Ultra fast low-loss
controlled avalanche rectifiers
Product specification
2000 Jan 19
Philips SemiconductorsProduct specification
Ultra fast low-loss
controlled avalanche rectifiers
FEATURES
• Glass passivated
• High maximum operating
temperature
• Ideal for surface mount automotive
applications
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• UL 94V-O classified plastic
package
• Shipped in 12 mm embossed tape
• Marking: cathode, date code,
type code
• Easy pick and place.
DESCRIPTION
DO-214AC surface mountable
package with glass passivated chip.
SMA ES1 series
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic. The small rectangular
package has two J bent leads.
Fig.1 Simplified outline (DO-214AC) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
RRM
repetitive peak reverse voltage
ES1A−50V
ES1B−100V
ES1C−150V
ES1D−200V
V
R
continuous reverse voltage
ES1A−50V
ES1B−100V
ES1C−150V
ES1D−200V
V
RMS
root mean square voltage
ES1A−35V
ES1B−70V
ES1C−105V
ES1D−140V
I
F(AV)
average forward currentaveraged over any 20 ms period;
−1.0A
Ttp= 120 °C; see Fig.2
I
FSM
non-repetitive peak forward currentt = 8.3 ms half sine wave;
−25A
Tj= 25 °C prior to surge;
VR= V
RRMmax
T
stg
T
j
storage temperature −65+175°C
junction temperature
See Fig.3
−65+175°C
2000 Jan 192
Philips SemiconductorsProduct specification
Ultra fast low-loss
SMA ES1 series
controlled avalanche rectifiers
ELECTRICAL CHARACTERISTICS
Tj= 25 °C unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
F
I
R
t
rr
C
d
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th j-tp
R
th j-a
forward voltage IF= 1 A; see Fig.4−−1.10V
reverse currentVR= V
VR= V
; see Fig.5−−5µA
RRMmax
; Tj= 165 °C; see
RRMmax
−−100µA
Fig.5
reverse recovery timewhen switched from IF= 0.5 A to
−−25
ns
IR= 1 A; measured at IR= 0.25 A;
see Fig.9
diode capacitanceVR= 4 V; f = 1 MHz; see Fig.6−19−
pF
thermal resistance from junction to tie-point; see Fig.727K/W
thermal resistance from junction to ambientnote 1100K/W
note 2150K/W
Notes
1. Device mounted on Al2O3 printed-circuit board, 0.7 mm thick; thickness of copper ≥35 µm.
2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm.
For more information please refer to the ‘General Part of associated Handbook’.
2000 Jan 193
Philips SemiconductorsProduct specification
Ultra fast low-loss
controlled avalanche rectifiers
GRAPHICAL DATA
VR= V
Fig.2Maximum permissible average forward
; δ = 0.5; a = 1.57.
RRMmax
current as a function of tie-point temperature
(including losses due to reverse leakage).
SMA ES1 series
Device mounted as shown in Fig.8.
Solid line: Al2O3 PCB.
Dotted line: epoxy PCB.
Fig.3Maximum permissible junction temperature
as a function of reverse voltage.
Tj= 25 °C.
Fig.4Forward current as a function of forward
voltage; typical values.
Fig.5Reverse current as a function of reverse
voltage; typical values.
2000 Jan 194
Philips SemiconductorsProduct specification
Ultra fast low-loss
controlled avalanche rectifiers
SMA ES1 series
f = 1MHz; Tj= 25 °C.
Fig.6Diode capacitance as a function of reverse
voltage; typical values.
Fig.7Transient thermal impedance as a function
of pulse width.
Dimensions in mm.
Material: AL2O3 or epoxy-glass.
Fig.8Printed-circuit board for surface mounting.
2000 Jan 195
Philips SemiconductorsProduct specification
Ultra fast low-loss
controlled avalanche rectifiers
SMA ES1 series
Input impedance oscilloscope: 1 MΩ, 22 pF; tr≤ 7 ns.
Source impedance: 50 Ω; tr≤ 15 ns.
Fig.9 Test circuit and reverse recovery time waveform and definition.
2000 Jan 196
Philips SemiconductorsProduct specification
Ultra fast low-loss
controlled avalanche rectifiers
PACKAGE OUTLINE
SMA ES1 series
2000 Jan 197
Philips SemiconductorsProduct specification
Ultra fast low-loss
SMA ES1 series
controlled avalanche rectifiers
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Jan 198
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