Compact™ 24V dc Sink/Source Input
Module
(Catalog Number 1769-IQ16)
Installation Instructions
Inside
Module Description.........................................................................................2
Module Installation..........................................................................................3
System Assembly...........................................................................................4
Mounting Expansion I/O..................................................................................5
Replacing a Single Module within a System...................................................7
Field Wiring Connections................................................................................8
I/O Memory Mapping ....................................................................................10
Spare/Replacement Parts.............................................................................10
Specifications................................................................................................11
Hazardous Location Considerations.............................................................13
Environnements dangereux..........................................................................13
For More Information ....................................................................................14
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2
Module Description
1
Item Description
bus lever
1
2a
(with locking function)
upper panel mounting tab
2a
3
DANGER
Do Not Remove RTB Under Power
Unless Area is Non-Hazardous
10a
10
10b
IN 0
IN 1
IN 2
IN 3
IN 4
IN 5
IN 6
IN 7
DC
COM1
IN 9
IN 8
IN 11
IN 10
IN 13
IN 12
IN 15
IN 14
DC
COM 2
Ensure Adjacent
Bus Lever is Unlatched/Latched
Before/After
Removing/Inserting Module
1769-IQ16
4
8a
7a
2b
7a
5a
9
5b
6
7b
7b
8b
lower panel mounting tab
2b
I/O diagnostic LEDs
3
module door with terminal
4
identification label
movable bus connector
5a
with female pins
stationary bus connector
5b
with male pins
nameplate label
6
upper
7a
tongue-and-groove slots
lower
7b
tongue-and-groove slots
upper DIN rail latch
8a
lower DIN rail latch
8b
write-on label (user ID tag)
9
removable terminal block
10
(RTB) with finger-safe cover
RTB upper retaining screw
10a
RTB low er retaining screw
10b
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Module Installation
Compact I/O is suitable for use in an industrial environment when installed in
accordance with these instructions. Specifically, this equipment is intended for
use in clean, dry enviro nments (Pollution degr ee 2
Over Voltage Category II
2
(IEC 60664-1).
3
Prevent Electrostatic Discharge
1
) and to circuits not exceeding
3
!
Remove Power
!
ATTENTION:
circuits or semiconductors if you touch bus connector pins.
Follow these guidelines when you handle the module:
• Touch a grounded object to discharge static potential.
• Wear an approved wrist-strap grounding device.
• Do not touch the bus connector or connector pins.
• Do not touch circuit components inside the module.
• If available, use a static-s afe work station.
• When not in use, keep the module in its static-shield box.
ATTENTION:
this module. When you remove or insert a module with power
applied, an electrical arc may occur. An electrical arc can cause
personal injury or property damage by:
• sending an erroneous signal to your system’s field devices,
causing unintended machine motion
• causing an explosion in a hazardous environment
Electrical arcing causes excessive wear to contacts on both the
module and its mating connector. Worn contacts may create
electrical resistance.
Electrostatic discharge can damage integrated
Remove power before removing or inserting
1. Pollution Deg ree 2 is an environment w here, normally, only non -conductive pollution occ urs except that
occasionally a temporary conductivity caused by condensation shall be expected.
2. Over Voltage C at ego ry II is th e loa d le vel sec tion of t he e lect rica l dis trib utio n sy ste m. A t th is lev el t ransient
voltages are controlled and do not exceed the impulse voltage capability of the product’s insulation.
3. Pollution Degree 2 and Over Voltage Category II are International Electrotechnical Commission (IEC)
designations.
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4
System Assembly
The module can be attached to the contro ller o r an adjacen t I/O m odu le before or
after mounting. For mounting instructio ns, see “Panel Mounting” on page 5, or
“DIN Rail Mounting” on page 6. To work with a system that is already mounted,
see “Replacing a Single Module within a System” on page 7.
The following procedure shows you how to assemble the Compact I/O system.
3
4
2
1
1
5
1. Disconnect power.
2. Check that the bus lever of the module to be installed is in the unlocked
(fully right) position.
