Rockwell Automation 1769-OB8 User Manual

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Page 1

Installation Instructions

Compact™ Solid State 24V dc Source, High Current Output Module

(Catalog Number 1769-OB8, Series A)

Inside

Module Description ................................................................................. 3

Environment and Enclosure ..................................................................... 4

System Assembly..................................................................................... 5

Mounting Compact I/O Modules............................................................. 6

Replacing a Single Module within a System .......................................... 8

Field Wiring Connections ......................................................................... 9

I/O Memory Mapping ............................................................................ 12

1769-OB8 Configuration File.................................................................. 13

Spare/Replacement Module Parts ........................................................ 14

Specifications ........................................................................................ 15

Hazardous Location Considerations ...................................................... 18

Environnements dangereux ................................................................... 18

For More Information............................................................................. 19

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2 Compact™ Solid State 24V dc Source, High Current Output Module

Important User Information

Because of the variety of uses for the products described in this publication, those responsible for the application and use of these products must satisfy themselves that all necessary steps have been taken to assure that each application and use meets all performance and safety requirements, including any applicable laws, regulations, codes and standards. In no event will Rockwell Automation be responsible or liable for indirect or consequential damage resulting from the use or application of these products.

Any illustrations, charts, sample programs, and layout examples shown in this publication are intended solely for purposes of example. Since there are many variables and requirements associated with any particular installation, Rockwell Automation does not assume responsibility or liability (to include intellectual property liability) for actual use based upon the examples shown in this publication.

Allen-Bradley publication SGI-1.1, Safety Guidelines for the Application, Installation and Maintenance of Solid-State Control (available from your local Rockwell Automation office), describes some important differences between solid-state equipment and electromechanical devices that should be taken into consideration when applying products such as those described in this publication.

Reproduction of the contents of this copyrighted publication, in whole or part, without written permission of Rockwell Automation, is prohibited.

Throughout this publication, notes may be used to make you aware of safety considerations. The following annotations and their accompanying statements help you to identify a potential hazard, avoid a potential hazard, and recognize the consequences of a potential hazard:

WARNING

Identifies information about practices or circumstances that can cause an explosion in a hazardous environment, which may lead to personal injury or death, property damage, or economic loss.

ATTENTION

Identifies information about practices or circumstances that can lead to personal injury or death, property damage, or economic loss.

IMPORTANT

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Identifies information that is critical for successful application and understanding of the product.

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Compact™ Solid State 24V dc Source, High Current Output Module 3

Module Description

DANGER

Do Not Remo v e R TB Under P o wer

Unless Area is Non-Hazardous

10a

10b

Ensure Adjacent

Bus Leve r is Unlatched/Latched

Before/After

Remo ving/Inser ting Module

9-O

Item Description

1 bus lever

(with locking function)

2a upper panel mounting tab

2b lower panel mounting tab

3 I/O diagnostic LEDs

4 module door with terminal

identification label

5a movable bus connector

with female pins

5b stationary bus connector

with male pins

6 nameplate label

7a upper

tongue-and-groove slots

7b lower

tongue-and-groove slots

8a upper DIN rail latch

8b lower DIN rail latch

9 write-on label (user ID tag)

10 removable terminal block (RTB)

with finger-safe cover

10a RTB upper retaining screw

10b RTB lower retaining screw

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4 Compact™ Solid State 24V dc Source, High Current Output Module

Environment and Enclosure

ATTENTION

This equipment is intended for use in a Pollution Degree 2 industrial environment, in overvoltage Category II applications (as defined in IEC publication 60664-1), at altitudes up to 2000 meters without derating.

This equipment is considered Group 1, Class A industrial equipment according to IEC/CISPR Publication 11. Without appropriate precautions, there may be potential difficulties ensuring electromagnetic compatibility in other environments due to conducted as well as radiated disturbance.

This equipment is supplied as “open type” equipment. It must be mounted within an enclosure that is suitably designed for those specific environmental conditions that will be present and appropriately designed to prevent personal injury resulting from accessibility to live parts. The interior of the enclosure must be accessible only by the use of a tool. Subsequent sections of this publication may contain additional information regarding specific enclosure type ratings that are required to comply with certain product safety certifications.

