Fairchild Semiconductor NDB7052, NDP7052 Datasheet

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Fairchild Semiconductor NDB7052, NDP7052 Datasheet

June 1997

NDP7052 / NDB7052

N-Channel Enhancement Mode Field Effect Transistor

General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage applications such as automotive, DC/DC converters, PWM motor controls, and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.

Features

75 A, 50 V. RDS(ON) = 0.01 Ω @ VGS= 10 V.

Critical DC electrical parameters specified at elevated temperature.

Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor.

175°C maximum junction temperature rating.

High density cell design for extremely low RDS(ON).

TO-220 and TO-263 (D2PAK) package for both through hole and surface mount applications.

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S

Absolute Maximum Ratings TC = 25°C unless otherwise noted

 

 

 

 

 

 

 

 

Symbol

Parameter

 

NDP7052

 

NDB7052

 

 

 

Units

 

 

 

 

 

 

 

 

 

 

 

 

VDSS

Drain-Source Voltage

 

 

50

 

 

 

 

 

V

VDGR

Drain-Gate Voltage (R

< 1 MΩ)

 

50

 

 

 

 

 

V

 

GS

 

 

 

 

 

 

 

 

 

 

VGSS

Gate-Source Voltage - Continuous

 

±20

 

 

 

 

 

V

 

- Nonrepetitive (tP < 50 µs)

 

±40

 

 

 

 

 

 

ID

Drain Current - Continuous

 

75

 

 

 

 

 

A

 

- Pulsed

 

 

225

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PD

Total Power Dissipation @ TC = 25°C

 

150

 

 

 

 

 

W

 

Derate above 25°C

 

1

 

 

 

 

 

W/°C

 

 

 

 

 

 

 

 

 

 

 

TJ,TSTG

Operating and Storage Temperature Range

 

-65 to 175

 

 

 

°C

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RθJC

Thermal Resistance, Junction-to-Case

 

1

 

 

 

 

 

°C/W

Rθ JA

Thermal Resistance, Junction-to-Ambient

 

62.5

 

 

 

 

 

°C/W

© 1997 Fairchild Semiconductor Corporation

NDP7052 Rev.B1

 

Electrical Characteristics (TC = 25°C unless otherwise noted)

Symbol

 

 

Parameter

Conditions

Min

Typ

Max

Units

 

 

 

 

 

 

 

 

DRAIN-SOURCE AVALANCHE RATINGS (Note)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WDSS

 

 

 

Single Pulse Drain-Source Avalanche Energy

VDD = 25 V, ID = 75 A

 

 

550

mJ

IAR

 

 

 

Maximum Drain-Source Avalanche Current

 

 

 

 

75

A

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BVDSS

 

 

 

Drain-Source Breakdown Voltage

VGS = 0 V, ID = 250 µA

50

 

 

V

BV

/

T

J

Breakdown Voltage Temp. Coefficient

ID = 250 µA, Referenced to 25 o C

 

57

 

mV/oC

DSS

 

 

 

 

 

 

 

 

IDSS

 

 

 

Zero Gate Voltage Drain Current

VDS = 40 V, VGS = 0 V

 

 

10

µA

 

 

 

 

 

 

TJ = 125°C

 

 

1

mA

IGSSF

 

 

 

Gate - Body Leakage, Forward

VGS = 20 V, VDS = 0 V

 

 

100

nA

IGSSR

 

 

 

Gate - Body Leakage, Reverse

VGS = -20 V, VDS = 0 V

 

 

-100

nA

ON CHARACTERISTICS (Note)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

V

/

T

 

Gate Threshold VoltageTemp. Coefficient

ID = 250 µA, Referenced to 25 o C

 

-5.2

 

mV/oC

GS(th)

J

 

 

 

 

 

 

 

 

VGS(th)

 

 

 

Gate Threshold Voltage

VDS = VGS, ID = 250 µA

2

2.2

3

V

 

 

 

 

 

 

TJ = 125°C

1.4

1.55

2.4

 

RDS(ON)

 

 

 

Static Drain-Source On-Resistance

VGS = 10 V, ID = 37.5 A

 

0.008

0.01

Ω

 

 

 

 

 

 

TJ = 125°C

 

0.011

0.018

 

ID(on)

 

 

 

On-State Drain Current

VGS = 10 V, VDS= 10 V

60

 

 

A

gFS

 

 

 

Forward Transconductance

VDS = 10 V, ID = 37.5 A

 

52

 

S

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ciss

 

 

 

Input Capacitance

VDS = 25 V, VGS = 0 V,

 

3400

 

pF

 

 

 

 

 

f = 1.0 MHz

 

 

 

 

Coss

 

 

 

Output Capacitance

 

1300

 

pF

 

 

 

 

 

 

 

Crss

 

 

 

Reverse Transfer Capacitance

 

 

 

460

 

pF

SWITCHING CHARACTERISTICS (Note)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tD(on)

 

 

 

Turn - On Delay Time

VDD = 30 V, ID = 75 A,

 

15

30

nS

tr

 

 

 

Turn - On Rise Time

VGS = 10 V, RGEN = 5 Ω

 

147

250

nS

 

 

 

 

 

 

 

 

 

 

tD(off)

 

 

 

Turn - Off Delay Time

 

 

 

85

150

nS

tf

 

 

 

Turn - Off Fall Time

 

 

 

165

300

nS

 

 

 

 

 

 

 

 

 

 

Qg

 

 

 

Total Gate Charge

VDS = 24 V,

 

117

160

nC

Qgs

 

 

 

Gate-Source Charge

ID = 37.5 A, VGS = 10 V

 

12

 

nC

 

 

 

 

 

 

 

Qgd

 

 

 

Gate-Drain Charge

 

 

 

46

 

nC

DRAIN-SOURCE DIODE CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IS

 

 

 

Maximum Continuos Drain-Source Diode Forward Current

 

 

75

A

ISM

 

 

 

Maximum Pulsed Drain-Source Diode Forward Current

 

 

225

A

VSD

 

 

 

Drain-Source Diode Forward Voltage

VGS = 0 V, IS = 13 A (Note)

 

0.9

1.3

V

trr

 

 

 

Reverse Recovery Time

VGS = 0 V, IF = 37.5 A,

 

75

150

ns

Irr

 

 

 

Reverse Recovery Current

dIF/dt = 100 A/µs

 

4

10

A

Note: Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.

NDP7052 Rev.B1

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