3. Use the upper and lower tongue-and-groove slots (1) to secure the modules
together (or to a controller).
4. Move the module back along the tongue-and-groove slots until the bus
connectors (2) line up with each other.
5. Push the bus lever back slightly to clear the positioning tab (3). Use your
fingers or a small screw driver.
6. To allow communication between the controller and module, move the bus
lever fully to the left (4) until it clicks. Ensure it is locked firmly in place.
ATTENTION:
important that the bus connectors are securely locked
!
7. Attach an end cap terminator (5) to the last module in t he system by using
the tongue-and-groove slots as before.
8. Lock the end cap bus terminator (6).
IMPORTANT:
together to ensure proper electrical connection.
A 1769-ECR or 1769 -ECL right or left end cap must be used to
terminate the end of the serial communication bus.
When attaching I/O modules, it is very
6
Publication 1769-IN007B-EN-P
Mounting Expansion I/O
5
ATTENTION:
During panel or DIN rail mounting of all
devices, be sure that all debris (metal chips, wire strands, etc.) is
!
kept from falling into the module. Debris that falls into the
module could cause dama ge on power up.
Minimum Spacing
Maintain spacing from
enclosure walls,
wireways, adjacent
equipment, etc. Allow 50
mm (2 in.) of space on all
sides for adequate
ventilation, as shown:
Side Side
Controller
Top
Compact I/O
Compact I/O
Bottom
Compact I/O
Compact I/O
Compact I/O
Panel Mounting
Mount the module to a panel using two screws per module. Use M4 or #8
panhead screws. Mounting screws are required on every module.
Panel Mounting Using the Dimensional Template
For more than 2 modules: (number of modules - 1) X 35 mm (1.38 in.)
Refer to host controller documentation for this dimension.
35
(1.38)
28.5
(1.12)
End Cap
132
(5.197)
(4.826±0.008)
122.6±0.2
Compact I/O
Host Controller
Compact I/O
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NOTE: All dimensions
are in mm (inches). Hole
Compact I/O
Right End Cap
spacing tolerance:
±0.4 mm (0.016 in.)
6
Panel Mounting Procedure Using Modules as a Template
The following procedure allows you to use the assembled modules as a template
for drilling holes in the panel. If you have sophisticated panel mounting
equipment, you can use the dimensional template provided on page 5. Due to
module mounting hole tolerance, it is important to follow these procedures:
1. On a clean work surface, assemble no more than three modules.
2. Using the assembled modules as a template, carefully mark the center of all
module-mounting holes on the panel.
3. Return the assembled modules to the clean work surface, including any
previously mounted modules.
4. Drill and tap the mounting holes for the recommended M4 or #8 screw.
5. Place the modules back on the panel, and check for proper hole alignment.
6. Attach the modules to the panel using the mounting screws.
Note:
If mounting more modules, mount only the last one of this group
and put the others aside. This reduces remounting time during
drilling and tapping of the next group.
7. Repeat steps 1 to 6 for any remaining modules.
DIN Rail Mounting
The module can be mounted using the following DIN rails: 35 x 7.5 mm (EN 50
022 - 35 x 7.5) or 35 x 15 mm (EN 50 022 - 35 x 15).
Before mounting the module on a DIN rail, close the DIN rail latches. Press the
DIN rail mounting area of the module against the DIN rail. The latches will
momentarily open and lock into place.
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7
Replacing a Single Module within a System
The module can be replaced while the system is mounted to a panel (or DIN rail).
1. Remove power. See important note on page 3.
2. On the module to be removed, remove the upper and lower mounting
screws from the module (or open the DIN latches using a flat-blade or
phillips style screw driver).
3. Move the bus lever to the right to disconnect (unlock) the bus.
4. On the right-side adjacent module, move its bus lever to the right (unlock)
to disconnect it from the module to be removed.
5. Gently slide the disconnected module forward. If you feel excessive
resistance, check that the module has been disconnected from the bus, and
that both mounting screws have been removed (or DIN latches opened).
