LG 32LK610BPUA, 32LK610BBUA Schematic

0 (0)

P/NO : MFL70504601 (1804-REV01)

CHASSIS : LA84J

MODEL : 32LK610BPUA

MODEL : 32LK610BBUA

LED TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

- 2 -

Only for training and service purposes.

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ....................................................................................... 6

SOFTWARE UPDATE .............................................................................. 8

BLOCK DIAGRAM ................................................................................... 9

EXPLODED VIEW .................................................................................. 10

ASSEMBLY GUIDE / DISASSEMBLY GUIDE ....................................... 12

TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 -

Only for training and service purposes.

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the

Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent

Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the

servicing of a receiver whose chassis is not isolated from the AC

power line. Use a transformer of adequate power rating as this

protects the technician from accidents resulting in personal injury

from electrical shocks.

It will also protect the receiver and it's components from being

damaged by accidental shorts of the circuitry that may be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,

over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to

be sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an

electrical jumper across the two AC plug prongs. Place the AC

switch in the on position, connect one lead of ohm-meter to the AC

plug prongs tied together and touch other ohm-meter lead in turn to

each exposed metallic parts such as antenna terminals, phone

jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the

reading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter

with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage

measurements for each exposed metallic part. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.

In case any measurement is out of the limits specified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

- 4 -

Only for training and service purposes.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions

on page 3 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an explo-

sion hazard.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10 % (by volume) Acetone and 90 %

(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.

Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are

correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas-

ily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques

should be used to help reduce the incidence of component dam-

age caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground. Alter-

natively, obtain and wear a commercially available discharging

wrist strap device, which should be removed to prevent poten-

tial shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or expo-

sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate

electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electri-

cally shorted together by conductive foam, aluminum foil or

comparable conductive material).

7. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be

installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace-

ment ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf-

cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within the

range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there

only until the solder ows onto and around both the compo-

nent lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 5 -

Only for training and service purposes.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent at against the cir-

cuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as the

solder melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing

the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close

as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos-

sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if

necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to

prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed whenever

this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC connec-

tions).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the

good copper pattern. Solder the overlapped area and clip off

any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly con-

nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead

of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

- 6 -

Only for training and service purposes.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This spec sheet is applied all of the LED TV with LA84J

chassis

2. Test condition

Each part is tested as below without special notice.

(1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC

(2) Relative Humidity: 65 % ± 10 %

(3) Power Voltage

Standard input voltage (100~240V@ 50/60Hz)

* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in

accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance: LGE TV test method followed

(2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

4. Electrical Specification

No Item Specication Remark

1 Receiving system ATSC / NTSC-M / 64 QAM / 256 QAM

2 Available Channel VHF : 2~13

UHF : 14~69

DTV : 2-69

CATV : 1 ~ 135

CADTV : 1 ~ 135

3 Video Input AC 100 ~ 240V@ 50/60Hz

4 Market North America

5 Screen Size 32”, 40”, 43”, 49”, 55”

6 Aspect Ratio 16:9

7 Tuning System FS

8 Operating Environment Temp : 0 ~ 40 deg

Humidity : ~ 80 %

9 Storage Environment Temp. : -20 ~ 60 deg

Humidity : ~ 85%

- 7 -

Only for training and service purposes.

5. External Input Support Format

5.1. Component input(Y, CB/PB, CR/PR)

5.2. HDMI Input (PC/DTV)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

2 720*480 15.75 60.00 13.5135 SDTV ,DVD 480I

3 720*480 31.47 59.94 27.00 SDTV 480P

4 720*480 31.50 60.00 27.027 SDTV 480P

5 1280*720 44.96 59.94 74.176 HDTV 720P

6 1280*720 45.00 60.00 74.25 HDTV 720P

7 1920*1080 33.72 59.94 74.176 HDTV 1080I

8 1920*1080 33.75 60.00 74.25 HDTV 1080I

9 1920*1080 67.432 59.94 148.352 HDTV 1080P

10 1920*1080 67.50 60.00 148.50 HDTV 1080P

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

DTV

1 640*480 31.46 59.94 25.125 SDTV 480P

2 640*480 31.50 60.00 25.125 SDTV 480P

3 720*480 31.47 59.94 27.00 SDTV, DVD 480I(525I)

