Service Manual History ............................................................................................ 502
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Sirona Dental Systems GmbH 1About this Service Manual
Service Manual ORTHOPHOS XG 3D / Ceph1.1Scope
About this Service Manual
1
1.1
1.2
1.3
Scope
Scope of the Service Manu al: XG 3D
This Service Manual describes the servicing of the ORTHOPHOS XG 3D/
Ceph digital volume tomograph. It is intended for use exclusively by
trained and authorized distributors and service technicians.
Other documentation required
In addition to this manual, you need the following documents:
Spare parts list
● GALILEOS List of Spare Parts: Order No. 61 25 699
Wiring diagrams
● GALILEOS Wiring References: Order No. 61 25 640
DVD text
Current Service Documentation, such as the Service Manual, can be
downloaded from the Sirona dealer website.
Tools and auxiliary materials
Tools and auxiliary materials: XG
● Screwdriver set (slot and Phillips)
● Torx offset screwdrivers TX10, TX20, TX25
(included in the scope of supply)
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● Open-end wrench, 13 mm A/F
● Socket wrench, 13 mm A/F
● Side cutting pliers
● Spirit level
● Digital Multimeter, Accuracy Class 1
● Mult-O-Meter 512L
● Soldering tool for repairing cables
● Cable ties
● Teflon tape
● Loctite
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1About this Service ManualSirona Dental Systems GmbH
1.4Structure of the documentService Manual ORTHOPHOS XG 3D / Ceph
1.4
Structure of the document
1.4.1Identification of the danger levels
To prevent personal injury and material damage, please observe the
warning and safety information provided in these operating instructions.
Such information is highlighted as follows:
DANGER
An imminent danger that could result in serious bodily injury or death.
WARNING
A possibly dangerous situation that could result in serious bodily injury
or death.
CAUTION
A possibly dangerous situation that could result in slight bodily injury.
NOTICE
A possibly harmful situation which could lead to damage of the product
or an object in its environment.
IMPORTANT
Application instructions and other important information.
Tip: Information on making work easier.
1.4.2Formats and symbols used
The formats and symbols used in this document have the following
meaning:
Prerequisite
1. First action step
2. Second action step
or
➢ Alternative action
Result
➢ Individual action step
See "Formats and symbols
used [ → 14]"
● ListDesignates a list.
"Command / menu item"Indicates commands, menu items or
Prompts you to do something.
Identifies a reference to another text
passage and specifies its page
number.
quotations.
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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS XG 3D / Ceph2.1Modifications to the unit
Safety instructions
2
2.1
2.2
2.3
Modifications to the unit
Modifications to this unit which might affect the safety of the system
owner, patients or other persons are prohibited by law!
For reasons of product safety, this product may be operated only with
original Sirona accessories or third-party accessories expressly approved
by Sirona. The user is responsible for any damage resulting from the use
of non-approved accessories.
Fixed connection
DANGER
Potentially lethal shock hazard!
Fixed connection!
Installing a mains plug instead of the specified fixed connection infringes
international medical regulatory actions and is prohibited. In case of
error, this puts patients, users, and other parties seriously at risk.
Electromagnetic compatibility
The unit complies with the requirements of standard IEC 60601-1-2.
Medical electrical equipment is subject to special EMC-related
precautions. It must be installed and operated as specified in the
document "Installation Requirements".
bеЦдблЬ
2.4
2.5
If high-voltage systems, radio link systems or MRI systems are located
within 5 m of the unit, please observe the specifications stated in the
installation requirements.
Portable and mobile RF communications equipment may affect medical
electrical equipment. Therefore, the use of mobile wireless phones in
medical office or hospital environments must be prohibited.
Electrostatic discharge from people can damage electronic components
when the components are touched.
Touch a ground point to discharge static electricity before touching any
boards.
Switching the unit on
Safety information for switching on the unit: Service engineer
XGPF-63464; Patient position when switching on
Due to the risk of injury caused by malfunction, no person may be
positioned in the unit when it is switched on.
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2Safety instructionsSirona Dental Systems GmbH
2.6CondensationService Manual ORTHOPHOS XG 3D / Ceph
2.6
2.7
2.8
Condensation
Safety information for condensation: Service engineer
Extreme fluctuations of temperature may cause condensation inside the
unit. Do not switch the unit on before it has reached normal room
temperature. See also the chapter "Technical details"
Laser light localizer
Safety information for light loca lizer: Service engineer
The system incorporates Class 1 laser products.
A minimum distance of 10 cm (4") is required between the eye and the
laser. Do not stare into the beam.
Do not use the system with any other lasers, and do not make any
changes to settings or processes that are not described in these
operating instructions. This may lead to a dangerous exposure to
radiation.
Ventilation slots
Ventilation slots
Never cover the ventilation slots on the unit under any circumstances,
since this may obstruct air circulation. This can cause the unit to overheat.
2.9
2.10
Qualifications of service personnel
Installation and startup may be carried out only by personnel specifically
authorized by Sirona.
Radiation protection
Safety information for radiation protection: Service engineer
The valid radiation protection regulations and measures must be
observed. The statutory radiation protection equipment must be used.
During an exposure, the service engineer should move as far away from
the X-ray tube assembly as the coiled cable of the manual release
permits.
With the exception of the service engineer, no other persons are allowed
to stay in the room during an exposure.
In case of malfunctions, cancel the exposure immediately by letting go of
the exposure release button.
Information aboutradiationprotection for Canada
NOTICE
3D imaging should not be used for screening examinations. 3D imaging
examinations must be clinically warranted and each exam must be
justified by demonstrating that the benefits outweigh the risks.
NOTICE
Where it is likely that evaluation of soft tissues will be required as part of
the patient's radiological assessment, the appropriate imaging should
be conventional medical CT or MR, rather than 3D imaging using Cone
Beam technology.
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Sirona Dental Systems GmbH 2Safety instructions
Service Manual ORTHOPHOS XG 3D / Ceph2.11Safety checks
2.11
2.12
Safety checks
Safety checks
Once repairs are completed, the circuit breaker test and unit leakage
current test must be carried out (see chapter "Checking the circuit
breaker" and "Checking the unit leakage current").
Functional check
Note for XG 3D:
CAUTION
Be sure to observe the descriptions and safety information given in the
chapter titled "Switching the unit on [ → 60]" and "Test exposures/Test
images [ → 469]".
Following any form of service and maintenance work, a functional check
must be performed on the device.
Perform the following test steps:
1. Perform a restart of the unit:
–Switch the unit off.
– Wait 1 minute.
–Switch the unit on.
– Wait for the self-test.
2. Perform a 2D test exposure using the needle phantom included in the
scope of supply.
3. Perform a 3D test exposure using the constancy test phantom / DIN
DVT test phantom included in the scope of supply.
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
Unit description
3
Accompanying documents
Electrostatic discharge (ESD)
Identification of single use devices
3.1
Hardware
3.1.1Information on the unit
The following symbols are applied to the unit:
Accompanying documents
This symbol is affixed next to the unit rating plate.
Meaning: When operating the unit, observe the operating instructions.
This symbol is affixed on the unit rating plate.
Meaning: The accompanying documents are available on the homepage
of Sirona.
Connector pins or sockets bearing ESD warning labels must not be
touched or interconnected without ESD protective measures. See also
"Electrostatic Discharge" and "Electromagnetic Compatibility" [ → 15].
XGPF-36245; Single use hygienic protective sleev es
Prior to each exposure, the hygienic protective sleeves (single use
devices) must be fitted.
Single use devices are identified with the symbol shown on the left. They
must be disposed of immediately after use. Do not use single use devices
more than once.
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Sirona Dental Systems GmbH 3Unit description
A
B
C
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
3.1.2System versions
XG3D device version
bеЦдблЬ
AORTHOPHOS XG 3D, digital volume tomograph
BORTHOPHOS XG 3D/Ceph,
digital volume tomograph with cephalometer, left-arm version
CORTHOPHOS XG 3D/Ceph,
digital volume tomograph with cephalometer, right-arm version
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
3.1.3Sensor versions
Sensor XG PAN: Sensor for panoramic X-ray (PAN)
Sensor XG CEPH: Sensor for panoramic and cephalometric
(CEPH) X-ray
PAN/3D combisensor:
Sensor for panoramic X-ray (PAN) and volume exposures (3D)
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Sirona Dental Systems GmbH 3Unit description
C
B
A
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
3.1.4Installation versions
Installation versions: XG 3D
AStandard installation
Unit
without remote control with release button on the coiled cable
in the treatment room.
BInstallation version 1
with remote control
Unit
outside the X-ray room
button on the coiled cable.
without release button and coiled cable).
