Compact Combination 24V dc Sink Input/Source
Output BOOLEAN Control Module
Catalog Number 1769-BOOLEAN
Inside . . .
ForSee Page
About This Publication1
About the 1769-BOOLEAN Module5
Module Description5
Install the 1769-BOOLEAN Module6
Replace a Single Module Within a System7
Mount Expansion I/O8
Minimum Spacing8
Mount Module to Panel8
Wire the 1769-BOOLEAN Module10
Ground the 1769-BOOLEAN Module11
Configure the 1769-BOOLEAN Module12
Specifications22
Additional Resources27
About This Publication
Use this document as a guide when installing a Compact Combination 24V dc Sink
Input/Source Output BOOLEAN Control Module.
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2
WARNING
IMPORTANT
ATTENTION
SHOCK HAZARD
BURN HAZARD
Important User Information
Solid state equipment has operational characteristics differing from those of electromechanical equipment.
Safety Guidelines for the Application, Installation and Maintenance of Solid State Controls (Publication
SGI-1.1 available from your local Rockwell Automation sales office or online at
http://rockwellautomation.com/literature) describes some important differences between solid state
equipment and hard-wired electromechanical devices. Because of this difference, and also because of the
wide variety of uses for solid state equipment, all persons responsible for applying this equipment must
satisfy themselves that each intended application of this equipment is acceptable.
In no event will Rockwell Automation, Inc. be responsible or liable for indirect or consequential damages
resulting from the use or application of this equipment.
The examples and diagrams in this manual are included solely for illustrative purposes. Because of the many
variables and requirements associated with any particular installation, Rockwell Automation, Inc. cannot
assume responsibility or liability for actual use based on the examples and diagrams.
No patent liability is assumed by Rockwell Automation, Inc. with respect to use of information, circuits,
equipment, or software described in this manual.
Reproduction of the contents of this manual, in whole or in part, without written permission of Rockwell
Automation, Inc., is prohibited.
Throughout this manual, when necessary, we use notes to make you aware of safety considerations.
Publication 1769-IN077A-EN-P - May 2006
Identifies information about practices or circumstances that can cause an explosion in
a hazardous environment, which may lead to personal injury or death, property
damage, or economic loss.
Identifies information that is critical for successful application and understanding of
the product.
Identifies information about practices or circumstances that can lead to personal injury
or death, property damage, or economic loss. Attentions help you identify a hazard,
avoid a hazard, and recognize the consequences.
Labels may be located on or inside the equipment (for example, drive or motor) to alert
people that dangerous voltage may be present.
Labels may be located on or inside the equipment (for example, drive or motor) to alert
people that surfaces may be dangerous temperatures.
Prevent Electrostatic Discharge
ATTENTION
ATTENTION
Electrostatic discharge can damage integrated circuits or semiconductors
if you touch bus connector pins. Follow these guidelines when you handle
the module:
– Touch a grounded object to discharge static potential.
– Wear an approved wrist-strap grounding device.
– Do not touch the bus connector or connector pins.
– Do not touch circuit components inside the module.
– If available, use a static-safe work station.
– When not in use, keep the module in its static-shield box.
Remove Power
Remove power before removing or inserting this module. When you
remove or insert a module with power applied, an electrical arc may occur.
An electrical arc can cause personal injury or property damage by:
– sending an erroneous signal to your system’s field devices, causing
unintended machine motion.
– causing an explosion in a hazardous environment.
Electrical arcing causes excessive wear to contacts on both the module
and its mating connector. Worn contacts may create electrical resistance.
3
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4
WARNING
AVERTISSEMENT
Hazardous Location Considerations
This equipment is suitable for use in Class I, Division 2, Groups A, B, C, D or non-hazardous
locations only. The following WARNING statement applies to use in hazardous locations.
EXPLOSION HAZARD
• Substitution of components may impair suitability for
Class I, Division 2.
• Do not replace components or disconnect equipment unless power is
switched off or the area is known to be non-hazardous.
• Do not connect or disconnect components unless power is switched
off or the area is known to be non-hazardous.
• This product must be installed in an enclosure.