Note:
6. Before installing the replacement module, be sure that the bus lever on the
module to be installed, and on the right-side adjacent module are in the
unlocked (fully right) position.
7. Slide the replacement module into the open slot.
8. Connect the modules together by locking (fully left) the bus levers on the
replacement module and the right-side adjacent module.
9. Replace the mounting screws (or snap the module onto the DIN rail).
It may be necessary to rock the module slightly from front to back
to remove it, or, in a panel-mounted system, to loosen the screws of
adjacent modules.
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Field Wiring Connections
Grounding the Module
This product is intended to be mounted to a well-grounded mounting surface
such as a metal panel. Additional grounding connections from the module’s
mounting tabs or DIN rail (if used), are not required un less the moun ting s urf ace
cannot be grounded. Refer to Industrial Automation Wiring and Grounding
Guidelines, Allen-Bradley publication 1770-4.1, for additional information.
Input Wiring
Basic wiring of input devices1 to the 1769-IQ16 is shown below.
ATTENTION:
• Miswiring of the module to an AC power source will damage
!
the module.
• Be careful when stripping wires. W ire fragments that f all into a
module could cause damage at power up. Once wiring is
complete, ensure the module is free of all metal fragments.
+DC (sinking)
-DC (sourcing)
IN 0
IN 1
+DC (sinking)
-DC (sourcing)
24V dc
-DC (sinking)
+DC (sourcing)
IN 3
IN 5
IN 7
IN 9
IN 11
IN 13
IN 15
DC
COM 2
IN 2
IN 4
IN 6
DC
COM 1
IN 8
IN 10
IN 12
IN 14
24V dc
-DC (sinking)
+DC (sourcing)
1.
Sinking/ Sourc ing I nputs
- Sourcing/sinking describes the current flow between the I/O module and the field
device. Sourcing I/O c ircuits su pply (so urce) c urrent to sinking field de vices. S inking I /O circu its are dr iven
by a current sourcing field dev ice. Field devi ces connect ed to the negat ive side (DC Com mon) of the field
power supply are s inki ng field de vic es. Fie l d d evi ces co nne cte d t o th e p osi tive sid e ( +V ) o f th e f ield su ppl y
are sourcing field devices. Europe: DC sinking input and sourcing output module circuits are the commonly
used options.
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9
A removable, write-on label is provided with the module. Remove the label from
the door, mark the identification of each terminal with permanent ink, and slide
the label back into the door. Your markings (ID tag) will be visible when the
module door is closed.
upper retaining screw
wiring the finger-safe terminal block
lower retaining screw
Removing the Finger-Safe Terminal Block
To remove the terminal block, loosen the upper and lower retaining screws. The
terminal block will back away from the module as you remove the screws. When
replacing the terminal block, torque the retaining screws to 0.46 Nm (4.1 in-lbs).
Wiring the Finger-Safe Terminal Block
When wiring the terminal block, keep the finger-safe cover in place.
1. Loosen the terminal screws to be wired.
2. Route the wire under the terminal pressure plate. You can use the bare wire
or a spade lug. The terminals will accept a 6.35 mm (0.25 in.) spade lug.
Note:
The terminal screws are non -capti v e. Therefo re, it is possibl e to use a ring
lug [max. 1/4” o.d. with a 0.139” mi nimum i.d. ( M3.5)] with the module.
3. Tighten the terminal screw making sure the pressure plate secures the wire.
Recommended torque when tightening terminal screws is 0.68 Nm (6 inlbs).
Note:
If you need to remove the finger-safe cover, insert a screw driver into one
of the square, wiring holes and gently pry the cover off. If you wire the
terminal block with the finger-safe cov er r emo v ed, y ou will not be able to
put it back on the terminal block because the wires will be in the way.