See NEMA Standards publication 250 and IEC publication 60529, as applicable, for explanations of the degrees of protection provided by different types of enclosure. Also, see the appropriate sections in this publication, as well as the Allen-Bradley publication 1770-4.1 (“Industrial Automation Wiring and Grounding Guidelines”), for additional installation requirements pertaining to this equipment.

Prevent Electrostatic Discharge

ATTENTION

Electrostatic discharge can damage integrated circuits or semiconductors if you touch bus connector pins. Follow these guidelines when you handle the module:

· Touch a grounded object to discharge static potential.

· Wear an approved wrist-strap grounding device.

· Do not touch the bus connector or connector pins.

· Do not touch circuit components inside the module.

· If available, use a static-safe work station.

· When not in use, keep the module in its static-shield box.

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Remove Power

Compact™ Solid State 24V dc Source, High Current Output Module 5

ATTENTION

Remove power before removing or inserting this module. When you remove or insert a module with power applied, an electrical arc may occur. An electrical arc can cause personal injury or property damage by:

· sending an erroneous signal to your system’s field devices, causing

unintended machine motion

· causing an explosion in a hazardous environment

Electrical arcing causes excessive wear to contacts on both the module and its mating connector. Worn contacts may create electrical resistance.

System Assembly

The module can be attached to the controller or an adjacent I/O module before or after mounting. For mounting instructions, see

Rail Mounting" on page 8. To work with a system that is already mounted, see "Replacing a Single Module within a System" on page 8.

The following procedure shows you how to assemble the Compact I/O system.

"Panel Mounting" on page 7, or "DIN

1. Disconnect power.

2. Check that the bus lever of the module to be installed is in the unlocked

(fully right) position.

3. Use the upper and lower tongue-and-groove slots (1) to secure the modules

together (or to a controller).

4. Move the module back along the tongue-and-groove slots until the bus

connectors (2) line up with each other.

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6 Compact™ Solid State 24V dc Source, High Current Output Module

5. Push the bus lever back slightly to clear the positioning tab (3). Use your

fingers or a small screw driver.

6. To allow communication between the controller and module, move the bus

lever fully to the left (4) until it clicks. Ensure it is locked firmly in place.

ATTENTION

When attaching I/O modules, it is very important that the bus connectors are securely locked together to ensure proper electrical connection.

7. Attach an end cap terminator (5) to the last module in the system by using

the tongue-and-groove slots as before.

8. Lock the end cap bus terminator (6).

IMPORTANT

A 1769-ECR or 1769-ECL right or left end cap must be used to terminate the end of the serial communication bus.

Mounting Compact I/O Modules

ATTENTION

During panel or DIN rail mounting of all devices, be sure that all debris (metal chips, wire strands, etc.) is kept from falling into the module. Debris that falls into the module could cause damage on power up.

Minimum Spacing

Maintain spacing from enclosure walls, wireways, adjacent equipment, etc. Allow 50 mm (2 in.) of space on all sides for adequate ventilation, as shown:

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Side Side

Host Controller

Top

Compact I/O

Bottom

Compact I/O

End Cap

Compact I/O

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Compact™ Solid State 24V dc Source, High Current Output Module 7

Panel Mounting

Mount the module to a panel using two screws per module. Use M4 or #8 panhead screws. Mounting screws are required on every module.

Panel Mounting Using the Dimensional Template

For more than 2 modules: (number of modules - 1) x 35 mm (1.38 in.) Refer to host controller documentation for this dimension.

Note: All dimensions are in mm (inches). Hole spacing tolerance: ±0.4 mm (0.016 in.).

132

(5.197)

(4.826±0.008)

122.6±0.2

Host Controller

(1.38)

Compact I/O

Panel Mounting Procedure Using Modules as a Template

The following procedure allows you to use the assembled modules as a template for drilling holes in the panel. If you have sophisticated panel mounting equipment, you can use the dimensional template provided on mounting hole tolerance, it is important to follow these procedures:

page 7. Due to module

28.5

(1.12)

Compact I/O

End Cap

Compact I/O

1. On a clean work surface, assemble no more than three modules.

2. Using the assembled modules as a template, carefully mark the center of all

module-mounting holes on the panel.

3. Return the assembled modules to the clean work surface, including any

previously mounted modules.

4. Drill and tap the mounting holes for the recommended M4 or #8 screw.

5. Place the modules back on the panel, and check for proper hole alignment.

6. Attach the modules to the panel using the mounting screws.

TIP

If mounting more modules, mount only the last one of this group and put the others aside. This reduces remounting time during drilling and tapping of the next group.

