Sony PCG-V505DC1x, PCG-V505DC1Px, PCG-V505W, PCG-V505T3x, PCG-V505DH Service Manual

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0 (0)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP
Area Model Lineup
PCG-V505F/B PCG-V505T3/Px PCG-V505T3x PCG-V505W/P PCG-V505DC1x PCG-V505DC1Px PCG-V505DH PCG-V505DX PCG-V505DXP
European
AEP/UK
PCG-V505CP
Chinese PCG-V505MCP
Korean PCG-V505MLP International PCG-V505MP
Thai PCG-V505MSP Taiwan PCG-V505MTP
: CTO Model
Asian/Oceania/ South Africa
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP
SERVICE MANUAL
Revision History
Japanese Japanese
PCG-V505F/V505T3x/V505W
PCG-V505CP
American US Canadian
9-876-349-04
Confidential
Design and specifications are subject to change without notice.
本機の仕様および外観は、改良のため予告なく変更
することがあります が 、ご了承ください。
NOTEBOOK COMPUTER
S400
Information in this document is subject to change without notice.
Sony, VAIO and CLIE are trademarks or regis­tered trademarks of Sony. Microsoft,Windows, Windows Media, Outlook, Bookshelf and other Microsoft products are trademarks or registered trademarks of Microsoft Corporation in the United States and other countries.The word Bluetooth and the Bluetooth logo are trademarks of Bluetooth SIG, Inc. AMD, AMD logo, AMD Duron and combinations there of, 3DNow!, are trademarks of Adv anced Micro Devices, Inc. Intel Inside logo, Pentium and Celeron are trademarks or registered trademarks of Intel Corporation. Transmeta, the Transmeta logo, Crusoe Proces­sor, the Crusoe logo and combinations there of are trademarks of Transmeta Corporation in the USA and other countries. Graffiti, HotSync, PalmModem, and Palm OS are resistered trade­marks, and the Hotsync logo and Palm are trade­marks of Palm,Inc. or its subsidiaries. (M) and Motrola are trademarks of Motrora, Inc. Other Motrola products and services with (R) mark like Dragomball are the trademarks of Motrola, Inc.
All other names of systems, products and servicesin this manual are trademarks or regis­tered trademarks of their respective owners. In this manual, the (TM) or (R) mark are not speci­fied.
Caution Markings for Lithium/Ion Battery - The following or similar texts shall be provided on battery pack of equipment or in both the operat­ing and the service instructions.
CAUTION: Danger of explosion if battery is in­correctly replaced. Replace only with the same or equivalent type recommended by the manu­facturer. Discard used batteries according to the manufacturer’s instructions.
CAUTION: The battery pack used in this device may present a fire or chemical burn hazard if mistreated. Do not disassemble, heat above 100ºC (212ºF) or incinerate. Dispose of used bat­tery promptly. Keep away from children.
CAUTION: Changing the back up battery.
•Overcharging, short circuiting, reverse charg­ing, multilati on or incineration of the cells must be avoided to prevent one or more of the fol­lowing occurrences; release of toxic materials, release of hydrogen and/or oxygen gas, rise in surface temperature.
• If a cell has leaked or vented, it should be re­placed immediately while avoiding to touch it without any protection.
Service and Inspection Precautions
1. Obey precautionary markings and instructions
Labels and stamps on the cabinet, chassis, and components identify are as requiring special pre­cautions. Be sure to observe these precautions, as well as all precautions listed in the operating manual and other associated documents.
2. Use designated parts only
The set’s components possess important safety characteristics, such as noncombustibility and the ability to tolerate large voltages. Be sure that re­placement parts possess the same safety charac­teristics as the originals. Also remember that the 0 mark, which appears in circuit diagrams and parts lists, denotes components that have particu­larly important safety functions; be extra sure to use only the designated components.
3. Always follow the original designwhen mounting parts and routing wires
The original layout includes various safety fea­tures, such as inclusion of insulating materials (tubes and tape) and the mounting of parts above the printer board. In addition, internal wiring has been routed and clamped so as to keep it away from hot or high-voltage parts. When mounting parts or routing wires, therefore, be sure toduplicate the original layout.
– 2 –
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring have been re­turned to their original condition. Also check the area around the repair location to ensure that re­pair work has caused no damage, and confirm safety.