• All wiring must comply with Class I, Division 2 wiring methods of
Article 501 of the National Electrical Code and/or in accordance
with Section 18-1J2 of the Canadian Electrical Code, and in
accordance with the authority having jurisdiction.
Environnements dangereux
Cet équipement est conçu pour être utilisé dans des environnements de Classe 1, Division 2,
Groupes A, B, C, D ou non dangereux. La mise en garde suivante s’applique à une utilisation
dans des environnements dangereux.
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DANGER D’EXPLOSION
• La substitution de composants peut rendre cet équipement
impropre à une utilisation en environnement de Classe 1, Division
2.
• Ne pas remplacer de composants ou déconnecter l'équipement
sans s'être assuré que l'alimentation est coupée et que
l'environnement est classé non dangereux.
• Ne pas connecter ou déconnecter des composants sans s'être
assuré que l'alimentation est coupée ou que l'environnement est
classé non dangereux.
• Ce produit doit être installé dans une armoire.
5
10a
10b
4
10
2b
3
2a
1
5
a
9
5
b
6
7a
7b
8b
7b
8a
7a
1769-BOOLEAN
DANGER
Do Not Remove RTB Under Power
Unless Area is Non-Hazardous
Ensure Adjacent
Bus Lever is Unlatched/Latched
Before/After
Removing/Inserting Module
O
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T
2
IN
4
IN
7
IN
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IN OUT
0
0246
7531
2
1
3
BOOLEAN
IN OUT
0
0246
7531
2
1
3
BOOLEAN
IN O
UT
0
0
2
46
7
5
31
2
1
3
Boolean
0
1
2
3
0
1
2
3
4
5
6
7
About the 1769-BOOLEAN Module
Compact I/O is suitable for use in an industrial environment when installed in accordance
with these instructions. Specifically, this equipment is intended for use in clean, dry
environments (Pollution degree 2
(2)
(IEC 60664-1)
II
(3)
.
Module Description
(1)
Pollution Degree 2 is an environment where, normally, only non-conductive pollution occurs except that occasionally a
temporary conductivity caused by condensation is expected.
(2)
Over Voltage Category II is the load level section of the electrical distribution system. At this level, transient voltages are
controlled and do not exceed the impulse voltage capability of the product’s insulation.
(3)
Pollution Degree 2 and Over Voltage Category II are International Electrotechnical Commission (IEC) designations.
(1)
) and to circuits not exceeding Over Voltage Category
Item Description
1Bus lever (with locking function)
2aUpper panel mounting tab
2bLower panel mounting tab
3Module status LED
4Module door with terminal
identification label
5aMovable bus connector
with female pins
5bStationary bus connector
with male pins
6Nameplate label
7aUpper
tongue-and-groove slots
7bLower
tongue-and-groove slots
8aUpper DIN rail latch
8bLower DIN rail latch
9Write-on label (user ID tag)
10Removable terminal block (RTB)
with finger-safe cover
10aRTB upper retaining screw
10bRTB lower retaining screw
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6
ATTENTION
1
1
2
6
5
4
3
30536-M
Install the 1769-BOOLEAN Module
Attach the module to the controller or an adjacent I/O module before or after mounting. For
mounting instructions, see Mount Module to Panel Using the Dimensional Template, or
Mount Module to DIN Rail. To work with a system that is already mounted, see Replace a
Single Module Within a System.
The following procedure shows you how to assemble the Compact I/O system.
1. Disconnect power.
Publication 1769-IN077A-EN-P - May 2006
2. Check that the bus lever of the module to be installed is in the unlocked (fully right)
position.
3. Use the upper and lower tongue-and-groove slots (1) to secure the modules together
(or to a controller).
4. Move the module back along the tongue-and-groove slots until the bus connectors (2)
line up with each other.
5. Push the bus lever back slightly to clear the positioning tab (3).
Use your fingers or a small screwdriver.
6. To allow communication between the controller and module, move the bus lever fully
to the left (4) until it clicks, making sure it is locked firmly in place.
When attaching I/O modules, it is very important that the bus connectors
are securely locked together to be sure of proper electrical connection.
7. Attach an end-cap terminator (5) to the last module in the system by using the
IMPORTANT
TIP
tongue-and-groove slots as before.
