HIT 4AK27 Datasheet

Features
e
Low on-resistance
0.15Ω, VGS = 10V, ID = 3.0A
DS(on)
4V gate drive devices.
High density mounting
Outline
4AK27
Silicon N Channel MOS FET High Speed Power Switching
ADE-208-728 (Z)
1st. Edition
January 1999
SP-10
G
2
S
1
1
2
3
10
4
5
6
7
8
9
10
1, 10. Sourc 2, 4, 6, 8. Gate 3, 5, 7, 9. Drain
3
D
4
G
5
D
6
G
7
D
8
G
9
D
S
4AK27
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Avalanche current I Avalanche energy1 E Channel dissipation Pch(Tc=25˚C) Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
AR
Note1
Note2
Note2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. 4 devices poeration
3. Value at Tch=25˚C, Rg 50
60 V ±20 V 5A 20 A 5A 5A
2.1 mJ 28 W 4W
2
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source breakdown voltage V Zero gate voltege drain current I Gate to source leak current I Gate to source cutoff voltage V Static drain to source on state resistance R Static drain to source on state resistance R
(BR)DSS
(BR)GSS
DSS
GSS
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs| 3.0 5.5 S ID = 3A, VDS = 10V Input capacitance Ciss 390 pF VDS = 10V Output capacitance Coss 190 pF VGS = 0 Reverse transfer capacitance Crss 45 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse recovery time t
d(on)
r
d(off)
f
DF
rr
Note: 4. Pulse test
60 V ID = 10mA, VGS = 0 ±20 V IG = ±100µA, VDS = 0 100 µAVDS = 50 V, VGS = 0 ——±10 µAVGS = ±16V, VDS = 0
1.0 2.25 V ID = 1mA, VDS = 10V — 0.12 0.15 ID = 3A, VGS = 10V — 0.15 0.2 ID = 3A, VGS = 4V
10 ns VGS = 10V, ID = 3A — 42 ns RL = 10 —90—ns —55—ns — 1.0 V IF = 5A, VGS = 0 — 60 ns IF = 5A, VGS = 0
diF/ dt =50A/µs
4AK27
Note4
Note4
Note4
3
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