CInstallation version 2
bеЦдблЬ
without release
(see section Installation version 1:
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Unit
with remote control
button on the coiled cable.
release button and coiled cable).
outside the X-ray room
(see section Installation version 2: with
with release
21
3Unit descriptionSirona Dental Systems GmbH
D
A
B
C
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
3.1.5Modules and components
Modules and components: XG 3D
ASlide [ → 23]
BStand [ → 24]
CCephalometer [ → 25]
DRemote control [ → 25]
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Sirona Dental Systems GmbH 3Unit description
DX11
DX1M1*, M2*DX5*
LS*
DX6*
DX61*
DX51
DX7*
DX81P*, DX85P*
DX88
M
U
LS
LS
M, M
AK1AK2
B
A
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
3.1.5.1
Slide
Slide: XG 3D
bеЦдблЬ
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ComponentDesignationFunction
BoardsDX1Open loop/closed loop control in
DX11Controller board
DX5*Headrest adapter
DX51*Occlusal bite block
DX6*(A)Open-loop/closed-loop control
DX6*(B)Open-loop/closed-loop control
DX7*Easypad touchscreen
DX61*Diaphragm control
DX81PDigital sensor
DX85P*Digital sensor power supply
DX88Image memory
general
(tube assembly 1.0)
(tube assembly 2.0)
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3Unit descriptionSirona Dental Systems GmbH
DX32
MHV
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
ComponentDesignationFunction
MotorMURotary movement of rotating
element
MAK1, MAK2Linear movement of rotating
element
M1*, M2*Linear movement of headrest
Light barriers LSPosition control of the ring cycle
*) not available as individual repair part (see spare parts list).
3.1.5.2
Stand
Stand: XG 3D
ComponentDesignationFunction
BoardsDX32Power supply board
MotorMHVLinear movement of height
adjustment
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Sirona Dental Systems GmbH 3Unit description
LS
MS
DX91
DX42
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
3.1.5.3
3.1.5.4
Cephalometer
ComponentDesignationFunction
BoardsDX91Cephalometer control
MotorsMSStepping motors: linear movement
of secondary diaphragm and sensor
Light barriersLSPosition check
Remote control
bеЦдблЬ
ComponentDesignationFunction
BoardDX42Display board for remote control
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3Unit descriptionSirona Dental Systems GmbH
DX32 / X2
DX6 / X3
DX32 / X1
DX1 / X100
DX1 / J302
DX6 / J6
C
B
A
L1
L4
DX1
L5
DX6
DX32
L3
L2
L1
L2
L3
L4
L5
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
3.1.6Cabling overview
Cabling overview: XG 3D
APower switch/S1
BLine filter
CWago terminal
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Sirona Dental Systems GmbH 3Unit description
DX1 / X104
DX7 / X102
DX1 / X302
DX7 / X103
DX1 / X102
DX61 / X501
DX1 / J306 – J307
DX6 / J2 – J3
L6_
X
G
592252
6
L
6
5
9
2
2
5
2
6
D
X
1
/
J
3
0
7
L
6
5
9
2
2
5
2
6
D
X
1
/
J
3
0
6
DX7
L9
L10
DX1
L6
DX6
DX61
L11
L6
L9
L10
L11
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
bеЦдблЬ
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3Unit descriptionSirona Dental Systems GmbH
DX1 / X306
DX61 / X101
DX1 / X500
DX81 / X100
DX1 / X404
DX5 / X1
DX1 / X610
DX1 / X403
DX1 / X500
DX81 / X100
B
A
DX81
L16
L19
L13.1
L13
DX1
L18
DX5
DX61
L12
L12
L13
L13.1
L16
L18
L19
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
AHA motor
BLS sensor
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Sirona Dental Systems GmbH 3Unit description
DX61 / X91
DX5
DX81 / X100
DX1 / X503
DX61 / X203
TSA Motor
LASER
LS
AMP
LS
L24_XG
6090760
L24_XG
6090760
DX91/
X407
DX91/
X302
AMP
DX91/X302
DX91/X407
D
C
B
A
L21
DX91
DX1
DX6
L23
L24
L20
DX61
L38
L35
DX81
L21
L20
L21
L23
L24
L31
L35
L38
L31
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
APotentiometer
BMotor
CLaser module
DLS sensor
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3Unit descriptionSirona Dental Systems GmbH
DX91 / X6
DX91 / X101
DX1 / X103
DX1 / X309
DX1 / X1000
DX51 / X1
L41
B
A
DX91
DX1
DX51
L36
L39
L37
L40
L41
L36
L37
L39
B
L40
L41
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
AHeat shrink tube
BCover, blue
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Sirona Dental Systems GmbH 3Unit description
L108_XG
6094705
DX1/
X303
L117/
X103
L108_XG
6094705
DX1 / X303
L117 / X103
L117_XG
6094697
L117_XG
6094697
DX42 / X100
L108 / X103
DX1 / J901
A
DX1
DX42
L108
L7
L117
L25
L26
L7
L25
L26
L108
L117
A
DX88 / X209
DX88 / X210
L15 XG
6319185 DX1/J309
L15 XG
6319185 DX6/J5
Hersteller-
produktionsdaten
DX1 / J309DX6 / J5
DX81 / X100
(Ltg.1)
(Ltg.2)
DX88/X212
DX88/X211
Kabel L80
AEM:
6279116 D3559
<KW/JAHR>
DX81/X100
DX88 / X211
DX88 / X212
DX1 / X111
A
L80 L13 L14
DX1
L15
DX6
DX88
DX81
L13
L14
L15
L80
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
AMedia converter
bеЦдблЬ
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
3.1.7Board photos
3.1.7.1
Boards DX1/DX11Installed up to unit serial number 628999 for "ORTHPHOS XG3D" and
Boards in the slide
XG 3D DX1/DX11 old version
648999 for "ORTHPHOS XG3D/Ceph"
XG 3D DX1/DX11 new version, ca. October 2011
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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
Boards DX1/DX11Installed as of unit serial number 629000 for "ORTHPHOS XG3D" and
649000 for "ORTHPHOS XG3D/Ceph"
IMPORTANT
The DX1/DX11V2 board can only be operated with unit software version
V04.04.00 or higher.
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
Board DX51
DX51: XG 3D
DX6: XG3D
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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
Board DX6This board is not available as a spare part or a repair part. X-ray tube
assemblies can only be ordered as complete units.
DX6 in X-ray tube assembly 1.0:
bеЦдблЬ
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
DX6 in X-ray tube assembly 2.0:
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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
Board DX7The board is not available as a spare part or a repair part. The Easypad
can only be ordered as a complete unit.
DX81P_85P: XG 3D
bеЦдблЬ
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
Boards DX81P / DX85P
NOTICE
You are not permitted to open the sensor! The sensor may be replaced
only as a complete unit!
Board is not available as a spare part or a repair part. Sensor can only be
ordered as a complete unit.
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Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
Board DX88
DX88: XG3D
bеЦдблЬ
Board DX32
3.1.7.2
Boards in the stand
ALine filter
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
Board DX91
3.1.7.3
Boards in the cephalometer (left- and right-arm versions)
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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
3.1.7.4
Board DX42This board is not available as a spare part or a repair part.
Board in the remote control
bеЦдблЬ
3.1.8Covers
When removing covers, always remember that direct sunlight or bright
room lighting can cause system malfunctions due to activated light
barriers. Therefore: avoid direct sunlight and bright room lighting above
the unit!
Reattach all covers. When attaching the covers: be sure to screw the
sheet metal cover back on.
IMPORTANT: For reasons of electromagnetic compatibility, be sure to
fasten all screws.
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
AProfile covers, top and bottom
BIntermediate piece
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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
CArm cover, top
DSlide cover, top rear
ESlide cover, bottom rear
FSlide cover, center rear
GSensor cover, complete
HSupport cover, bottom
ISupport cover, top
JTube assembly cover
KTube assembly, cover
LRing cover
MSlide cover, complete
NDrawer
OCover, Ceph
bеЦдблЬ
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
3.1.9Technical Data
Unit data, power, times
Unit data
Model designation:ORTHOPHOS XG 3D/Ceph
Nominal voltage:200 – 240 V
Permissible fluctuation:± 10%
Permissible drop under load: 10%
Rated current:12 A
Rated power:2 kW at 90 kV/12 mA with any radiation
time
Nominal frequency:50/60 Hz
Mains resistance:max. 0.8 ohms
Main building fuse:25 A slow-blow (16 A for single line)
Power consumption:2 kVA
Power output of tube
assembly:
Tube voltage:60 – 90 kV (for 90 kV max. 12 mA)
Tube current:3 – 16 mA (for 16 mA max. 66 kV)
Maximum setting range:60 kV / 3 mA to 90 kV / 12 mA
High-voltage waveform:High-frequency multipulse
Program duration:see Operating Instructions, section on
Exposure time:see Operating Instructions, section on
Image acquisition scale:For P1, normal dental arch (slice center)
Exposure time for a
cephalometric image:
Image acquisition scale for a
cephalometric image:
90 kV/12 mA = 1080 W with any radiation
time
Residual ripple ≤ 4 kV
"Program values"
"Program values"
approx. 1:1.19, i.e. the acquired image is
magnified by approx. 19% on average
compared to reality.