4 720*480 31.50 60.00 27.027 SDTV, DVD 480I(525I)

5 1280*720 44.96 59.94 74.176 SDTV, DVD 576I(625I) 50Hz

6 1280*720 45.00 60.00 74.25 SDTV 480P

7 1920*1080 33.72 59.94 74.176 SDTV 480P

8 1920*1080 33.75 60.00 74.25 SDTV 576P

9 1920*1080 26.97 23.97 74.176 HDTV 720P

10 1920*1080 27.00 24.00 74.25 HDTV 720P

11 1920*1080 33.71 29.97 74.176 HDTV 720P

12 1920*1080 33.75 30.00 74.25 HDTV 1080I

13 1920*1080 67.43 59.94 148.352 HDTV 1080I

14 1920*1080 67.50 60.00 148.50 HDTV 1080I

15 1920*1080p 26.97 23.97 63.29 HDTV 1080P

16 1920*1080p 27.00 24.00 63.36 HDTV 1080P

PC DDC

1 640*350 @70Hz 31.46 70.09 25.17 EGA X

2 720*400 @70Hz 31.46 70.08 28.32 DOS O

3 640*480 @60Hz 31.46 59.94 25.17 VESA(VGA) O

4 800*600 @60Hz 37.87 60.31 40.00 VESA(SVGA) O

5 1024*768 @60Hz 48.36 60.00 65.00 VESA(XGA) O

6 1152*864 @60Hz 54.34 60.05 80.002 VESA O

7 1280*1024 @60Hz 63.98 60.02 108.0 VESA (SXGA) O FHD only

8 1360*768 @60Hz 47.71 60.01 85.50 VESA (WXGA) O

9 1920*1080 @60Hz 67.5 60.00 148.5 WUXGA(CEA 861D) O FHD only

- 8 -

Only for training and service purposes.

SOFTWARE UPDATE

1. USB

(1) Insert the USB memory Stick to the USB port

(2) Automatically detect the SW Version and show the below

message

(3) Click [YES]: initiate the download and install of the update.

(4) Click [Check Now]: move to “About This TV” page for

update

(5) TV is updating

(6) After finished the update, below Pop-up appear

(7) Click [Yes] : TV will be DC OFF -> ON

(8) After TV turned on, Check the updated SW Version and

Tool Option

2. NSU

(This Function is needed to connect to the internet)

(1) Menu -> All Settings -> General -> About This TV

(2) Click [CHEK FOR UPDATES] : system check newest

version

(3) Click [DOWNLOAD AND INSTALL]

(4) TV is updating

(5) After finished the update, below Pop-up appear

(6) Turn OFF the TV and On. Check the updated SW Version

and Tool Option

- 9 -

Only for training and service purposes.

BLOCK DIAGRAM

Main IC

Audio AMP

Digital Demod

DIF (+/-)

IR / Key / Sensor

HDMI

MUX

LVDS

USB

SPDIF OUT

ETHERNET

USB1

USB2

OCP

1.5A

OCP

1.5A

HDMI1

HDMI2

(ARC)

REAR

OPTIC

LAN

51P(FHD)

DDR3 2133 4Gb x16

X_TAL

24MHz

WIFI 11ac only

SUB

ASSY

USB_WIFI

DDR3 2133 4Gb x16

HDMI3

SIDE

CVBS/YPbPr

AV/COMP

REAR

EEPROM (256Kb)

eMMC 5.0 (4GB)

I2S

I2C

Analog Demod

2100

CVBS/SIF

30P(HD)

IR / I2C / KEY

- 10 -

Only for training and service purposes.

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as

recommended in this manual to prevent Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

LV1

200C

200P

400

200A

700

AR1

501

500

900

530

820

120

540

570

571

521

HP1

800

HS1

HW1

810

ARC1

A10

- 11 -

Only for training and service purposes.

