Samsung D820 Service Manual

GSM TELEPHONE

SGH-D820

	JVP WHOHSKRQH				FRQWHQWV
			1.		Specification
			2.		Circuit Description
			3.		Exploded Views and Parts List
			4.		Electrical Parts List
			5.		Block Diagrams
			6.		PCB Diagrams
			7.		Flow Chart of Troubleshooting

This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

Samsung Electronics Co.,Ltd. March. 2006 Printed in Korea.

Code No.: GH68-09648A BASIC.

1. Specification

1-1. GSM General Specification

		GSM850	GSM900	EGSM 900	DCS1800	PCS1900
			Phase 1	Phase 2	Phase 1
	Freq.	824~849	890~915	880~915	1710~1785	1850~1910
	Band[MHz]
		869~864	935~960	925~960	1805~1880	1930~1990
	Uplink/Downlink
	ARFCN range	128~251	1~124	0~124 &	512~885	512~810
				975~1023
	Tx/Rx spacing	45MHz	45MHz	45MHz	95MHz	80MHz
	Mod. Bit rate	270.833kbps	270.833kbps	270.833kbps	270.833kbps	270.833kbps
	/ Bit Period	3.692us	3.692us	3.692us	3.692us	3.692us
	Time Slot	576.9us	576.9us	576.9us	576.9us	576.9us
	Period
		4.615ms	4.615ms	4.615ms	4.615ms	4.615ms
	/ Frame Period
	Modulation	0.3GMSK	0.3GMSK	0.3GMSK	0.3GMSK	0.3GMSK
	MS Power	33dBm~5dBm	33dBm~5dBm	33dBm~5dBm	30dBm~0dBm	30dBm~0dBm
	Power Class	5pcl ~ 19pcl	5pcl ~ 19pcl	5pcl ~ 19pcl	0pcl ~ 15pcl	0pcl ~ 15pcl
	Sensitivity	-102dBm	-102dBm	-102dBm	-100dBm	-100dBm
	TDMA Mux	8	8	8	8	8
	Cell Radius	35Km	35Km	35Km	2Km	2Km

1-1

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Specification

1-2. GSM TX power class

	TX Power			TX Power			TX Power			TX Power
	control	GSM850		control	GSM900		control	DCS1800		control	PCS1900
	level			level			level			level
	5	33±3 dBm		5	33±3 dBm		0	30±3 dBm		0	30±3 dBm
	6	31±3 dBm		6	31±3 dBm		1	28±3 dBm		1	28±3 dBm
	7	29±3 dBm		7	29±3 dBm		2	26±3 dBm		2	26±3 dBm
	8	27±3 dBm		8	27±3 dBm		3	24±3 dBm		3	24±3 dBm
	9	25±3 dBm		9	25±3 dBm		4	22±3 dBm		4	22±3 dBm
	10	23±3 dBm		10	23±3 dBm		5	20±3 dBm		5	20±3 dBm
	11	21±3 dBm		11	21±3 dBm		6	18±3 dBm		6	18±3 dBm
	12	19±3 dBm		12	19±3 dBm		7	16±3 dBm		7	16±3 dBm
	13	17±3 dBm		13	17±3 dBm		8	14±3 dBm		8	14±3 dBm
	14	15±3 dBm		14	15±3 dBm
							9	12±4 dBm		9	12±4 dBm
	15	13±3 dBm		15	13±3 dBm		10	10±4 dBm		10	10±4 dBm
	16	11±5 dBm		16	11±5 dBm		11	8±4dBm		11	8±4dBm
	17	9±5 dBm		17	9±5 dBm		12	6±4 dBm		12	6±4 dBm
	18	7±5 dBm		18	7±5 dBm		13	4±4 dBm		13	4±4 dBm
	19	5±5 dBm		19	5±5 dBm		14	2±5 dBm		14	2±5 dBm
							15	0±5 dBm		15	0±5 dBm
						1	-2

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2. Circuit Description

2-1. SGH-D820 RF Circuit Description

2-1-1. RX PART

- FRONT END MODULE(ANTENNA SWITCH MODULE + RX SAW FILTER) (F101)

It performs to switch Tx & Rx paths for GSM850, GSM900, DCS1800 and PCS1900 with logic controls below.