14.9 s max.
approx. 1:1.1, i.e. the acquired image is
magnified by approx. 10% on average
compared to reality.
3D X-ray tube
Total filtration of X-ray tube
assembly:
Focal spot size as specified
> 2.5 AI / 90 IEC 60522
0.3 mm Cu for volume exposures
0.5
in IEC 60336, measured in
the central X-ray beam:
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Sirona Dental Systems GmbH 3Unit description
Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
Marking of focal spot:
Source-skin distance> 200 mm (8“)
Automatic exposure
blocking:
The duration of automatic exposure
blocking (cooling period) depends on the
set kV/mA level and the actual exposure
time. Depending on the tube load,
interval times of 8 s to 300 s are
automatically set by the system.
A countdown of the waiting time is
displayed on the control panel.
Operating unit data, 200 W long-term power output
Class I device
Degree of protection against
electric shock:
Degree of protection against
ingress of water:
Type B device
Ordinary equipment (without protection
against ingress of water)
Year of manufacture:
bеЦдблЬ
(on the rating plate)
Operating mode:Continuous operation
Long-term power output:200 W
Anode material:Tungsten
Exposure parameters for
2 mA / 90 kV
determining leakage
radiation:
Transport and storage
Transport and storage
-10°C – +70°C (14°F – 158°F)
temperature:
Air humidity:10% – 95%
Admissible operating
temperature:
X-ray tube and PAN sensor
Acc. to IEC 60601-1 between +10 °C and
+40 °C (50 °F – 104 °F)
X-ray tube
SR 90 / 15 from Siemens or OCX 100 CEI
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
PAN Sensor
Digital CCD line sensor, repluggable for panoramic exposure technique
Active sensor area, Pan type: 138 mm x 6.48 mm
Detail resolution:0.027 mm pixel size
Focus-sensor distance:497 mm
Flat Panel Detector
Flat Panel Detector
Digital Flat Panel Detector with CMOS technology, integrated for 3D
exposure technique
Active sensor area type 3D:125 mm x 125 mm
Detail resolution:0.1 mm pixel size
Focus-sensor distance:530 mm
Max. filtration in front of
<1.2mm Al
sensor:
Ceph sensor
Ceph sensor
Digital CCD line sensor, repluggable for panoramic or ceph exposure
technique
Active sensor area, Ceph
230 mm x 6.48 mm
type:
Detail resolution:0.027 mm pixel size
Focus-sensor distance:1,714 mm
Diagrams
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Service Manual ORTHOPHOS XG 3D / Ceph3.1Hardware
Cooling curve of tube housing
Cooling curve of X-ray tube
Heating curve of tube housing
Central X-ray beam and anode angle
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3Unit descriptionSirona Dental Systems GmbH
3.1HardwareService Manual ORTHOPHOS XG 3D / Ceph
System requirements for SIDEXI S
Minimum PC system requirements for SIDEXIS
Processor:DualCore 1.6 GHz
RAM2 GB
Free hard disk
5 GB for SIDEXIS installation and database
storage:
Removable
CD/DVD writer
medium:
Operating system: Windows XP Professional, 32-bit, SP3
Windows 7 Professional, 32-bit or 64-bit (64-bit
version not tested)
Windows 7 Ultimate, 32-bit or 64-bit
Graphics card:> 512 MB, minimum resolution 1280 x 1024 pixels,
16.7 million colors (TrueColor)
Screen:Suitable for diagnosis applications
Network card:Network RJ45, 100 MBit/s
USB port:For Version 1.1 and higher, required for USB
components only
Software:Internet Explorer 6.0, SP1
Acrobat Reader 8.0, contained on CD, required for
the PDF test report function
System requirements for GALAXI S
Requirements for GALAXIS PC system
Minimum requirementsRecommended
configuration
Processor:DualCore from 2 GHzQuadCore from 2 GHz
RAM4 GB8 GB
Hard disk storage: 500 GB1 TB
Removable
DVD writer
medium:
Operating system: Windows XP
Professional, 32-bit, SP3
Windows 7 Ultimate,
64-bit
Windows 7 Professional,
32-bit or 64-bit
Graphics card:external (no chipset graphics), > 512 MB, minimum
resolution 1280x1024 pixels, 16.7 mil. colors
(TrueColor), Shader Model 3 for advanced
rendering in GALILEOS Implant
Any software combinations other than those listed here are not allowed.
If a module software version does not match the main software version,
the main software version is identified with an asterisk on the info screen
(e.g. 04.03.01*).
Software versions: XG 3D
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.03.00DX42V02.52.04
DX11-FPGAV01.03.00
DX6V03.03.07
DX61V03.05.00
DX7V02.74.07
DX7-L0V02.29.00
DX7-L1V02.29.00
DX7-L2V02.27.00
DX7-L3V02.27.00
DX7-L4V02.04.00
DX7-L5V02.02.00
DX71V02.52.01
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.00.03
DX88-FPGAV01.23.00
DX91V02.44.00
bеЦдблЬ
SIDEXIS XGXG3D
Workstation software
V2.5.1
V2.5.2
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V1.0
V1.1
RCU
Server software
V1.8
V2.0
GALILEOS Software
Compatibility Update
V1.7.4V1.7.2
GALILEOS
Implant
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3Unit descriptionSirona Dental Systems GmbH
3.2FirmwareService Manual ORTHOPHOS XG 3D / Ceph
Main software V 04.03.01
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.03.00DX42V02.52.04
DX11-FPGAV01.03.00
DX6V03.04.00
DX61V03.05.00
DX7V02.74.07
DX7-L0V02.29.00
DX7-L1V02.29.00
DX7-L2V02.27.00
DX7-L3V02.27.00
DX7-L4V02.04.00
DX7-L5V02.02.00
DX71V02.52.01
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.00.03
DX88-FPGAV01.23.00
DX91V02.44.00
SIDEXIS XGXG3D
Workstation software
V2.5.1
V2.5.2
V1.0
V1.1
RCU
Server software
V1.8
V2.0
GALILEOS Software
Compatibility Update
GALILEOS
Implant
V1.7.4V1.7.2
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Service Manual ORTHOPHOS XG 3D / Ceph3.2Firmware
Main software V04.04.00
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.04.01DX42V02.54.00
DX11-FPGAV01.03.00
DX6V03.05.00
DX61V04.01.00
DX7V02.77.01
DX7-L0V02.29.00
DX7-L1V02.29.00
DX7-L2V02.27.00
DX7-L3V02.27.00
DX7-L4V02.04.00
DX7-L5V02.02.00
DX71V02.54.00
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.02.00
DX88-FPGAV01.30.00
DX91V02.44.00
bеЦдблЬ
SIDEXIS XGXG3D
Workstation software
V2.5.2
V2.5.3
V1.1V2.0V1.8
RCU
Server software
GALILEOS
Implant
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3Unit descriptionSirona Dental Systems GmbH
3.2FirmwareService Manual ORTHOPHOS XG 3D / Ceph
Main software V04.07.00
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.07.00DX42V02.55.00
DX11-FPGAV01.03.00
DX6V03.05.00
DX61V04.02.00
DX7V02.79.00
DX7-L0V02.29.00
DX7-L1V02.29.00
DX7-L2V02.27.00
DX7-L3V02.27.00
DX7-L4V02.04.00
DX7-L5V02.02.00
DX71V02.54.01
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.03.00
DX88-FPGAV01.31.00
DX91V02.44.00
SIDEXIS XGXG3D
Workstation software
V2.5.2
V1.2V2.1V1.9
V2.5.3
RCU
Server software
GALILEOS
Implant
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Service Manual ORTHOPHOS XG 3D / Ceph3.2Firmware
Main software V04.07.01
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.07.01DX42V02.55.00
DX11-FPGAV01.03.00
DX6V03.05.00
DX61V04.02.00
DX7V02.79.00
DX7-L0V02.29.00
DX7-L1V02.29.00
DX7-L2V02.27.00
DX7-L3V02.27.00
DX7-L4V02.04.00
DX7-L5V02.02.00
DX71V02.54.01
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.02.05
DX88-FPGAV01.31.00
DX91V02.44.00
bеЦдблЬ
SIDEXIS XGXG3D
Workstation software
V2.5.2
V2.5.3
V1.2V2.1V1.9
RCU
Server software
GALILEOS
Implant
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3Unit descriptionSirona Dental Systems GmbH
3.2FirmwareService Manual ORTHOPHOS XG 3D / Ceph
Main software V04.09.02
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.09.02DX42V02.56.02
DX11-FPGAV01.03.00
DX6 tube
V03.06.03
assembly 1.0
DX6 tube
V04.07.01
assembly 2.0
DX61V04.02.00
DX7V02.80.05
DX7-L0V02.29.00
DX7-L1V02.29.00
DX7-L2V02.27.00
DX7-L3V02.27.00
DX7-L4V02.04.00
DX7-L5V02.02.00
DX71V02.54.03
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.02.05
DX88-FPGAV01.31.00
DX91V02.44.00
SIDEXIS XGXG3D
Workstation software
V2.5.2
V1.2V2.2V1.9 SP1
V2.5.3
V2.5.6
RCU
Server software
