Sirona Orthophos XG User Manual
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General information Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
General information
Dear customer, Thank you for purchasing your ORTHOPHOS XG
panoramic X-ray unit from Sirona.
This system enables you to take standard views (jaw
area), sinus views (maxillary sinuses) and temporomandibular joint views using digital imaging technology.
If the system is equipped with a cephalometer arm, you
can furthermore take cephalometric images using digital
imaging technology.
The technical documentation supplied is also part of
the product. Keep these documents handy at all times
(file in the X-ray logbook in Germany).
To safeguard your warranty claims, please complete the
attached “Installation Report/Warranty Passport”
together with the service engineer immediately after the
installation of your unit.
Please familiarize yourself with the unit by reading
through these Operating Instructions before taking
any X-rays of patients. Always observe the valid
radiation protection regulations and warnings.
These operating instructions presuppose that you are
familiar with the use of the SIDEXIS software. According
to the X-ray Ordinance of the Federal Republic of
Germany, owners of X-ray equipment must perform constancy tests at regular intervals in order to ensure the
safety of operating staff and patients.
Plus
Your ORTHOPHOS XG
Team
Plus
Maintenance In the interest of the safety and health of patients, users
and other persons, inspection and preventive maintenance must be performed at scheduled intervals to
ensure the operational reliability and functional safety of
your product (IEC 601-1/DIN EN 60601-1 etc.).
The system owner must ensure that all inspections and
maintenance events take place.
If the system owner fails to fulfil the obligation to have
inspections and maintenance work performed or ignores
error messages, Sirona Dental Systems GmbH and its
authorized dealers cannot assume any liability for resulting damage.
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Sirona Dental Systems GmbH Contents
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
Contents
1 Warning and safety information .............................................................................. 5
1.1 General safety information................................................................................................................ 5
1.2 ESD protective measures ................................................................................................................. 9
1.3 About the physics of electrostatic charges ....................................................................................... 9
2 Technical description ............................................................................................... 11
3 Controls and functional elements ........................................................................... 16
3.1 Operating and Display Elements ...................................................................................................... 16
3.2 General touchscreen functions ......................................................................................................... 19
4 Accessories ............................................................................................................... 28
4.1 Rests and supports for panoramic exposures .................................................................................. 28
4.2 Important when inserting the temporomandibular joint supports ...................................................... 29
4.3 Protective covers for panoramic exposures...................................................................................... 30
4.4 Protective covers for cephalometer .................................................................................................. 31
4.5 Accessories for transversal slices TSA............................................................................................. 31
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5 Program group panoramic images.......................................................................... 32
5.1 P1 Standard panoramic view, P1 A artifact-reduced,
P1 C with a constant magnification factor of 1.25............................................................................. 32
5.2 P2 normal view, limited to teeth without ascending rami,
P2 A artifact-free, P2 C with a constant magnification factor of 1.25................................................ 33
5.3 P10 normal view for children with significant dose reduction,
P10 A artifact-free, P10 C with a constant magnification factor of 1.25............................................ 34
5.4 P12 Slice thickness – anterior tooth region ...................................................................................... 35
6 Program group temporomandibular joint (TMJ) views.......................................... 36
6.1 TM1.1/TM1.2 Temporomandibular joints lateral with closed and open mouth in one image............ 36
6.2 TM2.1/TM2.2 Temporomandibular joints in posterior – anterior projection with closed and
open mouth in one image ................................................................................................................. 37
6.3 TM3 Temporomandibular joints lateral, ascending rami ................................................................... 38
6.4 TM4 Temporomandibular joints in posterior/anterior projection ....................................................... 39
6.5 TM5 Temporomandibular joints lateral, multislice ............................................................................ 40
6.6 TM6 Temporomandibular joints, multislice in posterior - anterior projection .................................... 41
7 Program group sinus views ..................................................................................... 42
7.1 S1 Paranasal sinuses ....................................................................................................................... 42
7.2 S2 Maxillary sinuses with two views in one image ........................................................................... 43
7.3 S3 Paranasal sinuses (linear slice orientation) ................................................................................. 44
7.4 S4 Maxillary sinuses with two views in one image (linear slice orientation) ..................................... 45
8 Program group multislice views .............................................................................. 46
8.1 MS1 Multislice (posterior tooth region) ............................................................................................. 46
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Contents Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
9 Operation .................................................................................................................... 47
9.1 Preparing the exposure.................................................................................................................... 47
9.2 Option: Execution of exposures from a SIDEXIS exposure template .............................................. 50
9.3 Positioning the patient...................................................................................................................... 51
9.4 Finishing the preparations (panoramic views) ................................................................................. 58
9.5 Making the basic settings in program level 3 ................................................................................... 59
9.6 Changing the startup settings in program level 4............................................................................. 59
9.7 Selecting the exposure parameters ................................................................................................. 60
9.8 Releasing the exposure ................................................................................................................... 61
9.9 Remote control................................................................................................................................. 63
10 Cephalometric exposures (CEPH)............................................................................ 64
10.1 Preparing a cephalometric exposure (CEPH function) .................................................................... 64
10.2 Preparations on the cephalometer................................................................................................... 66
10.3 Positioning a ceph patient................................................................................................................ 67
10.4 Select exposure data ....................................................................................................................... 74
10.5 Making the basic settings in program level 3 ................................................................................... 75