- FEM Control Logic Table

	FESW1	FESW2	FESW2
Tx Mode (GSM850/900)	H	L	L
Tx Mode (DCS1800/1900)	L	H	L
Rx Mode (GSM900/850)	L	L	L
Rx Mode (DCS1800)	L	L	L
Rx Mode (PCS1900)	L	L	H

- VC-TCXO (TCX100)

This	module generates the 26MHz reference clock to drive the logic and RF systems.
It is	turned on when the supply voltage (+VCC_SYN) is applied.
After buffering, the 26MHz reference clock is supplied to the other parts of the system through the transceiver pin
CLKOUT.

- Transceiver (U102)

This chip is fully integrated GSM & GPRS quad-band transceiver with RF VCO, loop filters and most of the passive components required in it.

It also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply regulator. Semi integrated reference oscillator with integrated supply regulator.

RF Receiver front-end amplifies the E-GSM900(GSM850), DCS1800 and PCS1900 aerial signal, convert the chosen

channel down to a low IF of 100kHz.
In IF	section, further amplifies the wanted channel, performs gain control to tune the output level to the desired value and
rejects	DC.

2-1-2. TX PART

The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band

power	up mixer. Gain is controlled by	6 dB via 3-wire serial bus programing. The fully integrated VCO and power
mixer	achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.
Output	matching/balun components drive	a standard 50 ohms single ended load.

2-1

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Circuit Description

2-2. Baseband Circuit description of SGH-D820

2-2-1. PCF50603 (U400)

-Power Management

Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs, while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system complexity.

I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor full control of the PCF50603 and enables system designers to maximize both standby and talk times.

Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

-Pulse-Width Modulator

The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) to modulate the intensity of a series of LED's or to control a DC/DC converter that drives LCD backlight.

This phone is using PWM control to modulate the LCD backlight brightness.

-Clock Generator

The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator provides an accurate low clock frequency for the PCF50603 and other circuitry.

2-2-2. LCD

D820 has just one 2.12" TFT LCD. 16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. There are couple of control signals such as RS, LCD_MAIN_CS, L_WRB, etc. RS stands for "Register Select pin." When RS = 0, data can be written to the index register or status can be read, and when RS = 1, an instruction can be issued or data can be written to or read from RAM. Read or write operation is selected according to L_WRB signals. The data is received when the R/W bit is 0, and is transmitted when the R/W bit is 1. At the falling edge of LCD_MAIN_CS input, serial data transfer is initiated. On the other hand, at the rising edge of LCD_MAIN_CS input, the data transfer is ceased.

2-2-3. Key

Key recognition part is consisted of 8 ports from PCF5213EL1. KEY_ROW(0:4) & KEY_COL(0:4)

These signals performs with the matrix. Any input from the matrix informs the key status to key interface in the PCF5213EL1. Power on/off key is independent of the matrix. Therefore, 'power on/off' signal is directly connected with PCF50603 to turn PCF50603 on.

Two 3.3V LDOs(U716, U823) enable Main and Sub Key LED on. Main and Sub Key LED are controlled by KEYLED_ON and SLIDER_KEY_ON signal respectively.

2-2

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Circuit Description

2-2-4. EMI ESD Filter (F500)

This system uses the EMI ESD filter (F500) to protect the device from noises from IF CONNECTOR part.

2-2-5. IF connetor (IFC500)

It has 20-pin. They are designed to allocate not only 'power and data lines'(VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1, AUX_ON, EXT1, EXT2 and GND) but also Earphone lines(EAMMIC_P/N, EARSPK_R/L, EAR_SWITCH, EARSPK_COM and EAR_ADC). They connected to power supply IC, microprocessor, signal processor IC and Earphone.

2-2-6. Battery Charge Management

D820 has a complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries inside.

If Travel Adapter is connected, "V_EXT_CHARGE" begins to provide the charger IC (to battery) with power (current). When the charging operation is done, "END_OF_CHG" informs it to PCF5213EL1 to stop the operation. "CHG_ON" signal enables the charger IC to operate in adequate circumstances.

2-2-7. Audio - Part

D820 has several audio-outputs such as stereo speaker, receiver, earphone, etc. HFR P/N signals from CPU are connected to the receiver. MIC_CP/N are connected to the main MIC and MIC_CP2/N2 as well.

SAPA1D2 is a Class-D amplifier for outputting sounds that are used by mobile phones including MP3 playback, melodies, voice output on speaker phone mode and so on..

STG3699(U515) is an analog switch to connect SAPA1D2 input port to main DSP or CODEC Chip.

2-2-8. Memory (UME307)

D820 has KBH10PD00M-D414 as a memory module.

The KBH10PD00M-D414 is a Multi Chip Package Memory which combines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and 1Gbit OneNAND Flash and 256Mbit Synchronous Burst UtRAM.

