Thermal Shock Chamber
TSE 11A
CAT.NO.E01133-T1202
ESPEC offers a compact, but highly performant thermal shock chamber ideal for the requirements of test standards with small and low-volume specimen.
Equipped with superior temperature recovery performance capable of answering the requirements of severe test specifications,
this thermal shock model offers a wide test area in a compact, slim design.
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*The paperless recorder and additional overheat protector are optional. |
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Characteristics
A high performance compact package to meet severe test requirements.
A temperature recovery time of less than 5 minutes is achieved in 2 zones ( 150 and 65 ) without auxiliary cooling
By realizing a temperature recovery time of less than 5 minutes for the upstream air in the 2 zones ( 150 and 65 ), we have achieved performance equivalent to that of a large thermal shock chamber without having to use auxiliary cooling by means of liquid carbon dioxide, which was required in previous compact thermal shock chamber.
Complies with MIL-STD-883H and other test standards
This compact thermal shock chamber satisfies the temperature cycle test requirements of MIL-STD-883H and other test standard (see page 5).
Smooth specimen transfer
The "soft-move mode" is used to reduce vibration shock when specimens are moving between the hot and cold chambers.
Uniform temperature distribution across specimens
High temperature uniformity performance ensures consistent stress on specimens.
High-temperature exposure Low-temperature exposure
● Examples of temperature uniformity
● Test conditions |
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●Temperature uniformity measurement method |
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High temperature exposure |
150 30 min. |
Thermocouples were embedded in 10 plastic |
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Low temperature exposure |
65 30 min. |
molded ICs (16 pin DIPs), which were then |
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Specimen |
Plastic molded IC 2kg |
placed on two levels in each of the corners |
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and in the center of a specimen basket. |
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Sensor temperature |
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Within ±1.5 (Test area: upstream) |
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Within ±1.0
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