10.6 Changing the startup settings in program level 4............................................................................. 75
10.7 Releasing a cephalometric exposure ............................................................................................... 76
11 Transversal slices (TSA) ........................................................................................... 79
11.1 Preparing a TSA exposure............................................................................................................... 79
11.2 Patient positioning............................................................................................................................ 86
11.3 TSA universal bite block .................................................................................................................. 90
11.4 Preselecting the exposure settings and releasing the exposure...................................................... 92
11.5 Program settings, basic settings, startup settings............................................................................ 93
11.6 TSA exposure with TSA slice orientation......................................................................................... 94
11.7 Slice orientations.............................................................................................................................. 96
12 Program values .......................................................................................................... 98
12.1 Panoramic views – program values for index 2A ............................................................................. 98
12.2 Panoramic views – program values for index 4A ............................................................................. 99
12.3 Panoramic views – program values for index 1A ............................................................................. 100
12.4 Program values for cephalometric exposures.................................................................................. 101
12.5 TSA exposure values....................................................................................................................... 102
13 List of messages ........................................................................................................ 105
13.1 List of help messages ...................................................................................................................... 105
13.2 Error message structure .................................................................................................................. 106
14 Care of outer surfaces ............................................................................................... 108
15 Inspection and maintenance..................................................................................... 109
15.1 Annual check performed by the system owner or other authorized persons ................................... 109
15.2 Maintenance by the service engineer .............................................................................................. 109
15.3 Image quality check ......................................................................................................................... 109
16 Activating functions................................................................................................... 110
16.1 Via the Easypad touchscreen .......................................................................................................... 110
16.2 Via web browser on the PC ............................................................................................................. 112
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Sirona Dental Systems GmbH 1 Warning and safety information
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 1.1 General safety information
1 Warning and safety information
1.1 General safety information
Identification of warning and safety information To prevent any personal injury or material damage,
please observe the warning and safety information provided in the present operating instructions. All such information is highlighted by the signal words NOTE,
ATTENTION or WARNING.
Symbols used Observe accompanying documents
(on rating plate)
Intended use This system is intended for generating panoramic or
cephalometric X-ray images.
This system must not be used in areas subject to explosion hazards.
Maintenance and repair As manufacturers of medical electrical equipment we
can assume responsibility for the safety-related features
of the equipment only if maintenance and repair are
carried out only by ourselves or agencies expressly
authorized by us, and if components affecting safe operation of the system are replaced with original spare
parts upon failure.
We suggest that you request a certificate showing the
nature and extent of the work performed from those who
carry out such work; it must contain any changes in rated
parameters or working ranges (if applicable), as well as
the date, the name of the company and a signature.
English
Modifications to the system Modifications to this system which might affect the safety
of the system owner, patients or other persons are prohibited by law!
For reasons of product safety, this product may be
operated only with original Sirona accessories or
third-party accessories expressly approved by Sirona.
The user assumes the risk of using non-approved
accessories.
Combination with other equipment Permissible combinations are specified in the
Declaration of Conformity by the system integrator.
The Declaration of Conformity is included in the technical documentation.
Ventilation slots Under no circumstances may the ventilation slots on the
unit be covered, since otherwise the air circulation will be
obstructed.
Do not spray disinfectants or other similar products into
the ventilation slots.
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1 Warning and safety information Sirona Dental Systems GmbH
1.1 General safety information Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
X-rays of patients X-rays of patients must be taken only when the system
works without errors.
The system may only be operated by skilled or properly trained personnel.
The movements of the unit must not be obstructed by
physical constitution nor clothing, dressings, wheelchairs or hospital beds!
Do not leave the patient unattended in the unit.
Electromagnetic compatibility (EMC) Medical electrical equipment is subject to special pre-
cautionary measures regarding EMC. It must be
installed and operated as specified in the document
“Installation Requirements”.
Information on avoiding, detecting and eliminating unintended electromagnetic effects: The ORTHOPHOS
Plus
XG
(classified according to CISPR 11, EN 60601-1-2: 2001
based on IEC 60601-1-2). This system may be operated
in a residential area.
Portable and mobile RF communications equipment
may interfere with medical electrical equipment. Therefore, the use of mobile wireless phones in practice or
hospital environments must be prohibited.
DS/Ceph acquisition unit is Class B equipment
Please also observe the ESD protective measures in
Chapter 1.2.
Removing the sensor To remove the sensor, hold it firmly, press the pushbutton
fully in and hold it down. Remove the sensor from its
holder by pulling it downward.
DO NOT DROP THE SENSOR!
A shock sensor for detecting shocks or dropping is
built in.
When removing the sensor, and also with an already
removed sensor, make sure not to touch the sensor plug
on the unit end, especially not while touching the patient
at the same time.
Precautionary measures when switching on the
unit
Following extreme changes in temperature, condensation may occur; therefore, please do not switch the system on until it has reached normal room temperature
(see chapter “Technical description”).
No patient may be positioned in the unit during
power-on.
In case of an error that requires switching the unit off and
back on again, the patient must be removed from the
unit, at the latest before switching the unit on again!
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Sirona Dental Systems GmbH 1 Warning and safety information
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 1.1 General safety information
Emergency Stop If any parts of the unit happen to touch the patient during
the rotary movement (PAN exposure) or during the scan
movement (cephalometric exposure), let go of the exposure release button (X-Ray) immediately or stop the unit
by actuating the unit main switch or an Emergency Stop
switch!
Disturbance of electronic devices worn on the
patient’s body
To prevent the malfunctioning of electronic devices and
data storage devices, e.g. radio-controlled watches,
telephone cards, etc., these objects must be removed
prior to X-raying.
Radiation protection The valid radiation protection regulations must be
observed.
The operator should move as far away from the X-ray
tube assembly as allowed by the coiled cable of the
exposure release button.