It has 16 bit data line, HD[0~15] which is connected to PCF5213 and CL8522S5(Multi-media chip), also has 24 bit address lines, HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS1n_RAM, and CS4n_NAND.

In the writing process, WEn is fallen to low and it enables writing process to operate. During reading process, OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose different types of memory.

2-2-9. PCF5213EL1 (UCP200)

The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn DSP core with embedded RAM and ROM, and a set of peripherals. It has 24k×16 bits PRAM, 104k×16 bits, 32k×16 XYRAM and 63k×16 XYROM in the DSP.

The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache, tightly-coupled ITCM (Instruction Tightly Coupled Memory) and DTCM (Data Tightly Coupled Memory) memories, a memory protection unit, and an AMBA (Advanced Microcontroller Bus Architecture) AHB (Advanced High-performance Bus) bus interface with a write buffer. HD(0:15), data lines and HA(0:23), address lines are connected to KBH10PD00M-D414(memory) and CL8522S5(Multi-media chip)

. It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap loader in the ARM core.

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Circuit Description

HD(0:15), data lines and HA(0:23), address lines are connected to memory and CL8522S5 to communicate.

ARM core and DSP core. OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status. It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM and DSP core. ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

2-2-10. TCO-5871U (TCX100, 26MHz)

This system has the 26MHz TCXO, TCO-5871U from Toyocom. AFC controlling signal form PCF5213EL1 controls frequency from 26MHz X-tal. It generates the clock frequency. This clock is connected to PCF5213EL1 and UAA3587.

2-2-11. CL8522S5 (U303)

CL8522S5	provides rich video functions up to 30-frame display with minimized tasks in the handset main processor
as well as	hardware based real-time JPEG compression and decompression. CL8522S5 directly transmits and previews

the RGB data to the LCD graphic memory by processing the sensor output data according to the handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the host processor to download

with scalable	sized compressed	data. It also provides I2S data bus to playback MP3 formatted	data.
It utilizes 16	bit data bus for	communication with the main processor, including bus interface	types.

2-4

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3. Exploded View and its Parts list

3-1. Exploded View

QFL01

QMW02
		QVO02	QAN06
		QVO09	QAN02
		QCR06	QSP01
QFU01			QCR09
			QSP02
			QMO01
QHI01			QKP01
QKP02
QLC01			QVK06
QMI01			QSH01
QME01
QCH04		QMP01
QCH10	QCA01	QVK01
			QCR06
QCW01
			QCH05
QSC11			QRE01
QSC12		QIF01
QCR12		QCR26	QRF01
QCR17
QPC01			QBA01

QBA00

3-1

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Exploded view and its Part list

3-2. Parts List

Location NO.		Description	SEC CODE
QAN06		MEC-TAPE ANTENNA RUBBER	GH75-08483A
QAR01		AUDIO-RECEIVER	3009-001178
QBA00		MEC-BATTERY COVER	GH75-08553A
QBA01		INNER BATTERY PACK-800MAH,BLAC	GH43-02098A
QCA01		UNIT-CAMERA	GH59-02787B
QCH04		MEC-CAMERA UPPER	GH75-08984A
QCH10		MEC-CAMERA LOWER	GH75-08107A
QCR06		SCREW-MACHINE	6001-001155
QCR09		SCREW-MACHINE	6001-001670
QCR12		SCREW-MACHINE	6001-001530
QCR17		SCREW-MACHINE	6001-001460
QCR26		SCREW-MACHINE	6001-001850
QCW01		PCT-CAMERA WINDOW	GH72-25223A
QFL01		MEC-FRONT SLIDER LOWER	GH75-08922A
QFU01		MEC-SLIDER UPPER	GH75-09284A
QHI01		MEC-HINGE(CAMERA)	GH75-06936A
QKP01		MEC-KEYPAD MAIN(EU/IKA)	GH75-08928A
QKP02		MEC-KEYPAD SUB	GH75-08927A
QLC01		ELA ETC-SGHD820 SUB LCD ASSY	GH96-02105A
QME01		UNIT-METAL DOME(SUB)	GH59-02384A
QMI01		MICROPHONE-ASSY	GH30-00220A
QMP01		PBA MAIN-SGHD820	GH92-02534A
QMW02		PCT-MAIN WINDOW	GH72-25222A
QPC01		MEA-SLIDER FPCB KIT	GH97-05501A
QRF01		PMO-RF COVER	GH72-25131A
QSC11		PMO-S/LOWER SCREW CAP R	GH72-26494A
QSC12		PMO-S/LOWER SCREW CAP L	GH72-26493A
QSH01		MEC-SHIELD CAN	GH75-09439A
QVK01		UNIT-VOLUME KEY	GH59-02935A
QVK06		UNIT-KEYPAD FPCB(MAIN)	GH59-02379A
QVO02		PMO-KEY VOLUME	GH72-24204A
QVO09		NDC-VOLUME KEY COVER	GH71-05436A
QSP01		UNIT-SPK MOT INTENNA MODULE	GH59-02915A
	QAN02	INTENNA-SGHD820	GH42-00767A
	QSP02	UNIT-MODULE SPEAKER	GH59-02851A
	QMO01	MOTOR DC-SGHT809	GH31-00196A
QRE01		MEC-REAR COVER	GH75-08929A
	QCH05	PMO-T FLASH COVER V3	GH72-26991A
	QIF01	PMO-IF COVER V4	GH72-26995A

