averaged over any 20 ms period;
1.0 A
Ttp= 120 °C; see Fig.2
I
FSM
non-repetitive peak forward current t = 8.3 ms half sine wave;
25 A Tj= 25 °C prior to surge; VR= V
RRMmax
T
stg
T
j
storage temperature −65 +175 °C junction temperature
See Fig.3
65 +175 °C
2000 Jan 19 2
Philips Semiconductors Product specification
Ultra fast low-loss
SMA ES1 series
controlled avalanche rectifiers
ELECTRICAL CHARACTERISTICS
Tj= 25 °C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
I
R
t
rr
C
d
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-tp
R
th j-a
forward voltage IF= 1 A; see Fig.4 1.10 V reverse current VR= V
VR= V
; see Fig.5 5 µA
RRMmax
; Tj= 165 °C; see
RRMmax
100 µA
Fig.5
reverse recovery time when switched from IF= 0.5 A to
25
ns IR= 1 A; measured at IR= 0.25 A; see Fig.9
diode capacitance VR= 4 V; f = 1 MHz; see Fig.6 19
pF
thermal resistance from junction to tie-point; see Fig.7 27 K/W thermal resistance from junction to ambient note 1 100 K/W
note 2 150 K/W
Notes
1. Device mounted on Al2O3 printed-circuit board, 0.7 mm thick; thickness of copper 35 µm.
2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 µm. For more information please refer to the ‘General Part of associated Handbook’.
2000 Jan 19 3
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
GRAPHICAL DATA
VR= V
Fig.2 Maximum permissible average forward
; δ = 0.5; a = 1.57.
RRMmax
current as a function of tie-point temperature (including losses due to reverse leakage).
SMA ES1 series
Device mounted as shown in Fig.8. Solid line: Al2O3 PCB. Dotted line: epoxy PCB.
Fig.3 Maximum permissible junction temperature
as a function of reverse voltage.
Tj= 25 °C.
Fig.4 Forward current as a function of forward
voltage; typical values.
Fig.5 Reverse current as a function of reverse
voltage; typical values.
2000 Jan 19 4
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
SMA ES1 series
f = 1MHz; Tj= 25 °C.
Fig.6 Diode capacitance as a function of reverse
voltage; typical values.
Fig.7 Transient thermal impedance as a function
of pulse width.
Dimensions in mm. Material: AL2O3 or epoxy-glass.
Fig.8 Printed-circuit board for surface mounting.
2000 Jan 19 5
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
SMA ES1 series
Input impedance oscilloscope: 1 M, 22 pF; tr≤ 7 ns. Source impedance: 50 ; tr≤ 15 ns.
Fig.9 Test circuit and reverse recovery time waveform and definition.
2000 Jan 19 6
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
PACKAGE OUTLINE
SMA ES1 series
2000 Jan 19 7
Philips Semiconductors Product specification
Ultra fast low-loss
SMA ES1 series
controlled avalanche rectifiers
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2000 Jan 19 8
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