The statutory radiation protection equipment must be
used.
With the exception of the patient, no other persons
without radiation protection are allowed to stay in the
room. In exceptional cases, a third person may provide
assistance, but not the practice staff. During the whole
exposure, visual contact with the patient and the unit
must be maintained.
In case of malfunctions, cancel the exposure immediately by letting go of the exposure release button.
Hygiene information The protective covers must be exchanged and the ster-
ilizable accessories must be resterilized for each new
patient to prevent any transmission of infective agents
which might cause serious illnesses.
English
Suitable hygienic measures must be taken to prevent
cross contamination among patients, users and other
persons.
Dismantling and reassembly When dismantling and reassembling the system, pro-
ceed according to the installation instructions for new
installation in order to guarantee its proper functioning
and stability.
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1 Warning and safety information Sirona Dental Systems GmbH
1.1 General safety information Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
Disposal It generally applies that any disposal of this product must
comply with the relevant national regulations. Please
observe the regulations applicable in your country.
Within the European Economic Community, Council
Directive 2002/96/EU (WEEE) requires environmentally
sound recycling/disposal of electrical and electronic
devices.
Your product is marked with the adjacent symbol.
Disposal of your product with domestic
refuse is not compatible with the objectives of environmentally sound recycling/disposal.
The black bar underneath the "garbage can" symbol
means that it was put into circulation after Aug. 13, 2005
(see EN 50419:2005).
Please note that this product is subject to Council
Directive 2002/96/EU (WEEE) and the applicable
national law of your country and must be recycled or
disposed of in an environmentally sound manner.
The X-ray tube assembly of this product contains a
tube with a potential implosion hazard, a small amount
of beryllium, a lead lining and mineral oil.
The unit contains counterbalancing weights made of
lead.
Please contact your dealer if final disposal of your product is required.
Laser light
localizer used
The system incorporates Class 1 laser products.
The light localizers are intended for correct patient positioning. They must not be used for any other purposes.
A minimum distance of 100mm between the eye and the
laser is required. Do not stare into the beam. Safe operation is described in chapter “9.3 Positioning the
patient”.
The light localizers must be switched on only when they
work properly and without errors. Repair work must be
carried out by authorized staff only.
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Sirona Dental Systems GmbH 1 Warning and safety information
ATTENTION
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 1.2 ESD protective measures
1.2 ESD protective measures
ESD stands for ElectroStatic Discharge.
Connector pins or sockets bearing ESD warning labels
must not be touched or interconnected without ESD
protective measures.
ESD protective measures include:
• Procedures for preventing electrostatic charge
build-up (e.g. air conditioning, air moistening, conductive floor coverings and non-synthetic clothing).
• Discharging the electrostatic charges of your own
body on the frame of the
wire or large metallic objects.
• Connecting yourself to ground using a wrist band.
We therefore recommend that all persons working with
this system be instructed on the significance of this
warning label. Furthermore, they also should receive
training in the physics of electrostatic discharges which
can occur in the practice and the destruction of electronic components which may result if such components
are touched by electrostatically charged USERS.
The content of this training is explained in Chapter 1.3.
UNIT, the protective ground
English
1.3 About the physics of electrostatic charges
ESD stands for ElectroStatic Discharge. Electrostatic
discharge must be preceded by electrostatic charging.
Static electric charges generally build up whenever two
bodies are rubbed against each other, e.g. when walking
(shoe soles against the floor) or driving a vehicle (tires
against the street pavement). The amount of charge
depends on several factors:
Thus the charge is higher in an environment with low air
humidity than in one with high air humidity; it is also
higher with synthetic materials than with natural materials (clothing, floor coverings).
The following rule of thumb can be applied to assess the
transient voltages resulting from an electrostatic discharge.
An electrostatic discharge is:
• perceptible at 3,000 V or higher
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1 Warning and safety information Sirona Dental Systems GmbH
1 nanosecond = 1/1.000.000,000 second =
1 billionth of a second
1.3 About the physics of electrostatic charges Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
• audible at 5,000 V or higher (cracking, crackling)
• visible at 10,000 V or higher (arc-over)
The transient currents resulting from these discharges
have a magnitude of 10 amperes. They are not hazardous for humans because they last for only several nanoseconds.
Voltage differentials exceeding 30,000 volts per centimeter may lead to a charge transfer (electrostatic discharge, lightning, arc-over).
Integrated circuits (logical circuits and microprocessors)
are used in order to implement a wide variety of functions in dental/X-ray/CEREC systems. The circuits must
be miniaturized to a very high degree in order to include
as many functions as possible on these chips. This leads
to structure thicknesses as low as a few ten thousandths
of a millimeter.
It is obvious that integrated circuits which are connected
to plugs leading outside of the unit via cables are sensitive to electrostatic discharge. Even voltages which are
imperceptible to the user can cause breakdown of the
structures, thus leading to a discharge current which
melts the chip in the affected areas. Damage to individual integrated circuits may cause malfunction or failure
of the system.
To prevent this from happening, the ESD warning label
next to the plug warns of this hazard.