5. When replacing chip components...
Never reuse components. Also remember that the negative side of tantalum capacitors is easily damaged by heat.
6. When handling flexible print boards...
• The temperature of the soldering-iron tip
should be about 270ºC.
• Do not apply the tip more than three times to
the same pattern.
• Handle patterns with care; never apply force.
Caution: Remember that hard disk drives areeasily damaged by vibration. Always handlewith care.
ATTENTION AU COMPOSANT AYANT
RAPPORT
À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANSCE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)

TABLE OF CONTENTS

Section Title Page
CHAPTER 1. SPECIFICATIONS ....................................................................................... 1-1
(to 1-1)
CHAPTER 2. BLOCK DIAGRAM...................................................................................... 2-1
(to 2-1)
CHAPTER 3. FRAME HARNESS DIAGRAM............................................................... 3-1
(to 3-1)
CHAPTER 4. EXPLODED VIEWS AND PARTS LIST
Palmrest
P-1 ........................................................................................................................................... 4-2
Bottom
B-1 .......................................................................................................................................... 4-3
Main Board
M-1 ......................................................................................................................................... 4-4
LCD
L-1........................................................................................................................................... 4-5
Accessories
A-1 .......................................................................................................................................... 4-6
(to 4-6)
Section Title Page
CHAPTER 5. OTHERS
5-1. The Barcode Label.................................................................................................................. 5-1
5-2. Replacing the CPU ................................................................................................................. 5-2
5-3. CTO Information .................................................................................................................... 5-3
(to 5-3)
History of the changes is shown as the “Revision History” at the end of this data.
変更履歴は,“RevisionHistory”として,本データ末に記 載してあります。
– 3 –
Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
CHAPTER 1.
SPECIFICATIONS
AMJ AO
CPU PM-1.3GHz PM-1.5GHz PM-1.4GHz PM-1.4GHz PM-1.4GHz PM-1.6GHz PM-1.5GHz PM-1.5GHz PM-1.5GHz PM-1.5GHz PM-1.5GHz LCD 12.1XGA 12.1XGA 12.1XGA 12.1XGA 12.1XGA 12.1XGA 12.1XGA 12.1XGA 12.1XGA 12.1XGA 12.1XGA HDD 40GB 60GB 40GB 60GB 60GB 40GB 40GB 40GB 40GB 40GB 40GB Graphics M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) M9+X(32MB) MEMORY1
QUANTITY
[STANDARD/MAX] 256MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB 512MB/2GB OPT-DRIVE CD-RW/DVD-ROM CD-RW/DVD-ROM CD-RW/DVD-ROM CD-RW/DVD-ROM CD-RW/DVD-ROM CD-RW/DVD-ROM CD-RW/DVD-ROM CD-RW/DVD-ROM Combo 9.5 Combo 9.5 Combo 9.5 internal W-LAN AC adaptor PCGA-AC16V6 PCGA-AC16V6 PCGA-AC16V6 PCGA-AC16V6 PCGA-AC16V7 PCGA-AC16V7 PCGA-AC16V7 PCGA-AC16V7 PCGA-AC16V6 PCGA-AC16V6 PCGA-AC16V6 Battery PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V PCGA-BP2V OS WinXP Home WinXP Pro XP Home XP Home XP Pro XP Pro XP Pro XP Pro XP Pro XP Pro XP Pro
PCG-V505F/B PCG-V505W/P PCG-V505DH PCG-V505DX PCG-V505DXP PCG-V505CP PCG-V505MP PCG-V506MLP PCG-V505MSP PCG-V505MTP PCG-V505MCP
256MB × 1 512MB × 1 256MB × 2 256MB × 2 256MB × 2 512MB × 1 512MB × 1 512MB × 1 512MB × 1 512MB × 1 512MB × 1
aaaaaaaaaaa
[MA]
2
[MA]
2
[MA]
2
EU
[MA]
2
[MA]
2
[MA]
2
[MA]
3
[MA]
3
[MA]
3
• The trademarks of registered trademarks of above table, refer to page 2.
本表中の商標・登録商標については,2ページをご参照ください。
1-1
(END)
Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
CHAPTER 2.
BLOCK DIAGRAM
MBX-100
Clock
Gen.