GALILEOS
Implant
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Service Manual ORTHOPHOS XG 3D / Ceph3.2Firmware
Main software V04.12.00
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.12.00DX42V02.56.04
DX11-FPGAV01.04.00
DX6 tube
assembly 1.0
DX6 tube
assembly 2.0
DX61V04.03.00
DX7V02.80.07
DX7-L0V02.29.00
DX7-L1V02.29.00
DX7-L2V02.27.00
DX7-L3V02.27.00
DX7-L4V02.04.00
DX7-L5V02.02.00
DX71V02.54.03
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.02.07
DX88-FPGAV01.31.00
DX91V02.44.00
V03.07.03
V04.09.00
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SIDEXIS XGXG3D
Workstation software
V2.5.6V1.3V2.3V1.9 SP1
RCU
Server software
GALILEOS
Implant
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3Unit descriptionSirona Dental Systems GmbH
3.2FirmwareService Manual ORTHOPHOS XG 3D / Ceph
Main software V04.14.00
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.14.00DX42V02.58.02
DX11-FPGAV01.04.00
DX6 tube
V03.08.00
assembly 1.0
DX6 tube
V04.09.07
assembly 2.0
DX61V04.04.00
DX7V02.82.01
DX7-L0V02.31.00
DX7-L1V02.31.00
DX7-L2V02.29.00
DX7-L3V02.29.00
DX7-L4V02.06.00
DX7-L5V02.02.00
DX71V02.55.02
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.03.07
DX88-FPGAV01.31.00
DX91V02.45.00
SIDEXIS XGXG3D
Workstation software
RCU
Server software
GALILEOS
Implant
V2.5.6V1.4V2.4V1.9 SP1
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Service Manual ORTHOPHOS XG 3D / Ceph3.2Firmware
Main software V04.14.01
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.14.00DX42V02.58.02
DX11-FPGAV01.04.00
DX6 tube
assembly 1.0
DX6 tube
assembly 2.0
DX61V04.04.00
DX7V02.82.01
DX7-L0V02.31.00
DX7-L1V02.31.00
DX7-L2V02.29.00
DX7-L3V02.29.00
DX7-L4V02.06.00
DX7-L5V02.04.00
DX71V02.55.02
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.03.07
DX88-FPGAV01.31.00
DX91V02.45.00
V03.08.00
V04.09.07
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SIDEXIS XGXG3D
Workstation software
V2.5.6V1.4V2.4V1.9 SP1
RCU
Server software
GALILEOS
Implant
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3Unit descriptionSirona Dental Systems GmbH
3.2FirmwareService Manual ORTHOPHOS XG 3D / Ceph
Main software V04.14.02
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.14.00DX42V02.58.02
DX11-FPGAV01.04.00
DX6 tube
V03.08.00
assembly 1.0
DX6 tube
V04.09.07
assembly 2.0
DX61V04.04.00
DX7V02.82.01
DX7-L0V02.31.00
DX7-L1V02.31.00
DX7-L2V02.29.00
DX7-L3V02.29.00
DX7-L4V02.06.00
DX7-L5V02.04.00
DX71V02.55.02
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.03.07
DX88-FPGAV01.31.00
DX91V02.45.00
SIDEXIS XGSIDEXIS 4XG3D
Workstation software
RCU
Server software
GALILEOS
Implant
V2.6.2V4.1.2V1.5V2.5V1.9 SP1
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Service Manual ORTHOPHOS XG 3D / Ceph3.2Firmware
Main software V04.14.03
ORTHOPHOS XG 3DRemote control
BoardModule software BoardModule software
DX11V04.16.06DX42V02.58.02
DX11-FPGAV02.03.00
DX6 tube
assembly 1.0
DX6 tube
assembly 2.0
DX61V04.04.00
DX7V02.82.02
DX7-L0V02.32.00
DX7-L1V02.31.00
DX7-L2V02.29.00
DX7-L3V02.29.00
DX7-L4V02.06.00
DX7-L5V02.04.00
DX71V02.55.02
DX81V02.33.00
DX81-FPGAV03.08.00
DX88V03.03.07
DX88-FPGAV01.31.00
DX91V02.45.00
V03.08.00
V04.10.06
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SIDEXIS XGSIDEXIS 4XG3D
Workstation software
V2.6.2V4.1.2V1.5V2.5V1.9 SP1
RCU
Server software
GALILEOS
Implant
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4General operating proceduresSirona Dental Systems GmbH
4.1Switching the unit onService Manual ORTHOPHOS XG 3D / Ceph
General operating procedures
4
4.1
Switching the unit on
WARNING
X-rays
Be sure to observe the radiation protection regulations applicable in
your country.
➢ No person may be positioned in the unit when it is switched on.
NOTICE
Damage to the unit
Check the room height before you raise the unit.
➢ If the room height is less than 2.27 m (89 3/8") or 2.30 m (90 1/2")
for installation with the floor stand, you must limit the maximum
travel height [ → 325].
NOTICE
Fluctuations in temperature can cause condensation to form in the unit.
Electrical components are destroyed by short circuits.
➢ Do not switch the unit on until the temperature of the unit has
adapted to the ambient temperature and the condensation has
evaporated.
Waiting time when switching on and off
NOTICE
The unit must not be switched on/off constantly.
Constant switching on and off reduces the service life of individual unit
components and results in increased power consumption.
➢ After switching the unit off, wait for approx. 60 seconds before
switching it on again.
Switchingthe unit on:XG 3D/3Dready
NOTICE
The surface of the touchscreen is sensitive.
The touchscreen can be damaged or its surface scratched.
➢ Never use pointed objects such as ballpoint pens, pencils, etc. to
operate the touchscreen.
➢ Only use your fingertips to operate the touchscreen.
IMPORTANT
After the unit is switched on, the touchscreen has only limited readability
for several minutes until the background lighting has completed its
warm-up phase.
After the unit is switched off with the main switch, the touchscreen
remains lit for approx. another 3 to 5 seconds.
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Sirona Dental Systems GmbH 4General operating procedures
T
R
C
B
A
Service Manual ORTHOPHOS XG 3D / Ceph4.1Switching the unit on
IMPORTANT
After switch-on, the unit requires approx. 1 min. of warm-up time.
At the same time, the self-adjustment routine for the mechanics and the
electronics of the unit is performed. If a key is pressed during the selfadjustment routine, an error message will display on the control panel.
1. Turn the main switch (A) to position I.
2. Wait for approx. 1 minute.
ª The radiation indicator X-ray (C) lights up for approx. one second
as a functional check.
ª After approx. 2 seconds, the green LED B in the upper part of the
control panel lights up. This LED remains lit as long as the unit is
on.
ª The start screen is displayed on the touchscreen for several
seconds.
ª The program selection is then displayed on the touchscreen.
ª The forehead support and temple supports are completely open.
3. Check whether the patient symbols on the touchscreen can be
selected in exactly the right position.
If problems occur during selection, adjust the touchscreen [ → 244].
4. Press the R key.
ª The unit moves to its starting position.
5. Switch on the PC.
6. Start SIDEXIS.
ª As long as no connection has been made to SIDEXIS, the
message
"Switch SIDEXIS to ready for exposure state"
displayed in the comment line of the control panel.
4.1.1Factory setting after switch-on
Factory setting after switch-on: XG 3D/3D ready
The unit has the following factory configuration on delivery:
● The acoustic signal for end of exposure is activated.
● The unit language is preconfigured as ordered.
● The preview image is switched on.
● The welcome screen is switched on.
● The first name, last name and date of birth lines are displayed on the
welcome screen.
If the custo mer requ i res a di f ferent co nfigura tio n, this c a n be implemented
via service routine S017.
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is
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4General operating proceduresSirona Dental Systems GmbH
4.2Updating the unit firmwareService Manual ORTHOPHOS XG 3D / Ceph
4.2
Updating the unit firmware
IMPORTANT
Downgrading to older versions
Downgrading the unit software version V04.14.00 or higher to an older
version is not a simple process. However, if this is essential, please get
in contact with the SIRONA Customer Service Center (CSC) in
advance.
XG 3D software update
Read the information provided on the firmware CD supplied with the unit
and on the SIRONA dealer page on the Internet very carefully. These
sources always contain the latest information on software updates.