3-2

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Exploded view and its Part list

Description	SEC CODE
BAG PE	6902-000297
BAG PE	6902-000378
CBF INTERFACE-AV CABLE	GH39-00442A
CBF INTERFACE-DATA LINK CABLE	GH39-00444A
ADAPTOR-SGHD800 TA(EU)	GH44-01060A
S/W CD-SAMSUNG PC STUDIO	GH46-00191A
UNIT-EARPHONE	GH59-02499A
LABEL(P)-IMEI	GH68-01335D
LABEL(P)-WATER SOAK	GH68-02026A
MANUAL-USER	GH68-08207A
LABEL(R)-SGHD820(EU)	GH68-08973A
BOX(P)-UNIT MAIN	GH69-03456A
BOX(P)-SLIP CASE(EU)	GH69-03553A
MPR-BOHO VINYL LCD CONN	GH74-15350A
MPR-TAPE MAIN WINDOW	GH74-17833A
MPR-TAPE SUB INSULATION	GH74-17843A
MPR-TAPE SUB INSULATION	GH74-17843A
MPR-TAPE MAIN CONNECTOR	GH74-17844A
MPR-TAPE RF COVER	GH74-17845A
MPR-TAPE EL FIXED	GH74-18873A
MPR-TAPE HOT BAR FIXED	GH74-18878A
MPR-BOHO VINYL INPUT BEF	GH74-18886A
MPR-BOHO VINYL INPUT AFT	GH74-18887A
MPR-TAPE VOLKEY SOLDER	GH74-18904A
MPR-BOHO VINYL KEYPAD	GH74-19130A
MPR-BOHO VINYL M/KEYPAD	GH74-19246A
MPR-TAPE SUB MIC SOLDER	GH74-19264A
MPR-TAPE LCD FPVB SUB 2	GH74-21187A
MPR-TAPE LCD FPCB MAIN 1	GH74-21189A
MPR-VINYL BOHO MAIN WIN FINAL	GH74-21556A
MPR-TAPE LCD ESD 1	GH74-21557A
MPR-TAPE LCD ESD 2	GH74-21558A
MPR-TAPE SUB CONNECTOR 2	GH74-21559A
MPR-TAPE LCD HOT BAR 2	GH74-21560A
MPR-GASKET MAIN CONN 2	GH74-22079A
MPR-VINYL BOHO WIN DUST	GH74-22082A
MPR-TAPE EMI 1	GH74-22084A

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3-3.Disassembling Procedure

1

2

Open the rear case with Put the disassembly tool

your finger

on lower end of rear

case

Remove the 3 screws on rear case & Volume Do not disassemble the phone by compulsion Key

3

4

						Remove the Antenna & Audio part by
						tweezer
	Remove the 4 screws on Antenna & Audio			When remove the Antenna part, make
		Parts				ensure the Vibrator part carefully
	5			6

When you remove the FPCB, you must pull up the actuator

Slide up then remove the green tape

Remove the Main PCB and Key pad then remove the 2 screws

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	7			8

Make a Slide up, then remove the 4 screws	Disassemble the Slide Part

9 10

Remove the green tape then remove the FPCB

Before disassemble the Camera part, remove the	When you remove the FPCB, first pull up the
green tape	actuator then removethe FPCB

11 12

	Before disassemble the slider PCB, remove	When you remove the audio part, using a
	the Receiver part	removal hole by tweezer
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13

When you disassemble the slide part, push the slide part to the upper end

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3-4. Assembling Procedure

1

2

Check the guide holes for

The lower part of dome sheet should

dome sheet

be attached on the rear side of PCB

3

4

Soldering

Point

	Solder the sub_microphone guided by						Adhere the non-conductive tape on
			it's soldering point					the soldering point of SUB_MIC
		5					6