7. Repeat steps 1 to 6 for any remaining modules.

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8 Compact™ Solid State 24V dc Source, High Current Output Module

DIN Rail Mounting

The module can be mounted using the following DIN rails: 35 x 7.5 mm (EN 50 022 - 35 x 7.5) or 35 x 15 mm (EN 50 022 - 35 x 15).

Before mounting the module on a DIN rail, close the DIN rail latches. Press the DIN rail mounting area of the module against the DIN rail. The latches will momentarily open and lock into place.

Replacing a Single Module within a System

The module can be replaced while the system is mounted to a panel (or DIN rail).

1. Remove power. See important note on page 5.

2. On the module to be removed, remove the upper and lower mounting

screws from the module (or open the DIN latches using a flat-blade or phillips style screw driver).

3. Move the bus lever to the right to disconnect (unlock) the bus.

4. On the right-side adjacent module, move its bus lever to the right (unlock)

to disconnect it from the module to be removed.

5. Gently slide the disconnected module forward. If you feel excessive

resistance, check that the module has been disconnected from the bus, and that both mounting screws have been removed (or DIN latches opened).

TIP

6. Before installing the replacement module, be sure that the bus lever on the

module to be installed, and on the right-side adjacent module are in the unlocked (fully right) position.

7. Slide the replacement module into the open slot.

8. Connect the modules together by locking (fully left) the bus levers on the

replacement module and the right-side adjacent module.

9. Replace the mounting screws (or snap the module onto the DIN rail).

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It may be necessary to rock the module slightly from front to back to remove it, or, in a panel-mounted system, to loosen the screws of adjacent modules.

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Compact™ Solid State 24V dc Source, High Current Output Module 9

Field Wiring Connections

Grounding the Module

This product is intended to be mounted to a well-grounded mounting surface such as a metal panel. Additional grounding connections from the module’s mounting tabs or DIN rail (if used), are not required unless the mounting surface cannot be grounded. Refer to Industrial Automation Wiring and Grounding Guidelines, Allen-Bradley publication 1770-4.1, for additional information.

Output Wiring

Basic wiring

(1)

of output devices

(2)

to the 1769-OB8 is shown below.

ATTENTION

· Miswiring of the module to an AC power source or applying reverse polarity will damage the module.

· Be careful when stripping wires. Wire fragments that fall

into a module could cause damage at power up. Once wiring is complete, ensure the module is free of all metal fragments.

DC -

(1) Recommended Surge Suppression - Use a 1N4004 diode reverse-wired across the load for transistor outputs switching 24V

dc inductive loads. For additional details, refer to Industrial Automation Wiring and Grounding Guidelines, Allen-Bradley publication 1770-4.1.

(2) Sourcing Output - Source describes the current flow between the I/O module and the field device. Sourcing output circuits

supply (source) current to sinking field devices. Field devices connected to the negative side (DC Common) of the field power supply are sinking field devices. Field devices connected to the positive side (+V) of the field supply are sourcing field devices. Europe: DC sinking input and sourcing output module circuits are the commonly used options.

OUT 2

DC COM

OUT 4

OUT 6

DC COM

OUT 1

OUT 3

+VDC 2

OUT 5

OUT 7

+VDC 1

OUT 0

DC+

DC-

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10 Compact™ Solid State 24V dc Source, High Current Output Module

A removable, write-on label is provided with the module. Remove the label from the door, mark the identification of each terminal with permanent ink, and slide the label back into the door. Your markings (ID tag) will be visible when the module door is closed.

SLOT # _____

MODULE TYPE ______

Removing the Finger-Safe Terminal Block

When wiring field devices to the module, it is not necessary to remove the terminal block. If you remove the terminal block, use the write-on label on the side of the terminal block to identify the module slot location and type.

To remove the terminal block, loosen the upper and lower retaining screws. The terminal block will back away from the module as you remove the screws. When replacing the terminal block, torque the retaining screws to 0.46 Nm (4.1 in-lbs).

Wiring the Finger-Safe Terminal Block

upper retaining screw

lower retaining screw

wiring the finger-safe terminal block

When wiring the terminal block, keep the finger-safe cover in place.