1. Start the
"SIDEXIS XG"
2. Click
"Configuration of the X-ray components"
ª The
"SIDEXIS Manager"
.
"Configuration of the X-ray components"
under "Start"/"Programs"/"SIDEXIS"/
.
menu opens.
3. Select the
4. Click on the
ª The dialog box for entering the service password opens.
5. Enter the service password.
Enter the first 4 digits of the current system date in reverse order as
the service password (e.g. on 05/24/1995, 5042 must be entered as
the service password.
If an incorrect service password or no password at all is entered, the
limited update menu for users will be started. This includes only the
possibility for an automatic update [ → 67].
ª The dialog box for selecting the installation source opens.
"Attributes"
tab.
"Software update"
button.
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Sirona Dental Systems GmbH 4General operating procedures
Service Manual ORTHOPHOS XG 3D / Ceph4.2Updating the unit firmware
6. Click on the button with the 3 dots.
ª The dialog box for selecting the update file opens.
7. Select the desired update file from the list and confirm the selection
with the
The update file is located on the unit software CD. It is delivered with
each DX11 replacement board and also included in the country set.
The contents of the CD can be downloaded from the Dealer domain
of the SIRONA Internet home page (under Products/Imaging
systems): www.sirona.com
8. Click on the
ª The software manager opens.
ª The modules and their current software versions are displayed in
ª In the structure tree on the left (B) of the software manager, the
"Open"
the action window (A) of the software manager.
update modes
can now be selected.
button.
"Next"
button.
"Automatic" , "Main version"
an d
"Module update"
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4General operating proceduresSirona Dental Systems GmbH
4.2Updating the unit firmwareService Manual ORTHOPHOS XG 3D / Ceph
IMPORTANT
In main software V04.09.02 and higher, two versions of the DX6
assembly (tube assembly 1.0 and tube assembly 2.0) appear in the
action window (A) of the software manager. Depending upon which tube
assembly has been installed, one of the versions is displayed with a red
bar and the other with a green bar.
9. Select the desired mode for the software update (see chapter entitled
"Update mode [ → 67]").
NOTICE
Unit inoperability!
Before starting the software update, make sure that no unit movements
are active. Otherwise the system may become inoperable in rare cases.
The X-ray detector must be installed as part of the update. Exposure
readiness must be deselected in SIDEXIS XG and the unit must not
already be in service mode.
10. Click on the
"Start SW update"
button.
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Service Manual ORTHOPHOS XG 3D / Ceph4.2Updating the unit firmware
ª The update is started. A message box informs you when the
update process is completed.
11. Confirm the update by clicking on the
ª A message in the software manager notifies you that a unit restart
is required to activate the software update you performed.
"OK"
button.
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NOTICE
Effectiveness of the software update
The unit must be restarted after every software update. The new DX11
version will run only after the unit has been rebooted (see also chapter
"Measures following replacement of boards [ → 432]").
Any errors with the consecutive numbers 01, 03, 04, 06, or 07 displayed
immediately following the software update may be ignored. If these
messages appear again after the system is rebooted, please carry out
troubleshooting as described in the "Error messages [ → 91]" section.
If any conspicuous problems occur in connection with system handling
after the software update and unit reboot has been completed, please
repeat the software update immediately.
12. Click on the
whether the update was successfully performed.
If it features entries such as "Update of DXxx failed!", please perform
the update again. Repeat this procedure as often as necessary until
the "failed messages" no longer appear.
"Show logfile"
button and use the log files to check
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4General operating proceduresSirona Dental Systems GmbH
4.2Updating the unit firmwareService Manual ORTHOPHOS XG 3D / Ceph
13. Restart the unit now.
14. Use the software manager or service routine S008.2 (see section
"Firmware [ → 49]") to test whether all modules have the current
program version (see section "Check program releases [ → 69]".
15. Call up "Further Details" [ → 71].
This generates an XML file (with the system parameters) which is
saved in the PDATA/.../P2K_Config directory [ → 71] under the
network name of the unit.
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Service Manual ORTHOPHOS XG 3D / Ceph4.2Updating the unit firmware
4.2.1Update mode
Update mode: XG3D
IMPORTANT
Update mode Module update is only intended for internal Sirona
purposes and is not activated for User or Service mode.
In
Service mode
[ → 188]), the update manager supports two modes for updating the
software; these can be selected via the elements
version"
in the structure tree:
(accessible only by entering the Service Password
"Automatic"
and
"Main
● Automatic
The software of all components is automatically
software version
The right window displays a list of the modules, their installed
software version and the latest software version offered by the
update.
.
updated to the latest
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4General operating proceduresSirona Dental Systems GmbH
4.2Updating the unit firmwareService Manual ORTHOPHOS XG 3D / Ceph
● Main version
The software can be updated or downgraded using this menu.
This update mode is required, among other things, if a replacement
module arrives from the warehouse and features a newer release
than the existing main release of the unit. In this case, a main version
update to the overall unit status (displayed on the info screen) must
be performed for the corresponding component with the appropriate
update file (*.SUI). The module is then reprogrammed.
User mode
In
update manager only supports
(which can be accessed without a service password), the
"Automatic"
update mode.
The colored bars in front of the software releases indicate their validity
(see chapter entitled "Check program releases [ → 69]").
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Service Manual ORTHOPHOS XG 3D / Ceph4.2Updating the unit firmware
4.2.2Check program releases
Check programreleases: XG 3D
You can use the action window (A) of the software manager to check
which modules are connected to the unit and what their latest program
release is.
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4General operating proceduresSirona Dental Systems GmbH
4.2Updating the unit firmwareService Manual ORTHOPHOS XG 3D / Ceph
Modules which are connected and whose program release corresponds
to the latest main software version (see chapter entitled "Firmware
[ → 49]" are identified by a continuous green bar.
Modules which the system does not recognize are identified by a broken
red bar.
If the actual status of the module cannot be polled for the update, the
actual SW version will be displayed as = V00:00.
If a module has a hardware incompatibility to the program status to be
programmed or the software version on the module is newer than the one
in the update file, this will be indicated by a red triangle with an
exclamation mark.
If the version of the selected update file is lower than the current software
version of the unit, then there will be no display in the right window. The
downgrade required in this case is possible only via
"Main version"
mode.
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Service Manual ORTHOPHOS XG 3D / Ceph4.3Opening "Details"
4.3
Opening "Details"
Opening details XG 3 / 5 / 3D / 3D ready
1. Start the
"SIDEXIS XG"
2. Click
ª The
"SIDEXIS Manager"
.
"Configuration of the X-ray components"
"Configuration of the X-ray components"
under "Start"/"Programs"/"SIDEXIS"/
.
menu opens.
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3. Select the
4. Click on the
ª The current parameters are read from the unit and filed in an XML
"Attributes"
"Details..."
file under the network name of the unit in the PDATA/.../
P2K_Config folder. The process can take up to 30 seconds. After
the parameters are read, an editor displaying the data is opened
automatically.
tab.
button.
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Service Manual ORTHOPHOS XG 3D / Ceph4.4Setup of an X-ray component
4.4
Setup of an X-ray component
Since it is addressable via the network, the X-ray component can in
principle be activated for X-ray image acquisition by any of the PCs
connected to the network.
The program SiXABCon is used to manage networkable X-ray
components. It can be executed on any PC in the network on which
SIDEXIS XG has been installed.
IMPORTANT: In order to avoid IP address conflicts, you should never
operate several networkable X-ray components in the network using the
same IP address. Each X-ray component needs to be assigned a unique
IP address.
Factory setting of the TCP/IP address of the unit:
192.168.15.240 (subnet mask: 255.255.255.0)
Checking existing IP addresses
To find out whether an IP address already exists in the network, enter the
"PING" function in the input prompt (DOS window).
all
1. Switch on
components) which are being operated in the network.
2. Invoke the input prompt (DOS window) from a network computer.
3. At the input prompt, enter "ping" followed by the address to be
checked and then press the Enter key.
Example: "ping 192.168.15.13"
ª If a network device responds, then this address has already been
assigned.
network devices (computers, printers, X-ray
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4.4Setup of an X-ray componentService Manual ORTHOPHOS XG 3D / Ceph
4.4.1Selecting an X-ray component
1. Switch all networkable X-ray components off.
2. Start the
"SIDEXIS"
/
3. Click
ª The
"SIDEXIS Manager"
.
by selecting
"start"
"Configuration of the X-ray components"
"Configuration of the X-ray components"
/
"Program Files"
.
menu opens.
4. Select the
5. Select the name of the desired X-ray component in the
down menu ("XG3D" in the example); then click the
button.
or
➢ Select the text
"Attributes"
"Add component"
component in the
tab.
"Name"
"Add component"
under the desired X-ray
pull-down menu.
"Name"
pull-
ª The password dialog box appears.
