MOTOROLA MC10E193FN, MC10E193FNR2, MC100E193FNR2 Datasheet

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SEMICONDUCTOR TECHNICAL DATA

2–1

REV 3

 Motorola, Inc. 1996

7/96

 


The MC10E/100E193 is an error detection and correction (EDAC)
circuit. Modified Hamming parity codes are generated on an 8-bit word
according to the pattern shown in the logic symbol. The P5 output gives
the parity of the whole word. The word parity is also provided at the PGEN
pin, after Odd/Even parity control and gating with the BPAR input. This
output also feeds to a 1-bit shiftable register, for use as part of a scan ring.

Used in conjunction with 12-bit parity generators such as the E160, a
SECDED (single error correction, double error detection) error system
can be designed for a multiple of an 8-bit word.

• Hamming Code Generation

• 8-Bit Word, Expandable

• Provides Parity of Whole Word

• Scannable Parity Register

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

Pinout: 28-Lead PLCC (Top View)

B4B5B

6

P

2

PGENCLKSHIFTS-INHOLDEN

LOGIC DIAGRAM

EV/OD

BPAR

B

0

V

EE

B

1

B

2

B

3

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

V

CCO

PARERR

PARERR

V

CC

P

5

V

CCO

P

4

P

3

V

CCOP1

B

7

B INPUTS

0 3 6 5 7 4 2 1

B2, B3, B6, B

7

B1, B3, B5, B

7

B4, B5, B6, B

7

B1, B2, B4, B

7

P

2

P

1

P

3

P

4

P

5

PGEN

BYTE (B0– B7)

PARERR
PARERR

BPAR

EV/OD

EN

HOLD

S-IN

SHIFT

CLK

0
1

0
1

D

1

* All VCC and V

CCO

pins are tied together on the die.





ERROR DETECTION/

CORRECTION CIRCUIT

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

MC10E193 MC100E193

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

I

IH

Input HIGH Current 150 150 150 µA

I

EE

Power Supply Current mA

10E 112 134 112 134 112 134
100E 112 134 112 134 129 155

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

t

PLH

Propagation Delay to Output ps

t

PHL

B to P1, P2, P3, P4 350 700 1000 350 700 1000 350 700 1000
B to P5 400 775 1150 400 775 1150 400 775 1150
EV/OD, BPAR to PGEN 350 650 850 350 650 850 350 650 850
B to PGEN 600 1000 1450 600 1000 1450 600 1000 1450

CLK to PARERR 300 550 850 300 550 850 300 550 850

t

s

Setup Time ps

SHIFT 400 150 400 150 400 150
S-IN 300 50 300 50 300 50
HOLD 750 350 750 350 750 350
EN 500 250 500 250 500 250
EV/OD 1300 850 1300 850 1300 850
BPAR 1300 850 1300 850 1300 850

B 1700 1100 1700 1100 1700 1100

t

h

Hold Time ps

SHIFT 200 –150 200 –150 200 –150
S-IN 300 – 50 300 – 50 300 – 50
HOLD 100 – 350 100 – 350 100 – 350
EN 100 – 250 100 – 250 100 – 250
EV/OD – 200 – 850 – 200 – 850 – 200 – 850
BPAR – 200 – 850 – 200 – 850 – 200 – 850

B – 300 –1100 – 300 –1100 – 300 –1100

t

r

Rise/Fall Times ps

t

f

20 - 80% 300 700 1100 300 700 1100 300 700 1100

MC10E193 MC100E193

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V

W

X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E193 MC100E193

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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MC10E193/D

*MC10E193/D*

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