SO-DIMM SO-DIMM
Thermal
Sensor
LM26
Thermal
Sensor
LM26
333 MHz
DDR
SDRAM
LPC
(33
MHz)
ATF0 LM86
Intel®
Pentium® M
Processor
478 mFCPGA
(socket)
400 MHz
PSB
Intel® 855PM
MCH
593
mFCBGA
(ODEM)
HUB
Interface
66 MHz
Intel®
82801DBM
AGP 4X
(264 MHz)
EEPROM
(MAC address)
LCD
12" XGA
LVDS
Graphics
ATI M9+
Ether
Kinnereth
USB
VIF-33
RJ-45
VGA
TMDS
Port 4
Memory
Stick
(SUMIRE 3)
Battery
DC Jack
(16 V)
Port 5
IFX-290
MS
CNX-201
DC/DC
port1
USB 2.0
Hub
port3
USB-
Parallel
CNX-206
DC Jack
(16 V)
USB
USB
RJ-45
Parallel
Debug
Internal Keyboard
TouchPad
EC/K
BC
FWH
EEPROM
(password)
HDD
421 BGA (ICH4-M)
IDE
(Ultra ATA100)
Opt.
Drive
ATF1 LM75
PCI Bus
(33 MHz)
W-LAN
(Mini PCI
Type 3B socket)
AC'97
Bus
MDC Modem
RJ-11
i.LINK
&
PC Card
EEPROM
(GUID)
Audio
CODEC
Port 0
PC Card
(Type II x 1)
CNX-226
2-1
(END)
Port 2
USB
(right)
CNX-227
USB
(left)
i.LINK
Headphone
Microphone
USB
VGA
DVI-D
PCGA-PRV1
Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
CHAPTER 3.
FRAME HARNESS DIAGRAM
Side L
DC IN
SPEAKER
CNX-226 BOARD SIDE A
CN5201
MONITOR
CN5130
USB
CN5120
i.LINK
MIC IN
HEADPHONE
PC CARD
L ch
1211
CN5251
PC CARD
CONNECTOR
CN5401
1 2
KEY BOARD
CN2800
(WITH HEATSINK)
12
FFC (CNX197)
CN5100
14
1
CN5101
CNX-227 BOARD SIDE A
1
110
CN5400
124
DC FAN
CN5200
12
39 40
1211
79 80
HARNESS (WITH DC JACK 2P)
Y
A
FFC (LEX44)
M
CN2650
12
39 40
12
FPC (I.LINK&USB)
CN1401
12
LEX-52 BOARD SIDE B
LITHIUM ION
BATTERY PACK
CN4051
18
12
910
NICKEL
HYDROGEN
BATTERY
CN60
21
CN3902
CN2660
49 50
1
CN1201
FLEXIBLE
PRINT PWB (HDD)
HDD
CN2900
12
2
114
LCD
HARNESS
(LCD)
CPU
TOUCH PAD
CN5621
29 30
12
CN5851
21
MBX-100 BOARD SIDE A
1
12
CN2830
FFC (TP)
SWX-154 BOARD SIDE B
RIGHT BUTTON
3-1
(END)
CN5000
CN2600
S5802
120 200181
120 200181
FFC (SWX130)
CN5801
FLEXIBLE FLAT CABLE (LEX43)
CN5300
110
CN2850
12
10
112
CENTER BUTTON
CN5800 112
S5508
LEX-51 BOARD SIDE B
From board to connector (direct connection) Harness (with connectors on both ends) Harness (soldering on either end)
INVERTER UNIT
VIF-33 BOARD SIDE A
RJ-45 HARNESS
SPEAKER
R ch
CNX-228
BOARD
(COMBO DRIVE)
CN1202
12
49 50
CN2860
1
FFC (MBX-IFX)
10
1
CN5802
S5801
LEFT BUTTON
CN2680
21
10
9
CN5700
CN2001
30 29
21
FFC (MBX-IFX)
10 1
MODEM
CARD
SWX-156 BOARD SIDE A
110
WIRELESS LAN CARD
DOCKING STATION
PCGA-PRV1
CN5001
2
1
HARNESS (RJ11)
IFX-290 BOARD
CN4602
SIDE A
100
99
CN4601
1
10
Side R
NETWORK MODULAR
JACK
MEMORY
STICK
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