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Service Manual ORTHOPHOS XG 3D / Ceph4.4Setup of an X-ray component
6. Enter the service password [ → 188] and confirm your input by clicking
"OK"
the
ª The
ª The
button.
"Device configuration"
"Boot service"
element is selected automatically.
menu opens.
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4.4Setup of an X-ray componentService Manual ORTHOPHOS XG 3D / Ceph
Boot service
IMPORTANT
Automatic addition and setup of the X-ray component via the boot
service functions properly only if the unit is started with the default
factory-set IP address.
If the IP address already has been changed, reset it to the factory setting
via service routine S037.2 or use the elements
"Add component manually"
service".
(see section on "Alternatives to the boot
"Automatic search"
or
✔ The element
1. Switch the unit on.
ª The unit is detected in the network and the values for the IP
address, subnet mask and standard gateway are automatically
imported to the input fields of the menu.
"Boot service"
is selected in the structure tree.
IMPORTANT
If the unit is not automatically detected in the network, it is possible to
manually assign a static IP address via service routine S037.4.
IMPORTANT
Each unit must be assigned a unique IP address in the network.
2. If you want to, you can enter an individual IP address in the
address"
with the cursor.
ª Default values suitable for the IP address are automatically
3. You can either overwrite the default values in the input fields or leave
them unchanged, depending on the network involved.
input field and then click into one of the other input fields
entered in the
fields.
"Subnet mask"
and
"Standard Gateway"
"IP
input
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Service Manual ORTHOPHOS XG 3D / Ceph4.4Setup of an X-ray component
4. Select the desired RCU in the
menu.
5. Confirm the settings by clicking on the
ª The settings are saved.
ª The
6. Confirm this dialog by clicking on the
7. Close the
button.
ª The new X-ray component appears in the device list of the menu
"Device configuration"
you that the configuration of the X-ray component has been
completed successfully.
"Device configuration"
"Configuration of the X-ray component"
"Sirona Control Server"
"Save values"
dialog window appears and informs
"OK"
button.
menu by clicking on the
.
drop-down
button.
"Quit"
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Alternatives to the boot service
As an alternative to adding new X-ray components via the boot service,
you also can add them via the
manually"
function.
"Automatic search"
or t he
"Add component
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4.4Setup of an X-ray componentService Manual ORTHOPHOS XG 3D / Ceph
Automatic search
1. Select the
ª The network is searched for existing X-ray components. All X-ray
2. Select the desired X-ray component from the list.
ª The values for the IP address, subnet mask and standard
3. Select the desired RCU in the
menu.
4. Confirm the settings by clicking on the
ª The settings are saved.
ª The
5. Confirm this dialog by clicking on the
6. Close the
button.
ª The new X-ray component appears in the device list of the menu
"Automatic search"
components found appear in the menu list.
gateway are automatically imported to the input fields of the
menu.
"Device configuration"
you that the configuration of the X-ray component has been
completed successfully.
"Device configuration"
"Configuration of the X-ray component"
element.
"Sirona Control Server"
"Save values"
dialog window appears and informs
"OK"
button.
menu by clicking on the
.
drop-down
button.
"Quit"
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Service Manual ORTHOPHOS XG 3D / Ceph4.4Setup of an X-ray component
Adding the component manually
1. Select the
2. Enter the values in the menu input fields manually.
3. Select the desired RCU in the
menu.
4. Confirm the settings by clicking on the
ª The settings are saved.
ª The
5. Confirm this dialog by clicking on the
6. Close the
button.
ª The new X-ray component appears in the device list of the menu
"Add component manually"
"Sirona Control Server"
"Device configuration"
you that the configuration of the X-ray component has been
completed successfully.
"Device configuration"
"Configuration of the X-ray component"
element.
drop-down
"Save values"
dialog window appears and informs
"OK"
button.
menu by clicking on the
.
button.
"Quit"
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4.4Setup of an X-ray componentService Manual ORTHOPHOS XG 3D / Ceph
4.4.2Approval of the X-ray component
✔ The X-ray component must have been selected [ → 74] via the
"Device configuration"
menu.
➢ Click on the check box in front of the X-ray component that you would
like to enable and accept the setting by clicking on the
ª The X-ray component is enabled.
"Apply"
button.
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Service Manual ORTHOPHOS XG 3D / Ceph4.4Setup of an X-ray component
Checking enablement➢ To check the communication with the unit, click the
button.
ª If the unit is communicating, a logfile with information on the unit
configuration appears.
"Device info"
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4.4Setup of an X-ray componentService Manual ORTHOPHOS XG 3D / Ceph
4.4.3Deleting an X-ray component
1. Switch all networkable X-ray components off.
2. Start the
"SIDEXIS"
/
3. Click
ª The
"SIDEXIS Manager"
.
by selecting
"start"
"Configuration of the X-ray components"
"Configuration of the X-ray components"
/
"Program Files"
.
menu opens.
4. Select the
5. Select the name of the desired X-ray component in the
down menu ("XG3D" in the example); then click the Delete
component button.
"Attributes"
tab.
"Name"
pull-
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Service Manual ORTHOPHOS XG 3D / Ceph4.5Using demo mode – operation without radiation release
4.5
Using demo mode – operation without radiation
release
XG 3 / 5 / 3D / 3D ready
If the unit is to be presented as a demo unit at trade fairs or exhibitions, it
must be ensured that radiation release is blocked.
4.5.1Switching on demo mode
When operated in demo mode, the unit must not release any radiation.
For this reason, you must take the following safety measures:
Switching on demo mode X G 3D ready / XG 3D
1. Switch off the unit.
DANGER
Perilous shock hazard!
It is essential to switch off the unit and to wait at least another 4 minutes
before taking off the covers of the X-ray tube assembly.
2. Remove the "Rear tube assembly" cover [ → 41].
3. Remove the cover plate of board DX6 [ → 406].
4. Set dip switch S2 (DX6) to position 2.
IMPORTANT: If switch S2 is not set to position 2 in demo mode
before switching off the unit, various error messages will display
when the unit is turned back on.
5. Pull cable L5 (XRAY) off connector J6/J103 (DX6).
ª Radiation release is now no longer possible.
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6. Switch on the unit and check the mode on the info screen.
Demo mode: ON means that: Demo mode is switched on (radiation
release is not possible)
Demo mode: OFF means that: Demo mode is switched off
(radiography, X-ray radiation are possible!)
7. Switch the unit off again and reattach the cover plate and the tube
assembly cover by following the dismantling procedure in reverse
order.
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4.5Using demo mode – operation without radiation releaseService Manual ORTHOPHOS XG 3D / Ceph
4.5.2Switching off demo mode
Switching off XG 3D / XG 3D ready
1. Switch off the unit.
DANGER
Perilous shock hazard!
It is essential to switch off the unit and to wait at least another 4 minutes
before taking off the covers of the X-ray tube assembly.
2. Remove the "Rear tube assembly" cover [ → 41].
3. Remove the cover plate of board DX6 [ → 406].
4. Set the dip switch S2 (DX6) to position 1.
5. Connect cable L5 (XRAY) to connector J6/J103 (DX6).
ª Radiation release is now once again possible.
6. Switch on the unit and check the mode on the info screen.
Demo mode: ON means that: Demo mode is switched on (radiation
release is not possible)
Demo mode: OFF means that: Demo mode is switched off
(radiography, X-ray radiation are possible!)
7. Switch the unit off again and reattach the cover plate and the tube
assembly cover by following the dismantling procedure in reverse
order.
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Service Manual ORTHOPHOS XG 3D / Ceph4.5Using demo mode – operation without radiation release
4.5.3Important information for repacking and transport
IMPORTANT
If a used carton on which one of the shockwatch or tiltwatch indicators
has already been tripped is used to package the unit, please make an
entry to that effect on the delivery note.
Cephalometer: XG3D / 3D ready / 5
Packing the cephalometer
1. Call service routine S034.6 [ → 355].
ª After calling the service routine, an inactive progress indicator is
displayed in selection field 1. Selection field 2 shows the
characters "FFFF".
2. Touch the T key (A).
ª The cephalometer moves to the packing position. The procedure
is visualized by an active progress indicator in selection field 1.
ª When the cephalometer has reached its packing position, "0000"
is displayed in selection field 2.
3. Exit the service routine [ → 262].
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4.5Using demo mode – operation without radiation releaseService Manual ORTHOPHOS XG 3D / Ceph
Panoramic: XG3D
Packing the panoramic unit
IMPORTANT
The bottom edge of the slide cover must be at the same height as the
markings A in the column.
DANGER
Shock hazard!
Be sure to switch off the line power supply before connecting the line
voltage!
1. Switch the unit on and move it to its packing height by actuating the
up/down keys on the control panel.
ª Bite block height = 965 mm (displayed as height on the control
panel)
ª Bottom edge of slide cover = 702 mm
2. Pack the panoramic X-ray unit
(Packing condition (see section "Delivery").