1. Loosen the terminal screws to be wired.

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Compact™ Solid State 24V dc Source, High Current Output Module 11

2. Route the wire under the terminal pressure plate. You can use the bare wire

or a spade lug. The terminals will accept a 6.35 mm (0.25 in.) spade lug.

TIP

The terminal screws are non-captive. Therefore, it is possible to use a ring lug [maximum 1/4 inch o.d. with a 0.139 inch minimum i.d. (M3.5)} with the module.

3. Tighten the terminal screw making sure the pressure plate secures the wire.

Recommended torque when tightening terminal screws is 0.68 Nm (6 in-lbs).

TIP

If you need to remove the finger-safe cover, insert a screw driver into one of the square, wiring holes and gently pry the cover off. If you wire the terminal block with the finger-safe cover removed, you will not be able to put it back on the terminal block because the wires will be in the way.

Simplified Output Circuit Diagram

Logic Side User Side

VDC

VCC

OUT

ASIC

COM

Wire Size and Terminal Screw Torque

Each terminal accepts up to two wires with the following restrictions:

Wire Type Wire Size Terminal Screw

Solid Cu-90°C (194°F) #14 to #22 AWG 0.68 Nm (6 in-lbs) 0.46 Nm (4.1 in-lbs)

Stranded Cu-90°C (194°F) #16 to #22 AWG 0.68 Nm (6 in-lbs) 0.46 Nm (4.1 in-lbs)

Tor qu e

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Retaining Screw To rq ue

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12 Compact™ Solid State 24V dc Source, High Current Output Module

I/O Memory Mapping

Output Data File

For each module, slot x, word 0 in the output data file contains the control program’s directed state of the discrete output points.

Bit Position

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

Word

0 0 0 0 0 0 0 0 0 w w w w w w w w

w = write

Output Module’s Input Data File

For each module, slot x, input data file word 0 contains the state of the module’s output data (output data echo) file word 0. During normal operation, these input bits represent the logic state that the outputs are directed to by the control program. They are also dependent upon the:

· Program Mode configuration (if supported by the controller)

· The Fault Mode configuration (if supported by the controller)

Bit Position

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

Word

0 0 0 0 0 0 0 0 0 r r r r r r r r

r = read

IMPORTANT

The output module’s input data file reflects the output data echo of the module, not necessarily the electrical state of the output terminals. It does not reflect shorted or open outputs.

It is important to use this input word if the controller adapter supports the Program Mode or Fault Mode function, and if it is configured to use them.

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Compact™ Solid State 24V dc Source, High Current Output Module 13

1769-OB8 Configuration File

The read/writable configuration data file allows the setup of the hold last state and user-defined safe state conditions.

The manipulation of the bits from this file is normally done with programming software (e.g. RSLogix 500, RSNetWorx for DeviceNet, etc.) during initial configuration of the system. In that case, graphical screens are provided via the programmer to simplify configuration. However, some systems (e.g. 1769-ADN DeviceNet Adapter) also allow the bits to be altered as part of the control program using communication rungs. In that case, it is necessary to understand the bit arrangement.

Bit Position

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

Word

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PFE

1 0 0 0 0 0 0 0 0 Program State for Output Array Word 0

2 0 0 0 0 0 0 0 0 Program Value for Output Array Word 0

3 0 0 0 0 0 0 0 0 Fault State for Output Array Word 0

4 0 0 0 0 0 0 0 0 Fault Value for Output Array Word 0

Program to Fault Enable Bit (PFE), Word 0 Bit 0

Allows the selection of which data value, the program or fault value, to apply to the output if a system in Program mode undergoes a system fault, resulting a change to Fault mode.

Program State, Word 1

Selects the hold last state or user-defined safe state condition for each individual output on a system transition from Run to Program.

Program Value, Word 2

Defines the user-defined safe state value (0=Off, 1=On). Each output is individually configurable for on or off.

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Value Applied Bit Setting

Program 0

Fault 1

Condition Bit Setting

User-defined Safe State 0

Hold Last State 1

Value Bit Setting

Off 0

On 1

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14 Compact™ Solid State 24V dc Source, High Current Output Module

Fault State, Word 3

Selects the hold last state or user-defined safe state condition for each individual output on a system transition from Run to Fault.

Condition Bit Setting

User-defined Safe State 0

Hold Last State 1

Fault Value, Word 4

Value Bit Setting

Defines the fault state value (0=Off, 1=On). Each output is individually configurable for on or off.