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10
Wire Size and Terminal Screw Torque
Each terminal accepts up to two wires with the following restrictions:
Solid
Stranded
Wire Type Wire Size
Cu-90°C (194°F) #14 to #22 AWG 0.68 Nm (6 in-lbs) 0.46 Nm (4.1 in-lbs)
Cu-90°C (194°F) #16 to #22 AWG 0.68 Nm (6 in-lbs) 0.46 Nm (4.1 in-lbs)
Terminal Screw
Torque
Retaining Screw
Torque
I/O Memory Mapping
Input Data File
For each input module, slot x, word 0 in the input data file contains the current
state of the field input points.
Bit Position
Word
1514131211109876543210
0rrrrrrrrrrrrrrrr
r= read
Spare/Replacement Module Parts
• Terminal Block: 1769-RTBN18 (1 per kit)
• Door Label: 1769-RL1 (2 per kit)
• Door: 1769-RD (2 per kit)
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11
Specifications
General Specifications
Specification Value
118 mm (height) x 87 mm (depth) x 35 mm (width)
Dimensions
Approximate Shipping Weight
(with carton)
Storage Temperature -40°C to +85°C (-40°F to +185°F)
Operating Temperature 0°C to +60°C (32°F to +140°F)
Operating Humidity 5% to 95% non-condensing
Operating Altitude 2000 meters (6561 feet)
Vibration
Shock
Agency Certification
Hazardous Environment Class
Radiated and Conducted Emissions EN50081-2 Class A
Electrical /EMC: The module has passed testing at the following levels:
• ESD Immunity (IEC1000-4-2) • 4kV contact, 8 kV air, 4 kV indirect
• Radiated Immunity (IEC1000-4-3)
• Fast Transient Burst (IEC1000-4-4) • 2 kV, 5 kHz
• Surge Immunity (IEC1000-4-5) • 2 kV common mode, 1 kV differential mode
• Conducted Immunity (IEC1000-4-6) • 10V, 0.15 to 80 MHz
1. Conducted Immunity frequency range may be 150 kHz to 30 MHz if the Radiated Immunity frequency range
is 30 MHz to 1000 MHz.
height including mounting tabs is 138 mm
4.65 in. (height) x 3.43 in (depth) x 1.38 in (width)
height including mounting tabs is 5.43 in.
270g (0.6 lbs.)
Operating: 10 to 500 Hz, 5G, 0.030 inches maximum
peak-to-peak
Relay Operation: 2G
Operating: 30G panel mounted (20G DIN rail mounted)
Relay Operation: 7.5G panel mounted (5G DIN rail
mounted)
Non-Operating: 40G panel mounted (30G DIN rail
mounted)
• C-UL certified (under CSA C22.2 No. 142)
• UL 508 listed
• CE compliant for all applicable directives
Class I, Division 2, Hazardous Location, Groups A, B, C,
D (UL 1604, C-UL under CSA C22.2 No. 213)
• 10 V/m, 80 to 1000 MHz, 80% amplitude modulation,
+900 MHz keyed carrier
1
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12
Input Specifications
Specification 1769-IQ16
Voltage Category 24V dc (sink/source
Operating Voltage Range
10 to 30V dc at 30°C (86°F)
10 to 26.4V dc at 60°C (140°F)
Number of Inputs 16
Bus Current Draw (max.) 115 mA at 5V dc (0.575W)
Heat Dissipation
Signal Delay (max.)
3.55 Total Watts
with all points energized.)
On Delay: 8.0 ms
Off Delay: 8.0 ms
Off-State Voltage (max.) 5V dc
Off-State Current (max.) 1.5 mA
On-State Voltage (min.) 10V dc
On-State Current (min.) 2.0 mA
Inrush Current (max.) 250 mA
Nominal Impedance 3K
Ω
IEC Input Compatibility Type 1+
Power Supply Distance Rating
Input Point to Bus (Compact Bus)
Isolation
8 (The module may not be more than 8 modules away from the
power supply or controller.)
Verified by one of the following dielectric tests: 1200V ac for 1
sec. or 1697V dc for 1 sec.
75V dc working voltage (IEC Class 2 reinforced insulation)
Group 1: inputs 0 to 7
Isolated Groups
Group 2: inputs 8 to 15
Isolated groups operate in either sink or source configurations.