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Sirona Dental Systems GmbH 2 T echnical description
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
2 Technical description
Model designation: ORTHOPHOS XG
Nominal voltage: 200 – 240 V
Permissible deviation: ± 10 %
Permissible drop under load: 10 %
Rated current: 12 A
Nominal power output: 2 kW at 90 kV/12 mA with any radiation time
Nominal frequency: 50/60 Hz
Internal line impedance: max. 0.8 Ohm
Main building fuse: 25 A slow-blow (16 A for standalone connection)
Power consumption: 2 kVA
Power output of tube assembly: 90 kV/12 mA = 1080 W with any radiation time
Tube voltage: 60 – 90 kV (for 90 kV max. 12 mA)
Tube current: 3 – 16 mA (at 16 mA max. 66 kV)
Maximum setting range: 60 kV/3 mA to 90 kV/12 mA
High-voltage waveform: High-frequency multipulse
Residual ripple ≤ 4 kV
Plus
DS/Ceph
English
Program duration: see chapter 12
Exposure time: see chapter 12
Image acquisition scale: For P1, normal dental arch (slice center) approx. 1:1.19,
i.e. the acquired image is magnified by approx. 19 % on average compared to reality
Exposure time for cephalometry: max. 14.9 s
Total filtration of X-ray tube assembly: > 2.5 Al/90 IEC 522 1976
Focal spot size acc. to IEC 336,
measured in the central X-ray beam: 0.5 mm
Marking of focal spot:
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2 Technical description Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
Automatic exposure blocking (see page 46): The duration of automatic exposure blocking (cooling period)
depends on the set kV/mA level and the actual exposure time.
Depending on the tube load, a pause duration of 8 s to 300 s is
automatically set by the system.
Example: For program P1 with 80 kV/14 mA as exposure
parameters and a radiation time of 14.1 s, the resulting pause
duration is 255 s.
Class I device
Type B equipment
Degree of protection against electric shock:
Degree of protection against ingress of water: Ordinary device
(without protection against ingress of water)
Year of manufacture: (on the rating plate)
Mode of operation: Continuous operation
Long-term power output: 100 W
Anode material: Tungsten
Exposure parameters for determining leakage
radiation: 1.1 mA/90 kV
Transport and storage temperature: -10 °C – +70 °C (14 °F – 158 °F)
Air humidity: 10 % – 95 %
Admissible operating temperature: Acc. to IEC 601-1 between +10 °C and +40 °C (50 °F – 104 °F)
Panoramic exposures:
Sensor (image receptor):
Pan sensor type: Digital CCD line sensor, pluggable for
panoramic exposure technique
Active sensor area, Pan type: 138 x 6.48 mm
Detail resolution: 0.027 mm pixel size
Focus/sensor distance: 497 mm
Cephalometric exposures:
Sensor (image receptor):
Ceph sensor type: Digital CCD line sensor, pluggable for
panoramic or ceph exposure technique
Active sensor area, Ceph type: 230 mm x 6.48 mm
Detail resolution: 0.027 mm pixel size
Focus-sensor distance: 1.714 mm
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Sirona Dental Systems GmbH 2 T echnical description
0123
Operating Instructions ORTHOPHOS XG
TSA exposure:
Sensor (image receptor):
TSA senor type: Digital CCD line sensor, pluggable for
Plus
DS/Ceph
panoramic or ceph exposure technique
Active sensor area, TSA type 60 mm x 20 mm
Detail resolution: 0.0195 mm pixel size
Focus-sensor distance: 497 mm
X-ray tube: SR 90/15 from Siemens
or
OCX 100 CEI
Minimum requirements for PC systems:
Hard disk: > 4 GB/database
> 50 MB/SIDEXIS installation
RAM: min. 256 MB
Drives: CD-ROM
MOD drive, min. 640 MB (once per system/network)
Operating system: Minimum requirement: Windows 2000 Workstation (SP 4),
Windows XP Professional Workstation (SP 2) or Vista.
Additional information is available on the Sidexis website,
www.sidexis.com, or in the Sidexis Operator's Manual.
Graphics system: Min. resolution 1024 x 768 pixels, min. color depth 8 bits
Network: 10/100 MBit Ethernet
English
Communication interface: RJ45 for LAN cable
Plus
ORTHOPHOS XG
ORTHOPHOS XG
ORTHOPHOS XG
ORTHOPHOS XG
Original language: German
Reg. No.: China SFDA (I) 20053301583
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DS/Ceph complies with IEC 601-2-28/1993
Plus
DS/Ceph complies with IEC 601-1-3/1994
Plus
DS/Ceph complies with IEC 601-2-7/1998
Plus
DS/Ceph complies with AS/NZS 3200.1.0
This product bears the CE mark in accordance with
the provisions of Council Directive 93/42/EEC of
June 14, 1993 concerning medical devices.
Cooling curve of tube housing
13
2 Technical description Sirona Dental Systems GmbH
0 60 120 180 240 300 360 420 480 540 600 660 720
10
20
30
40
50
60
70
80
90
100
110
120
130
HUx10
4
t
min
1 HU = 1.35 Joule
012 3 4 5 6
5
10
15
20
min
t
25
HUx10
3
1HU = 1,35 Joule
012 3 4 5 6
5
10
15
20
min
t
25
HUx10
3
1HU = 1,35 Joule
SR 90/15 OCX 100
78
30
012 3 4 5 6
130
h
t
HUx10
4
1 HU = 1.35 Joule
Anode angle
Central X-ray beam
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
Abkühlkurve der Röntgenröhre
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Heating curve of tube housing
Central X-ray beam/anode angle
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Sirona Dental Systems GmbH 2 T echnical description
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
These operating instructions are valid for the basic and
full versions of the system.
The following programs and functions are included in the basic version:
10 panoramic programs:
P1, P1 A, P1 C, P2, P10
P1 L, P1 R
P12
TM1.1/TM1.2
TM2.1/TM2.2
S1
S2
MS1
5 Ceph programs:
C1, C2, C3, C3 F, C4
Half-views of right/left side possible only with P1 (not upper/lower jaw).