Off 0

On 1

Module Default Condition

The modules default condition is all zeros, which defines these conditions:

Word or Bit Affected Condition Applied

Word 0, Bit 0: Program-to-Fault Enable Program Value

Word 1: Program State User-defined Safe State

Word 2: Program Value Off

Word 3: Fault State User-defined Safe State

Word 4: Fault Value Off

Spare/Replacement Module Parts

· Terminal Block: 1769-RTBN18 (1 per kit)

· Door Label: 1769-RL1 (2 per kit)

· Door: 1769-RD (2 per kit)

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Compact™ Solid State 24V dc Source, High Current Output Module 15

Specifications

General Specifications

Specification Value

Dimensions 118 mm (height) x 87 mm (depth) x 35 mm (width)

Approximate Shipping Weight (with carton)

Storage Temperature -40°C to +85°C (-40°F to +185°F)

Operating Temperature 0°C to +60°C (32°F to +140°F)

Operating Humidity 5% to 95% non-condensing

Operating Altitude 2000 meters (6561 feet)

Vibration Operating: 10 to 500 Hz, 5G, 0.030 inches maximum

Shock Operating: 30G panel mounted (20G DIN rail mounted)

Agency Certification · C-UL certified (under CSA C22.2 No. 142)

Hazardous Environment Class Class I, Division 2, Hazardous Location, Groups A, B, C, D (UL

Radiated and Conducted Emissions EN50081-2 Class A

Electrical /EMC: The module has passed testing at the following levels:

ESD Immunity (IEC61000-4-2) · 4kV contact, 8 kV air, 4 kV indirect

Radiated Immunity (IEC61000-4-3) · 10 V/m, 80 to 1000 MHz, 80% amplitude modulation,

Fast Transient Burst (IEC61000-4-4) · 2 kV, 5 kHz

Surge Immunity (IEC61000-4-5) · 2 kV common mode, 1 kV differential mode

Conducted Immunity (IEC61000-4-6)

(1) Conducted Immunity frequency range may be 150 kHz to 30 MHz if the Radiated Immunity frequency range is 30 MHz to

1000 MHz.

height including mounting tabs is 138 mm

4.65 in. (height) x 3.43 in (depth) x 1.38 in (width) height including mounting tabs is 5.43 in.

280g (0.61 lbs.)

peak-to-peak Relay Operation: 2G

Relay Operation: 7.5G panel mounted (5G DIN rail mounted) Non-Operating: 40G panel mounted (30G DIN rail mounted)

· UL 508 listed

· CE and C-Tick compliant for all applicable directives

1604, C-UL under CSA C22.2 No. 213)

+900 MHz keyed carrier

· 10V, 0.15 to 80 MHz

(1)

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16 Compact™ Solid State 24V dc Source, High Current Output Module

Output Specifications

Specification 1769-OB8

Voltage Category 24V dc

Operating Voltage Range

20.4V dc to 26.4V dc (source

Number of Outputs 8

Bus Current Draw (maximum) 145 mA at 5V dc (0.725W)

Heat Dissipation 2.20 Total Watts

(Watts per point, plus minimum Watts, with all points energized.)

Signal Delay (maximum) – resistive load turn-on =0.1 ms

turn-off =1.0 ms at 60°C maximum load 2A, minimum V in 20.4V

1.5 ms at 60°C minimum load 1mA, minimum V in 20.4V

Off-State Leakage (maximum)

(2)

1.0 mA at 26.4V dc

On-State Current (minimum) 1.0 mA

On-State Voltage Drop (maximum) 1.0V dc at 2.0 A

Continuous Current Per Point (maximum) 2.0A at 60°C (140°F)

Continuous Current Per Module (maximum) 8.0A at 60°C (140°F)

Surge Current (maximum)

(3)

4.0A (repeatability is once every 2 seconds for a duration of 10 ms)

Power Supply Distance Rating 8 (the module may not be more than 8 modules away from the

power supply.)