Input Group to Input Group
Isolation
Verified by one of the following dielectric tests: 1200V ac for 1
sec. or 1697V dc for 1 sec.
75V dc working voltage (IEC Class 2 reinforced insulation)
Vendor I.D. Code 1
Product Type Code 7
Product Code 67
1.
Sinking/ Sourc ing In puts
device. Sourcing I/O circui ts supp ly (sou rce) cu rrent to sinkin g field device s. Sink ing I/O circuit s are d riven
by a current sourcing fie ld device. Fie ld devices c onnected to the negativ e side (DC Co mmon) of th e field
power supply are sinking field devices. Field devic es conne cted to the positive sid e (+V) of the field supply
are sourcing field device s.
used options.
- Sourcing/sinking describes the current flow between the I/O module and the field
Europe:
DC sinking input and so urci ng o utp ut mo du le circ uits are the co mm on ly
1
)
(The Watts per point, plus the minimum Watts,
Publication 1769-IN007B-EN-P
13
Hazardous Location Considerations
This equipment is suitable for use in Class I, Division 2, Groups A, B, C, D or
non-hazardous locations only. The following ATTENTION statement applies to
use in hazardous locations.
ATTENTION:
• Substitution of components may impair suitability for Class I,
!
Division 2.
• Do not replace components or disconnect equipment un less
power has been switched off or the area is known to be no nhazardous.
• Do not connect or disconnect components unless power has
been switched off or the area is known to be non-hazardous.
• This product must be installed in an enclosure.
• All wiring must comply with N.E.C. article 501-4(b).
EXPLOSION HAZARD
Environnements dangereux
Cet équipement est conçu pour être utilisé dans des environnements de Classe 1,
Division 2, Groupes A, B, C, D ou non dangereux. La mise en garde suivante
s’applique à une utilisation dans des environnements dangereux.
ATTENTION:
• La substitution de composants peut rendre cet équipement
!
impropre à une utilisation en environnement de Classe 1,
Division 2.
• Ne pas remplacer de composants ou déconnecter l'équipement
sans s'être assuré que l'alimentation est coupée et que
l'environnement est classé non dangereux.
• Ne pas connecter ou déconnecter des composants sans s'être
assuré que l'alimentation est coupée ou que l'environnement est
classé non dangereux.
• Ce produit doit être installé dans une armoire.
DANGER D’EXPLOSION
Publication 1769-IN007B-EN-P
14
For More Information
For Refer to this Document Pub. No.
A more detailed description of how to
install and use your Compact I/O with
MicroLogix 1200 & 1500 programmable
controller.
A more detailed description of how to
install and use your Compact I/O with
the 1769-ADN DeviceNet Adapter.
More information on proper wiring and
grounding techniques.
If you would like a manual, you can:
• download a free electronic version from the internet:
www.ab.com/micrologix
• purchase a printed manual by:
– contacting your local distributor or Rockwell Automation representative
– visiting
www.theautomationbookstore.com
MicroLogix 1200 and MicroLogix
1500 Programmable Controllers
User Manual
1769-ADN DeviceNet Adapter
User Manual
Industrial Automation Wiring and
Grounding Guidelines
www.theautomationbookstore.com
or
1764-RM001B-US-P
1769-UM001A-US-P
and placing your order
1770-4.1
– calling
Publication 1769-IN007B-EN-P
1.800.9NEWLIT(800.963.9548)
001.330.725.1574
or
(USA/Canada)
(Outside USA/Canada)
15
Compact and M icroLogix are trademarks of Rockwell A u tomation.
Publication 1769-IN007B-EN-P
Publication 1769-IN007B-EN-P - June 2000 PN 40071-097-01(B)
Supercedes 1769-IN007A-EN-P - April 2000
& 1769-5.3 - January 1999
© 2000 Rockwell International Corporation. All rights reserved. Printed in the U.S.A.
´H'*£!¶Bq¨
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