The full version offers the following programs and functions in addition to those featured in
the basic version:
Additional pan programs:
Constant magnfication factor of 1.25 P2 C, P10 C
Artifact-free display P2 A, P10 A
Selectable right/left side image detail and individual quadrants P1A/C, P 2/A/C, P10/A/C
Image detail selectable upper jaw/lower jaw and single quadrants P1A/C, P2/A/C, P10/A/C
Selectable upper jaw/lower jaw image detail P12
Temporomandibular joint views TM3, TM4, TM5, TM6
Sinus views S3, S4
Program setting for “jaw shape” selectable.
Quickshot function possible (for Pan P1, P2, P10 and Ceph C1 to C4).
Execution of exposure templates from SIDEXIS possible without cooling periods, e.g.: orthodontic image series
P1 - C3 - C4.
Welcome screen with patient data from SIDEXIS.
Ceph – no shadowing in the upper cranial region preselectable for programs C3 and C3 F.
Ceph – shadowing in the thyroid area for programs C1 and C2 can be preselected.
English
Option for basic version and full version:
TSA function (transversal slices)
It is possible to upgrade a basic version system to a full version system and/or to include the TSA function.
A certificate with a corresponding activation key number must be purchased for this purpose (see chapter 16).
If the unit is ordered with TSA ex works, TSA will be activated at the factory.
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3 Controls and functional elements Sirona Dental Systems GmbH
T
R
CEPH
PAN
TS
ORTHOPHOSist aufnahmebereitORTHOPHOSist aufnahmebereit
1260
64
64kV
8mA8mA
?
P1
14,2s14,2s
AEC
TS
1
23
5
6
7
89
10
13
141615
12
4
17
11
3.1 Operating and Display Elements Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
3 Controls and functional elements
3.1 Operating and Display Elements
on the Panoramic unit
1. Main switch
2. Light localizer with height adjustment of FH light line
3. Light localizer central light beam for face center
4. Control mirror for patient positioning
5. Tray for jewelry, etc.
6. Forehead support
7. Temple supports
8. Pushbutton for sensor (image receptor) removal
9. Sensor (image receptor), depending on unit version:
for XG Pan
for XG Ceph
for XG Pan/TSA
for XG Ceph/TSA
10. Exposure release button (must be pressed and held
down during the entire exposure)
11. Touch bar for swiveling the control mirror in and out
12. Easypad (swivelable control panel)
13. Drawer for accessories
14. Handles for patient
15. Holder for chin rest, bite blocks or
contact segments etc.
16. Bite block, contact segment or chin rest
17. Primary diaphragm field on the X-ray tube assembly
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Sirona Dental Systems GmbH 3 Controls and functional elements
ATTENTION
60
90
120
70
80
100
110
2
0
3
0
4
0
5
0
60 90 120
70 80 100 110
20
30
40
50
9
23
19
20 21
22
23
8
8
25
25
24
24
20
26
18
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 3.1 Operating and Display Elements
Controls and scales on the cephalometer
8. Pushbutton for sensor removal
9. Sensor (image receptor)
18. Nose support
19. Locking knob for nose support
20. Scale for horizontal nose support adjustment
English
21. Rotating element for rotary movement of head
supports
22. Secondary diaphragm with FH line light localizer
23. Scale for vertical nose support adjustment
24. Projection scale
25. Ear plugs with holders
26. Carpus support plate
Magnification of the lateral view
With this exposure technique, a metal scale (24) integrated in the nose support is displayed on the X-ray
exposure.
Using this scale, the magnification factor in the median
plane can be determined precisely via a measurement.
Never support yourself on the cephalometer or the
ceph arm, hang objects from them or place objects
on them. Otherwise their adjustment may be altered,
thus resulting in incorrect images.
59 87 594 D 3352
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17
3 Controls and functional elements Sirona Dental Systems GmbH
ATTENTION
T
R
CEPH
PA N
TS
Filmkassette einlegen
1260
64
68kV
8mA
?
P6.1
12,1s
14 s
PAN
1260
10
64kV
8mA
?
P1
14,1 s14,1 s
CEPH
TS
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
27 28
29
31
32
33
30
34
35
36
37
38
P1, P2, P10, P12
TM1.1, TM3, TM5
TM2.1, TM4, TM6
S1
MS1
TM1.2
TM2.2
S2
A
C
B
D
3.1 Operating and Display Elements Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
Controls and displays on the Easypad with
touchscreen
27. “Move forehead support away from forehead” key
28. Light localizers ON/OFF
29. “Move forehead support to forehead” key
30. “Unit up” arrow key
31. “Unit down” arrow key
32. Optical radiation indicator
33. “Unit ON” LED
34. “Open temple supports” key
35. “T” key for test cycle without radiation
36. “R” key for return of the unit
37. “Close temple supports” key
38. Touchscreen – touch-sensitive screen
Never touch the touchscreen with sharp or pointed
objects (ball-point pens, pencils, etc.)!
Display aids for patient head positioning
The icon for the patient's head that is displayed in the
upper right corner for panoramic and TSA images will
guide you in positioning the patient's head.
A The gray patient's head icon shows the head pos-
ture: straight (FH), bent forward with open or closed
mouth, or reclined.
B A colored symbol (yellow or blue) will indicate if a
bite block or a contact segment should be used.
C The red line indicates the reflecting light localizer
line (FH), the white line is only an auxiliary line to
indicate the head inclination.
D For temporomandibular joint and sinus views, the
temporomandibular joint support is also displayed in
blue.
If a small circle with a dot in its center appears at the
end of the support, ear holders must be inserted;
only contact pads are required if this symbol is not
displayed.