8. Lock the end-cap bus terminator (6).
You must use a 1769-ECR or 1769-ECL right or left end cap to terminate
the end of the serial communication bus.
Replace a Single Module Within a System
The module can be replaced while the system is mounted to a panel (or DIN rail).
1. Remove power.
Refer to Remove Power on page 3.
2. Remove the upper and lower mounting screws from the module (or open the DIN
latches using a flat-blade or Phillips-style screwdriver).
3. Move the bus lever to the right to disconnect (unlock) the bus.
4. On the right-side adjacent module, move its bus lever to the right (unlock) to
disconnect it from the module to be removed.
7
5. Gently slide the disconnected module forward.
If you feel excessive resistance, check that the module is disconnected from the bus
and that both mounting screws are removed (or DIN latches opened).
It may be necessary to rock the module slightly from front to back to
remove it, or, in a panel-mounted system, to loosen the screws of adjacent
modules.
6. Be sure that the bus lever on the module and on the right-side adjacent module are in
the unlocked (fully right) position before installing the replacement module.
7. Slide the replacement module into the open slot.
8. Connect the modules by locking (fully left) the bus levers on the replacement module
and the right-side adjacent module.
9. Replace the mounting screws (or snap the module onto the DIN rail).
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8
ATTENTION
Controller
Compact I/O
Compact I/O
Compact I/O
Compact I/O
Compact I/O
End Cap
To p
Bottom
SideSide
Spacing for single-wide modules 35mm (1.378 in.)
Spacing for one-and-a half-wide modules 52.5mm (2.067 in.)
Refer to host controller documentation for this dimension.
During panel or DIN rail mounting of all devices, be sure that all debris,
that is, metal chips or wire strands, is kept from falling into the module.
Debris that falls into the module could cause damage when cycling power.
Minimum Spacing
Maintain spacing from
enclosure walls, wireways, or
adjacent equipment. Allow
50 mm (2 in.) of space on all
sides for adequate
ventilation, as shown.
Mount Module to Panel
Mount the module to a panel using two screws per module. Use M4 or #8 panhead screws.
Mounting screws are required on every module.
Mount Module to Panel Using the Dimensional Template
Locate holes every 17.5 mm (0.689 in.) to allow for a mix of single-wide and
one-and-a-half-wide modules (for example, the 1769-OA16 module).
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9
TIP
Mount Module to Panel Using Modules as a Template
This procedure lets you use the assembled modules as a template for drilling holes in the
panel. Refer to Mount Module to Panel Using the Dimensional Template on page 8 if you
have sophisticated panel-mounting equipment. Due to module-mounting hole tolerance, it is
important to follow this procedure:
1. On a clean work surface, assemble no more than three modules.
2. Using the assembled modules as a template, carefully mark the center of all
module-mounting holes on the panel.
3. Return the assembled modules to the clean work surface, including any previously
mounted modules.
4. Drill and tap the mounting holes for the recommended M4 or #8 screws.
5. Place the modules back on the panel, and check for proper hole alignment.
6. Attach the modules to the panel using the mounting screws.
If mounting more modules, mount only the last one of this group and put
the others aside. This reduces the remounting time during drilling and
tapping of the next group.
7. Repeat steps 1 to 6 for any remaining modules.
Mount Module to DIN Rail
The module can be mounted using these DIN rails:
• 35 x 7.5 mm (EN 50 022 - 35 x 7.5)
• 35 x 15 mm (EN 50 022 - 35 x 15)
Before mounting the module on a DIN rail, close the DIN-rail latches. Press the DIN-rail
mounting area of the module against the DIN rail. The latches will momentarily open and
lock into place.
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10
+VDC
OUT DC COM
OUT x
Wire the 1769-BOOLEAN Module
Each terminal accepts as many as two wires with these restrictions:
Wire TypeWire SizeTerminal Screw
Torque
SolidCu-90 °C (194 °F)
Stranded Cu-90 °C (194 °F)
2.08…0.34 mm
(14…22 AWG)
1.31…0.34 mm
(16…22 AWG)
2
0.68 Nm (6 in-lb)0.46 Nm (4.1 in-lb)
2
0.68 Nm (6 in-lb)0.46 Nm (4.1 in-lb)
Simplified Input Circuit Diagram
Simplified Output Circuit Diagram
Retaining Screw
Torque
Publication 1769-IN077A-EN-P - May 2006
Input/Output Wiring
Ground the 1769-BOOLEAN Module
11
This product is intended to be mounted to a well-grounded mounting surface such as a metal
panel. Additional grounding connections from the module’s mounting tabs or DIN rail (if
used) are not required unless the mounting surface cannot be grounded. Refer to Industrial
Automation Wiring and Grounding Guidelines, Allen-Bradley publication 1770-4.1, for
additional information.