.Check the guide hole on right	Check the Hot Bar, Backlight FPCB,
position	Heat seal and Guide poles

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7

8

		Check the guide hole on right		Adjust between each corners of LCD
		position		module and Guiding edges on PCB
							GUIDE MARK
	9			10

Solder the backlight FPCB

Be careful of two guide marks on soldering process

11	Guide hole	12
		NG

OK

Solder the Receiver on PCB

Receiver's FPCB should be parallel to the PCB

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13

14

Adhere the non-conductive tape on

Adhere the non-conductive tape on

left side of PCB

the charger pump

15

16

Adhere the non-conductive tape on	Adhere the non-conductive tape on
Hot-bar	backlight FPCB

17

18

Solder and bond the vibrator's wire	Paste the Bluetooth Ant. on the right
and bend it on picture's direction	side Speaker
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19	20	Higher side
	Push lightly
	Lower side
Solder the side key FPCB. Adjust the
PCB outline and be careful of	Insert the rubber for intenna contact
electrical shortage.
21	22

Rubber should be place on aligned

Adhere the non-conductive tape on

position on the red line

the solder point of side key

Bending point

23

24

of FPCB

(the

form of

'U')

This point should not be bended

Bend the SPK FPCB	The bending point of SPK FPCB

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25

Check the white

Push & Paste

silk line

Remove the protection cover

Check the alignment between FPCB and white silk line

26

		Adhere the non-conductive tape on			Check the alignment between FPCB
			FPCB connector of Sub PCB			and white silk line
		27			28

	Put the Sub Key Pad on the slide	Remove the protection tape on LCD
	upper case	window
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					30
		29

Insert the receiver and Sub MIC into							Put the sub PBA assy. on the slide
each holder on the slide upper case								upper case
					from '2' to '1'
					direction
	31						32

1 2

Wind the FPCB twice

Wind the camera's FPCB on the its

Insert the camera module on the

hinge

fron case

(put on the camera's hinge first)

							34
		33

Adhere the non-conductive tape on	Pull out the Main FPCB through the
the cameras FPCB	slider case's hole(red circle)
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					36
		35

Push the slide lower to the slide	If there is no problems until now,
upper's direction	the current state will be like this

37		38
	SCREW	SCREW
	HOLE
		HOLE

Screw down the upper's 4 points	Screw down the lower's 2 points

39

Insert the screw cap	Be careful of each direction

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								shield can's
			MAIN KEY PAD's GUIDE HOLE			41
		40						guide line

	Put the main key pad on the front			Place the shield can over the main
		case			key pad
	42			43

		Confirm the
		alignment
Confirm the bending state of Main	Push the main FPCB into the Main
FPCB	connector

	44	Push the whole parts	45
		of FPCB equaly		Push the middle of actuator
				first and the both sides later
				2	1	2
		Insertion guide		Insertion guide II ;
			3-14

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					47
		46

	Adhere the non-conductive tape on		Adhere the gold gasket over the non-
		the Main connector of Main PCB			conductive tape
	48			49

		Bending line should be aligned with			If the other point is bent, the critical
			the red line			display error will be occurred
		50			51

Bend and push the side key FPCB	Put the Main PCB on the shield can
into the front case	in the order described above

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				53
	52

Insert the shield can's connector	Insert the Speaker's connector

	54
				55

		Reference position of the vibrator's		Bend as the form of 'U' and push the
			wire		SPK's FPCB into the inner space
		56			57

SCREW

The picture of side key FPCB on

Screw down the side key's holder

normal condition

3-16

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Exploded view and its Part list

				59
	58

Screw down on each 4 points of

Two red circles' point should be

intenna module

inserted first at the rear case assembly procedure

	60
									61

SCREW

Push each 5 points sufficiently	Screw down on the last 2 points

3-17

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Exploded view and its Part list

3-5. Slide FPCB KIT Assembling Procedure

- Sub PCB Part

	1																																		2				3
																																					Check the white
																																											Push & Paste
																																					silk line

1.Check the condition of FPCB and remove the protection cover of Sub PCB

2.Check the alignment between FPCB and white silk line

3.Push and Paste evenly by pushing tool

4

5

6

4.Adhere the non-conductive tape on FPCB connector of Sub PCB

5.Check the condition of attachment

6.Bend the FPCB upward and check the alignment between FPCB and white silk line

3-18

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