POL(Front) Panel

Ass’y

POL(Rear) Optical Sheet

Rear Side

200PPF

200PPR

200P

200PC 200SL1 200SR1

EXPLODED VIEW(MODULE)

MRC use only

* MRC : Module Repair Center

IMPORTANT NOTICE

- 12 -

Only for training and service purposes.

[Disassembly Guide]

(1) Lay the TV Set on a flat.

(2) Remove Screw (1, 2, 3).

* Prohibition : Pull the upward on bottom side.

Please remove Screw and Latch rst. * SCREW TORQUE : 5 ~ 7Kgf.cm

(3) Remove the latch.

1) Hold the left bottom handle and lift the B/C. At the same time, gently pushing the push points.

And Lift the right direction repeatedly (Separate the B/C from bottom to top direction)

* If push with strong force from left side, Side Latch will break.

ASSEMBLY / DISASSEMBLY GUIDE

1 1

32LK61 Screw 6 Points

32LK61 Latch 15 Points

ⓐ

ⓑ

ⓐ

ⓐⓐ

ⓐ

- 13 -

Only for training and service purposes.

1) Without S tand

2) With Stand

43” Back Cover

32” Back Cover

Push

Pull

Latch

Pull

Hold

Step1) Left Side

Pull

Hold

Push

Pull

Latch

Step2) Right Side

- 14 -

Only for training and service purposes.

(4) After holding the left/right bottom handle and lift the bottom of the B/C, push the B/C in the upward direction .

- Caution : Hook can be separated on the top position, don’t pull it hard for upward

- 15 -

Only for training and service purposes.

[Assembly Guide]

(1) Place the B/C on the module plate and Press Latch Points to assemble the B/C. (Assemble from bottom to top about B/C)

(2) Check whether gap occurs in the Top/left side/right side of the B/C

(3) Assemble the screws. (8ea)

49L K61 La tc h 20 P oints

• Press directio n

- Oblique direction from the outer surface

32LK61 La tc h 15 Point s

ⓐ

ⓑ

ⓐ

ⓐⓐ

ⓐ

1 1

32LK61 S crew 6 Points

- 16 -

Only for training and service purposes.

[Disassemble Guide]

(1) Disassemble back cover

* Loosen the screws (6ea) and uncover the back cover

(2) Disassemble the IR and Wi-fi bracket

(3) Detach the EMI tapes from the S-PCB

* The EMI tape (6ea) should be reused, therefore, attach them to the C/bottom as a right figure

(4) Disassemble the FFC cables from the S-PCB and

* Open the black connector shield first

* Separate FFC cable from the connector

ASSEMBLY / DISASSEMBLY GUIDE (MODULE)

- 17 -

Only for training and service purposes.

(5) Disassemble the S-PCBs from the holder

(6) Disassemble the case top

* Loosen the side screws – 14ea (upper - 5ea, L, R and bottom – 3ea for each)

* Flip the whole module and disassemble the case top to the upper side

(7) Disassemble the panel

* Firstly, detach the EMI tape at left and right side of the guide panel

* Starting from the bottom side, raise up the panel carefully until it

stands vertically

* When you handle the panel, standing it vertically first and carrying

the panel is recommended

- 18 -

Only for training and service purposes.

(8) Disassemble the guide panel

* Uncover latches on the guide panel with the thin and narrow tool (ex, a flat head screwdriver)

* Be careful about fragile latches

(9) Disassemble the sheets and diffuser plate

* Uncover latches on the guide panel with thin and narrow tool (ex, a flat head screwdriver)

* Be careful about fragile latches

(11) Disassemble the reflector sheet

* Be careful about damaging the reflector sheet

- 19 -

Only for training and service purposes.

(12) Disassemble the LED array

* Press the connectors from the both side, at the same time, pull the connector up to the direction of the upper side

* Detach the whole LED array bars

- 20 -

Only for training and service purposes.