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Configure the 1769-BOOLEAN Module
The following I/O memory mapping lets you configure the 1769-BOOLEAN module.
Output Data File
For each module, slot x, word 0 in the output data file contains the control program’s directed
state of the module’s output points when operated in Direct Control mode. Direct Control
mode is active when an output’s disable BOOLEAN (DB_x) bit is set in the configuration
data file. Word 1 contains the control program’s directed states of the virtual inputs, which
can be used in controlling the module’s output points via BOOLEAN expressions.
Bit Position
1514131211109876543210
Word
0OUT3OUT2OUT1OUT
0
1V7V6V5V4V3V2V1V0
Shaded bit positions must be set to 0.
OUTx = Output state in Direct Control mode; 1 = output on, 0 = output off.
Vx = Virtual inputs 0…7.
Input Data File
For each module, slot x, word 0 in the input data file contains the state of the module’s real
input points. Word 1 in the input data file contains the state of the module’s output data
(output data echo). During normal operation, this word represents the values that the outputs
are directed to by the control program (in Direct Control mode) or by the module (in
BOOLEAN Control mode).
Bit Position
1514131211109876543210
Word
0IN7 IN6 IN5 IN4 IN3 IN2 IN1 IN0
1O3O2O1O0
Shaded bit positions must be set to 0.
INx = State of module’s real inputs 0…7.
Ox = Data echo of directed states of module outputs 0…3; 1 = output on, 0 = output off.
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13
Configuration Data File
The manipulation of bits from this file is normally done with programming software (for
example, RSLogix 500 software or RSNetWorx for DeviceNet software) during initial
configuration of the system. In that case, graphical screens provided by the programming
software simplify configuration.
Some systems, like the 1769-ADN DeviceNet adapter system, also allow the bits to be altered
as part of the control program using communication rungs. In that case, it is necessary to
understand the bit arrangement. Words 0 and 1 of the configuration data file set the input
control parameters for the module. Words 2 to 7 set the alternate output state operation of
the module. Each output point’s operating parameters are controlled by a group of eight
words.
No pre-determined output pulse duration. Output directed off when BOOLEAN expression goes to FALSE.
Shaded bit positions must be set to 0. Entering a binary value greater than 1111101000 (greater than 1000 decimal)
results in a configuration error.
21
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22
Specifications
Compact I/O - 1769-BOOLEAN General Specifications
SpecificationValue
Closed Loop Time
(Digital Filter = 0)
Bus Current Draw, Max220 mA at 5V dc
Heat Dissipation3.55 Total Watts (The Watts per point, plus the minimum Watts, with all
Power Supply Distance Rating8 (The module may not be more than 8 modules away from the power
Isolated GroupsGroup 1: inputs 0…7
Input Point to Output Point
Isolation
Vendor I.D. Code1
Product Type Code109
Product Code37
Dimensions, HxDxW118 mm x 87 mm x 35mm (4.65 in. x 3.43 in. x 1.38 in.)
Approximate Shipping Weight
(With Carton)
Output on-state current > 5 mA: 100 µs max
Output on-state current < 5 mA: 150 µs max
points energized.)
supply or controller.)
Group 2: outputs 0…3
Verified by one of the following dielectric tests: 1200V ac for 1 s or
1697V dc for 1 s
75V dc working voltage (IEC Class 2 reinforced insulation)
Height including mounting tabs is 138 mm (5.43 in.)
