Motorola MC10E151FN, MC100E151FN, MC100E151FNR2, MC10E151FNR2 Datasheet

V

CCOQ0

Q0Q

1

V

CCO

Q

5

V

CCO

NCCLK1CLK2MR

Q

2

LOGIC DIAGRAM

D

0

D

1

D

2

D

3

D

4

D

5

CLK1
CLK2

MR

Q

0

Q

0

Q

1

Q

1

Q

2

Q

2

Q

3

Q

3

Q

4

Q

4

Q

5

Q

5

D

R

D

R

D

R

D

R

D

R

D

R

D

5

D

4

D

3

V

EE

D

2

D

1

D

0

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

Q

5

Q

4

Q

4

V

CC

Q

3

Q

3

Q

2

NC Q

1

1

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 2

 Motorola, Inc. 1996

12/93

  

The MC10E/100E151 contains 6 D-type, edge-triggered, master-slave
flip-flops with differential outputs. Data enters the master when both CLK1
and CLK2 are LOW, and is transferred to the slave when CLK1 or CLK2
(or both) go HIGH. The asynchronous Master Reset (MR) makes all Q
outputs go LOW.

• 1100MHz Min. Toggle Frequency

• Differential Outputs

• Asynchronous Master Reset

• Dual Clocks

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

PIN NAMES

Pin Function

D0– D

5

Data Inputs

CLK1, CLK2 Clock Inputs
MR Master Reset
Q0– Q

5

True Outputs

Q0– Q

5

Inverted Outputs





6-BIT D REGISTER

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

MC10E151 MC100E151

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

I

IH

Input HIGH Current 150 150 150 µA

I

EE

Power Supply Current mA

10E 65 78 65 78 65 78
100E 65 78 65 78 75 90

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

f

MAX

Max. Toggle Frequency 1100 1400 1100 1400 1100 1400 MH

z

t

PLH

Propagation Delay to Output ps

t

PHL

Clk 475 650 800 475 650 800 475 650 800
MR 475 650 850 475 650 850 475 650 850

t

s

Setup TIme ps

D 0 –175 0 –175 0 –175

t

h

Hold Time ps

D 350 175 350 175 350 175

t

RR

Reset Recovery Time 750 550 750 550 750 550 ps

t

PW

Minimum Pulse Width ps

CLK, MR 400 400 400

t

SKEW

Within-Device Skew 65 65 65 ps 1

t

r

Rise/Fall Times ps

t

f

20 - 80% 300 450 700 300 450 700 300 450 700

1. Within-device skew is defined as identical transitions on similar paths through a device.

MC10E151 MC100E151

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V

W

X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E151 MC100E151

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MC10E151/D

*MC10E151/D*

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