[Assemble Guide]

(1) Assemble the LED array

* Assemble the LED array and press LED Array to cover bottom

(2) Assemble the reflector sheet

(3) Assemble the DP and sheet

* Assemble the reflector sheet according to the guide embossing

* Assemble the reflector sheet bellow the lens with your fingers

* Check the upper and lower side of sheet at corner and arrange it

according to the remarks

* Make sure that all the holes of sheet is fastened on the racks of

cover bottom

- 21 -

Only for training and service purposes.

(4) Assemble the guide panel

(5) Assemble the panel

* Arrange the upper left/right side first, and then, assemble the bottom left/right side of the panel

(6) Attach the EMI pad on the panel and guide panel

(7) Assemble the case top and flip the module

- 22 -

Only for training and service purposes.

(8) Arrange the S-PCBs to the holders

(9) Connect FFC cable to the S-PCB

(10) Attach the EMI tape (6ea)

(11) Tighten the case top screw (14ea)

- 23 -

Only for training and service purposes.

(12) Assemble the Wi-fi and RF bracket

(13) Assemble the back cover

* Tighten the screws (6ea) and cover the back cover

TROUBLE SHOOTING GUIDE

Only for training and service purposes.

Contents of Standard Repair Process

No. Error symptom (High category) Error symptom (Mid category) Page Remarks

A. Video error

No video/Normal audio 1

2 No video/No audio 2

3 Picture broken/ Freezing 3

4 Color error 4

Vertical/Horizontal bar, residual image, light

spot, external device color error

B. Power error

No power 6

Off when on, off while viewing, power auto

on/off

7,8

C. Audio error

No audio/Normal video 9

9 Wrecked audio/discontinuation/noise 10

D. Function error

Remote control & Local switch checking 11

11 Wifi operating checking 12

12 External device recognition error 13

13 E. Noise Circuit noise, mechanical noise 14

14 F. Exterior error Exterior defect 15

First of all, Check whether there is SVC Bulletin in GSCS System for these model.

Only for training and service purposes.

Normal

audio

Move to No

video/No audio

No video

Normal audio

Check Back Light

On with naked eye

Check Power

Board

13.2V etc.

Normal

voltage

Replace T-con/Main

Board or module

Repair Power

Board or parts

Check Power Board 13.2V output

Normal

voltage

Replace Inverter

or module

Repair Power

Board or parts

End

Always check & record S/W Version and White

Balance value before replacing the Main Board

Replace Main Board

Re-enter White Balance value

※Precaution

Established

date

Standard Repair Process

Revised date

1/16

Error

symptom

A. Video error

No video/ Normal audio

☞A18 ☞A1

☞A18

☞A4 & A2

First of all, Check whether all of cables between board is inserted properly or not.

(Main B/D ↔ Power B/D, LVDS or EPI Cable, Speaker Cable, IR B/D Cable,,,)

Only for training and service purposes.

Normal

voltage?

Check various

voltages of Power

Board (13.2V…)

No Video/

No audio

Check and

replace

MAIN B/D

Replace Power

Board and repair

parts

End

Standard Repair Process

A. Video error

No video/ No audio

☞A18

Established

date

Revised date

2/16

Error

symptom

Only for training and service purposes.

A. Video error

Picture broken/ Freezing

☞ A3

Check RF Signal level

Normal

Signal?

Check RF Cable

Connection

1. Reconnection

2. Install Booster

Check

S/W Version

S/W Upgrade

Check whether other equipments have problem or not.

(By connecting RF Cable at other equipment)

→ DVD Player ,Set-Top-Box, Different maker TV etc`

SVC

Bulletin?

Replace

Main B/D

Check

Tuner soldering

Normal

Picture?

. By using Digital signal level meter

. By using Diagnostics menu on OSD

( Advanced→ Channels→ Channel Tuning→ Manual Tuning → Check the Signal )

- Signal strength (Normal : over 50%)

- Signal Quality (Normal: over 50%)

Normal

Picture?

Contact with signal distributor

or broadcaster (Cable or Air)

Normal

Picture?

☞ A4

Standard Repair Process

Established

date

Revised date

3/16

Error

symptom

Only for training and service purposes.

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