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Service Manual ORTHOPHOS XG 3D / Ceph4.5Using demo mode – operation without radiation release
Packing the X-ray detect or XG 3D
Dismantling and packaging the X-ray detector
IMPORTANT
For transport, pack the X-ray detector in its original packaging (for
packing condition see section "Delivery").
➢ To dismantle the X-ray detector, follow the same procedure as
Installation in reverse order.
Attaching the transport safety device
➢ Install the transport safety device by following the same procedure as
Dismantling in reverse order.
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Service Manual ORTHOPHOS XG 3D / Ceph
Messages
5
The different message texts are displayed ...
XG 3D message texts
● On the Easypad touchscreen
● On the display of the remote control
There are 3 groups of message texts:
Help messages (Hx xx):
● Help messages are caused by operator errors.
● The user must take action.
Error messages (Ex yyxx):
● Error messages indicate unit faults.
● The user must take action to eliminate the fault(s).
System messages (Sxxx):
● System messages inform the user about the current operating status
of the unit.
● The user does not have to take any action.
If error messages are displayed on the control panel that are not listed in
this section (such as message 1311), these messages come from the
Windows system. In such cases, you must check whether the firmware
you are using is compatible with the SIDEXIS XG version and run a
software update [ → 62] if necessary.
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Service Manual ORTHOPHOS XG 3D / Ceph5.1Help messages
5.1
Help codeDescriptionActions required
H3 01
H3 07
H3 20
H3 21
H3 22
H3 25
H4 02
H4 03
H4 04
H4 06
"R button, move into starting position"
"Change bite block"
"R button, confirm exposure data"
"Close the door"
"Select quadrant"
"Select region of exposure"
"Plug sensor into Ceph slot"
"Switch SIDEXIS to ready for exposure state"
"Plug in Ceph sensor"
"R button, move into Ceph starting position"
Help messages
Help messages: XG 3D
Help messages are displayed as help codes (Hx xx) on the Easypad
touchscreen or on the remote control display (if available). The codes tell
you how to operate the system if radiation release is not possible due to
a previous operator error.
The following list provides you with an overview of all help codes, their
meaning and the action required to eliminate the corresponding
problems.
IMPORTANT: The measures listed only clear help messages that result
from operator errors. If it is not possible to clear a message by taking the
measures listed, another type of error is the cause. In such cases, you
should run an error diagnosis [ → 94].
● Press the R key.
● Unit moves to starting position.
Remove the occlusal bite block.
● Press the R key.
● Exposure data are confirmed.
● Close door or check door contact.
Then press R key to acknowledge the
message.
● Select quadrant
● Select the center of rotation.
● Check the ceph sensor or plug it into the
cephalometer.
If this message does not disappear even after
the ceph sensor has been plugged in, this
indicates a system error. Perform error
diagnosis as described in the section titled
Troubleshooting [ → 160] .
● Make SIDEXIS XG ready for
exposure.
● Plug the ceph sensor into the cephalometer.
● Press the R key.
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H4 07
H4 08
H4 09
H4 20
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"Correct SIDEXIS preselection"
"Select SIDEXIS 3D exposure"
"Select SIDEXIS 2D exposure"
"Get existing exposure"
● Cephalometer moves to starting position.
● Perform alternative program setting.
Select 3D exposure in SIDEXIS XG.
Select 2D exposure in SIDEXIS XG.
IMPORTANT: Do not switch the system off until the
help message has disappeared.
● Get exposure with "Sirona Control Admin" (see
SIDEXIS XG
134).
"Operator’s Manual"
(REF 59 62
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5.2System messagesService Manual ORTHOPHOS XG 3D / Ceph
5.2
System messages
XG 3D system messages
System codes are only displayed on the remote control. System
messages are displayed in plain text on the Easypad.
System codeDescriptionActions required
XG3D system message table
S100
S110
"System is starting"
"Exposure not possible"
● Wait, no action required.
● Restart the unit:
1. Switch off the unit.
2. Wait 1 minute.
3. Switch unit on.
4. Repeat procedure
5.3
Status displays
Status displays:XG 3D
Status display on the EasypadDescription
Ready for exposureThe unit is ready for operation.
Exposure is performedRadiation is released.
Please waitUnit waiting for operational readiness.
Ready for exposure in XX secondsThe cooling time countdown is running.
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Service Manual ORTHOPHOS XG 3D / Ceph5.4Error messages
5.4
Error messages
XG 3D error messages
Error messages are displayed as error codes (Ex yy zz) on the Easypad
touchscreen and on the remote control display (if there is one).
The codes provide you with error type, error location and troubleshooting
information.
5.4.1Error code: Ex yy zz
The error messages are encoded according to the following pattern:
ExError type“Troubleshooting” classification for the user
yyLocationModule, subsystem or logical function unit
zzConsecutive
number
Identification of error
5.4.2Ex - Error type
Identifier x is intended to help you reach a decision quickly on how to
proceed with the corresponding error.
xDescriptionError groupActions required
1System warning
System message
This error group includes all errors
that indicate still acceptable
tolerance variations, or messages
about states which do not directly
affect system operation.
● Acknowledge the error message.
If the error occurs again ...
● Restart the unit:
1. Switch off the unit.
2. Wait 1 minute.
3. Switch unit on.
4. Repeat procedure
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2Errors caused by
system overload
3The system detects that
a key was pressed
during power-on.
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This error group includes states
that indicate temporary
overtemperatures or similar, for
example. The cause of the error
disappears automatically after a
certain waiting time.
This error group includes all errors
that indicate invalid signal states
of keys and safety signals during
power-on.
If the error occurs again ...
● Run an error diagnosis [ → 94].
● Acknowledge the error message.
● Repeat the procedure step after a certain
waiting time.
If the error occurs again ...
● Extend the waiting time.
If the error occurs again ...
● Run an error diagnosis [ → 94].
● Restart the unit:
1. Switch off the unit.
2. Wait 1 minute.
3. Switch unit on.
4. Repeat procedure
If the error occurs again...
● Run an error diagnosis [ → 94].
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5.4Error messagesService Manual ORTHOPHOS XG 3D / Ceph
xDescriptionError groupActions required
4Malfunction or
mechanical obstruction
of unit movements
This error group includes all errors
that indicate problems with the
motor-controlled movements on
the outside of the unit.
● Acknowledge the error message and make
sure that the movements of the unit are not
obstructed.
● Repeat the last procedure step or exposure.
If the error occurs again ...
● Run an error diagnosis [ → 94].
5Malfunction during the
exposure or during
exposure preparation.
This error group includes all errors
resulting from a certain system
action triggered by the user which
could not be performed because a
required (internal) partial function
(software or hardware) is not
● Acknowledge the error message.
● Repeat the last procedure step or exposure.
If the error occurs again ...
● Run an error diagnosis [ → 94].
ready or fails.
6Error during system
self-test.
This error group includes all errors
which may occur spontaneously
and without any related operator
action. They may be caused by
● Acknowledge the error message.
● Run an error diagnosis [ → 94].
Further operation of the unit is possible.
system self-tests.
7Unrecoverable system
error.
This error group includes all errors
which may occur spontaneously
● Run an error diagnosis [ → 94].
and without any related operator
action. They may be caused by
system self-tests. In this case it is
absolutely certain that continued
system operation is not possible.
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Service Manual ORTHOPHOS XG 3D / Ceph5.4Error messages
5.4.3yy - Location
Identifier yy defines the location or logical function unit where the error
has occurred.
The location may be a DX module number standing for an entire HW
function unit, or a logical SW function unit on board DX11 (central
control).
5.4.4General handling of error messages
Error messages must always be acknowledged with the R key.
If trouble-free operation is possible after the error is acknowledged, then
no further action is necessary.
If error messages occur again or frequently, or if fault-free operation is not
possible, run an error diagnosis (see chapter "Troubleshooting [ → 160]").
In some cases, it may make sense to obtain more information on the
history and frequency of errors via the error logging memory (S007) and
"SiXABCon" /"Properties" /"Details..."
via
[ → 71]) (see also section "Error logging memory [ → 161]").
(see section, Opening "Details"
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5.5List of error messagesService Manual ORTHOPHOS XG 3D / Ceph
5.5
List of error messages
In the following table, the error codes are sorted by the location or function
unit where the error has occurred. For enhanced clarity, the
corresponding ID in the error code is printed in bold type.
5.5.1Location 06: Tube assembly/DX6
Error codeDescriptionActions requiredsee
E6 06 01General error during module
initialization
Error codeDescriptionActions requiredsee
E6 06 02Invalid system data or uninitialized
module storage data
E6 06 01
E6 06 02 XG 3D
● Please contact the Sirona Customer
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
If the error occurs repeatedly ...
● Replace the tube assembly.