282 g (0.625 lbs)
Input Specifications
Voltage Category
Operating Voltage Range10…30V dc @ 30 °C (86 °F)
Number of Inputs8 real
Digital FilterOFF to ON: 0 s, 100 µs, 200 µs, 500 µs, 1 ms, 2 ms, 4 ms, 8 ms
Hardware Delay, MaxOFF to ON: 10 µs
Off-state Voltage, Max5V dc
24V dc (sink
10…26.4V dc @ 60 °C (140 °F)
8 virtual
ON to OFF: 0 s, 100 µs, 200 µs, 500 µs, 1 ms, 2 ms, 4 ms, 8 ms
ON to OFF: 10 µs
Publication 1769-IN077A-EN-P - May 2006
(1)
)
Input Specifications
Off-state Current, Max1.5 mA
On-state Voltage, Min10V dc
On-state Current, Min2.0 mA
Inrush Current, Max250 mA
Nominal Impedance2.0 kohm @ 24V dc
2.3 kohm @ 30V dc
IEC Input CompatibilityTyp e 1+
Input Point to Bus (CompactBus)
Isolation
Verified by one of the following dielectric tests: 1200V ac for 1 s or
1697V dc for 1 s
75V dc working voltage (IEC Class 2 reinforced insulation)
(1)
Sinking Input - Sink describes the current flow between the I/O module and the field device. Sinking I/O circuits are driven
by a current sourcing field device. Field devices connected to the positive side (+V) of the field supply are sourcing field
devices. Europe: DC sinking input and sourcing output module circuits are the commonly used options.
Output Specifications
Voltage Category24V dc
Operating Voltage Range
20.4…26.4V dc (source
Number of Outputs4
Signal Delay, Max (Resistive Load) Turn-on: 10 µs, output on-state current > 5 mA
Turn-off: 10 µs, output on-state current > 5 mA
Off-state Leakage, Max
(1)
1.0 mA @ 26.4V dc
On-state Current, Min1.0 mA
On-state Voltage Drop, Max1.0V dc @ 1.0 A
Continuous Current per Point, Max 0.5 A @ 60 °C (140 °F)
1.0 A @ 30 °C (86 °F)
Refer to Temperature Derating on page 25.
Surge Current, Max
(2)
Output Point to Bus (CompactBus)
Isolation
2.0 A (Repeatability is once every 2 s for a duration of 10 ms.)
Verified by one of the following dielectric tests: 1200V ac for 1 s or
1697V dc for 1 s
75V dc working voltage (IEC Class 2 reinforced insulation)
(1)
Typical Loading Resistor - To limit the effects of leakage current through solid state outputs, a loading resistor can be
connected in parallel with your load. Use a 5.6 kohm, 1/2 W resistor for transistor outputs, 24V dc operation.
(2)
Recommended Surge Suppression - Use a 1N4004 diode reverse-wired across the load for transistor outputs switching 24V
dc inductive loads. For additional details, refer to Industrial Automation Wiring and Grounding Guidelines, Allen-Bradley
publication 1770-4.1.
(3)
)
23
Publication 1769-IN077A-EN-P - May 2006
24
(3)
Sourcing Output - Source describes the current flow between the I/O module and the field device. Sourcing output circuits
supply source current to sinking field devices. Field devices connected to the negative side (dc common) of the field power
supply are sinking field devices. Europe: DC sinking input and sourcing output module circuits are the commonly used
options.
Environmental Specifications
SpecificationValue
Storage Temperature-40…+85 °C (-40…+185°F)
Operating Temperature0…60 °C (32…140 °F)
Operating Humidity5…95% non-condensing
Operating Altitude2000 m (6561 ft)
VibrationOperating: 10…500 Hz, 5 g, 0.030 in. max peak-to-peak
ShockOperating: 30 g panel mounted (20 g DIN-rail mounted)
Non-operating: 40 g panel mounted (30 g DIN-rail mounted)
Radiated and Conducted
Emissions
Electrical /EMCThe module has passed testing at the following levels
ESD Immunity (IEC1000-4-2)4 kV contact, 8 kV air, 4 kV indirect
Radiated Immunity (IEC1000-4-3)10V/m, 80…1000 MHz, 80% amplitude
Fast Transient Burst (IEC1000-4-4) 2 kV, 5 kHz
Surge Immunity (IEC1000-4-5)2 kV common mode, 1 kV differential mode
Conducted Immunity (IEC1000-4-6)
(1)
Conducted Immunity frequency range may be 150 kHz…30 MHz if the radiated immunity frequency range is 30…1000 MHz.
