D1d D0b D0c D0d V
CCOQ0
V
CCO
D2aD2bD2cD2dD1aD1b
LOGIC DIAGRAM
SEL0
SEL1
MR
V
EE
LEN1
LEN2
D
1c
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
115 6 7 8 9 10
Q
2
Q
2
V
CC
Q
1
Q
1
V
CCO
Q
0
D0a
D0a
D0b
D0c
D0d
D1a
D1b
D1c
D1d
D2a
D2b
D2c
D2d
SEL0
SEL1
LEN1
LEN2
MR
Q
0
Q
0
Q
1
Q
1
Q
2
Q
2
4:1
MUX
4:1
MUX
4:1
MUX
D
EN
R
D
EN
R
D
EN
R
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and V
CCO
pins are tied together on the die.
SEMICONDUCTOR TECHNICAL DATA
2–1
REV 3
Motorola, Inc. 1996
7/96
The MC10E/100E156 contains three 4:1 multiplexers followed by
transparent latches with differential outputs. When both Latch Enables
(LEN1, LEN2) are LOW, the latch is transparent, and output date is
controlled by the multiplexer select controls (SEL0, SEL1). A logic HIGH
on either LEN1 or LEN2 (or both) latches the outputs. The Master Reset
(MR) overrides all other controls to set the Q outputs LOW.
• 950ps Max. D to Output
• 850ps Max. LEN to Output
• Differential Outputs
• Asynchronous Master Reset
• Dual Latch-Enables
• Extended 100E V
EE
Range of – 4.2V to – 5.46V
• 75kΩ Input Pulldown Resistors
PIN NAMES
Pin Function
D0x – D3x Input Data
SEL0, SEL1 Select Inputs
LEN1, LEN2 Latch Enables
MR Master Reset
Q0– Q
2
True Outputs
Q
0
– Q
2
Inverted Outputs
FUNCTION TABLE
SEL1 SEL0 Data
L
L
H
H
L
H
L
H
a
b
c
d
3-BIT 4:1
MUX-LATCH
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
MC10E156 MC100E156
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
I
IH
Input HIGH Current 150 150 150 µA
I
EE
Power Supply Current mA
10E 75 90 75 90 75 90
100E 75 90 75 90 86 103
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
D 400 600 900 400 600 900 400 600 900
SEL0 550 775 1050 550 775 1050 550 775 1050
SEL1 450 650 900 450 650 900 450 650 900
LEN 350 500 800 350 500 800 350 500 800
MR 350 600 825 350 600 825 350 600 825
t
s
Setup Time ps
D 400 275 400 275 400 275
SEL0 700 300 700 300 700 300
SEL1 600 400 600 400 600 400
t
h
Hold Time ps
D 300 – 275 300 – 275 300 – 275
SEL0 100 – 300 100 – 300 100 – 300
SEL1 200 – 400 200 – 400 200 – 400
t
RR
Reset Recovery Time 800 600 800 600 800 600 ps
t
PW
Minimum Pulse Width ps
MR 400 400 400
t
SKEW
Within-Device Skew 50 50 50 ps 1
t
r
Rise/Fall Times ps
t
f
20 - 80% 275 475 700 275 475 700 275 475 700
1. Within-device skew is defined as identical transitions on similar paths through a device.
MC10E156 MC100E156
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
—
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
—
—
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92
—
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
—
2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
—
—
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430
—
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E156 MC100E156
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC10E156/D
*MC10E156/D*
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