Motorola MC10E150FNR2, MC10E150FN, MC100E150FN, MC100E150FNR2 Datasheet

NC Q1Q1V

CCO

Q

5

Q

5

V

CCO

NCLEN1LEN2MR

LOGIC DIAGRAM

D

5

D

4

D

3

V

EE

D

2

D

1

D

0

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

115 6 7 8 9 10

Q

4

Q

4

V

CC

Q

3

Q

3

Q

2

Q

2

V

CCOQ0

Q

0

D

0

D

1

D

2

D

3

D

4

D

5

LEN1
LEN2

MR

Q

0

Q

0

Q

1

Q

1

Q

2

Q

2

Q

3

Q

3

Q

4

Q

4

Q

5

Q

5

D

R

D

R

D

R

D

R

D

R

D

R

1

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 2

 Motorola, Inc. 1996

12/93

  

The MC10E/100E150 contains six D-type latches with differential
outputs. When both Latch Enables (LEN1, LEN2) are LOW, the latch is
transparent and input data transitions propagate through to the output. A
logic HIGH on either LEN1 or LEN2 (or both) latches the data. The Master
Reset (MR) overrides all other controls to set the Q outputs low.

• 800ps Max. Propagation Delay

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

PIN NAMES

Pin Function

D0– D

5

Data Inputs

LEN1, LEN2 Latch Enables
MR Master Reset
Q0– Q

5

True Outputs

Q0– Q

5

Inverting Outputs





6-BIT D LATCH

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

MC10E150 MC100E150

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

I

IH

Input HIGH Current µA

D 200 200 200
LEN, MR 150 150 150

I

EE

Power Supply Current mA

10E 52 62 52 62 52 62
100E 52 62 52 62 60 72

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

0°C 25°C 85°C

Symbol Characteristic min typ max min typ max min typ max Unit Condition

t

PLH

Propagation Delay to Output ps

t

PHL

D 250 375 550 250 375 550 250 375 550
LEN 375 500 700 375 500 700 375 500 700

MR 450 625 750 450 625 750 450 625 750

t

s

Setup Time ps

D 200 50 200 50 200 50

t

h

Hold Time ps

D 200 – 50 200 – 50 200 – 50

t

RR

Reset Recovery Time 750 650 750 650 750 650 ps ps

t

PW

Minimum Pulse Width ps

MR 400 400 400

t

SKEW

Within-Device Skew 50 50 50 ps 1

t

r

Rise/Fall Times ps

t

f

20 - 80% 300 450 650 300 450 650 300 450 650

1. Within-device skew is defined as identical transitions on similar paths through a device.

MC10E150 MC100E150

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V

W

X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—

2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E150 MC100E150

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

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MC10E150/D

*MC10E150/D*

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