Output Point to Bus Isolation and Output Group to Output Group Isolation

Isolated Groups Group 1: outputs 0-3 (internally connected to dc common 1)

Verified by one of the following dielectric tests: 1200V ac for 1 sec. or 1697V dc for 1 sec. 75V dc working voltage (IEC Class 2 reinforced insulation)

Group 2: outputs 4-7 (internally connected to dc common 2)

Vendor I.D. Code 1

Product Type Code 7

Product Code 70

(1) Sourcing Output - Source describes the current flow between the I/O module and the field device. Sourcing output circuits

(2) Typical Loading Resistor - To limit the effects of leakage current through solid state outputs, a loading resistor can be

connected in parallel with your load. Use a 5.6K ohm, ½ watt resistor for transistor outputs, 24V dc operation.

(3) Recommended Surge Suppression - Use a 1N4004 diode reverse-wired across the load for transistor outputs switching 24V

dc inductive loads. For additional details, refer to Industrial Automation Wiring and Grounding Guidelines, Allen-Bradley publication 1770-4.1.

(1)

)

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Compact™ Solid State 24V dc Source, High Current Output Module 17

Transistor Output Transient Pulses

The maximum duration of the transient pulse occurs when minimum load is connected to the output. However, for most applications, the energy of the transient pulse is not sufficient to energize the load.

ATTENTION

The graph below illustrates that the duration of the transient is proportional to the load current. Therefore, as the on-state load current increases, the transient pulse decreases. Power-up transients do not exceed the time duration shown below, for the amount of loading indicated, at 60°C (140°F).

A transient pulse occurs in transistor outputs when the external DC supply voltage is applied to the output common terminals (e.g. via the master control relay). The sudden application of voltage creates this transient pulse. This condition is inherent in transistor outputs and is common to solid state devices. A transient pulse can occur regardless of the controller having power or not. Refer to your controller’s user manual to reduce inadvertent operation.

Transient Pulse Duration as a Function of Load Current

Time - Duration of Transient (ms)

On-State Load Current (mA)

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18 Compact™ Solid State 24V dc Source, High Current Output Module

Hazardous Location Considerations

This equipment is suitable for use in Class I, Division 2, Groups A, B, C, D or non-hazardous locations only. The following WARNING statement applies to use in hazardous locations.

WARNING

EXPLOSION HAZARD

· Substitution of components may impair suitability for Class I, Division 2.

· Do not replace components or disconnect equipment unless power has been switched off or the area is known to be non-hazardous.

· Do not connect or disconnect components unless power has been switched off or the area is known to be non-hazardous.

· This product must be installed in an enclosure.

· All wiring must comply with N.E.C. article 501-4(b).

Environnements dangereux

Cet équipement est conçu pour être utilisé dans des environnements de Classe 1, Division 2, Groupes A, B, C, D ou non dangereux. La mise en garde suivante s’applique à une utilisation dans des environnements dangereux.

AVERTISSEMENT

DANGER D’EXPLOSION

· La substitution de composants peut rendre cet équipement impropre à une utilisation en environnement de Classe 1, Division 2.

· Ne pas remplacer de composants ou déconnecter l'équipement sans s'être assuré que l'alimentation est coupée et que l'environnement est classé non dangereux.

· Ne pas connecter ou déconnecter des composants sans s'être assuré que l'alimentation est coupée ou que l'environnement est classé non dangereux.

· Ce produit doit être installé dans une armoire.

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Compact™ Solid State 24V dc Source, High Current Output Module 19

For More Information

For Refer to this Document Pub. No.

A more detailed description of how to install and use your Compact™ I/O with MicroLogix™ 1200 & 1500 programmable controller.

A more detailed description of how to install and use your Compact I/O with the 1769-ADN DeviceNet Adapter.

A more detailed description of how to install and use your Compact I/O with the CompactLogix™ System.

More information on proper wiring and grounding techniques.

If you would like a manual, you can:

· download a free electronic version from the internet:

www.ab.com/micrologix or www.theautomationbookstore.com

· purchase a printed manual by:

– contacting your local distributor or Rockwell Automation representative – visiting www.theautomationbookstore.com and placing your order – calling 1.800.963.9548 (USA/Canada)

or 001.330.725.1574 (Outside USA/Canada)

MicroLogix 1200 & 1500 Programmable Controllers User Manual

1769-ADN DeviceNet Adapter User Manual

CompactLogix System User Manual 1769-UM007

Industrial Automation Wiring and Grounding Guidelines

1764-UM001

1769-UM001

1770-4.1

Publication 1769-IN063A-EN-P - March 2003

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Notes:

Publication 1769-IN063A-EN-P - March 2003 PN 40071-152-01(1)

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