LG LCW007 User Manual

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LG LCW007 User Manual

USER MANUAL

PRODUCT NAME :

WLAN Module

MODEL NAME :

LCW-007

H/W version : v1.0

S/W version : v1.0

The information contained herein is the exclusive property of LG

and shall not be distributed, reproduced or disclosed in whole or no in part without prior written permission of LG.

Designed

Checked

Approved

K.H. CHOI

J.H. JANG

S.D. CHOI

LG Electronics Inc.

 

 

 

 

 

 

 

 

 

 

Document No.

 

 

 

 

 

 

2018.07.27

2018.07.27

2018.07.27

PAGE

8

 

 

 

 

 

 

 

DOCUMENT No. :

 

 

 

 

REG. DATE : 2018. 07. 27

USER MANUAL

REV. NO : 1.0

 

MODEL NAME : LCW-007

 

REV. DATE : 2018. 07. 27

PAGE :

 

 

 

 

1. Features

LCW-007 is the module for IEEE 802.11b/g/n wireless LAN + MCU. LCW-007 is based on Realtek RTL8711AM solution.

IEEE 802.11 b/g/n HT40 single band WLAN Infrastructure

Size : 20mm x 48mm x 11.4 mm

Auto-calibration(RF, Crystal)

Data rates up to 72.2Mbps PHY rate

UART interface

Integrated IPv4/IPv6 TCP/IP stack

Integrated Network services such as HTTP, DNS, FTP

Security : WFA, WPA, WPA2, WEP, WAPI, TKIP

Application : Home Appliance

©2018 LGIT. All rights reserved.

 

 

 

 

 

DOCUMENT No. :

 

 

 

 

 

 

 

 

 

 

REG. DATE : 2018. 07. 27

 

 

USER MANUAL

REV. NO : 1.0

 

 

 

MODEL NAME : LCW-007

 

 

 

REV. DATE : 2018. 07. 27

 

PAGE :

 

 

 

 

 

 

 

 

 

3. Absolute Maximum Ratings

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

Min

 

Max

 

Unit

 

 

 

 

 

 

 

 

 

 

 

Storage Temperature

 

-40

 

+100

 

 

 

 

 

 

 

 

 

 

 

 

Storage Humidity (@ 40 )

-

 

90

 

%

 

 

 

 

 

 

 

 

 

 

 

Caution : The specifications above the Table define levels at which permanent damage to the device can occur. Function operation is not guaranteed under these conditions. Operating at absolute maximum conditions for extend periods can adversely affect the long-term reliability of the device.

Other conditions

1)Do not use or store modules in the corrosive atmosphere, especially where chloride gas, sulfide gas, acid, alkali, salt or the like are contained.

Also, avoid exposure to moisture.

2)Store the modules where the temperature

and relative humidity do not exceed 5 to 40 and 20 to 60%.

3)Assemble the modules within 6 months.

Check the soldering ability in case of 6 months over.

4.Operating Test Conditions

Parameter

Min

Typ

Max

Unit

Operating Temperature

0

-

+85

 

 

 

 

 

 

Operating Humidity (40 )

-

-

85

%

 

 

 

 

 

Supply Voltage

4.5

5.0

5.5

Vdc

 

 

 

10.8

12

13.2

 

 

 

 

 

 

 

1)Test condition: AP connection Ping test mode(not continuous Tx and T-Put mode)

2)Surface Tem.: RTL8711AM(113 ), Crystal(90 )

©2018 LGIT. All rights reserved.

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