● Run service routine S005.2.
● Please contact the Sirona Customer
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
S. [ → 62]
S. [ → 406]
S. [ → 62]
Error codeDescriptionActions requiredsee
E6 06 03
E6 06 03Invalid commanding of control data,
CAN bus error
This error may also occur in
connection with other causal error
messages! Please also observe the
causal error message! It appears
● Check the CAN bus.S. [ → 163]
● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
only after you acknowledge the first
error message.
Error codeDescriptionActions requiredsee
E6 06 04
E6 06 04Data transfer error or dialog error to
module (master side)
● Check the CAN bus.S. [ → 163]
● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
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Service Manual ORTHOPHOS XG 3D / Ceph5.5List of error messages
Error codeDescriptionActions requiredsee
E6 0605
E6 06 05Data transfer error or dialog error to
bootloader of module
Only occurs in connection with
software update.
● Repeat the software update.S. [ → 62]
● Check the CAN bus.S. [ → 163]
If the error occurs repeatedly or the module
S. [ → 406]
is no longer addressable ...
● Replace the tube assembly.
Error codeDescriptionActions requiredsee
E6 0606
E6 06 06Module failed in TTP (detected on
master side)
This error may also occur in
connection with other causal error
messages! Please also observe the
causal error message! It appears
● Check the CAN bus.S. [ → 163]
● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
only after you acknowledge the first
error message.
TTP = Time Trigger Protocol
Error codeDescriptionActions requiredsee
E6 0607
E6 06 07TTP timeout error (detected on
slave side).
The module was temporarily not
addressed by the master:
● Undervoltage on the master
side
● Procedure error in the software
● Master (DX11) receives no
return commanding from the
module
This error may also occur in
connection with other causal error
messages! Please also observe the
● Check the CAN bus.S. [ → 163]
● Check power supply of board DX11;
measuring point 3.3 V on board DX1
(see wiring diagrams)
If 3.3 V present ...
S. [ → 428]
● Replace board DX11.
If 3.3 V is not present ...
S. [ → 428]
● Replace board DX1.
● Check cable L6, replace if necessary. S. [ → 176]
S. [ → 441]
● Check tube assembly (DX6), replace if
S. [ → 406]
necessary.
causal error message! It appears
only after you acknowledge the first
error message.
bеЦдблЬ
TTP = Time Trigger Protocol
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5.5List of error messagesService Manual ORTHOPHOS XG 3D / Ceph
Error codeDescriptionActions requiredsee
E6 06 08
E6 06 08General fault detected locally on
module (slave side). CAN controller
being reinitialized.
● Check the CAN bus.S. [ → 163]
● Check software versions on the info
screen or by running service routine
S008.2, perform software update if
S. [ → 286],
S. [ → 62]
necessary.
● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E7 06 10
E7 06 10Module is stuck in bootloader stage. ● Check board DX6 (note LED states).S. [ → 169]
If the board remains in the bootloader
S. [ → 62]
stage ...
● Repeat the software update.
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E7 06 12
E7 06 12Unit is not ready for operation
This error may also occur in
connection with other causal error
messages! Please also observe the
causal error message! It appears
only after you acknowledge the first
error message.
● Check the CAN bus.S. [ → 163]
If this error occurs in combination with
other errors ...
● Restart the unit:
1. Switch off the unit.
2. Wait 1 minute.
3. Switch unit on.
4. Repeat procedure and observe causal
error messages.
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E6 06 13
E6 06 13Error when writing to
EEPROM.
Stored data may be lost.
● Acknowledge error and repeat
procedure.
If the error occurs repeatedly ...
S. [ → 406]
● Replace the tube assembly.
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Service Manual ORTHOPHOS XG 3D / Ceph5.5List of error messages
Error codeDescriptionActions requiredsee
E2 0620
E2 06 20Overtemperature of single tank/
power pack
E6 0621
● Wait until the X-ray tube assembly has
cooled down.
● Check fan function by running service
routine S005.4; replace fan if
necessary.
● Check temperature sensor in single
tank by running service routine S005.5,
replace tube assembly if necessary.
S. [ → 275],
S. [ → 412]
S. [ → 276],
S. [ → 406]
Error codeDescriptionActions requiredsee
E6 06 21Hardware signal of release button
not detected.
● Check cable L5 (optical fiber), replace
if necessary.
S. [ → 176],
S. [ → 441]
● Replace board DX1.S. [ → 428]
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E6 0622
E6 06 22Broken temperature sensor● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E3 0623
E3 06 23Hardware signal of release button
applied during power-on.
● Check cable L5:
1. Switch off the unit.
2. Pull cable L5 off tube assembly.
3. Switch unit on.
4. Perform optical check of L5:
If light is visible ...
S. [ → 428]
bеЦдблЬ
● Replace board DX1.
If no light is visible ...
S. [ → 406]
● Replace the tube assembly.
Error codeDescriptionActions requiredsee
E5 0630
E5 06 30Total radiation time exceeded.If a CAN bus error had been reported
before ...
● Check the CAN bus.S. [ → 163]
● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
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5.5List of error messagesService Manual ORTHOPHOS XG 3D / Ceph
Error codeDescriptionActions requiredsee
E5 06 31
E5 06 31Partial radiation time exceededIf a CAN bus error had been reported
before...
● Check the CAN bus.S. [ → 163]
● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
Error codeDescriptionActions requiredsee
E5 06 32
E5 06 32Minimum preheating time not
observed.
If a CAN bus error had been reported
before...
● Check the CAN bus.S. [ → 163]
● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
Error codeDescriptionActions requiredsee
E1 06 40 XG 3D
E1 06 40Tolerance exceeded:
Preheating (VH) - nom.
● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E1 06 41 XG 3D
E1 06 41Tolerance exceeded: kV - nom.● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E1 06 42 XG 3D
E1 06 42Tolerance exceeded:
mA - nom.
E1 06 43 XG 3D
● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E1 06 43Tolerance exceeded:
Preheating (VH) - act.
E1 06 44 XG 3D
● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E1 06 44Tolerance exceeded: kV - act.● Check the supply line to the check
release button, replace check release
button if necessary.
● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
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Service Manual ORTHOPHOS XG 3D / Ceph5.5List of error messages
Error codeDescriptionActions requiredsee
E106 45 XG3D
E1 06 45Tolerance exceeded: mA - act.● Check the supply line to the check
release button, replace check release
button if necessary.
● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
E606 51 XG3D
Error codeDescriptionActions requiredsee
E6 06 51VHmax● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
E606 52 XG3D
Error codeDescriptionActions requiredsee
E6 06 52MAmax● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
E606 53 XG3D
Error codeDescriptionActions requiredsee
E6 06 53KVmax● Run service routine S005.2.S. [ → 274]
● Replace the tube assembly.S. [ → 406]
E6 0654
Error codeDescriptionActions requiredsee
E6 06 54Basic heating pulses not applied.● Replace the tube assembly.S. [ → 406]
bеЦдблЬ
Error codeDescriptionActions requiredsee
E6 0655
E6 06 55Anode voltage too low.● Replace the tube assembly.S. [ → 406]
Error codeDescriptionActions requiredsee
E6 0656
E6 06 56Error during auto-compensation.● Please contact the Sirona Customer
S. [ → 62]
Service Center (CSC) to find out
whether a bug fix by means of a
software update is possible and
perform such an update if necessary.
● Let the tube assembly cool down for
approx. 30 mins and repeat this
procedure.
If the error occurs repeatedly ...
S. [ → 406]
● Replace the tube assembly.
Error codeDescriptionActions requiredsee
E6 0660
E6 06 60TDI signal from board DX11 to
board DX6 is disturbed.
TDI = Signal to start synchronized
readout sequence and to prepare
● Replace cable L15.
● Replace board DX1.
● Replace the tube assembly.
S. [ → 441],
S. [ → 428],
S. [ → 406]
the next exposure
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5.5List of error messagesService Manual ORTHOPHOS XG 3D / Ceph
Error codeDescriptionActions requiredsee
E6 06 65
E6 06 65Tube current or tube voltage is too
● Replace the tube assembly.S. [ → 406]
high in standby mode.
Error codeDescriptionActions requiredsee
E6 06 66
E6 06 66Impermissible tube type.● Check tube type of tube assembly
S. [ → 406]
using extended detail query, replace
tube assembly if necessary.
Error codeDescriptionActions requiredsee
E6 06 67
E6 06 67Light guide input TDI is active during
switch-on.
TDI = Signal to start synchronized
readout sequence and to prepare
the next exposure
● Check TDI signal:
1. Switch off the unit.
2. Disconnect cable L15 at board DX11.
3. Switch unit on.
4. Perform visual check at socket J5:
● If light is visible: Replace board DX11.
● If no light is visible: Replace the tube
S. [ → 428],
S. [ → 406]
assembly.
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