59 87 594 D 3352
18 D 3352.201.01.14.02
Sirona Dental Systems GmbH 3 Controls and functional elements
SID = 19,6”
6
x 12”
SID = 19,6”
6 x 12”
CEPH
PAN
1260
10
64kV
8mA
?
P1
9,0 s9,0 s
Quick
TS
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
1
2
3
5
6
3
7
8
9
10
12
13
15
17
19
11
4
16
18
14
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 3.2 General touchscreen functions
3.2 General touchscreen functions
Touchscreen = touch-sensitive screen, i.e. touching the
screen surface triggers different functions.
Color codes:
orange – selected
white – presettings
light blue – selectable
grey and white – auxiliary symbols
Touchscreen symbols
1. Display of height setting value
2. Display of forehead support setting value
3. Program selection keys –/+
Sequence: P 1, P 2, P 10, P 12, TM 1, TM 2, TM3,
TM 4, TM 5, TM 6, S 1, S2, S3, S4, MS 1
4. Orange – display of the exposure area for the selected program (dental arch or dental arch segment)
English
5. Display of program group selection
6. Program display; touch to loop through P1 (normal
panoramic view), P1C (with constant magnification),
P1A (artifact-free display)...
7. Display of head posture (FH or bent forward or backward, mouth open or closed) with reference line for
the chosen program
8. Submenu column (options)
9. Blue arrows: Select submenu, close menu
10. Preselection of exposure parameters (patient sym-
bols)
11. Red symbol for light localizer ON (is displayed as
long as the laser light of the light localizer is
switched on)
12. Program-specific menu area
13. Comment line for help and error messages
14. Expected radiation time (upon completion actual ra-
diation time)
15. Light gray symbol for dental arch
16. Light gray symbol for temporomandibular joints
17. Display of color-coded bite block or contact segment
for the chosen program
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18. Quickshot display – ON (visible)/OFF (hidden) for reduction of cycle time
19. When you touch the
screen is displayed
? symbol, the help or info
19
CEPH
PANPAN
TS
LS
1260
10
64kV
8mA
?
P1
8,5 s8,5 s
CEPH
PANPAN
TS
LS
1260
10
64kV
8mA
?
P1
14,1 s14,1 s
R
L
R
L
CEPH
PANPAN
TS
LS
1260
10
64kV
8mA
?
P1
8,5 s8,5 s
R
L
10
P1
14,1 s14,1 s
PANPAN
LS
CEPH
R
L
64kV
8mA
?
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
8
8
8
8
3 Controls and functional elements Sirona Dental Systems GmbH
3.2 General touchscreen functions Operating Instructions ORTHOPHOS XG
Program settings
When you touch a symbol in the “submenu” in
column (8), a submenu line for program settings opens.
There are 4 submenu lines for program settings
available:
1. Selection of half-views and individual quadrants
In this submenu, you can select a half-view of the jaw,
i.e. right or left side (P1, P2, P10) or upper or lower jaw
(P1, P2, P10, P12) for programs P1, P2 and P10 including constant magnification and artifact-free display.
The preselected type of exposure is also displayed in the
submenu column (8).
Plus
DS/Ceph
Selection of individual quadrants
The full version of XG Plus offers the option of selecting
individual quadrants.
For each selection, please make sure that you know
where to touch the icon (see finger).
You can reactivate the full screen mode by touching the
center of the quadrant field.
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Sirona Dental Systems GmbH 3 Controls and functional elements
R
L
R
L
R
L
R
L
Halbseite rechts Halbseite links
R
L
R
L
R
L
R
Einzelquadrant rechts Einzelquadrant links
L
L
Right individual quadrant
Left individual quadrant
Right half-view Left half-view
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 3.2 General touchscreen functions
Half-view and individual quadrant exposures
The adjacent illustrations show the X-ray image displays
and indicate how the half-views and the individual quadrants are associated with the patient.
Individual quadrant exposures are possible only in
the XG Plus full version.
The program duration for individual quadrant exposures
equals the program duration for half-view exposures.
English
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21
3 Controls and functional elements Sirona Dental Systems GmbH
NOTE
i
CEPH
PANPAN
1260
10
64kV
8mA
?
P1
SID = 19,6”
6
x 12”
SID = 19,6”
6 x 12”
TS
64
64
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
CEPH
PANPAN
1260
64kV
8mA
?
P1
AEC
TS
14,1s
10
62kV
8mA
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
CEPH
PANPAN
1260
64kV
8mA
?
P1
TS
10
SID = 19,6”
6
x 12”
SID = 19,6”
6 x 12”
64
64
14,1s
10
ORTHOPHOS is ready for exposureORTHOPHOS is ready for exposure
8
8
8
9
10
SID = 19,6”
6
x 12”
SID = 19,6”
6 x 12”
64
64
3.2 General touchscreen functions Operating Instructions ORTHOPHOS XG
2. Presetting for malocclusions
Here you can preselect one level of retrusion as well as
one or two levels of protrusion for programs P1, P2 and
P10 including constant magnification and artifact-free
display.
For preselection touch the corresponding tooth symbol
in the submenu line.
Plus
DS/Ceph
3. Presetting for jaw shape
In this submenu you can preselect a normal jaw shape,
a V-shaped jaw and a square jaw for programs P1, P2
and P10 including constant magnification and artifact-free display.
For preselection touch the corresponding tooth symbol
in the submenu line.
4. Manual setting of kV/mA values
If the default kV/mA combinations do not provide satisfactory results, you can preselect intermediate kV/mA
values in this submenu (for all programs) using the
–/+ keys in the submenu line.