Hazardous Environment ClassClass I, Division 2, Hazardous Location, Groups A, B, C, D
Publication 1769-IN077A-EN-P - May 2006
• UL 508 listed
• CE compliant for all applicable directives
(UL 1604, C-UL under CSA C22.2 No. 213)
25
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
3.8
253035404550556065
Ambient Temperature oC
Maximum Amperes per Module
Temperature Derating
The area within the curve represents the safe operating range for the module under various
conditions of user-supplied voltages and ambient temperatures.
Figure 1 1769-BOOLEAN Maximum Output Amperes per Module vs. Temperature
Figure 2 1769-BOOLEAN Maximum Output Amperes per Point vs. Temperature
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26
ATTENTION
Transistor Output Transient Pulses
The maximum duration of the transient pulse occurs when minimum load is connected to the
output. However, for most applications, the energy of the transient pulse is not sufficient to
energize the load.
A transient pulse occurs in transistor outputs when the external dc supply
voltage is applied to the output common terminals, for example, via the
master control relay. The sudden application of voltage creates this
transient pulse. This condition is inherent in transistor outputs and is
common to solid-state devices. A transient pulse can occur regardless of
the controller having power. Refer to your controller’s user manual to
reduce inadvertent operation.
Figure 3 illustrates that the duration of the transient is proportional to the load current.
Therefore, as the on-state load current increases, the transient pulse decreases. Transients
when you cycle power do not exceed the time duration shown for the amount of loading
indicated at 60 °C (140 °F).
Figure 3 Transient Pulse Duration as a Function of Load Current
Publication 1769-IN077A-EN-P - May 2006
Additional Resources
If you would like a manual, you can:
• Download a free electronic version from www.ab.com/literature
• Purchase a printed manual by contacting your local distributor or Rockwell
Automation representative
ForRefer To This DocumentPub. No.
A more detailed description of how to install
and use your Compact I/O with MicroLogix
1200/1500 programmable controllers
A more detailed description of how to install
and use your Compact I/O system with the
1769-ADN DeviceNet adapter
A more detailed description of how to install
and use your Compact I/O system with the
CompactLogix system
More information on proper wiring and
grounding techniques
MicroLogix 1200 and MicroLogix
1500 Programmable Controllers User
Manual
1769-ADN DeviceNet Adapter User
Manual
CompactLogix System User Manual 1769-UM007
Industrial Automation Wiring and
Grounding Guidelines
1764-RM001
1769-UM001
1770-4.1
27
Compact, CompactLogix, MicroLogix, RSLogix 500, and RSNetWorx for DeviceNet are trademarks of Rockwell Automation, Inc.
Trademarks not belonging to Rockwell Automation are property of their respective companies.
Publication 1769-IN077A-EN-P - May 2006
Rockwell Automation Support
Rockwell Automation provides technical information on the web to assist you in using its products. At
http://support.rockwellautomation.com, you can find technical manuals, a knowledge base of FAQs,
technical and application notes, sample code and links to software service packs, and a MySupport feature
that you can customize to make the best use of these tools.
For an additional level of technical phone support for installation, configuration and troubleshooting, we
offer TechConnect Support programs. For more information, contact your local distributor or Rockwell
Automation representative, or visit http://support.rockwellautomation.com.
Installation Assistance
If you experience a problem with a hardware module within the first 24 hours of installation, please
review the information that's contained in this manual. You can also contact a special Customer Support
number for initial help in getting your module up and running:
United States1.440.646.3223 Monday – Friday, 8am – 5pm EST
Outside United States Please contact your local Rockwell Automation representative for any technical
New Product Satisfaction Return
Rockwell tests all of its products to ensure that they are fully operational when shipped from the
manufacturing facility. However, if your product is not functioning and needs to be returned:
United StatesContact your distributor. You must provide a Customer Support case number (see
Outside United States Please contact your local Rockwell Automation representative for return procedure.
support issues.
phone number above to obtain one) to your distributor in order to complete the return
process.
Publication 1769-IN077A-EN-P - May 2006PN 40071-209-01(1)