As long as the respective menu line is open, the background is displayed as inactive.
You can close a menu line:
– by touching the blue arrows in the menu line.
– by touching the corresponding symbol in the light
blue area at the right margin.
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Sirona Dental Systems GmbH 3 Controls and functional elements
NOTE
i
8mA
?
8mA
?
71kV
12mA
71kV
12mA
TSTS
R
L
2
8mA
?
8mA
?
60kV
9mA
60kV
9mA
CEPHCEPH
QuickONQuick
OFF
9,4s
8mA
?
8mA
?
60kV
3mA
60kV
3mA
PANPAN
Programmeinstellungen wählenProgrammeinstellungen wählen
R
L
Select program settingsSelect program settings
9
9
20
20
9
20
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 3.2 General touchscreen functions
Entire menu settings
Level 2
You may also display all of the program settings and
make the settings described above in a second program
level.
To access the second program level, touch the blue
arrow (9) in the upper right corner of the touchscreen;
the arrow will point upward then.
After having made your selections, you can return to program level 1 only by touching the blue arrow (9) once
again.
When you confirm the exposure with the R key, the
program settings changed in these submenu lines will
automatically be reset to the default settings (except
for Ceph Quickshot).
English
59 87 594 D 3352
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23
3 Controls and functional elements Sirona Dental Systems GmbH
ATTENTION
71kV
12mA
?
71kV
12mA
TSTS
CEPH
LR
73kV
15mA
?
C3
C3
73kV
15mA
CEPHCEPH
Select basic settingsSelect basic settings
64kV
8mA
?
PANPAN
P1
P1
Quick
64kV
8mA
Quick
On
Quick
Off
Select basic settingsSelect basic settings
9
9
9
21
22
3.2 General touchscreen functions Operating Instructions ORTHOPHOS XG
Basic Settings menu
Level 3
In a third program level, you can freely choose and then
save certain exposure parameters for the individual programs.
To access the third program level, touch the arrow pointing downward (20) in the second program level.
The right arrow will then become a double arrow.
This menu can be closed again simply by touching the
blue double arrow (9) in the upper right corner.
The display always returns to the standard menu
(level 1).
Plus
DS/Ceph
If you want to change the kV/mA values in the TSA basic
settings, make sure to first preselect the corresponding
quadrant and jaw region.
The kV/mA change always applies only to this preselection.
24 D 3352.201.01.14.02
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Sirona Dental Systems GmbH 3 Controls and functional elements
NOTE
i
TSTS
Select Start Settings
CEPHCEPH
Select Start SettingsSelect Start Settings
PANPAN
Select Start Settings
9
9
9
8
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 3.2 General touchscreen functions
Start settings menu
Level 4
Various factory preset start parameters can be reprogrammed in level 4.
They are then displayed after each unit power-on and for
each new exposure.
You can reach the 4th level by touching the disk icon (21)
in the basic settings menu (level 3).
For PAN exposures you can change the abnormality
preference (2nd icon from the right, as per factory setting) and the patient icon preference (2nd icon from the
left, as per factory setting).
For CEPH exposures you can only change the patient
icon preference (2nd icon from the left, as per factory
setting).
English
For TS exposures you can change the slice thickness
preference (left icon for the thinnest slice, as per factory
setting) and the patient icon preference (2nd icon from
the left, as per factory setting).
To perform a particular change, touch the desired icon;
the icon then turns orange and is also displayed in
column 8.
Then save the new presetting by touching the programming key symbols.
This menu can be closed again simply by touching the
blue double arrow (9) in the upper right corner.
The display always returns to the standard menu
(level 1).
The icons framed with a broken line represent the factory
settings.
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25
3 Controls and functional elements Sirona Dental Systems GmbH
NOTE
i
T
R
9
64kV
8mA
?
19
9
8
3.2 General touchscreen functions Operating Instructions ORTHOPHOS XG
Service menu
The service menu is intended exclusively for service
engineers.
The service engineer accesses the service menu by
touching the wrench symbol (22) in the third program
level.
Plus
DS/Ceph
Touchscreen settings
When you touch the question mark (19) in the lower right
corner of the touchscreen, the help screen is displayed
starting at the first level.
You can open two fly-out menus here by touching the
corresponding symbols in column (8).
In the upper fly-out menu you can switch off the clicking
tone of the touchscreen by activating the crossed-out
musical note symbol.
In the lower fly-out menu, you can adjust the intensity of
the touchscreen display with the –/+ keys. During this
adjustment a reference value appears above the symbol
in column (8).
Switch the unit on for at least 10 minutes before adjusting
the touchscreen intensity to ensure that the touchscreen
has reached its full brightness.
An hour glass is displayed during the run-up time.
As long as the hour glass is running, it is not possible to
enter a change of intensity.
To close a fly-out menu, touch the blue arrow at the left
end of the corresponding line or the relevant symbol in
column (8).
To return to the previous level, touch the blue arrow (9)
at the top of column (8).
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Sirona Dental Systems GmbH 3 Controls and functional elements
8mA
?
8mA
?
60kV
3mA
60kV
3mA
PANPAN
Programmeinstellungen wählenProgrammeinstellungen wählen
R
L
Select program settingsSelect program settings
1/2
Serialnumber
Systemsoftware
Bootmode
Type
Network Name
MAC address
IP address
Subnet mask
: 000000012
: V.02.21.01
: Static
:43
: Geraet1
: 00101900242d
: 192. 168. 15. 125
: 255.255.255.0
ORTHOPHOS XG configuration
=======================
70
19
8
9
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 3.2 General touchscreen functions
Info screen
Starting at level 2, the info screen is displayed when you
touch the question mark (19) in the lower right corner of
the touchscreen “ORTHOPHOS XG configuration”.
System data which may be useful when contacting your
service engineer are displayed here.
If this list is too long to be displayed all at once, a scroll
bar for paging up or down appears on the right.
You can activate the “touchscreen click tone” and
“touchscreen intensity setting” fly-out menus from the
help screen in column (8) here as well.
To return to the previous level, touch the blue arrow (9)
at the top of column (8).
English
59 87 594 D 3352
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27
T
R
C
E
P
H
CEPH
PA
N
PAN
T
S
TS
L
S
LS
Film
kassette einrasten
Filmkassette einrasten
1260
64
62kV
8
m
A
8mA
?
P6.1
12,1s
CEPH
PANPAN
TS
ORTHOPHOS
ist
aufnahmebereitO
R
T
H
O
P
H
O
S
is
t
a
u
fn
a
h
m
e
b
e
re
it
1
2
6
0
6
4
64kV
8mA
?
P1
14,2
s14,2
s
A
E
C
1
2
TS
F*
J*
H*
G
M*
C
K*
E*
A
B*
N*
P*
D
L*
E1*
4 Accessories Sirona Dental Systems GmbH
4.1 Rests and supports for panoramic exposures Operating Instructions ORTHOPHOS XG
Plus
4 Accessories
4.1 Rests and supports for panoramic exposures
The accessories and the hygienic protective covers can
be stored in the drawer between the two handles.
The forehead support and the temple supports (A) can
be removed for cleaning after pressing the corresponding locking button.
Sterilization only in an autoclave at 135 °C, 2.1 bar.
All accessories marked with * can be sterilized.
For reorders:
A Forehead support and temple supports
(can be removed for cleaning after pressing the
corresponding locking button)
(1 pieces) Order No. 59 80 383
B* Contact pads for forehead/temple supports
(1 pieces) Order No. 59 80 391
C Temporomandibular joint support “1” (right) for tem-
poromandibular joint views Order No. 59 80 607
D Temporomandibular joint support “2” (left) for tem-
poromandibular joint views Order No. 59 80 599
E* Ear holders for temporomandibular joint supports
(10 pieces) Order No. 18 88 838
1* Contact pads for temporomandibular joint supports
E
(10 pieces) Order No. 59 90 648
F* Bite block
(10 pieces) Order No. 18 88 887
G Bite block fixation
(5 pieces) Order No. 18 88 895
H* Bar for chin rest
Order No. 59 61 461
J* Chin pad
Order No. 14 49 227
K* Chin rest complete,
incl. 5xF, 1xG, H, J, S, T
Order No. 59 81 472
L* Contact segment blue
for subnasale
for sinus/PNS and maxillary TSA views
(5 pieces) Order No. 89 31 552
M* Bite block blue
for sinus and maxillary TSA views
(5 pieces) Order No. 89 21 850
N* Contact segment standard yellow
for subnasale
(5 pieces) Order No. 89 31 545
P* Bite block standard yellow
(5 pieces) Order No. 89 21 843
DS/Ceph
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Sirona Dental Systems GmbH 4 Accessories
2
1
“2“
“1“
2
1
2
1
L
R
“1“
“2“
“R“
“L“
Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph 4.2 Important when inserting the temporomandibular joint supports
4.2 Important when inserting the temporomandibular joint supports
In ORTHOPHOS XG units delivered during/after 2006
the holders of the temple supports are tilted slightly
toward the rear.
The temporomandibular joint supports are marked
“1“ (for right) and “2“ (for left).
Insert the temporomandibular joint supports here as
shown in the adjacent drawing.
All of the following drawings and descriptions contained
in these operating instructions show this arrangement.
In ORTHOPHOS XG units delivered before
October 2006, the holders of the temple supports point
straight down.
The temporomandibular joint supports marked “1“ and
“2“ must be inserted here so that the support marked “2“
is positioned on the right and the one marked “1“ is
positioned on the left.
English
59 87 594 D 3352
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For software updates of units delivered before
October 2006, the existing temporomandibular joint supports will be inserted in the familiar manner, i.e. marked
“R“ for right and “L“ for left as shown.
For spare parts deliveries, your new temporomandibular
joint supports will be marked “1“ for left and “2“ for right.
29
4 Accessories Sirona Dental Systems GmbH
1
E*
S
R
T
U
V
E1*
4.3 Protective covers for panoramic exposures Operating Instructions ORTHOPHOS XG
Plus
DS/Ceph
4.3 Protective covers for panoramic exposures
Prior to each exposure, the protective covers (disposable) must be fitted.
For the sake of clarity, the protective covers have been
omitted on the subsequent illustrations.
For reorders of protective covers:
R For forehead support and temple supports
(500 pieces) Order No. 59 68 263
Dimensions: 150 mm x 47 mm
S For bite block
(500 pieces) Order No. 33 14 072
Dimensions: 43 mm x 21 mm
T For chin rest and bar
(100 pieces) Order No. 59 32 603
Dimensions: 75 mm x 60 mm
U For bite blocks and contact segments
(500 pieces) Order No. 33 14 080
Dimensions: 80 mm x 40 mm
V Protective foil for handles
Order No. 59 68 255
E* Sterilizable ear holders for temporomandibular joint
supports for temporomandibular joint views
(10 pieces) Order No. 18 88 838
1* Sterilizable contact pads for temporomandibular
E
joint supports for sinus views
(10 pieces) Order No. 59 90 648
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30 D 3352.201.01.14.02
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